KR100822363B1 - Manufacturing method of LED substrate for stop lamp of automobile having chromium plating layer - Google Patents
Manufacturing method of LED substrate for stop lamp of automobile having chromium plating layer Download PDFInfo
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- KR100822363B1 KR100822363B1 KR1020060131885A KR20060131885A KR100822363B1 KR 100822363 B1 KR100822363 B1 KR 100822363B1 KR 1020060131885 A KR1020060131885 A KR 1020060131885A KR 20060131885 A KR20060131885 A KR 20060131885A KR 100822363 B1 KR100822363 B1 KR 100822363B1
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- Prior art keywords
- plating layer
- hole
- chromium plating
- copper
- led
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- 238000007747 plating Methods 0.000 title claims abstract description 53
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 229910052804 chromium Inorganic materials 0.000 title claims abstract description 29
- 239000011651 chromium Substances 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 239000010408 film Substances 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 239000011889 copper foil Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 4
- 239000004575 stone Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000001149 cognitive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
- B60Q1/44—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating braking action or preparation for braking, e.g. by detection of the foot approaching the brake pedal
- B60Q1/445—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating braking action or preparation for braking, e.g. by detection of the foot approaching the brake pedal controlled by inertial devices
- B60Q1/447—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating braking action or preparation for braking, e.g. by detection of the foot approaching the brake pedal controlled by inertial devices with indication of the braking strength or speed changes, e.g. by changing the shape or intensity of the indication
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
본 발명은 자동차의 후미 선단이나 하단에 설치되는 스탑 램프용 엘이디 기판에 대한 것으로, 특히 엘이디가 부착되는 원판의 일측 전면에 크롬도금층을 형성하되, 그 크롬도금층은 엘이디를 납땜하기 위한 스루홀(Through Hole)과 완전히 분리 및 비통전 상태가 되게 형성함으로써,The present invention relates to an LED substrate for a stop lamp installed at the rear end or the bottom of a car, in particular, to form a chromium plating layer on the entire surface of one side of the disc to which the LED is attached, the chromium plating layer is a through hole for soldering the LED (Through Hole) Hole) so as to be completely separated from and in a non-conductive state,
엘이디의 점등시 그 빛이 상기한 크롬도금층에 의해 고휘도로 반사되어 외부에서 관측시 보다 우수한 발광 효율을 기대하게 됨은 물론 그에 따른 시인성의 향상을 얻을 수 있는 것이며, 크롬도금층에 의해 기판 상의 솔더마스크(Solder mask) 및 회로 패턴(Pattern), 원판 자체의 색감이나 무늬 등이 전혀 노출되지 아니하므로 클리어 상태의 커버를 사용할 수 있어 더욱 고급스럽고 미려한 이미지를 갖는 크롬 도금층을 갖는 자동차의 스탑 램프용 엘이디 기판의 제조방법에 대한 것이다.When the LED is turned on, the light is reflected by the above-described chromium plating layer with high brightness, so that better luminous efficiency can be expected when observed from the outside, and the visibility can be improved accordingly, and the solder mask on the substrate can be obtained by the chromium plating layer. Solder mask, pattern, and color or pattern of the original plate are not exposed at all, so that the cover of clear state can be used and the LED substrate for the stop lamp of a car with a chrome plated layer having a more elegant and beautiful image It is about a manufacturing method.
