KR100825356B1 - 열처리장치 및 기판의 제조방법 - Google Patents
열처리장치 및 기판의 제조방법 Download PDFInfo
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- KR100825356B1 KR100825356B1 KR1020077005725A KR20077005725A KR100825356B1 KR 100825356 B1 KR100825356 B1 KR 100825356B1 KR 1020077005725 A KR1020077005725 A KR 1020077005725A KR 20077005725 A KR20077005725 A KR 20077005725A KR 100825356 B1 KR100825356 B1 KR 100825356B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 126
- 238000010438 heat treatment Methods 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000006243 chemical reaction Methods 0.000 claims abstract description 232
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 51
- 239000010453 quartz Substances 0.000 claims abstract description 44
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 9
- 230000002452 interceptive effect Effects 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 85
- 238000012986 modification Methods 0.000 description 21
- 230000004048 modification Effects 0.000 description 21
- 235000012431 wafers Nutrition 0.000 description 21
- 238000009826 distribution Methods 0.000 description 8
- 230000036961 partial effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000007664 blowing Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- -1 oxygen ions Chemical class 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001698 pyrogenic effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000009279 wet oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (15)
- 기판을 처리하는 반응관과,상기 반응관을 지지하는 어댑터와,상기 반응관 내부에 처리가스를 공급하는 노즐과,상기 반응관 내부를 가열하는 히터를 포함하며,상기 노즐은 상기 반응관 내부에 있어서 상기 어댑터의 상면에 접속되는 제1 부분과, 이 제1 부분에 접속되는 제2 부분을 포함하고, 상기 제1 부분은 상기 어댑터와 열팽창률이 동등한 재료로 구성되는 열처리장치.
- 제1항에 있어서, 상기 노즐의 제1 부분은 상기 노즐의 제2 부분보다 열팽창률이 작은 재료로 구성되는 것인 열처리장치.
- 제1항에 있어서, 상기 노즐의 제1 부분은 석영제이며, 상기 노즐의 제2 부분은 탄화규소제인 열처리장치.
- 제1항에 있어서, 상기 노즐의 제1 부분은 상기 어댑터의 상면에 있어서 상기 어댑터와 감합 접속되는 것인 열처리장치.
- 제1항에 있어서, 상기 노즐의 제1 부분과 상기 노즐의 제2 부분은 감합 접속 되고, 상기 제1 부분의 일부가 상기 제2 부분의 내측에 감합되도록 구성되는 것인 열처리장치.
- 제1항에 있어서, 상기 노즐의 제1 부분은 가스를 수직방향이 아닌 방향으로 흘리도록 구성되고, 상기 노즐의 제2 부분은 가스를 수직방향으로 흘리도록 구성되는 것인 열처리장치.
- 제1항에 있어서, 상기 반응관 내부에서 복수 매의 기판을 지지하는 지지구를 갖고, 상기 노즐의 제1 부분은 상기 반응관 내벽의 주위를 따르도록 구성되며, 상기 노즐의 제2 부분은 기판배열 방향으로 연장하도록 구성되는 것인 열처리장치.
- 제1항에 있어서, 상기 노즐의 제1 부분의 유로 단면적이 상기 노즐의 제2 부분의 유로 단면적보다 큰 열처리장치.
- 제1항에 있어서, 상기 노즐의 제1 부분 또는 제2 부분은, 가스가 상기 제1 부분을 유통하는 것이 상기 제2 부분을 유통할 때보다 가스 유속이 늦어지도록 구성되는 열처리장치.
- 제7항에 있어서, 상기 노즐의 제1 부분은 상기 반응관 내부에 있어서 상기 어댑터의 상면에 재치되고, 상기 노즐의 제1 부분의 유로단면형상이 직사각형인 열 처리장치.
- 제7항에 있어서, 상기 노즐의 제1 부분은 상기 반응관 내부에 있어서 상기 어댑터의 상면에 재치되고, 상기 노즐의 제1 부분의 유로단면형상이 세로 방향으로 긴 직사각형인 열처리장치.
