KR100812514B1 - Compact broadband integrated active module for radar and communication systems - Google Patents

Abstract

An integrated module 14 for an active antenna assembly is disclosed. The integrated module is switchable between receive mode and transmit mode, and includes active elements and dual input wideband baluns 34. Active elements include amplifiers 26, 36 and micro electro-mechanical system (MEMS) switches 22, 24. The integrated module is employed to be placed directly behind the copier of the antenna array.

Active Antenna Assemblies, Integrated Modules, MEMS Switches, Amplifiers, Copiers, Baluns

Description

Compact Broadband Integrated Active Modules for Radar and Communication Systems {COMPACT, WIDE-BAND, INTEGRATED ACTIVE MODULE FOR RADAR AND COMMUNICATION SYSTEMS}

The present invention relates generally to an integrated active module for use in a radio frequency (RF) system, and more particularly to a radiator to combine RF energy from a transmitter and / or a receiver. An integrated active module, which may include an assembly having wideband baluns, amplifiers, and MEMS (micro-electro-mechanical systems) switches disposed together.

A wide variety of antennas are used to transmit and / or receive signals (eg, RF signals) at microwave and / or millimeter wave frequencies. Primarily, these antennas are formed of a plurality of radiators. Each copier may be associated with a transmitter used to generate signals to be transmitted by the antenna and a receiver used to process the signals received by the antenna. Many transmit / receive (TR) modules are provided with an amplifier for the transmit path and an amplifier for the receive path.

The TR module may include switches used to select which of the receiver or transmitter is coupled to the copier. In the past, switches have been implemented by electromechanical devices such as PIN diodes, gallium arsenide (GaAs) field effect transistors (FETs), latching circulators, and relays.

Circuit losses that can degrade system performance are inherent problems in RF transceiver circuits. Factors contributing to circuit loss include, for example, conductor loss, dielectric material loss, and the like. Conventional attempts to compensate for circuit losses and to improve system performance include providing additional signal gain by the TR module amplifiers. However, providing additional gain in the TR module amplifier results in an increase in the size and power consumption of the TR module. In addition, heat loss problems may arise when high gain amplifiers are employed.

Also, since the loss increases with increasing length of the conductor coupling the TR module and the copier, the position of the TR module relative to the copier may be a problem. The size of the TR module elements affects the placement of the TR module. In other words, as the size of the TR module increases, the TR module can be placed further from the copier to accommodate each TR module in the multiple copier antenna.

Accordingly, there is a need in the art for a high performance integrated copier / TR module having a compact size for RF applications.

According to one aspect of the invention, the invention relates to an integrated module for an active antenna copier assembly, said integrated module being switchable between a receive mode and a transmit mode. The integrated module is coupled to the output of a first amplifier amplifying the signals to be transmitted by the copier, a second amplifier amplifying the signals received by the copier, a dual input wideband balun, a balun and a first amplifier. A receive line coupled to the input of the transmit line, the balun and the second amplifier, a first MEMS switch that shunts the receive line to ground when the integrated module is in transmit mode, and the integrated module may be in receive mode And a second MEMS switch to shunt the transmission line to ground.

According to another aspect of the invention, the invention relates to an active antenna copier assembly. The assembly may include an integrated module and a copier disposed behind the copier and switchable between a receive mode and a transmit mode. The integrated module includes a high power amplifier (HPA) for amplifying the signals to be transmitted by the copier; A low noise amplifier (LNA) for amplifying the signals received by the copier; A wideband balun having at least a first arm and a second arm each of which is coupled to the copier via a pair of probes that are 180 degrees out of phase with respect to the copier; A receive line coupled to the input of the balun and the LNA; A transmission line coupled to the output of the balun and the HPA; A receive MEMS switch for selectively coupling the receive line to ground when the integrated module is in a transmit mode; And a transmit MEMS switch for selectively coupling the transmit line to ground when the integrated module is in a receive mode.

Referring to the following description and drawings, these and other features of the present invention will become apparent.

