KR100783816B1 - OLED display element - Google Patents

Abstract

There is provided an LED display device that can prevent the wiring from being damaged by the particles generated during the scribing process. The LED display device according to the present invention comprises a substrate divided into an active region and an inactive region; A data line and a scan line formed in a direction perpendicular to each other on an active region of the substrate; Data line wiring and scan line wiring formed on the inactive region of the substrate to be electrically connected to the data line and the scan line, respectively; First and second support layers formed on the inactive region of the substrate with the data line wiring and the scan line wiring interposed therebetween; And an encapsulation cap formed on the active region and the inactive region of the substrate and spaced apart from the data line wiring and the scan line wiring by the first and second support layers.

OID, scribing, particles, wiring damaged

Description

OLED display device {Organic light emitting diode display device}

1 is a plan view of an LED display device according to a first embodiment of the present invention.

FIG. 2 is a cutaway view taken along the scribing line of FIG. 1. FIG.

3 is a plan view of an LED display device according to a second embodiment of the present invention.

4 is a cross-sectional view taken along the scribing line of FIG. 3.

<Explanation of symbols for main parts of the drawings>

100, 200: substrate A: active region

B: inactive area 105, 205: scribing line

110, 210: data line 120, 220: scan line

130, 230: data line wiring 140, 240: scan line wiring

150, 250: first support layer 160, 260: second support layer

170, 270: bag cap

The present invention relates to an LED display device, and more particularly, to an LED display device to prevent the wiring from being damaged by the glass particles during the scribing process.

In general, an OLED display device is one of the flat panel display devices, and is formed through an organic thin film layer including an organic light emitting layer between a positive electrode layer and a negative electrode layer on a transparent substrate, and forms a matrix having a very thin thickness.

The OLED display device is a display device using an electroluminescence phenomenon in which light is generated when a certain electric field is applied to a phosphor. When a predetermined electric field is applied to the positive electrode layer and the negative electrode layer, holes and electrons are respectively emitted from the positive electrode layer and the negative electrode layer. Move to the organic light emitting layer, and these holes and electrons meet with each other in the organic light emitting layer to form electron-hole pairs to generate high energy excitons, and these light excitation falls to the ground state to generate light energy do.

Such an LED display device can be driven at a low voltage of 15V or less, and exhibits excellent characteristics in brightness, viewing angle, power consumption, etc., compared to other display devices, for example, TFT-LCD. In addition, the OLED display device has a fast response speed of 1 kHz compared to other display devices, and thus is suitable for a next-generation multimedia display that requires video implementation.

By the way, the conventional OLED display device using the glass cap proceeds to the sealing process and then scribing to expose the outer periphery and the pad portion of the cell, at this time by the class particles generated while scribing the glass cap When a person handles or pressurizes the equipment, the wiring formed on the pad portion may be damaged by the impact of the particles.

As such, the damaged part by the impact causes overheating when driven by oxygen or moisture, and a short circuit occurs due to the overheating.

Therefore, there is a need for an LED display device capable of preventing the wiring from being damaged by particles generated during the scribing process.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide an LED display device capable of preventing damage to a wiring by particles generated during a scribing process.

Technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above technical problem, an LED display device according to a first embodiment of the present invention includes a substrate divided into an active region and an inactive region; A data line and a scan line formed in a direction perpendicular to each other on the active area of the substrate; Data line wiring and scan line wiring formed on the inactive region of the substrate to be electrically connected to the data line and the scan line, respectively; First and second support layers formed on the inactive region of the substrate with the data line wiring and the scan line wiring interposed therebetween; And an encapsulation cap formed on the active region and the inactive region of the substrate and spaced apart from the data line wiring and the scan line wiring by the first and second support layers.

In the first embodiment of the present invention, the heights of the first and second support layers are preferably higher than the heights of the data line wiring and the scan line wiring, respectively.

The first and second support layers are preferably formed at positions corresponding to scribing lines.

The first and second support layers may be formed of an insulating material.

The insulating material may include photoresist, polyimide, silicon oxide, or silicon nitride.

In order to solve the above technical problem, an LED display device according to a second embodiment of the present invention includes a substrate divided into an active region and an inactive region; A data line and a scan line formed on the active region of the substrate in a direction perpendicular to each other; Data line wiring and scan line wiring formed on the inactive region of the substrate to be electrically connected to the data line and the scan line, respectively; First and second support layers formed on the data line wiring line and the scan line wiring line, respectively; And an encapsulation cap formed on the active region and the inactive region of the substrate and in close contact with the first and second support layers.

In the second embodiment of the present invention, the first and second support layers are preferably formed at positions corresponding to the scribing lines.

The first and second support layers may be formed of an insulating material.

