KR100758396B1 - Lsi package and method of assembling the same - Google Patents

Abstract

An LSI package disposed on a mounting board and configured to have a heat dissipation member, the LSI package comprising: an LSI configured to process signals and having signal input / output terminals and a surface coupled to the heat dissipation member; First signal terminals configured to mount the LSI, electrically connected to signal input / output terminals of the LSI, second electrical terminals for electrically connecting the LSI to the mounting board, and the first signal terminals An interposer including an internal wire electrically connected to the first wire, and an first coupling part electrically connected to the internal wire; And signal transmission lines configured to transmit signals externally and receive signals from an external second coupling portion electrically connected to them, and a package structure configured to support the signal transmission lines and the second coupling portion. An interface module comprising: the second coupling portions are each electrically connected to the first coupling portions by mechanical contacts, and the package structure is mounted on the interposer and has space to receive the LSI and the rows A dissipation member is allowed to be located over the surface of the LSI, the heat dissipation member having a thermal connection with the LSI.

LSI Package, LSI, Interposer, Mounting Boards

Description

LSI PACKAGE AND METHOD OF ASSEMBLY {LSI PACKAGE AND METHOD OF ASSEMBLING THE SAME}

1 is a schematic cross-sectional view partially showing a configuration of an LSI package including a high speed interface module according to a first embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of the assembled structure of the LSI package shown in FIG. 1. FIG.

3 is an oblique view showing a substantially mounted state of the LSI package shown in FIG.

4 is a cross-sectional view schematically showing the configuration of an LSI package including a high speed interface module according to a second embodiment of the present invention.

5 is a schematic cross-sectional view of a configuration of an LSI package including a high speed interface module according to a third embodiment of the present invention;

6 is a schematic cross-sectional view of a configuration of an LSI package including a high speed interface module according to a fourth embodiment of the present invention;

FIG. 7 is a schematic cross-sectional view of the assembled structure of the LSI package shown in FIG. 6. FIG.

8 is a schematic cross-sectional view of an LSI package including a high speed interface module according to a fifth embodiment of the present invention during an assembling process;

FIG. 9 is a schematic cross-sectional view of an LSI package including the high speed interface module shown in FIG. 8. FIG.

10 is a schematic cross-sectional view of an LSI package including a high speed interface module according to a sixth embodiment of the present invention during the assembling process;

FIG. 11 is a schematic cross-sectional view of the assembled structure of the LSI package shown in FIG. 10. FIG.

12 is an enlarged cross-sectional view of a portion of a connection structure between the optical interface module and the interposer shown in FIG. 11;

FIG. 13 is a schematic view in exploded form of an LSI package according to a sixth embodiment of the present invention; FIG.

FIG. 14 is a schematic view of the assembled structure of the LSI package shown in FIG. 13. FIG.

15 is a schematic cross-sectional view of an LSI package including a high speed interface module according to a seventh embodiment of the present invention during an assembling process;

FIG. 16 is a schematic cross-sectional view of the assembled structure of the LSI package shown in FIG. 15. FIG.

FIG. 17 is an enlarged cross-sectional view of a portion of a connection structure between the optical interface module and the interposer shown in FIG. 16; FIG.

FIG. 18 is an isometric view of the mounting procedure of the LSI package shown in FIG. 16 in an exploded form; FIG.

19 is a schematic cross-sectional view of an LSI package including a high speed interface module according to an eighth embodiment of the present invention during an assembling process;

FIG. 20 is a schematic cross-sectional view of the assembled structure of the LSI package shown in FIG. 19. FIG.

21A, 21B and 21C are enlarged cross-sectional views of a part of the connection process of the connection structure between the optical interface module and the interposer shown in FIG. 20;

FIG. 22 is a schematic cross-sectional view of an LSI package including a high speed interface module according to a ninth embodiment of the present invention during an assembling process; FIG.

FIG. 23 is a schematic cross-sectional view of the assembled structure of the LSI package shown in FIG. 22; FIG.

24A to 24C are sectional views showing the configuration of the electrical connection portion.

Figure 25 is a schematic cross-sectional view of a modification of a portion of the LSI package constituting the high speed interface module of the present invention.

FIG. 26 is a schematic cross-sectional view of yet another variation of a portion of an LSI package including a high speed interface module of the present invention. FIG.