1 is an exploded assembly view of an antenna copier assembly including an antenna copier and an integrated module according to the present invention.

2 is a schematic diagram illustrating a first embodiment of an integrated module;

3 is a block diagram of an exemplary MEMS switching unit suitable for use as part of the integrated module of FIG.

4A is a cross-sectional view of a MEMS switch configured for use with the integrated module of FIG. 2 in a closed state, taken along line 4-4 of FIG.

4B is a cross-sectional view of a MEMS switch configured for use with the integrated module of FIG. 2 in an open state, taken along line 4-4 of FIG.

5 is an exemplary antenna array comprising a matrix of antenna copier assemblies according to the present invention.

6 is a schematic diagram illustrating a second embodiment of an integrated module.

7 is a block diagram of an exemplary MEMS switching unit suitable for use as part of the integrated module of FIG. 6.

8A is a cross-sectional view of a MEMS switch configured for use with the integrated module of FIG. 6 in a closed state, taken along line 8-8 of FIG.

8B is a cross-sectional view of a MEMS switch configured for use with the integrated module of FIG. 6 in an open state, taken along line 8-8 of FIG.

In the following detailed description, whether or not used in different embodiments of the present invention, similar configurations are denoted by the same reference numerals. In order to explain the invention clearly and concisely, the drawings are not necessarily to scale, certain features may be presented in a somewhat schematic form.

One feature of the invention is an integrated module for an active antenna copier assembly. The integrated module is switchable between a receive mode and a transmit mode, the first amplifier amplifying the signals to be transmitted by the copier, the second amplifier amplifying the signals received by the copier, the dual input wideband balun, the output of the first amplifier. A transmission line for directing signals, a reception line for directing input signals to an input of a second amplifier, a first MEMS switch for shunting the receiving microstrip line to ground when the integrated module is in transmission mode; And a second MEMS switch for shunting the transmission strip line to ground when the integrated module is in a receive mode.

Another aspect of the invention relates to an integrated module for an active antenna copier assembly. The assembly includes a copier, a balun, amplifiers, and a MEMS switch module disposed behind the copier. The module is switchable between a receive mode and a transmit mode and includes an HPA for amplifying the signals to be transmitted by the copier, an LNA for amplifying the signals received by the copier, and a broadband balun having a receive path and a transmit path. . The signals received from the copier are coupled to the balun through a pair of probes 180 degrees out of phase. The balun combines, resonates, and couples the signals to a receive line that directs energy to the input of the LNA. The transmission line combines the energy from the output of the HPA into a balun whose energy (in the form of a signal to be transmitted) is separated into two signals having a 180 degree phase difference. Two signals having a phase difference of 180 degrees are alternately supplied to the copier through the probes. The receive MEMS switch selectively couples the balun's receive path and receive line to ground when the integrated module is in transmit mode, and the transmit MEMS switch transmits the balun's transmit path and transmit line when the integrated module is in receive mode. Is selectively coupled to ground.

1, an exploded view of an integrated active antenna copier assembly 10 is shown. Copier assembly 10 includes a copier 12 and an integrated module 14. It should be understood that the plurality of copier assemblies 10 may be used in conjunction with each other to form an array antenna for use in applications such as scanning, communication, and the like. In the embodiment described above, the copier 12 has a wideband, widescan, low profile, multi-layer, high dielectric, circular shape. (Or cylindrical) copiers. In one embodiment, copier 12 may be an X-band copier, and in other embodiments, the copier may be a dual frequency copier (eg, X-band and C-band). The copier 12 shown in FIG. 1 has a linear polarization in which the input probe 16a has a 180 degree phase difference from the other probe 16b. The invention is not limited to the copier 12 described above, and other types of copiers may be used as part of the copier assembly 10, such as spiral copiers, vivaldi copiers, and the like. In one embodiment, copier 12 is a circular patch printed onto a dielectric cylinder.