- 제1항에 있어서, 상기 노즐의 제2 부분은 적어도 2개 이상 설치되는 열처리장치.
- 기판을 처리하는 반응관과,상기 반응관을 지지하는 어댑터와,상기 반응관 내부에 처리가스를 공급하는 노즐과,상기 반응관 내부를 가열하는 히터와,상기 반응관 내부에서 복수 매의 기판을 지지하는 지지구를 포함하고,상기 노즐은 상기 반응관 내부에 있어서 상기 어댑터의 상면에 접속되는 제1 부분과, 이 제1 부분에 접속되는 제2 부분을 포함하고, 상기 제1 부분은 상기 반응관 내벽의 주위를 따르도록 구성되고, 상기 제2 부분은 기판배열 방향으로 연장되도록 구성되는 열처리장치.
- 기판을 처리하는 반응관과,상기 반응관을 지지하는 어댑터와,상기 반응관 내부에 처리가스를 공급하는 노즐과,상기 반응관 내부를 가열하는 히터를 포함하고,상기 노즐은 상기 반응관 내부에 있어서 상기 어댑터의 상면에 접속되는 제1 부분과, 이 제1 부분에 접속되는 제2 부분을 포함하고, 상기 제1 부분의 유로 단면적은, 상기 제2 부분의 유로 단면적보다 큰 열처리장치.
- 반응관과,상기 반응관을 지지하는 어댑터와,상기 반응관 내부를 가열하는 히터를 포함하는 반응로 내부에 기판을 반입하는 공정과,상기 반응관 내부에 있어서 상기 어댑터의 상면에 접속되는 제1 부분과, 이 제1 부분에 접속되는 제2 부분을 포함하고, 상기 제1 부분이 상기 어댑터와 열팽창률이 동등한 재료로 구성되는 노즐에 의해 상기 반응로 내부에 처리가스를 공급하여 기판을 처리하는 공정과,처리 후의 기판을 상기 반응로로부터 반출하는 공정을 포함하는 기판의 제조방법.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004269311 | 2004-09-16 | ||
JPJP-P-2004-00269311 | 2004-09-16 | ||
JP2005146517 | 2005-05-19 | ||
JPJP-P-2005-00146517 | 2005-05-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070041627A KR20070041627A (ko) | 2007-04-18 |
KR100825356B1 true KR100825356B1 (ko) | 2008-04-28 |
Family
ID=36060107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077005725A Expired - Fee Related KR100825356B1 (ko) | 2004-09-16 | 2005-09-15 | 열처리장치 및 기판의 제조방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8963051B2 (ko) |
JP (1) | JP4815352B2 (ko) |
KR (1) | KR100825356B1 (ko) |
WO (1) | WO2006030857A1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4706199B2 (ja) * | 2004-07-20 | 2011-06-22 | 株式会社Sumco | Simox基板の製造方法 |
JP5109588B2 (ja) * | 2007-10-31 | 2012-12-26 | 信越半導体株式会社 | 熱処理装置 |
JP5237133B2 (ja) * | 2008-02-20 | 2013-07-17 | 株式会社日立国際電気 | 基板処理装置 |
JP2010263082A (ja) * | 2009-05-07 | 2010-11-18 | Koyo Thermo System Kk | 熱処理装置 |
WO2011038242A2 (en) * | 2009-09-25 | 2011-03-31 | Ferrotec (Usa) Corporation | Hybrid gas injector |
TWI513848B (zh) * | 2010-09-24 | 2015-12-21 | Ferrotec Usa Corp | 混合氣體注射器 |
US20130168377A1 (en) * | 2011-12-29 | 2013-07-04 | Stmicroelectronics Pte Ltd. | Adapter for coupling a diffusion furnace system |
KR101867364B1 (ko) | 2012-01-03 | 2018-06-15 | 삼성전자주식회사 | 배치 타입 반도체 장치 |
US20150075431A1 (en) * | 2012-05-18 | 2015-03-19 | Veeco Instruments Inc. | Rotating Disk Reactor With Ferrofluid Seal For Chemical Vapor Deposition |
JP6706901B2 (ja) | 2015-11-13 | 2020-06-10 | 東京エレクトロン株式会社 | 処理装置 |
US20170167023A1 (en) * | 2015-12-09 | 2017-06-15 | Lam Research Corporation | Silicon or silicon carbide gas injector for substrate processing systems |