FIG. 27 is a schematic cross-sectional view of yet another variation of a portion of an LSI package including a high speed interface module of the present invention. FIG.

FIG. 28 is a schematic cross-sectional view of yet another variation of a portion of an LSI package including a high speed interface module of the present invention. FIG.

29 is a schematic cross-sectional view of yet another variation of a portion of an LSI package including a high speed interface module of the present invention.

30 is a schematic cross-sectional view of yet another variation of a portion of an LSI package including a high speed interface module of the present invention.

31 is a schematic cross-sectional view of yet another variation of a portion of an LSI package including a high speed interface module of the present invention.

<Brief description of symbols for the main parts of the drawings>

1: LSI

2: interposer

3: solder bump

4: high speed signal wiring

7: optical interface module

8: optical fiber

9: electrical connection terminal

10: jack structure

12: optical connector

19: thermally conductive paste layer

21: heat sink

31: cavity

This application is based on Japanese Patent Application Laid-Open No. 2000-039828, filed on February 18, 2003, which is hereby incorporated by reference in its entirety and claims its priority.

The present invention relates to an LSI package provided with an interface module and a mounting method thereof, and more particularly, to an LSI package provided with an interface module for transmitting signals at high speed between an external wiring and an interface module and a mounting method thereof.

In recent years, the clock frequency of LSI is made higher and higher, and the CPU for personal computers operating at the clock frequency of GHz is actually used. However, compared to the increase in clock frequency, the speed of improvement in throughput at the interface between adjacent LSIs is slow, which is a problem in the performance of the personal computer. In such situations, research and development are actively underway to improve the throughput at the interface.

In order to improve the throughput of the interface, it is necessary to increase the signal frequency per terminal and to increase the number of terminals. However, the increase in the number of terminals is limited because, as the number of terminals increases, the area of the LSI and its package become large to increase the length of the internal wiring, and as a result, it becomes impossible to operate the LSI at high frequency. Accordingly, it is very important to increase the frequency per terminal. On the other hand, if the frequency per terminal is increased, the attenuation of the electrical signal is increased to increase the effect on reflection due to impedance mismatch. In such a situation, the line length is limited. In this situation, it is necessary to use a transmission line that allows a large suppression of impedance mismatch and attenuation as a high speed signal transmission line.

It is effective to use an optical fiber as a long distance transmission line that is less affected by loss and impedance mismatch. Therefore, an optical interface module that performs a photo-electric converting function is used as the interface module. Interface modules commercialized by using optical interface modules include, for example, transceiver modules disclosed in "Proceedings. 51st Electronic Components and Technology Conference, P. P. 880-5, 2001".

In the transceiver module disclosed in the cited document, the LSI for processing signals is integrated into a programmable gate array (PGA) package. This PGA package is mounted on a mounting board. Input / output signals from the LSI are transmitted through the package to the optical interface module mounted on the mounting board and also transmitted from the optical interface module to the signal line. The optical interface module includes not only optical fibers but also optical elements such as semiconductor laser elements LD and photodetection elements PD, and optical signals are received from external circuits or transmitted to external circuits via optical fibers. In addition, the interface IC for driving the optical element is housed in the optical interface module to be connected to a signal line, a required control signal line, and a power supply line (not shown) on the mounting board via electrical input / output terminals. Each of the LSI and optical interface module is provided with a heat sink for heat dissipation for cooling.

In the board edge mounted optical interface module of the above-described configuration, the electrical signal is converted into the optical signal by the photoelectric conversion function so that the converted optical signal is introduced into the optical fiber. In optical fibers, the loss is very small and the band limit is small, so that a signal can be transmitted at high speed even when a transmission line is relatively long as in transmission between mounting boards or devices. However, in the optical interface module, since electrical signals are transmitted and received through signal lines on the mounting board, signal transmission is affected by attenuation and impedance mismatch of the electrical signals on the mounting board. Since the maximum length of the signal wiring of the mounting board exceeds 30 cm, a very expensive transmission line is required for the transmission signal having a high frequency (for example, a signal of 10 Gbps), causing a problem that the cost of the mounting board is increased. .