Description
도 1은 본 발명에 의한 엘이디 기판의 전체도1 is an overall view of the LED substrate according to the present invention
도 2a 내지 도 2e는 본 발명에 의한 엘이디 기판의 제조공정도로서,2a to 2e is a manufacturing process diagram of the LED substrate according to the present invention,
도 2a는 원판에 스루홀을 천공하는 공정도Figure 2a is a process chart for drilling through holes in the disc
도 2b는 통전된 스루홀을 갖는 원판의 일면에 드라이필름을 부착한 상태도2b is a state in which a dry film is attached to one surface of a disc having energized through holes
도 2c는 스루홀 주변에 필름제거부가 형성된 상태도2c is a state in which a film removal unit is formed around the through hole
도 2d는 필름제거부에 의해 해당 동박판이 부식 제거된 상태도Figure 2d is a state in which the copper foil is corroded by the film removing unit
도 2e는 전체 필름이 제거된 원판의 크롬도금층 과정도Figure 2e is a process of chromium plating layer of the original film is removed
도 3은 본 발명에 의한 제조공법을 통해 완성된 기판의 실시예도Figure 3 is an embodiment of a substrate completed through the manufacturing method according to the present invention
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1,1' : 동박판 2 : 원판1,1 ': copper foil 2: disc
3,3' : 스루홀 4 : 드라이필름3,3 ': Through Hole 4: Dry Film
5 : 비통전부 6 : 크롬도금층5: non-electric part 6: chromium plating layer
10 : 엘이디10: LED
본 발명은 자동차의 후미 선단이나 하단에 설치되는 스탑 램프용 엘이디 기판에 대한 것으로, 더욱 상세하게는 엘이디 기판의 일면 전체에 크롬도금층을 형성하되 그 크롬도금층은 엘이디가 삽입되는 스루홀과의 비통전 상태가 되게 함으로써, 스탑 램프를 형성함에 있어 내부 회로 기판의 패턴이나 솔더 마스크 등이 전혀 드러나지 않아 클리어 커버의 적용이 가능하여 보다 고급스러우면서도 미려한 외장적 특징을 연출하고, 상기 크롬도금층은 우수한 반사 효율을 갖고 있어 엘이디의 점등시 더욱 상승된 발광특성을 발현하므로 시인성의 향상에도 이바지할 수 있는 크롬 도금층을 갖는 엘이디 기판의 제조방법에 관한 것이다.The present invention relates to an LED substrate for a stop lamp installed at the rear end or the bottom of an automobile, and more particularly, a chromium plating layer is formed on one surface of the LED substrate, and the chromium plating layer is not energized with a through hole into which the LED is inserted. By forming the stop lamp, the pattern of the internal circuit board, the solder mask, etc. are not revealed at all, so that the clear cover can be applied to produce a more elegant and beautiful exterior feature, and the chromium plating layer has excellent reflection efficiency. The present invention relates to a method for manufacturing an LED substrate having a chromium plating layer which can contribute to improvement of visibility since the light emission characteristic is further enhanced when the LED is turned on.
근자에 들어 일반 승용차 및 승합차의 후미에는 하이마운티드 스탑 램프 또는 테일&스탑 램프 등이 장착된다. 이와 같은 스탑 램프는 리어글래스 또는 트렁크 단부에 설치되는 테일&스탑 램프와 승합차 및 SUV, RV 차량의 테일게이트에 설치되는 하이마운티드 스탑 램프로 세분된다.In recent years, high-mounted stop lamps or tail & stop lamps are installed at the rear of ordinary cars and vans. Such stop lamps are subdivided into tail & stop lamps installed at the rear glass or trunk end and high mounted stop lamps installed at the tailgate of vans and SUVs and RV vehicles.
이러한 스탑 램프는 리어글래스 또는 트렁크 단부에 설치하거나 테일게이트 의 하단 또는 상단에 설치하되, 양측으로 분할된 콤비네이션 램프와 연동하는 구조를 갖고 있다.The stop lamp is installed at the rear glass or trunk end or at the bottom or top of the tailgate, but has a structure that interlocks with the combination lamp divided into two sides.
이와 같은 스탑 램프는 상기한 리어 콤비네이션 램프의 점멸과 동시에 점멸하는 것으로서, 자동차의 제동시 후방에서의 인지 효과를 상승시켜 후방 추돌사고 등을 방지하기 위해 설치되는 것이다.Such a stop lamp blinks at the same time as the flash of the rear combination lamp, and is installed to prevent a rear collision accident by increasing a cognitive effect at the rear during braking of the vehicle.
