KR100805605B1 - 아크릴계 대전방지 점착제 조성물 - Google Patents
아크릴계 대전방지 점착제 조성물 Download PDFInfo
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- KR100805605B1 KR100805605B1 KR1020060005291A KR20060005291A KR100805605B1 KR 100805605 B1 KR100805605 B1 KR 100805605B1 KR 1020060005291 A KR1020060005291 A KR 1020060005291A KR 20060005291 A KR20060005291 A KR 20060005291A KR 100805605 B1 KR100805605 B1 KR 100805605B1
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- South Korea
- Prior art keywords
- meth
- acrylic
- sensitive adhesive
- adhesive composition
- acrylate
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 53
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 37
- 239000000853 adhesive Substances 0.000 title claims abstract description 36
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 72
- -1 antistatic Substances 0.000 claims abstract description 47
- 150000003839 salts Chemical class 0.000 claims abstract description 24
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 23
- 150000001450 anions Chemical class 0.000 claims abstract description 20
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 12
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 35
- 125000000217 alkyl group Chemical group 0.000 claims description 28
- 239000000178 monomer Substances 0.000 claims description 26
- 229910052757 nitrogen Inorganic materials 0.000 claims description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 22
- 239000004973 liquid crystal related substance Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 150000001768 cations Chemical class 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 9
- 238000004132 cross linking Methods 0.000 claims description 9
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 8
- 239000012948 isocyanate Substances 0.000 claims description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 8
- 239000003522 acrylic cement Substances 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 7
- 229920002554 vinyl polymer Polymers 0.000 claims description 7
- 125000000524 functional group Chemical group 0.000 claims description 6
- 210000002858 crystal cell Anatomy 0.000 claims description 5
- 125000001153 fluoro group Chemical group F* 0.000 claims description 5
- 229920005862 polyol Polymers 0.000 claims description 5
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 239000013522 chelant Substances 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 150000003505 terpenes Chemical class 0.000 claims description 4
- 235000007586 terpenes Nutrition 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 239000008096 xylene Substances 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 claims description 3
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 125000004429 atom Chemical group 0.000 claims description 3
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 claims description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims description 2
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 claims description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 2
- OZDGMOYKSFPLSE-UHFFFAOYSA-N 2-Methylaziridine Chemical compound CC1CN1 OZDGMOYKSFPLSE-UHFFFAOYSA-N 0.000 claims description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 2
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 claims description 2
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 claims description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 2
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 claims description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 2
- 239000013032 Hydrocarbon resin Substances 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 2
- 102000001708 Protein Isoforms Human genes 0.000 claims description 2
- 108010029485 Protein Isoforms Proteins 0.000 claims description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 claims description 2
- WTKZEGDFNFYCGP-UHFFFAOYSA-O Pyrazolium Chemical compound C1=CN[NH+]=C1 WTKZEGDFNFYCGP-UHFFFAOYSA-O 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- FYAMXEPQQLNQDM-UHFFFAOYSA-N Tris(1-aziridinyl)phosphine oxide Chemical compound C1CN1P(N1CC1)(=O)N1CC1 FYAMXEPQQLNQDM-UHFFFAOYSA-N 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 238000012662 bulk polymerization Methods 0.000 claims description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000005442 diisocyanate group Chemical group 0.000 claims description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 claims description 2
- VIBDJEWPNNCFQO-UHFFFAOYSA-N ethane-1,1,2-triol Chemical compound OCC(O)O VIBDJEWPNNCFQO-UHFFFAOYSA-N 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 2
- 229920006270 hydrocarbon resin Polymers 0.000 claims description 2
- ZCQWOFVYLHDMMC-UHFFFAOYSA-O hydron;1,3-oxazole Chemical compound C1=COC=[NH+]1 ZCQWOFVYLHDMMC-UHFFFAOYSA-O 0.000 claims description 2