The first support layer may be formed of an insulating material, and the second support layer may be formed of chromium.

The insulating material may include photoresist, polyimide, silicon oxide, or silicon nitride.

Specific details of other embodiments are included in the detailed description and the accompanying drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, only the present embodiments to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Also, in the drawings, the size and thickness of layers and films or regions are exaggerated for clarity of description and, when stated that a film or layer is formed "on" of another film or layer, the film or layer described above. It may be directly on top of this other film or layer, and a third other film or layer may be interposed therebetween.

1 is a plan view of an LED display device according to a first embodiment of the present invention, Figure 2 is a cross-sectional view cut along the scribing line of FIG.

1 and 2, the LED display device according to the first embodiment of the present invention may include a substrate 100, a data line 110, a scan line 120, a data line wiring 130, and a scan line. And a wiring line 140, a first support layer 150, a second support layer 160, and an encapsulation cap 170.

The substrate 100 mainly uses a transparent substrate such as a glass substrate as a base layer for forming the LED display device according to the first embodiment of the present invention. However, a plastic substrate having excellent transparency can also be used.

The substrate 100 is divided into an active area A and an inactive area B. The active area A includes a scan line 120, a data line 110, and a light emitting organic layer (not shown). An LED element is formed to indicate a region generating light, and the inactive region B is a scan line wiring 140 and a data line wiring 130 electrically connected to the scan line 120 and the data line 110, respectively. ) Indicates the area where it is formed.

The data line 110 is formed in a stripe shape on the active region A of the substrate 100, spaced apart at a predetermined interval, parallel to each other, and extending in one direction. The data line 110 is an anode electrode for hole injection, and has a high work function and indium tin oxide (ITO) or indium zinc oxide (IZO) so that light emitted from the light emitting organic layer can be irradiated to the outside through the substrate 100. It is preferably formed of a transparent metal oxide such as).

However, since the ITO and IZO electrodes are oxide electrodes, the electrical conductivity is low, and thus the signal transmission speed is significantly lowered, which may cause signal delay. To solve this problem, the transparent ITO and IZO patterns have been followed. A solid chromium (Cr) electrode may be disposed.

The scan line 120 is formed in the direction perpendicular to the data line 110 on the active region A of the substrate 100. The scan line 120 is a cathode electrode for electron injection, and is generally formed of a metal material having a small work function such as calcium (Ca), magnesium (Mg), aluminum (Al), or the like.

The data line wiring 130 is formed on the inactive region B of the substrate 100 and is electrically connected to the data line 110 formed on the active region A of the substrate 100. The data line wiring 130 may be formed of the same material as that of the data line 110, that is, a single layer structure of ITO or IZO, or a stack structure of Cr (chromium) / ITO or Cr / IZO.

The scan line wiring 140 is formed on the inactive region B of the substrate 100 and is electrically connected to the scan line 120 formed on the active region A of the substrate 100. The scan line wiring 140 may be formed of the same material as that of the scan line 120, that is, a metal material having a small work function such as calcium (Ca), magnesium (Mg), or aluminum (Al), and ITO and IZO. Alternatively, it may be formed of chromium (Cr). In addition, the scan line wiring 140 may be formed in a stacked structure of Cr / ITO or Cr / IZO.

The first support layer 150 is formed on the inactive region B of the substrate 100 with the data line wiring 130 therebetween. In this case, the first support layer 150 is formed at a position corresponding to the scribing line 105, and the height of the first support layer 150 is higher than that of the data line wiring 130.

As such, forming the first support layer 150 higher than the height of the data line wiring 130 at a position corresponding to the scribing line 105 causes the first support layer 150 to support the encapsulation cap 170. This is to allow the data line wiring 130 and the sealing cap 170 to be spaced apart from each other.

As such, the data line wiring 130 is separated from the encapsulation cap 170 by the first support layer 150, so that the data line wiring 130 is formed by particles generated from the encapsulation cap 170 during the scribing process. This can be prevented from being damaged.

The first support layer 150 is preferably formed of an insulating material. As the insulating material, photoresist, polyimide, silicon oxide, silicon nitride, or the like may be used.

The second support layer 160 is formed on the inactive region B of the substrate 100 with the scan line wiring 140 therebetween. In this case, like the first support layer 150, the second support layer 160 is formed at a position corresponding to the scribing line 105, and the height of the second support layer 160 is higher than that of the scan line wiring 140. .

As such, forming the second support layer 160 higher than the height of the scan line wiring 140 at a position corresponding to the scribing line 105 causes the second support layer 160 to support the encapsulation cap 170. This is to allow the scan line wiring 140 and the sealing cap 170 to be spaced apart from each other.

