KR100790721B1 - 급속 열처리 장치의 공정 챔버 - Google Patents
급속 열처리 장치의 공정 챔버 Download PDFInfo
- Publication number
- KR100790721B1 KR100790721B1 KR1020020080246A KR20020080246A KR100790721B1 KR 100790721 B1 KR100790721 B1 KR 100790721B1 KR 1020020080246 A KR1020020080246 A KR 1020020080246A KR 20020080246 A KR20020080246 A KR 20020080246A KR 100790721 B1 KR100790721 B1 KR 100790721B1
- Authority
- KR
- South Korea
- Prior art keywords
- edge ring
- heat treatment
- rapid heat
- circular cylinder
- process chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000010438 heat treatment Methods 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052742 iron Inorganic materials 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 19
- 238000001816 cooling Methods 0.000 description 4
- 238000011068 loading method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (2)
- 급속 열처리 장치의 공정 챔버에 있어서,웨이퍼를 안착하는 안착부를 구비하며 테두리에 요(凹) 형상의 홈을 하나 이상 구비하는 에지 링;상기 에지 링의 하부에 구비되어 에지 링의 회전 구동을 매개하며 상기 에지 링의 요(凹) 형상의 홈 위치에 대응되는 부위에 철(凸) 형상의 돌출 부위를 하나 이상 구비하는 원형 실린더를 포함하여 이루어지는 것을 특징으로 하는 급속 열처리 장치의 공정 챔버.
- 제 1 항에 있어서, 상기 에지 링과 원형 실린더를 회전시키는 회전 기판을 더 구비하며, 상기 회전 기판 내에는 웨이퍼를 상승시키는 리프트 핀이 형성되어 있는 것을 특징으로 하는 급속 열처리 장치의 공정 챔버
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020080246A KR100790721B1 (ko) | 2002-12-16 | 2002-12-16 | 급속 열처리 장치의 공정 챔버 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020080246A KR100790721B1 (ko) | 2002-12-16 | 2002-12-16 | 급속 열처리 장치의 공정 챔버 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040052375A KR20040052375A (ko) | 2004-06-23 |
KR100790721B1 true KR100790721B1 (ko) | 2007-12-31 |
Family
ID=37346046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020080246A Expired - Fee Related KR100790721B1 (ko) | 2002-12-16 | 2002-12-16 | 급속 열처리 장치의 공정 챔버 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100790721B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101368899B1 (ko) * | 2007-07-09 | 2014-02-28 | (주)뉴영시스템 | 급속열처리장비의 웨이퍼 안착장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001010894A (ja) * | 1999-06-24 | 2001-01-16 | Mitsubishi Materials Silicon Corp | 結晶成長用サセプタとこれを用いた結晶成長装置、およびエピタキシャル・ウェーハとその製造方法 |
KR20010042416A (ko) * | 1998-04-01 | 2001-05-25 | 조셉 제이. 스위니 | 열처리 챔버용 기판 지지부 |
KR20020033169A (ko) * | 1999-10-28 | 2002-05-04 | 조셉 제이. 스위니 | 반도체 제조장치 |
-
2002
- 2002-12-16 KR KR1020020080246A patent/KR100790721B1/ko not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010042416A (ko) * | 1998-04-01 | 2001-05-25 | 조셉 제이. 스위니 | 열처리 챔버용 기판 지지부 |
JP2001010894A (ja) * | 1999-06-24 | 2001-01-16 | Mitsubishi Materials Silicon Corp | 結晶成長用サセプタとこれを用いた結晶成長装置、およびエピタキシャル・ウェーハとその製造方法 |
KR20020033169A (ko) * | 1999-10-28 | 2002-05-04 | 조셉 제이. 스위니 | 반도체 제조장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20040052375A (ko) | 2004-06-23 |
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Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20021216 |
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Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20071210 |
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Comment text: Registration of Establishment Patent event date: 20071224 Patent event code: PR07011E01D |
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Payment date: 20071224 End annual number: 3 Start annual number: 1 |
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