KR100773384B1 - EL element - Google Patents

Abstract

The present invention does not form a separate noise prevention layer and an ESD layer, but rather forms an integrated layer for ESD and noise prevention to realize slimming, prevents the occurrence of defects of the device due to static electricity, and at the same time, By shielding the outside with an equipotential to reduce the influence of phase change of the power supply, it is possible to reduce the noise generated in the dielectric layer and the light emitting layer, and to minimize the internal structure of the EL element connected to the external structure, manufacturing process and printed circuit Provided is an EL device that simplifies the connection with external terminals such as a substrate and can lower costs and improve yield.

EL, noise

Description

EL device

1 is a cross-sectional view of a conventional EL element,

2 is a cross-sectional view of an EL device according to an embodiment of the present invention;

3 is a cross-sectional view of an EL element according to another embodiment of the present invention.

* Explanation of symbols for main parts of the drawings

1: transparent insulating layer 2: transparent electrode layer

3: fluorescent layer 4: dielectric layer

5: back electrode layer 6: insulating layer

7: ESD and noise prevention integrated layer 9: First terminal

10: Terminal 2 11: Terminal 3

20: FPCB

The present invention relates to an EL element.

In the conventional EL element, the transparent electrode layer and the back electrode layer are used as two electrodes, and AC power is applied to these two electrodes. At this time, since the EL element uses the DC power source of the battery as a power source, the DC power source of the battery is transformed through the inverter, and the alternating sinusoidal AC power is applied to the electrode.

FIG. 1 shows a laminated structure and a cross-sectional view of a conventional EL element, and the EL element generally includes a transparent electrode layer 101, a light emitting layer 102, an insulating layer 103, a back electrode layer 104, and a protective layer 105. ) Is formed by lamination. An alternating current voltage 106 is applied between the back electrode layer 104 and the transparent electrode layer 101 or a direct current voltage is transformed into an alternating current-like sine wave to the inverter to apply a voltage. The laminated structure and cross-sectional view in FIG. 1 are shown to explain the EL element conveniently, and the thickness, the width, the shape, etc. of each layer may have various shapes as necessary in actual application.

The transparent electrode layer 101 may be configured in the form of a conductive transparent film, or may be configured in the form of a coating film with a conductive polymer, ITO ink, or the like, and may be formed between the transparent electrode layer 101 and the back electrode layer 104. 106 is connected. The light emitting layer (luminescent layer 102) is a layer printed by mixing a phosphor and a binder and emitting light. The insulating layer (dielectric layer) 103 serves to prevent insulation breakdown that may appear when power is applied to the transparent electrode and the back electrode and to protect the light emitting layer. The rear electrode layer (Rear Electrode, 104) is also called a metal electrode and is a layer through which electricity passes when a power source is connected to the transparent electrode layer. The protection layer 105 is a layer used to prevent the product from moisture or contamination.

In the EL element having such a configuration, the light generated from the light emitting layer 102 passes through the transparent electrode layer 101 and is irradiated to various keys of the keypad. Through the irradiated light, the user sees the keypad in a dark place. It becomes possible.

An integrated circuit (IC) or various electric / electronic elements are essentially used in various devices in which such EL elements are used, and these elements are susceptible to damage by static electricity. In particular, devices used in small devices such as mobile phones are a problem because they can be more easily damaged by static electricity.

In addition, in the conventional EL device, there is a problem in that electrical noise is generated by a sinusoidal AC power source, and an audible frequency is generated in the dielectric layer as the AC power phases alternately change.

In addition, as described above, the EL device has a somewhat more complicated structure than the conventional structure in order to prevent noise and static electricity. As the complexity of the process increases, manufacturing cost, time cost increase, and yield decreases. Development is required.

Accordingly, the present invention is to solve the above problems,

The present invention does not form a separate noise prevention layer and an ESD layer, but rather forms an integrated layer for ESD and noise prevention to realize slimming, prevents the occurrence of defects of the device due to static electricity, and at the same time, An object of the present invention is to provide an EL device capable of reducing noise generated in a dielectric layer and a light emitting layer by shielding the outside with an equipotential to reduce the influence of phase change of the power source.

In addition, by simplifying the structure and minimizing the internal terminal of the EL element connected to the external terminal, to simplify the connection to the external terminal, such as manufacturing process and printed circuit board, to provide a low-cost and improved EL device It aims to do it.