이러한 스탑 램프의 내부에는 다이오드 또는 엘이디(LED)가 배열된 기판이 내장되는 것인데, 브레이킹에 의해 상기한 기판으로 전원이 인가되면 상기한 다이오드 또는 엘이디가 동시에 점등하여 스탑 램프를 작동시키는 것이다.The inside of the stop lamp is a substrate in which a diode or LED (LED) is arranged. If power is applied to the substrate by braking, the diode or LED is turned on at the same time to operate the stop lamp.
상기와 같은 스탑 램프의 일반적인 구조를 살펴보면, 자동차에 장착할 수 있게 된 케이스를 갖고 있고 그 케이스의 내부에는 다이오드 또는 엘이디가 배열된 기판이 내장되고 있으며, 상기한 다이오드 또는 엘이디의 발광측에는 개방된 케이스의 일측을 마감하는 반사판이 결합되어 있게 된다.Looking at the general structure of the stop lamp as described above, the case has a case that can be mounted on the vehicle, the inside of the case is embedded with a substrate on which the diode or LED is arranged, the case open on the light emitting side of the diode or LED The reflector to close one side of the will be combined.
따라서, 상기한 기판에 전원이 인가되면 상기 기판 내의 다이오드 또는 엘이디가 점등하여 그 빛이 색채를 갖는 반사판을 투과하여 외부에서 빠르게 인지할 수 있는 것이며, 상기한 반사판은 투광이 가능한 합성수지재로 성형되는 것으로서 적색을 갖고 있어, 전체적으로 스탑 램프의 점등시 붉은 색을 발현하게 된다.Therefore, when power is applied to the substrate, the diode or LED in the substrate is turned on so that the light can be quickly perceived from the outside by passing through a reflecting plate having a color, and the reflecting plate is formed of a synthetic resin material that can transmit light. This product has red color and develops red color when the stop lamp is turned on.
그러나, 상기한 바와 같은 일반적인 스탑 램프는 내부 엘이디의 빛이 붉은색의 커버를 통해 투과되는 것으로서, 상기한 커버는 미점등시 내부 엘이디 기판 상의 솔더 마스크의 색상이나 패턴 등이 노출되는 것을 피하기 위한 것으로서, 붉은 색의 커버에 의한 스탑 램프의 외관은 고급스럽지 못한 것이다.However, the general stop lamp as described above is to transmit the light of the inner LED through the red cover, the cover is to avoid the color or pattern of the solder mask on the inner LED substrate when not lit. The appearance of the stop lamp by the red cover is not luxurious.
특히, 상기와 같이 적색 계열의 커버를 투과하여 발현되는 엘이디의 빛은 상기 유색의 커버를 통과하는 동안 상당량이 감소하여 고휘도로 발색되지 못하므로 반사율이 떨어져 시인성이 저하되는 문제점이 있는 것이다.In particular, the light of the LED that is expressed through the red cover as described above is significantly reduced during the passage of the colored cover, so that the color is not emitted with high brightness, there is a problem that the visibility is lowered visibility is lowered.