In this situation, improved techniques for high speed signal transmission are described, for example, in "HOT9 Interconnects, Symposium on High Performance Interconnects, PP 31-5, 2001" and "Nikkei Electronics No. 810, December 3, 2001, pp. 121 Proposed at -122 ". Specifically, the signal is transmitted only within the interposer of the LSI package without using a mounting board so that the electrical wiring is as short as possible, and the electrical signal is interposer to receive the signal from or transmit the signal to the external device. It is proposed to convert an optical signal into a phase.

Each publication cited above discloses a configuration in which the optical interface module is fixed by welding to an interposer of the LSI, the interposer of the LSI being optically connected to the optical interface module by a fiber comprising an optical connector.

In this configuration, the LSI for signal processing is electrically connected to the interposer by solder bumps. The optical interface module is mounted to the interposer by solder bumps. The input / output terminals of the LSI are connected to the wiring, and the wiring is connected to the optical interface module. The interface IC and the optical element are housed in the optical interface module, and the electrical signal is converted into the optical signal by the interface IC and the optical element. The interface IC and the optical element are housed in a package having an input / output window for the optical signal to ensure reliability as the optical interface module.

A flat microlens plate is mounted to the input / output window so that the light beam entering the optical interface module and the light beam coming from the optical interface module are converged by the microlens. Micro lenses give great tolerance in terms of optical coupling with externally mounted optical fibers. The interposer is electrically connected to the solder bumps by a mounting board. One end of the optical fiber is connected to an optical connector that includes a mirror for changing the optical path by 90 degrees. The aligning pins mounted on the optical connector are inserted into a coupling hole of the package to determine the position of the optical connector and the package so that the micro lens and the optical fiber are aligned.

According to the above-described configuration, the optical interface module is mounted to the interposer after the interface IC, the optical element, and the like are packaged. Thus, the optical interface module can be individually inspected to mount only a good optical interface of high reliability, thereby reducing the inspection cost. In addition, since the optical connector is connected after the interposer is mounted on the mounting board, convenience in the manufacturing process can be obtained. For example, it is not necessary to consider the deterioration of the resin cover caused by the heat treatment at the mounting stage of the interposer and other parts. In addition, there is no need to consider the limitations in the processing of the optical fiber such as bending leading to breakage.

However, this particular configuration requires soldering the LSI to the interposer, soldering the optical interface module to the interposer, or soldering the interposer to the mounting board. It should be noted that in this configuration, the melting point of the solder must be changed so that the LSI package is assembled so that some soldering does not cause defects in other soldering. In addition, the mounting procedure is limited to the case of assembling a portion of the LSI package. In addition, in order to support the optical connector, a mechanism for supporting the optical connector by pushing the optical connector into a package is required, and the mechanism of the apparatus becomes bulky when the optical connection is made using the connector. . In addition, when a support mechanism is mounted to the device, the space in which the heat sink mounted on top of the LSI is arranged is limited, which makes the configuration complicated and increases the cost. As a result, it becomes difficult to mount the heat dissipation heat sink of the optical interface module.

In general, power consumption per terminal tends to increase with increasing transmission frequency of the signal. For example, the power consumption of some LSIs has recently reached 70-80 W in CPUs used in personal computers. Thus, the apparatus is configured such that a heat spreader and a huge heat sink are mounted on the signal processing LSI to ensure a large heat dissipation area, for example, forcing forced air cooling by using a fan. On the other hand, there is a need to reduce the wiring length between the signal processing LSI and the interface module as much as previously described. Thus, in the case of mounting a heat sink for the signal processing LSI, space for mounting another heat sink for the interface module is not allowed.

In this situation, it is possible to consider heat dissipation from the signal processing LSI and the interface module at the same time by mounting a heat sink shared by the signal processing LSI and the interface module. However, when the signal processing LSI and the interface module are simultaneously mounted on the interposer 2, it is difficult to strictly align the upper surface of the interface module and the signal processing LSI and to accurately set the level difference to a predetermined value.

It should also be noted that since the interface module is soldered, it is necessary to replace the expensive signal processing LSI in case of failure of the interface module.

A configuration in which an optical element is mounted directly on the interposer 2 and an optical waveguide made of an organic material is attached to a mounting board to form a transmission line is disclosed in "16th Academic Lecture Meeting of Electronics Mounting, 20B-10, 2002".