As an aspect for achieving the above object,

The present invention includes an ESD and an anti-noise integral layer, a transparent insulating layer, a transparent electrode layer, a light emitting layer, a dielectric layer, a back electrode layer, the ESD and the anti-noise integral layer and the back electrode layer has an equipotential. It is an object of the present invention to provide an EL element electrically connected thereto.

It is also an object of the present invention to provide an EL device characterized in that the ESD and the noise preventing integrated layer and the back electrode layer are electrically connected to be grounded.

In addition, the EL element includes a first terminal and a second terminal connected to the outside, the transparent electrode layer is electrically connected to the second terminal, and the ESD and the noise prevention integrated to the first terminal. An object of the present invention is to provide an EL device characterized in that the layer and the back electrode layer are electrically connected.

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

2 is a cross-sectional view of an EL element according to an embodiment of the present invention.

As shown, the EL element according to the embodiment of the present invention is an ESD and noise prevention integrated layer 7, a transparent insulating layer (1), a transparent electrode layer (2), a light emitting layer (3), a dielectric layer ( 4) In the EL element including the back electrode layer 5, the ESD and the noise preventing integrated layer 7 and the back electrode layer 5 are electrically connected to become an equipotential.

In the present invention, the ESD layer and the anti-noise layer are not formed separately, but are formed integrally, thereby simplifying the manufacture of the EL element and realizing slimmer.

The ESD and the noise preventing integral layer 7 and the back electrode layer 5 may be electrically connected to ground.

In addition, the EL element includes a first terminal 9 and a second terminal 10 connected to the outside, and the transparent electrode layer 5 is electrically connected to the second terminal 10, and the first terminal 10 is electrically connected to the second terminal 10. The terminal 9 and the ESD prevention integrated layer 7 and the back electrode layer 5 may be electrically connected to the terminal 9.

Although the transparent insulating layer 1 is a transparent insulating layer, there is no particular limitation, but a thin film such as a film or a coating film is preferable, and it is preferable to have excellent light transmittance. Resin such as PET, polyurethane and the like can be selected. The thickness of the transparent insulating layer is not limited, but 20 to 50 μm is preferred for ultra-thinning, and may be formed by a printing method.

On one surface of the transparent insulating layer, the transparent electrode layer 2 may be formed on the entire surface or by patterning the light emitting region. A transparent conductive polymer may be used as the material of the transparent electrode layer, and may be a transparent material including indium tin oxide (ITO).

The light emitting layer 3, the dielectric layer 4, and the back electrode layer 5 may be sequentially stacked on the transparent electrode layer 2. The light emitting layer may be used without limitation the light emitting material known in the art. The inorganic light emitting material is good, and an organic light emitting material may be used if necessary. The back electrode layer is not limited, but may be formed by patterning to correspond to the transparent electrode layer, or may be formed on the entire surface.

The transparent electrode layer, the light emitting layer, the dielectric layer, and the back electrode layer may be covered and insulated by the insulating layer 6.

On the other surface of the transparent insulating layer 1, the ESD and the noise preventing integral layer 7 are formed. The integral layer 7 serves to emit the generated static electricity through a printed circuit board (2-8) or a device case and to reduce noise.

The ESD and the noise preventing integral layer 7 may be preferably formed using a material having high electrical conductivity, and materials such as ITO, carbon, copper, silver, gold, and conductive polymers are preferable. Can be used. The integral layer 7 may be more preferably implemented by forming a dry form after silkscreen printing a material having electrical conductivity. The integral layer 7 may be formed entirely on the transparent insulating layer or partially formed.

In other words, since the static electricity generated in the device in which the EL element is used is discharged through the ESD and the noise prevention integrated layer 7, it is possible to protect various elements used in the device from damage by static electricity. .

In addition, the ESD and the noise preventing integral layer 7 serve to block noise generated when the EL element is operated by an AC power source.

When the EL element driven by the AC power source, especially the material of the light emitting layer is an inorganic material, electric noise is generated by the characteristics of the AC power source which is the driving power source. On the other hand, the power source used in the mobile phone is a DC power source, but the mobile phone converts the DC power source into a sinusoidal wave power similar to AC through an inverter, and uses the converted sinusoidal power source. In this way, the modified sinusoidal power source used in the mobile phone also has electrical noise, and audible noise also occurs as the polarity of the dielectric layer is changed by the power source whose phase changes.

In order to reduce such noise, the present invention is characterized by shielding the light emitting layer and the dielectric layer at an equipotential to reduce the influence of phase change, thereby reducing the change in polarity of the dielectric layer and reducing the noise generated by the light emitting layer.