본 발명은 전기한 바와 같은 문제점을 개선하고자 안출된 것으로서, 엘이디가 부착되는 원판의 일측 전면에 크롬도금층을 형성하되, 그 크롬도금층은 엘이디를 납땜하기 위한 스루홀(Through Hole)과 완전히 분리 및 절연되게 형성함으로써,The present invention has been made to improve the problems as described above, and form a chromium plating layer on the front side of the disk to which the LED is attached, the chromium plating layer is completely separated and insulated from the through-hole for soldering the LED By forming
엘이디의 점등시 그 빛이 상기한 크롬도금층에 의해 고휘도로 반사되어 외부에서 관측시 보다 우수한 발광 효율을 기대하게 됨은 물론 그에 따른 시인성의 향상을 얻을 수 있는 것이며, 크롬도금층에 의해 기판 상의 솔더마스크(Solder mask) 및 회로 패턴(Pattern), 원판 자체의 색감이나 무늬 등이 전혀 노출되지 아니하므로 클리어 상태의 커버를 사용할 수 있어 더욱 고급스럽고 미려한 이미지를 갖는 자동차의 스탑 램프용 엘이디 기판의 제조방법을 제공함에 본 발명의 목적이 있는 것이다.When the LED is turned on, the light is reflected by the above-described chromium plating layer with high brightness, so that better luminous efficiency can be expected when observed from the outside, and the visibility can be improved accordingly, and the solder mask on the substrate can be obtained by the chromium plating layer. Solder mask), circuit pattern (Pattern), color and pattern of the original plate are not exposed at all, so the cover of clear state can be used, thus providing a manufacturing method of LED substrate for stop lamp of automobile with more luxurious and beautiful image. It is an object of the present invention.
이하, 본 발명의 바람직한 실시예를 설명한다.Hereinafter, preferred embodiments of the present invention will be described.
도 1은 본 발명에 의한 엘이디 기판의 전체도이다.1 is an overall view of an LED substrate according to the present invention.
본 발명에 따른 제조방법은 우선, 양면에 동박판이 형성된 원판상에 스루홀을 천공하고, 천공된 스루홀을 통해 상,하 동박판이 통전되게 스루홀의 내벽을 도금한 후,In the manufacturing method according to the present invention, first, through the hole formed on the plate formed with the copper foil on both sides, and through the through hole to plate the inner wall of the through hole so that the upper and lower copper plate is energized,
상기한 원판의 일면 전체에 드라이필름을 부착 형성하고, 상기한 드라이필름은 스루홀의 주변에 자외선을 쏘여 도우넛 형상의 필름경화부를 형성하며,The dry film is attached to the entire surface of the disc, and the dry film forms a donut-shaped film hardening part by shooting ultraviolet rays around the through hole.
드라이필름은 상기한 필름경화부를 제외한 전체를 용해 제거한 후, 그 드라이필름의 제거를 통해 노출되는 일측 동박판의 전체면과 스루홀부분에 동도금과 석도금을 순차 수행하며,After the dry film is completely dissolved and removed except for the film curing unit, copper plating and tin plating are sequentially performed on the entire surface and through hole of one copper foil plate exposed through removal of the dry film.
경화된 도우넛 형상의 드라이필름을 제거한 후 해당 부분의 동박판 만을 부식 제거하여 절연상태의 원판기재가 노출됨에 따라 동박판 전체와 스루홀 간의 비통전부가 형성되게 하고,After removing the hardened donut-shaped dry film, only the copper foil of the corresponding part is removed by corrosion so that the non-conductive part is formed between the entire copper plate and the through hole as the original base material is exposed.
상기 석도금층을 용해 제거한 상태에서 전기적 분리 상태의 스루홀을 제외한 동박판의 전체에 크롬도금층을 형성한 후, 상기 스루홀에는 박막의 납을 올려 완성하는 것이다.After forming the chromium plating layer on the entire copper plate except the through-holes in the electrically separated state in the state in which the stone plating layer is dissolved and removed, the lead-through of the thin film is placed on the through-holes.
이때, 상기한 크롬도금을 수행하기 전 그 원판 일측의 동박판 전체에 니켈 도금층을 형성하는 경우에는 니켈 도금층에 의해 상기한 크롬 도금층이 보다 균일하고 매끄럽게 형성되게 할 수도 있는 것이다.In this case, when the nickel plating layer is formed on the entire copper foil on one side of the disc before the chromium plating is performed, the chromium plating layer may be more uniformly and smoothly formed by the nickel plating layer.
도면 중 미설명 부호 10은 엘이디이다.In the figure,
이상과 같은 자동차의 스탑 램프용 엘이디 기판 및 그 제조방법에 대한 제조 공정별 상세한 설명은 다음과 같다.Detailed description for each manufacturing process of the LED substrate for the stop lamp of the vehicle and the manufacturing method as described above are as follows.