The integrated module 14 is located directly behind the copier 12. This configuration increases the proximity of the integrated module 14 to the copier 12. Thus, the length of the conductors used to couple the integrated module 14 to the copier 12 can be kept to a minimum, and the conductor losses can be minimized. The integrated module 14 also includes amplifiers for the transmit and receive paths. The integrated module 14 also includes a wideband, dual input balun. In the above embodiment, the copier 12 is coupled to the outputs of the integrated module 14 by a pair of probes 16. The radome 18 and dielectric layer 20 may be disposed on top of the copier 12 as in the prior art. In one embodiment, a parasitic patch (not shown) for increasing the bandwidth is provided between the copier 12 and the dielectric layer 20.

2, a first embodiment of an integrated module 14 is shown. In order to place the integrated module 14 directly behind the copier 12, the size of the integrated module 14 is a problem. As will be explained in more detail below, the integrated module 14 uses MEMS switches to obtain a compact integrated module 14 configuration. More specifically, integrated module 14 incorporates MEMS switches and other active devices (eg, amplifiers) with baluns to obtain a compact multi-layer microwave circuit.

The integrated module 14 includes a first MEMS switch used in connection with coupling the transmitter (not shown) to the copier 12. This MEMS switch will be referred to herein as the transmit MEMS switch 22. The integrated module 14 also includes a second MEMS switch used in connection with coupling the receiver (not shown) to the copier 12. This MEMS switch will be referred to herein as the receiving MEMS switch 24.

The integration module 14 includes an HPA 26 that is coupled to receive and amplify the signals generated by the transmitter before the signals are connected to the transmitting copier 12. The connection between the HPA 26 and the transmitter may be made, for example, by the microstrip line 28. The output of the HPA 26 is coupled to the transmit microstrip line 30. As described below, the transmission microstrip line 30 may be considered part of the transmission path used to couple the outgoing signal to the broadband balun 34. The balun 34 includes a first arm pair 32, 33 and a second arm pair 42, 43. The arms 32 of the balun 34 are connected to one of the probes 16, and the arm 42 of the balun 34 is connected to the other of the probes 16.

The integrated module 14 also includes an LNA 36 which is coupled to receive and amplify the signals received by the copier 12 before the signals are connected to a receiver for further processing. The connection between the LNA 36 and the receiver can be made, for example, by the microstrip line 38. The input of LNA 36 is coupled to the receiving microstrip line 40. As discussed below, the receive microstrip line 40 may be considered part of the receive path used to couple the incoming signal from the balun 34 to the LNA 36.

In addition to placing the integrated module 14 directly behind the copier 12, it also integrates active devices (MEMS switches 22, 24, HPA 26, and LNA 36) and balun 34. This improves system performance over conventional designs. That is, circuit losses can be minimized, and the gains from the LNA 36 and the HPA 26 contribute to improved performance.

As mentioned above, the balun 34 includes a first pair of inner connecting arms 32 and 33 and a pair of second inner connecting arms 42 and 43. The pairs of arms 32/33, 42/43 form an "L" shaped structure arranged oppositely. Slot 44 separates pairs of arms 32/33, 42/43. In the above embodiment, each arm 32, 33, 42, and 43 of the balun 34 are quarter wavelength (1/4 lambda) portions. The output of the arm 42 is via the copier through the other one of the probes 16 at a position 180 degrees out of phase from the arm 32 coupled to the copier 12 by one of the probes 16. 12).

The transmit microstrip line 30 and the receive microstrip line 40 are disposed on top of the balun 34. In the above embodiment, the transmit microstrip line 30 extends from the transmit MEMS switch 22 toward the receive MEMS switch 24, and the receive microstrip line 40 extends from the receive MEMS switch 24 to the transmit MEMS switch. Extend toward the switch 22. The transmit microstrip line 30 and the receive microstrip line 40 can be separated into several line widths.