That is, the present invention electrically connects the ESD and the noise preventing integrated layer 7 and the back electrode layer 5 so that the outer surface of the EL element becomes an equipotential to shield the light emitting layer and the dielectric layer with the equipotential, and the noise Provide a reduction effect. The equipotential may be a ground potential.

In addition, the EL device according to the present invention includes a first terminal 9 and a second terminal 10 connected to the outside, wherein the transparent electrode layer 5 is electrically connected to the second terminal 10, The first terminal 9 is characterized in that the ESD (ESD), the noise prevention integral layer 7 and the back electrode layer (5) is electrically connected.

In other words, by connecting the ESD and the anti-noise integrated layer 7 and the back electrode layer 5 to the first terminal connected to the outside to provide an equipotential shielding effect as described above and to simplify the method of connecting to the outside. You can. When the ESD and the noise preventing integral layer 7 are not electrically connected as described above, a terminal for a separate ground is required, which complicates the configuration of the EL element and also makes the connection to the outside complicated. There is, the present invention solved this.

The first terminal to which the ESD and the noise preventing integral layer 7 and the back electrode layer 5 are connected is connected to one end of a driving power source of the printed circuit board. If necessary, it may be connected to the terminal of the printed circuit board via the FPCB. The first terminal may or may not be grounded according to the circuit diagram of the printed circuit board, or may be included in the present invention.

3 is a cross-sectional view of an EL element according to another embodiment of the present invention.

As shown, the EL element has a first terminal 9, a second terminal 10 and a third terminal 11 connected to the outside, and the transparent terminal layer 2 is provided on the second terminal 10. ) And the first terminal 9 and the third terminal 11, which may be electrically connected to each other through the FPCB 20 and may be equipotential, respectively. (7) and the back electrode layer (5) is characterized in that it is electrically connected.

That is, as one of the methods of forming the equipotential by electrically connecting the ESD and the noise preventing integrated layer 7 and the back electrode layer 5, the EL elements are provided with terminals 9 and 11 independently. Connect ESD and noise prevention integrated layer 7 and back electrode layer 5, respectively, and connect independent terminals 9 and 11 to FPCB (flexible printed circuit board) 20, respectively. . As shown in the figure, the FPCB 20 electrically connects the terminals to which the ESD and the noise preventing integrated layer and the back electrode layer are respectively electrically connected to the printed circuit board in the form of two terminals. .

When forming the equipotential using FPCB, the process of electrically connecting the ESD and anti-noise integral layer and the back electrode layer when constructing the EL element can be omitted so that the equipotential can be formed more easily. do.

The above embodiments are intended to describe the present invention in detail, and are not intended to limit the present invention, and thus modifications, modifications, omissions, etc. that can be applied within the scope of the technical idea of the present invention are defined by the claims. It is included in the scope of the invention.

Due to the above characteristic configuration, the following effects are provided. That is, the present invention does not form a separate noise prevention layer and an ESD layer, respectively, but forms an integrated layer for ESD and noise prevention to realize slimming, prevents the occurrence of element defects due to static electricity, and at the same time, EL By shielding the outside of the device with an equipotential to reduce the influence of the phase change of the power source, it is possible to reduce noise generated in the dielectric layer and the light emitting layer. In addition, by simplifying the structure and minimizing the internal terminal of the EL element connected to the external terminal, it is possible to simplify the connection to the external terminal of the manufacturing process and printed circuit board, and to lower the cost and improve the yield. .

Claims (4)

ESD and an anti-noise integral layer, a transparent insulating layer, a transparent electrode layer, a light emitting layer, a dielectric layer, and a back electrode layer are sequentially included. EL devices electrically connected to each other. The EL device according to claim 1, wherein the ESD and the noise preventing integrated layer and the back electrode layer are electrically connected to be grounded. 2. The EL device of claim 1, wherein the EL element includes a first terminal and a second terminal connected to an external device, the transparent electrode layer is electrically connected to the second terminal, and the ESD terminal is connected to the first terminal. And an anti-noise integral layer and a back electrode layer are electrically connected. ESD and noise prevention integral layer, transparent insulating layer, transparent electrode layer, light emitting layer, dielectric layer, and the back electrode layer are made in sequence, The EL element includes a first terminal, a second terminal, and a third terminal connected to the outside, and the transparent electrode layer is electrically connected to the second terminal, and is electrically connected to each other through an FPCB to form an equipotential. And the ESD terminal, an anti-noise integral layer, and a back electrode layer are electrically connected to the first terminal and the third terminal, respectively.

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