일반적인 회로기판용 원판(2)은 양면에 동박판(1)(1')이 형성되어 있는 것인데, 이와 같은 원판(2)을 이용하여 양면 회로기판을 완성할 수 있는 것이다.In the general circuit board
즉, 상기한 동박판(1)(1')을 갖는 원판(2) 상에 엘이디를 삽입하여 납땜하기 위한 스루홀을 도 2a의 도시와 같이 천공한다. 이와 같은 스루홀은 통상적으로 드릴날에 의해 천공하거나 동시에 다수 개의 천공핀을 이용하여 프레스에 의해 천공하기도 한다.That is, a through hole for inserting and soldering an LED onto the
이와 같이 스루홀(3)(3')이 형성되면 상기한 스루홀(3)(3')의 내벽에 도전층을 형성하기 위한 스루홀 내벽 도금을 수행함에 따라 상부면의 동박판(1)과 하부면의 동박판(1')이 내벽 도금된 스루홀(3)(3')에 의해 통전 상태가 되게 하는 것이다.As such, when the
이렇게 완성된 원판(2)의 일면 즉, 상부면 전체에 도 2b의 도시와 같이 드라이필름(4)을 부착한 후, 도 2c의 도시와 같이 상기한 스루홀(3)(3') 주변만을 도우넛 형상으로 자외선을 쏘여 해당부분의 드라이필름이 도우넛 형상으로 경화되게 한다.After attaching the
이와 같이 상기한 드라이필름이 스루홀의 주변에 도우넛 형상으로 경화되면, 용해제에 의해 상기한 비경화상태의 드라이필름 만을 제거하면 스루홀 주변에 도우넛 형상으로 경화된 드라이필름만이 각각 부착 형성된 상태를 갖게 된다.As described above, when the dry film is cured in a doughnut shape around the through hole, only the dry film cured in the form of the doughnut in the periphery of the through hole is formed by removing only the non-hardened dry film by a solvent. do.
이후, 상기한 원판 일면 전체에 전기적인 통전성을 향상시키기 위한 동도금을 수행하고, 동도금층이 형성된 원판 전체에 산화방지용 석도금층을 재차 수행하 게 되는 것인데, 상기한 동도금층과 석도금층은 경화된 드라이필름이 부착된 부분에는 형성되지 아니한다.Subsequently, copper plating is performed on the entire surface of the original plate to improve electrical conductivity, and the anti-oxidation stone plating layer is performed on the entire plate on which the copper plating layer is formed. The copper plating layer and the stone plating layer are hardened dry. It is not formed in the part where the film is attached.
이러한 상태에서 상기한 스루홀(3)(3')의 주변에 도우넛 형상으로 경화된 드라이필름을 용해 제거한 후, 그 드라이필름의 제거에 의해 노출되는 도우넛 형상의 동박판을 부식(에칭)에 의해 제거하게 되면 유리섬유 등으로 된 절연재의 원판기재가 노출되므로 도 2d의 도시와 같이 스루홀이 동박판 전체와 전기적으로 완전히 분리되는 비통전부(5)가 형성되는 것이다.After dissolving and removing the donut-shaped hardened dry film around the through-
이때, 상기와 같은 동박판의 제거공정시 상기와 같이 선행된 석도금층에 의해 그 내층인 동도금층과 동박판에는 약품에 의한 산화 및 부식의 영향이 최소화되므로 상기한 석도금층은 내부의 전기적 도금층을 보호하는 역할을 하게 된다.At this time, since the influence of oxidation and corrosion caused by chemicals is minimized in the copper plating layer and the copper plate, which are the inner layers, by the above-described stone plating layer during the removal process of the copper foil as described above, the above-described plating layer may be formed of an electroplating layer therein. It will protect you.