- CZPWVGJYEJSRLH-UHFFFAOYSA-O hydron;pyrimidine Chemical compound C1=CN=C[NH+]=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-O 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 2
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 claims description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 150000003077 polyols Chemical class 0.000 claims description 2
- UOMUPDCRXJLVGR-UHFFFAOYSA-N propane-1,2,2-triol Chemical compound CC(O)(O)CO UOMUPDCRXJLVGR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical compound C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 claims description 2
- 239000000376 reactant Substances 0.000 claims description 2
- 238000010557 suspension polymerization reaction Methods 0.000 claims description 2
- 125000005207 tetraalkylammonium group Chemical group 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 2
- IUCJMVBFZDHPDX-UHFFFAOYSA-N tretamine Chemical compound C1CN1C1=NC(N2CC2)=NC(N2CC2)=N1 IUCJMVBFZDHPDX-UHFFFAOYSA-N 0.000 claims description 2
- 229950001353 tretamine Drugs 0.000 claims description 2
- 125000001425 triazolyl group Chemical group 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- WWEXBGFSEVKZNE-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=CC2=CC=CC=C21 Chemical compound N=C=O.N=C=O.C1=CC=CC2=CC=CC=C21 WWEXBGFSEVKZNE-UHFFFAOYSA-N 0.000 claims 1
- 229920006223 adhesive resin Polymers 0.000 claims 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 claims 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims 1
- 230000002087 whitening effect Effects 0.000 abstract description 8
- 238000002834 transmittance Methods 0.000 abstract description 6
- 150000001340 alkali metals Chemical class 0.000 abstract description 3
- 150000002892 organic cations Chemical class 0.000 abstract description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 229910010199 LiAl Inorganic materials 0.000 description 8
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- 238000006243 chemical reaction Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 5
- 206010040844 Skin exfoliation Diseases 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
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- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
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- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
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- 230000015572 biosynthetic process Effects 0.000 description 3
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- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
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- 239000004971 Cross linker Substances 0.000 description 2
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- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
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- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
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- 229910013063 LiBF 4 Inorganic materials 0.000 description 1
- 229910013870 LiPF 6 Inorganic materials 0.000 description 1
- 229910012424 LiSO 3 Inorganic materials 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
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- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
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- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229910001496 lithium tetrafluoroborate Inorganic materials 0.000 description 1
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- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
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- 239000001301 oxygen Substances 0.000 description 1
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- 238000001179 sorption measurement Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
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- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
Claims (20)
- 하기 화학식 1로 표시되는 약하게 배위결합하는 음이온 (superweak anion)과 양이온으로 이루어진 염을 포함하는 아크릴계 점착제 조성물.[화학식 1]X+[M(OCR1 aRf (3-a))b(C6F5)(4-b)]-상기식에서,X는 알칼리금속 양이온 또는 질소 오늄 양이온을 나타내고,M은 IIIA족 금속원자를 나타내며,R1은 각각 독립적으로 수소, 알킬, 및 알킬로 치환되거나 비치환된 아릴로 이루어진 군에서 선택되고, a가 2 이상인 경우 R1은 서로 상이할 수 있으며,Rf는 하나 이상의 플루오로로 치환된 알킬을 나타내고,a는 0 내지 3의 정수를 나타내며,b는 1 내지 4의 정수를 나타낸다.
- 제1항에 있어서,(A) 아크릴계 공중합체 100 중량부;(B) 화학식 1로 표시되는 염 0.001 내지 10 중량부; 및(C) 다관능성 가교제 0.01 내지 10 중량부를 포함하는 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제2항에 있어서, 아크릴계 공중합체 (A)는 (메타)아크릴산 에스테르 모노머 90 내지 99.9 중량부; 가교가능한 관능기를 포함하는 비닐계 및/또는 아크릴계 가교성 모노머 0.1 내지 10 중량부; 및 하기 화학식 2의 기능성 모노머 0 내지 5 중량부를 포함하는 것을 특징으로 하는 아크릴계 점착제 조성물.[화학식 2]상기식에서,R2는 수소 또는 알킬을 나타내고,R3는 시아노, 알킬로 치환되거나 비치환된 페닐, 아세틸옥시, 또는 COR4를 나타내며, 여기서 R4는 알킬로 치환되거나 비치환된 아미노 또는 글리시딜옥시를 나타낸다.