In the above embodiment, the transmission microstrip line 30 is electrically coupled to the arms 33, 43 of the balun 34. The transmission microstrip 30 extends from the transmission MEMS switch 22 and is disposed above and separated from the arm 33 of the balun 34. It also runs along the longitudinal axis of the transmission microstrip line 30 and is disposed above and separated from the arm 43 of the balun 34. As will be described in detail below, for the installation of standing wave resonators when the integrated module 14 is in the receive mode, the end of the transmitting MEMS switch 22 (ie the arm of the balun 34) from the center of the slot 44. The length of the transmission microstrip line 30 measured to the end of the transmission microstrip line 30, which is the end disposed above 43, is 1/4 wavelength (i.e., 1/4 lambda). The length of the transmission microstrip line 30 from the slot 44 to the transmission MEMS switch 22 is insignificant for the operation of the integrated module 14.

Similarly, the receiving microstrip line 40 is electrically coupled to the arms 43, 33 of the balun 34. The receive microstrip line 40 extends from the receive MEMS switch 24 and is disposed above and separated from the arm 43 of the balun 34. It also runs along the longitudinal axis of the receiving microstrip line 40 and is disposed above and separated from the arm 33 of the balun 34. As described below, for the purpose of installing the standing wave resonator when the integrated module 14 is in the transmission mode, the end of the receiving MEMS switch 24 from the center of the slot 44 (ie, the arm of the balun 34) The length of the receiving microstrip line 40 measured to the end of the receiving microstrip line 40, the end disposed above 33) is 1/4 wavelength (i.e., 1/4 [lambda]). The length of the receive microstrip line 40 from the slot 44 to the receive MEMS switch 24 is insignificant for the operation of the integrated module 14.

In operation, the integrated module 14 may be placed in a transmit mode and a receive mode. In the transmit mode, the integrated module 14 couples the signals produced by the transmitter to the copier 12 and shunts the receive path to ground line 46. As described below, shunt is established by actuation of the receiving MEMS switch 24. The shunt from the balun 34 and the receiving microstrip line 40 to the ground line 46 provides maximum energy transfer through the balun 34 along the transmission path (ie, the conducting path from the transmitter to the copier 12). Form a virtual short at switch 24 for the allowable receive path (ie, conductive path from copier 12 to receiver).

In the receive mode, the integrated module 14 couples the signals received by the copier 12 to the receiver and shunts the transmit path to ground line 48. As will be described later, the shunt is established by actuation of the transmission MEMS switch 22. The shunt of the balun 34 and the transmit microstrip line 30 to ground line 48 is a virtual short-circuit at the switch 22 for the transmit path that allows maximum energy transfer through the balun 34 along the receive path. To form.

In addition to the aforementioned operation of the integrated module 14, the shunt of the receiving microstrip line 40 to the ground line 46 during transmission transmits (eg, isolates) the LNA 36 from the transmitted signals. Similarly, shunting of the transmitting microstrip line 30 to ground line 48 during the reception protects (eg, isolates) the HPA 26 from received signals.

Receive MEMS switch 24 and transmit MEMS switch 22 function together as a single pole, double throw (SPDT) switch. When integrated module 14 is in transmit mode, receive MEMS switch 24 functions as an isolator to block incoming signals (e.g., jamming or countermeasures).

Referring to FIG. 3, a block diagram of an exemplary MEMS switching unit 50 that can be used as the transmit MEMS switch 22 and / or the receive MEMS switch 24 of the integrated module 14 is shown. Note that the configuration of the connection pads and the conductive members shown in FIG. 3 can be changed for use in the integrated module 14. 4A and 4B show a cross-sectional view of a receive MEMS switch 24 manufactured using the general configuration of MEMS switching section 50 but configured for use within integrated module 14. In the above embodiment, the cross section of the transmitting MEMS switch 22 may generally be a mirror image of the cross section of the receiving MEMS switch 24. Therefore, the transmission MEMS switch 22 will not be described separately. 4A shows the receive MEMS switch 24 in the closed state (also referred to as the on state to generate the shunt described above), while the cross section of FIG. 4B shows the receive MEMS switch in the open state (also referred to as the off state). Note that (24) is shown.