따라서, 상기와 같이 부식에 의해 도우넛 형상의 비통전부(5)를 형성한 후에는 상기의 석도금층을 용해 제거하여 동도금된 전체면과 스루홀부가 노출되게 하면 되는 것이다.Therefore, after the donut-shaped
이와 같은 상태는 동도금된 전체면과 스루홀이 전기적으로 완전히 분리되어 있으므로 도 2e의 도시와 같이 상기 동도금된 전체면에 전기분해에 의한 크롬도금을 수행하게 되면 상기한 스루홀은 전기적 단락부이므로 도금이 이루어지지 아니하고 그 스루홀과 도우넛 형상의 비통전부를 제외한 전체면 만이 크롬도금층을 갖게 된다.In such a state, since the entire surface of the copper plated and the through hole are electrically separated completely, when the chromium plating is performed by electrolysis on the entire surface of the copper plated as shown in FIG. This is not done and only the entire surface except the through-hole and the donut-shaped non-conductive portion has a chromium plating layer.
또한, 상기와 같은 상태에서 그 스루홀 부분에는 납을 올려 이를 통해 부품의 납땜이 용이하도록 전처리 공정을 수행함으로써 본 발명에 의한 기판이 완성되 는 것이다.In addition, in the above state, the through-hole portion is subjected to a pretreatment process to facilitate the soldering of the parts through the lead, thereby completing the substrate according to the present invention.
따라서, 상기한 크롬도금층(6)이 외부를 향하도록 사용되는 본 발명 엘이디 기판은 그 크롬도금층(6) 자체의 반사효율이 매우 뛰어나 도 3의 도시와 같이 엘이디(10)가 삽입된 상태의 기판에 전원이 인가되어 이들이 발광하게 되면 그 엘이디(10)의 빛은 상기한 크롬도금층(6)의 고도한 반사효율에 의해 더욱 우수한 발광력을 갖게 되는 것이다.Therefore, the LED substrate of the present invention, wherein the
특히, 본 발명에 의한 엘이디 기판을 제조함에 있어 상기한 크롬 도금 공정 전에 원판 일측의 동박판 전면에 니켈 도금층을 형성하는 경우 니켈 도금층의 표면에 크롬 도금층이 보다 균일하고 매끄럽게 형성되므로 보다 우수한 품질의 제품을 양산할 수도 있는 것이다.Particularly, in the manufacture of the LED substrate according to the present invention, when the nickel plating layer is formed on the entire surface of the copper plate on the one side of the original plate before the chromium plating process, the chromium plating layer is more uniformly and smoothly formed on the surface of the nickel plating layer, so that the product of higher quality. You can also mass-produce.
이와 같이 본 발명 자동차의 스탑 램프용 엘이디 기판의 제조방법은, 엘이디의 점등시 그 빛이 상기한 크롬도금층에 의해 고휘도로 반사되어 외부에서 관측시 보다 우수한 발광 효율을 기대하게 됨은 물론 그에 따른 시인성의 향상을 얻을 수 있는 것이며, 크롬도금층에 의해 기판 상의 솔더마스크(Solder mask) 및 회로 패턴(Pattern), 원판 자체의 색감이나 무늬 등이 전혀 노출되지 아니하므로 클리어 상태의 커버를 사용할 수 있어 더욱 고급스럽고 미려한 이미지를 갖는 것이다.As described above, in the method of manufacturing an LED substrate for a stop lamp of an automobile according to the present invention, when the LED is turned on, the light is reflected by the chromium plating layer with high brightness, and thus, better luminous efficiency is expected when viewed from the outside, and accordingly, It is possible to obtain an improvement, and since the chrome plating layer does not expose the solder mask, the circuit pattern, and the original color or pattern of the original plate, the clear cover can be used. It has a beautiful image.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100932180B1 (en) | 2007-10-12 | 2009-12-16 | 주식회사 이랜텍 | Housing for fixing light emitting means such as auxiliary stop for vehicle and manufacturing method thereof |
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