As such, the scan line wiring 140 and the sealing cap 170 are spaced apart from the second support layer 160, so that the scan line wiring 140 is formed by particles generated from the sealing cap 170 during the scribing process. This can be prevented from being damaged.

The second support layer 160 is preferably formed of an insulating material similarly to the first support layer 150. As the insulating material, photoresist, polyimide, silicon oxide, silicon nitride, or the like may be used.

The encapsulation cap 170 is formed on the active region A and the inactive region B of the substrate 100, and an OLED element (data line 110, formed on the active region A of the substrate 100). By sealing the scan line 120, the light emitting organic layer, etc., it prevents moisture and oxygen from penetrating into the device from the outside to protect the ODL device.

The encapsulation cap 170 includes a first support layer 150 formed to face each other with the data line wiring 130 therebetween, and a second support layer 160 formed to face each other with the scan line wiring 140 therebetween. It is supported by the to be spaced apart from the data line wiring 130 and the scan line wiring 140.

As such, the encapsulation cap 170 is spaced apart from the data line wiring 130 and the scan line wiring 140 so that the data line wiring 130 and the scan are formed by particles generated from the encapsulation cap 170 during the scribing process. It is possible to prevent the line wiring 140 from being damaged.

In addition, when the ODL display element is driven in a humid environment, the damaged wiring portion may be oxidized and deteriorated to prevent the wiring from being shorted.

For reference, a glass substrate is generally used as the encapsulation cap 170.

3 is a plan view of an LED display device according to a second exemplary embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along the scribing line of FIG. 3.

3 and 4, the LED display device according to the second embodiment of the present invention may include a substrate 200, a data line 210, a scan line 220, a data line wiring 230, and a scan line. The wire 240 includes a first support layer 250, a second support layer 260, and an encapsulation cap 270.

The substrate 200 mainly uses a transparent substrate such as a glass substrate as a base layer for forming the LED display device according to the second embodiment of the present invention. However, a plastic substrate having excellent transparency can also be used.

The substrate 200 is divided into an active region A and an inactive region B. The active region A includes a scan line 220, a data line 210, and a light emitting organic layer (not shown). The LED element is formed to indicate a region generating light, and the inactive region B is a scan line wiring 240 and a data line wiring 230 electrically connected to the scan line 220 and the data line 210, respectively. ) Indicates the area where it is formed.

The data lines 210 are formed in a stripe shape on the active region A of the substrate 200, spaced apart at regular intervals, parallel to each other, and extending in one direction. The data line 210 is an anode electrode for hole injection, and has a high work function and indium tin oxide (ITO) or indium zinc oxide (IZO) so that light emitted from the light emitting organic layer can be irradiated to the outside through the substrate 200. It is preferably formed of a transparent metal oxide such as).

However, since the ITO and IZO electrodes are oxide electrodes, the electrical conductivity is low, and thus the signal transmission speed is significantly lowered, which may cause signal delay. To solve this problem, the transparent ITO and IZO patterns have been followed. A solid chromium (Cr) electrode may be disposed.

The scan line 220 is formed in the direction perpendicular to the data line 210 on the active region A of the substrate 200. The scan line 220 is a cathode electrode for electron injection, and is generally formed of a metal material having a small work function such as calcium (Ca), magnesium (Mg), aluminum (Al), or the like.

The data line wiring 230 is formed on the inactive region B of the substrate 200 and is electrically connected to the data line 210 formed on the active region A of the substrate 200. The data line wire 230 may be formed of the same material as that of the data line 210, that is, a single layer structure of ITO or IZO, or a stack structure of Cr (chromium) / ITO or Cr / IZO.

The scan line wiring 240 is formed on the inactive region B of the substrate 200 and is electrically connected to the scan line 220 formed on the active region A of the substrate 200. The scan line wiring 240 may be formed of the same material as that of the scan line 220, that is, a metal material having a small work function such as calcium (Ca), magnesium (Mg), or aluminum (Al), and ITO and IZO. Alternatively, it may be formed of chromium (Cr). In addition, the scan line wiring 240 may be formed in a stacked structure of Cr / ITO or Cr / IZO.

The first support layer 250 is formed on the data line wiring 230 formed on the inactive region B of the substrate 200 and has a structure in close contact with the encapsulation cap 270. In this case, the first support layer 250 may be formed at a position corresponding to the scribing line 205.

As such, the first support layer 250 is formed between the data line wire 230 and the encapsulation cap 270 so that the data line wire 230 and the encapsulation cap 270 do not directly contact each other. It is possible to prevent the data line wiring 230 from being damaged by the particles generated from the encapsulation cap 270.

When the data line wire 230 is a transparent conductive material such as ITO or IZO, the first support layer 250 is formed using an insulating material such as photoresist, polyimide, silicon oxide, or silicon nitride. However, when the data line wire 230 is made of Cr / ITO or Cr / IZO, it may be formed using chromium (Cr).