In the first embodiment of the integrated module 14, the MEMS switches 22 and 24 may be implemented by shunt cantilever MEMS switches such as the MEMS switch 50. Hereinafter, while the features and characteristics of the MEMS switching unit 50 will be described, a detailed additional description of a suitable switching unit may be found in US Pat. No. 6,046,659, which is a publication, which is incorporated herein by reference in its entirety.

The MEMS switching unit 50 can be seen as an SPST switch device. More specifically, the MEMS switching unit 50 may be implemented by a MEMS switch that interrupts signal transmission by shunting (or "shorting") the signal conduction path to the ground state.

The switch 50 includes an armature 52 attached to the first signal transmission line 54 at the adjacent end 56 of the armature 52. The distal end (or contact end 58) of the armature 52 is located above the second signal transmission line 60. A substrate bias electrode 62 may be disposed below the armature 52, and when the armature 52 is in an open state, the armature 52 may be formed of the substrate bias electrode 62 and the first through an air gap. 2 is spaced apart from the transmission line 60.

The conducting dimple, or contact 64, projects in the closed state downwardly from the contact end 58 of the armature 52 such that the contact 64 contacts the second signal transmission line 60. The contact 64 is connected to the conductive transmission line 66 such that the first signal transmission line 54 and the second signal transmission line 60 are electrically coupled to each other by a conductive path when the armature 52 is in the closed state. It is electrically connected to the 1st signal transmission line 54 by this. The signals may then pass through the MEMS switching unit 50 from the first signal transmission line 54 to the second signal transmission line 60 (or vice versa). When the armature 52 is in the open state, the first signal transmission line 54 and the second signal transmission line 60 are electrically isolated from each other.

Above the substrate bias electrode 62, the armature 52 is provided with an armature bias electrode 68 (the armature bias electrode 68 will have multiple segments on either side of the transmission line 66 as described above). Or have a portion disposed below the transmission line 66 and separated there from by an insulating layer). The substrate bias electrode 62 is electrically coupled to the substrate bias pad 70. Armature bias electrode 68 (and portions thereof) is electrically coupled to armature bias pad 72 through at least one armature conductor 74. When an appropriate voltage potential is applied between the substrate bias pad 70 and the armature bias pad 72, the armature bias electrode 68 is attracted to the substrate bias electrode 62 to open the MEMS switch 50 in an open state (eg, , As shown in FIG. 4B) from the closed state (eg, as shown in FIG. 4A).

Armature 52 may include structural members 76 for supporting components such as contact 64, transmission line 66, bias electrode 68, conductor 74, and the like. Contact 64 and transmission line 66 may be formed of the same material layer or different material layers.

As shown in FIGS. 4A and 4B, when the MEMS switching unit 50 is used as the MEMS switches 22 and 24 in the integrated module 14, the first signal transmission line 54 is a microstrip line. (Receive microstrip line 40 to receive MEMS switch 24 and transmit microstrip line 30 to transmit MEMS switch 22). Similarly, second transmission line 60 is implemented as ground lines (ground line 46 for receiving MEMS switch 24 and ground line 48 for transmitting MEMS switch 22). Thus, when the armature 52 of the transmitting MEMS switch 22 and the receiving MEMS switch 24 is in the closed state, the microstrip lines 30 or 40 are divided into respective ground lines 48 or 46. The armature of the transmitting MEMS switch 22 or the receiving MEMS switch 24 is in an open state, and the microstrip lines 30 or 40 are isolated from each ground line 48 or 46.

With continued reference to FIGS. 4A and 4B, a receive indicating each of a closed state (eg, when the integrated module 14 is in transmit mode) and an open state (eg, when the integrated module 14 is in receive mode) MEMS switch 24 is shown. The receiving microstrip line 40 is disposed above and separated from the arms 43, 33 of the balun 34. Insulating layer 78 isolates receiving microstrip line 40 from arms 43 and 33. The transmission MEMS switch 22 is likewise arranged with the transmission microstrip line 30 and the arms 33, 43. The aforementioned structures (eg, balun 34, microstrips 30 and 40, MEMS switches 22 and 24, HPA 26, and LNA 36) may be disposed on substrate 82. have.