US10998205B2 (en) * | 2018-09-14 | 2021-05-04 | Kokusai Electric Corporation | Substrate processing apparatus and manufacturing method of semiconductor device |
JP6994524B2 (ja) * | 2019-03-26 | 2022-01-14 | 株式会社Kokusai Electric | 基板処理装置、反応管及び半導体装置の製造方法 |
CN111755359B (zh) * | 2019-03-26 | 2024-04-12 | 株式会社国际电气 | 基板处理装置、反应管以及半导体装置的制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05160042A (ja) * | 1991-12-09 | 1993-06-25 | Matsushita Electric Ind Co Ltd | プラズマ生成装置および半導体薄膜のプラズマ処理方法 |
JPH10256245A (ja) | 1997-03-11 | 1998-09-25 | Sony Corp | ウエハ熱処理装置およびその方法 |
JPH11102876A (ja) * | 1997-09-29 | 1999-04-13 | Asahi Kasei Micro Syst Co Ltd | 縦型炉 |
JP2002299273A (ja) * | 2001-04-04 | 2002-10-11 | Sharp Corp | 半導体基板用熱処理装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5016567A (en) * | 1988-08-26 | 1991-05-21 | Tel Sagami Limited | Apparatus for treatment using gas |
TW239164B (ko) * | 1992-08-12 | 1995-01-21 | Tokyo Electron Co Ltd | |
JP3982844B2 (ja) * | 1995-01-12 | 2007-09-26 | 株式会社日立国際電気 | 半導体製造装置及び半導体の製造方法 |
JPH0997767A (ja) * | 1995-09-28 | 1997-04-08 | Kokusai Electric Co Ltd | 半導体製造装置の縦型炉 |
NL1005963C2 (nl) * | 1997-05-02 | 1998-11-09 | Asm Int | Verticale oven voor het behandelen van halfgeleidersubstraten. |
JP2003031564A (ja) * | 2001-07-19 | 2003-01-31 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法 |
US20040033361A1 (en) * | 2002-08-06 | 2004-02-19 | Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel, Ltd.) | Component of glass-like carbon for CVD apparatus and process for production thereof |
US20060048707A1 (en) * | 2004-09-03 | 2006-03-09 | Applied Materials, Inc. | Anti-clogging nozzle for semiconductor processing |
-
2005
- 2005-09-15 US US11/662,573 patent/US8963051B2/en active Active
- 2005-09-15 KR KR1020077005725A patent/KR100825356B1/ko not_active Expired - Fee Related
- 2005-09-15 JP JP2006535198A patent/JP4815352B2/ja not_active Expired - Fee Related
- 2005-09-15 WO PCT/JP2005/017040 patent/WO2006030857A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05160042A (ja) * | 1991-12-09 | 1993-06-25 | Matsushita Electric Ind Co Ltd | プラズマ生成装置および半導体薄膜のプラズマ処理方法 |
JPH10256245A (ja) | 1997-03-11 | 1998-09-25 | Sony Corp | ウエハ熱処理装置およびその方法 |
JPH11102876A (ja) * | 1997-09-29 | 1999-04-13 | Asahi Kasei Micro Syst Co Ltd | 縦型炉 |
JP2002299273A (ja) * | 2001-04-04 | 2002-10-11 | Sharp Corp | 半導体基板用熱処理装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2006030857A1 (ja) | 2006-03-23 |
JP4815352B2 (ja) | 2011-11-16 |
US20080190910A1 (en) | 2008-08-14 |
JPWO2006030857A1 (ja) | 2008-05-15 |
KR20070041627A (ko) | 2007-04-18 |
US8963051B2 (en) | 2015-02-24 |
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