The second support layer 260 is formed on the scan line wiring 240 formed on the inactive region B of the substrate 200 and has a structure in close contact with the encapsulation cap 270. In this case, the second support layer 260 is preferably formed at a position corresponding to the scribing line 205 like the first support layer 250.

As such, the second support layer 260 is formed between the scan line wire 240 and the encapsulation cap 270 so that the scan line wire 240 and the encapsulation cap 270 do not directly contact each other. It is possible to prevent the scan line wiring 240 from being damaged by the particles generated from the sealing cap 270.

The second support layer 260 is formed using an insulating material such as photoresist, polyimide, silicon oxide, silicon nitride, or the like.

The encapsulation cap 270 is formed on the active region A and the inactive region B of the substrate 200, and an OID element (data line 210, formed on the active region A of the substrate 200). By sealing the scan line 220, the light emitting organic layer, etc., it prevents moisture and oxygen from penetrating into the device from the outside to protect the ODL device.

The encapsulation cap 270 forms a structure in close contact with the first support layer 250 formed on the data line wire 230 and the second support layer 260 formed on the scan line wire 240.

As such, the encapsulation cap 270 is formed to be in close contact with the first support layer 250 and the second support layer 260 formed on the data line wire 230 and the scan line wire 240, respectively. Particles generated from the encapsulation cap 270 may be prevented from damaging the data line wiring 230 and the scan line wiring 240.

In addition, when the ODL display element is driven in a humid environment, the damaged wiring portion may be oxidized and deteriorated to prevent the wiring from being shorted.

For reference, a glass substrate is generally used as the encapsulation cap 270.

As such, the first support layer 250 and the second support layer 260 are formed on the data line wire 230 and the scan line wire 240 at positions corresponding to the scribing line 205, respectively. By preventing the line wiring 230 and the scan line wiring 240 from directly contacting the encapsulation cap 270, the data line wiring 230 is formed by particles generated from the encapsulation cap 270 during the scribing process. ) And the scan line wiring 240 can be prevented from being damaged.

In addition, when the ODL display element is driven in a humid environment, the damaged wiring portion may be oxidized and deteriorated to prevent the wiring from being shorted.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings and tables, the present invention is not limited to the above embodiments, but may be manufactured in various forms, and common knowledge in the art to which the present invention pertains. Those skilled in the art can understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

According to the LED display device according to an embodiment of the present invention, by forming a support layer between the wiring to separate the wiring and the sealing cap or by forming a support layer between the wiring and the sealing cap so that the wiring and the sealing cap does not directly contact Due to the particles generated from the encapsulation cap during the scribing process, it is possible to prevent the wiring from being damaged during handling or pressurized by the scribing equipment or the tab bonding equipment. Accordingly, when driving the LED display device according to the embodiment of the present invention in a humid environment, there is an advantage of preventing the wiring from being shorted due to oxidation or deterioration of the damaged wiring portion.

Claims (10)

A substrate divided into an active region and an inactive region; A data line and a scan line formed on the active region of the substrate in a direction perpendicular to each other; Data line wiring and scan line wiring formed on the inactive region of the substrate to be electrically connected to the data line and the scan line, respectively; First and second support layers formed on the inactive region of the substrate with the data line wiring and the scan line wiring interposed therebetween; And And an encapsulation cap formed on the active region and the inactive region of the substrate, the encapsulation cap being spaced apart from the data line wiring and the scan line wiring by the first and second support layers. The method of claim 1, The height of the first and the second support layer is an LED display device, characterized in that formed higher than the height of the data line wiring line and the scan line wiring, respectively. The method of claim 1, And the first and second support layers are formed at positions corresponding to the scribing lines. The method of claim 1, And the first and second support layers are made of an insulating material. The method of claim 4, wherein And the insulating material includes photoresist, polyimide, silicon oxide, or silicon nitride. A substrate divided into an active region and an inactive region; A data line and a scan line formed on the active region of the substrate in a direction perpendicular to each other; Data line wiring and scan line wiring formed on the inactive region of the substrate to be electrically connected to the data line and the scan line, respectively; First and second support layers formed on the data line wiring line and the scan line wiring line, respectively; And And an encapsulation cap formed on the active region and the inactive region of the substrate and in close contact with the first and second support layers. The method of claim 6, And the first and second support layers are formed at positions corresponding to the scribing lines. The method of claim 6, And the first and second support layers are made of an insulating material. The method of claim 6, And the first support layer is made of an insulating material, and the second support layer is made of chromium. The method according to claim 8 or 9, And the insulating material includes photoresist, polyimide, silicon oxide, or silicon nitride.

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