To apply the appropriate signals to the armature bias pad 72 and the substrate bias pad 70 of both the transmit MEMS switch 22 and the receive MEMS switch 24 such that the integrated module 14 is designated as a receive mode or a transmit mode. A controller (not shown) can be used. In one embodiment, the controller may be a digital microprocessor.

Referring to FIG. 5, an exemplary antenna array 84 is shown that consists of a 9 × 9 matrix of antenna copiers 12. It should be understood that the present invention is also applicable to antenna arrays of other sizes, such as a phased array antenna with multiple radiating elements. For example, by appropriate excitation of the input ports of the radiating elements, a dual-linear polar antenna or a dual-circular polar antenna can be obtained.

An integrated module 14 is disposed behind each antenna copier 12 of the antenna array 84 to form the antenna copier assembly 10 (FIG. 1). In order to clarify the antenna array 84, only one integrated module 14 is described. In addition, the integrated module 14 is described as the side of the antenna array 84. However, as described herein and in FIG. 1, the integration module 14 may be disposed immediately behind the copier 12 to minimize the length of the conductors that couple the integration module 14 and the copier 12. .

Referring to FIG. 6, a second embodiment of an integrated module 14 ′ is shown. In operation, the second embodiment of the integrated module 14 'functions in the same manner as the first embodiment of the integrated module 14, and is sized to be disposed immediately behind the copier 12. As shown in FIG.

Like the integrated module 14, the integrated module 14 ′ includes a balun 34 ′ with an arm 32 ′ and an arm 42 ′ disposed oppositely and separated by a slot 44 ′. However, in the integrated module 14 ', the balun 34' is arranged as a co-planar wave guide (CPW). The integrated module 14 'also includes an HPA 26' electrically connected to the transmitter by conductor 28 'and an LNA 36' connected to the receiver by conductor 38 '. The output of HPA 26 'and the output of LNA 36' are connected to transmit CPW line 30 'and receive CPW line 40', respectively. The transmit CPW line 30 'and the receive CPW line 40' may be considered part of the transmit path and receive path, respectively.

The transmit CPW line 30 'and the receive CPW line 40' are electrically coupled to the balun 34 '. In the above-described embodiment, the receiving strip line 40 'and the balun 34' are arranged in the same plane. In the second embodiment of the integrated module 14 ', the transmit and receive MEMS switches 22', 24 'are capacitive membrane MEMS switches. Suitable capacitive membrane MEMS switches to be used as transmit MEMS switch 22 'and / or receive MEMS switch 24' are described in detail in US Pat. No. 6,391,675, which is a published document incorporated herein by reference in its entirety.

7, 8A, and 8B, the connection to receive MEMS switch 24 'and receive CPW line 40' and arm 42 'is shown in detail. As will be apparent to those skilled in the art, similar configurations are used for the arm 32 'of the balun 34', the transmit MEMS switch 22 ', and the transmit CPW line 30'. Therefore, the transmission MEMS switch 22 'will not be described separately.

The receive MEMS switch 24 'includes a conductive membrane 86 that spans between the non-conductive posts 88 and the bias pad 90 disposed on the arms 42' of the balun 34 '. do. Below the membrane 86 is arranged an electrode 92 which forms part of the receiving CPW line 40 '(alternatively, although the electrode 92 is separated from the MEMS CPW line 40', the receiving 92 Connected to strip line 40 '). The dielectric layer 94 is placed on the electrode 92. As described, the above-described structure is formed on the substrate 96.

Bias pad 90, and thus membrane 86, is connected to a reference voltage, such as ground potential. In the off state of the receiving MEMS switch 24 ′ (eg, as shown in FIG. 8A), an air gap exists between the membrane 86 and the dielectric layer 94. When a DC bias voltage is applied to the electrode 92 so that a voltage difference occurs between the membrane 86 and the electrode 92, the receiving MEMS switch 24 ′ is applied to the membrane (until the membrane 86 is placed on the dielectric layer 94). 86 will toggle on, deflected downwards. This contact is a capacitive element that effectively short-circuits or shunts high frequency signals from the arm 42 'of the balun 34' and the receiving CPW line 40 'to the membrane 86 and to ground in the above-described embodiment. To form a bond.