- 제3항에 있어서, (메타)아크릴산 에스테르 모노머는 부틸(메타)아크릴레이 트, 2-에틸헥실(메타)아크릴레이트, 에틸(메타)아크릴레이트, 메틸(메타)아크릴레이트, n-프로필(메타)아크릴레이트, 이소프로필(메타)아크릴레이트, t-부틸(메타)아크릴레이트, 펜틸(메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 이소옥틸(메타)아크릴레이트 및 이소노닐(메타)아크릴레이트로 이루어진 군으로부터 선택된 1 종 이상인 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제3항에 있어서, 가교성 모노머는 2-하이드록시에틸(메타)아크릴레이트, 2-하이드록시프로필(메타)아크릴레이트, 4-하이드록시부틸(메타)아크릴레이트, 2-하이드록시에틸렌글리콜(메타)아크릴레이트, 2-하이드록시프로필렌글리콜(메타)아크릴레이트, 아크릴산, 메타크릴산, 아크릴산 이중체, 이타콘산, 말레인산 및 말레인산 무수물로 이루어진 군으로부터 선택된 1 종 이상인 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제3항에 있어서, 화학식 2의 기능성 모노머는 아크릴로니트릴, (메타)아크릴아미드, N-메틸아크릴아미드, 스티렌, 메틸스티렌, 글리시딜(메타)아크릴레이트, 및 비닐아세테이트로 이루어진 군으로부터 선택된 1 종 이상인 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제2항에 있어서, 아크릴계 공중합체 (A)의 중량평균분자량은 400,000 내지 2,000,000인 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제2항에 있어서, 아크릴계 공중합체가 용액중합법, 광중합법, 벌크중합법, 서스펜션중합법, 및 에멀션 중합법으로 이루어진 군으로부터 선택되는 중합방법으로 제조되는 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제1항에 있어서, 화학식 1로 표시되는 염을 구성하는 약하게 배위결합하는 음이온은 Al(OC(CH3)(CF3)2)4 -, Al(OC(CF3)3)4 -, Al(OC(C6H5)(CF3)2)4 -, Al(OC(4-C6H4(tBu))(CF3)2)4 -, Al(OC(C6H5)2(CF3))4 -, Al(OCH(CF3)2)4 -, B(C6F5)3(OCH(CF3)2)-, B(C6F5)3(OCH(CF3)(C6H5))-, 및 B(C6F5)3(OC(CF3)3)- 로 이루어진 군으로부터 선택된 1종 이상인 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제1항에 있어서, 화학식 1로 표시되는 염을 구성하는 질소 오늄 양이온은 비고리형 4급 암모늄; 및 피리디늄, 피리다지늄, 피리미디늄, 피라지늄, 이미다졸륨, 피라졸륨, 티아졸륨, 옥사졸륨, 및 트리아졸륨으로부터 선택된 방향족 암모늄 염으로 구성된 군으로부터 선택된 1종 이상인 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제10항에 있어서, 질소 오늄 양이온은 테트라알킬암모늄 [N+(CnH2n +1)4: n = 1 ~ 8]; N-알킬피리디늄 [N-CnH2n +1-cyc-N+C5H5: n = 4 ~ 16], 1,3-알킬메틸이미다졸륨 [CH3-cyc-(N+C2H2NCH)CnH2n +1: n = 2 ~ 10]; 및 1,2-디메틸-3-알킬이미다졸륨 [CH3-cyc-(N+C2H2NC(CH3))CnH2n +1: n = 2 ~ 10]으로 이루어진 군으로부터 선택된 1 종 이상인 것을 특징으로 아크릴계 점착제 조성물.
- 제2항에 있어서, 다관능성 가교제 (C)는 이소시아네이트계 화합물, 에폭시계 화합물, 아지리딘계 화합물, 및 금속 킬레이트계 화합물로 이루어진 군으로부터 선택된 1 종 이상인 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제12항에 있어서,이소시아네이트계 화합물은 톨루엔디이소시아네이트, 크실렌디이소시아네이트, 디페닐메탄디이소시아네이트, 헥사메틸렌디이소시아네이트, 이소포름디이소시아네이트, 테트라메틸크실렌디이소시아네이트, 나프탈렌디이소시아네이트, 및 이들의 폴리올과의 반응물로 이루어진 군으로부터 선택된 1종 이상이고,에폭시계 화합물은 에틸렌글리콜디글리시딜에테르, 트리글리시딜에테르, 트리메틸올프로판트리글리시딜에테르, N,N,N'N'-테트라글리시딜에틸렌디아민 및 글리 세린 디글리시딜에테르로 이루어진 군으로부터 선택된 1종 이상이며,아지리딘계 화합물은 N,N'-톨루엔-2,4-비스(1-아지리딘카르복사이드), N,N'-디페닐메탄-4,4'-비스(1-아지리딘카르복사이드), 트리에틸렌멜라민, 비스이소프로탈로일-1-(2-메틸아지리딘), 및 트리-1-아지리디닐포스핀옥사이드로부터 이루어진 군에서 선택된 1종 이상이고,금속 킬레이트계 화합물은 알루미늄, 철, 아연, 주석, 티탄, 안티몬, 마그네슘 및 바나듐으로부터 선택된 다가 금속이 아세틸아세톤 또는 아세토초산에틸에 배위한 화합물로부터 선택된 1 종 이상인 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제1항 내지 제13항 중 어느 한 항에 있어서, 아크릴계 점착제 조성물의 가교밀도가 5 내지 95 % 임을 특징으로 하는 아크릴계 점착제 조성물.