In the transmit mode, the transmit MEMS switch 22 'is placed in an off state to allow signals generated by the transmitter to be coupled to the copier 12, and the receive MEMS switch 24' is placed in an on state to provide a balun 34 '. Shunt arm 42 'and receive CPW line 40' to ground. In the receive mode, the transmit MEMS switch 22 'is placed in an on state to divide the arm 32' of the balun 34 'and the transmit CPW line 30' to ground, and the receive MEMS switch 24 ' It is placed in the off state to allow signals received by the copier 12 to be coupled to the receiver.

Although not shown, a controller for applying appropriate signals to electrodes 92 of both transmit MEMS switch 22 'and receive MEMS switch 24' is provided to designate integrated module 14 'in receive or transmit mode. Can be used.

While specific embodiments of the invention have been described above, it should be understood that the invention is not limited to the scope thereof, but includes all changes, modifications and equivalents derived from the spirit and terminology of the claims appended hereto. .

Claims (10)

As an integrated module 14 for an active antenna radiator assembly 10, switchable between a receive mode and a transmit mode, A first amplifier 26 for amplifying the signals to be transmitted by the copier; A second amplifier (36) for amplifying the signals received by the copier; Dual input broadband balun 34; A transmission line 30 coupled to the balun and the output of the first amplifier; A receive line (40) coupled to the input of the balun and the second amplifier; A first MEMS switch (24) for shunting the receive line to ground when the integrated module is in a transmit mode; And A second MEMS switch 22 that shunts the transmission line to ground when the integrated module is in a receive mode Integrated module comprising a. The method of claim 1, And said transmit and receive lines are microstrip lines disposed above said balun. The method according to claim 1 or 2, And the first and second MEMS switches are shunt cantilever MEMS switches. The method of claim 1, Wherein the transmit and receive lines are co-planar wave guide (CPW) lines disposed in the plane of the balun. The method according to claim 1 or 2, And the first and second MEMS switches are capacitive membrane MEMS switches. The method according to claim 1 or 2, The transmission line is configured to function as a virtual short at the second MEMS switch when the integrated module is in a receive mode, And the receive line is configured to function as a virtual short at the first MEMS switch when the integrated module is in a transmit mode. The method according to claim 1 or 2, The balun has an first arm (43) and a second arm (33) spaced by slots. The method of claim 7, wherein The first arm is paired with a third arm 42 to form a first "L" shaped structure, The second arm is paired with a fourth arm (32) to form a second “L” shaped structure disposed opposite the first “L” shaped structure. As an active antenna copier assembly 10, Copier 12; And An integrated module 14 disposed behind the copier and switchable between a receive mode and a transmit mode Including; The integrated module, A high power amplifier (HPA) 26 for amplifying the signals to be transmitted by the copier; A low noise amplifier (LNA) 36 for amplifying the signals received by the copier; Broadband balun 34 having at least a first arm 33 and a second arm 43, each of which is connected to the copier via a pair of probes 16 having a phase difference of 180 degrees relative to the copier. Combined-; A receiving line 40 coupled to the balun and to the input of the LNA; A transmission line 30 coupled to the balun and to the output of the HPA; A receive micro electro-mechanical system (MEMS) switch 24 for selectively coupling the receive line to ground when the integrated module is in a transmit mode; And Transmit MEMS switch 22 that selectively couples the transmit line to ground when the integrated module is in a receive mode. Active antenna copier assembly comprising a. The method of claim 9, The transmission line is configured to function as a virtual short at the transmission MEMS switch when the integrated module is in a reception mode, And the receive line is configured to function as a virtual short at the receive MEMS switch when the integrated module is in a transmit mode.

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