- 제2항에 있어서, γ-글리시독시프로필트리메톡시실란, γ-글리시독시프로필메틸디에톡시실란, γ-글리시독시프로필트리에톡시실란, 3-메르캅토프로필트리메톡시실란, 비닐트리메톡시실란, 비닐트리에톡시실란, γ-메타크릴옥시프로필트리메톡시실란, γ-메타크릴옥시프로필트리에톡시실란, γ-아미노프로필트리에톡시실란, 3-이소시아네이트프로필트리에톡시실란, 및 γ-아세토아세테이트프로필트리메톡시실란으로 이루어진 군으로부터 선택된 1 종 이상의 실란계 커플링제 (D)를 아크릴 공중합체 100 중량부에 대하여 0.005 ~ 5 중량부로 포함하는 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제2항에 있어서, (수첨)하이드로카본계수지, (수첨)로진수지, (수첨)로진에스터수지, (수첨)터펜수지, (수첨)터펜페놀수지, 중합로진수지, 및 중합로진에스터수지로 이루어진 군으로부터 선택된 1 종 이상의 점착성부여수지 (E)를 아크릴 공중합체 100 중량부에 대하여 1 ~ 100 중량부로 포함하는 것을 특징으로 하는 아크릴계 점착제 조성물.
- 제1항 내지 제13항, 제15항 또는 제16항 중 어느 한 항에 따른 아크릴계 점착제 조성물을 포함하는 산업용 시트, 광학용 점착제품, 전자부품용 점착제, 의료용 패치 또는 가열활성 점착제.
- 제1항 내지 제13항, 제15항 또는 제16항 중 어느 한 항에 따른 아크릴계 점착제 조성물을 편광필름의 일면 또는 양면의 점착제층으로 포함하는 것을 특징으로 하는 점착편광판.
- 제18항에 있어서, 점착편광판은 보호층, 반사층, 방현층, 위상차판, 광시야각 보상필름 및 휘도 향상필름으로 이루어지는 군으로부터 선택되는 1 종 이상의 층을 추가로 포함하는 것을 특징으로 하는 점착편광판.
- 제18항에 따른 점착편광판을 액정셀의 일면 또는 양면에 접합한 액정패널을 포함하는 것을 특징으로 하는 액정표시소자.
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TWI586529B (zh) * | 2012-02-10 | 2017-06-11 | Skc哈斯顯示膜股份有限公司 | 平板顯示器之玻璃分散防止膜 |
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KR101509442B1 (ko) * | 2008-08-06 | 2015-04-06 | 동우 화인켐 주식회사 | 대전방지성 및 빛샘방지성 점착제 조성물 및 이를 이용한편광판 |
KR101127104B1 (ko) * | 2008-12-30 | 2012-03-22 | 제일모직주식회사 | 대전방지성 점착제 조성물, 이를 이용한 점착제 필름 및 그 제조방법 |
KR101362866B1 (ko) * | 2010-12-23 | 2014-02-14 | 제일모직주식회사 | 점착제 및 이를 이용한 광학 부재 |
KR101582034B1 (ko) * | 2013-04-29 | 2015-12-31 | 주식회사 엘지화학 | 점착제 조성물 |
KR101507315B1 (ko) * | 2014-12-11 | 2015-04-07 | 주식회사 성림크로바 | 동해안정성을 지닌 아크릴 에멀젼수지 조성물 및 그 제조방법 |
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