In this particular configuration, the interface IC is soldered to the interposer. The interposer is secured to the mounting board with spacers located therebetween. The mounting board and the interposer are connected to each other by, for example, flexible wiring, and power, input / output electrical signals, and the like are supplied to the mounting board and the interposer. In this configuration, it is assumed that the signal processing LSI, etc. are mounted in the three-dimensional direction above the interface IC.

The surface-emitting type optical element is mounted on an interposer on the mounting board side, and includes an optical waveguide and a mirror mounted on the mounting board to position the optical element to change the optical path by 90 °. The optical waveguide and the optical element are optically coupled. In addition, an electrode is mounted to extend through the interposer to reduce the length of the wiring for the electrical signal, thereby obtaining good signal characteristics.

In this particular configuration, the optical element is mounted directly to the interposer as a bare chip. When the interposer is mounted to the mounting board, the optical element is optically coupled to the optical waveguide. As a result, it is difficult to maintain optical accuracy due to the difference in coefficient of thermal expansion between the mounting board and the interposer. In addition, when the optical element is mounted as a bare chip, it is difficult to secure the reliability of the optical element. In order to ensure reliability, the optical element portion needs to be embedded in a resin that passes a wavelength used, for example, for signal transmission, requiring processing operations on the mounting board. As a result, many restrictions are imposed on the manufacturing process, which increases the manufacturing cost. In addition, since the optical waveguide needs to be separately attached to the mounting board, the mounting process is complicated and the mounting cost is increased. Another problem to note is that in certain configurations the optical device needs to be replaced with an expensive signal processing LSI in case of optical device failure.

The aforementioned problems associated with the prior art using optical fibers as transmission lines also arise when using electrical transmission lines such as coaxial cables, semi-rigid cables or flexible wiring boards.

As mentioned above, various optical interface modules are used to improve the throughput of conventional interfaces. However, the board edge mounted optical interface module disclosed in "Proceedings. 51st Electronic Components and Technology Conference, PP 880-5, 2001" has caused a problem that expensive transmission lines are required for high frequency transmission signals. Increase the cost.

In addition, the configurations disclosed in "HOT9 Interconnects, Symposium on High Performance Interconnects, PP 31-5, 2001" and "Nikkei Electronics No. 810, December 3, 2001, pp. 121-122" employ a connector system so that the mechanism is excessive. It becomes bulky and causes problems in mounting which requires attention to soldering. In addition, the above configuration is complicated because it is necessary to secure a space for mounting the heat sink, which increases the manufacturing cost and causes a problem that it becomes difficult to mount the heat sink for heat dissipation from the optical interface module. When the heat sink is shared by the signal processing LSI and the interface module, the upper surface of the interface module and the signal processing LSI is correctly aligned, and when the LSI and the interface module are simultaneously mounted as interposers, the difference in level is accurately determined. Is difficult to control. In addition, because the interface module is soldered, expensive signal processing LSIs need to be replaced if the interface module fails.

In addition, the configuration disclosed in "16th Academic Lecture Meeting of Electronics Mounting, 20B-10, 2002" causes a problem that it is difficult to maintain optical precision due to the difference in thermal expansion coefficient between the mounting board and the interposer. In addition, since it is necessary to separately mount the optical waveguide to the mounting board, the mounting process is complicated, which increases the mounting cost. In addition, in case of failure of the optical element, it is necessary to replace the expensive signal processing LSI.

Problems similar to those described above also arise in configurations in which an electrical interface module is used that does not include an optical element.

It is an object of the present invention to provide an LSI package with an interface module that allows mounting the interface module without expensive transmission lines.

According to one feature of the invention,
An LSI package is provided that is disposed on a mounting board and configured to have a heat dissipation member, which LSI package,
An LSI configured to process signals and having a surface coupled to signal input / output terminals and the heat dissipation member;
First signal terminals configured to mount the LSI, electrically connected to signal input / output terminals of the LSI, second electrical terminals for electrically connecting the LSI to the mounting board, and the first signal terminals An interposer including an internal wire electrically connected to the first wire, and an first coupling part electrically connected to the internal wire; And
To support signal transmission lines configured to transmit signals to and receive signals from the outside, a second coupling portion electrically connected to the signal transmission lines, and the signal transmission lines and the second coupling portion. An interface module comprising a configured package structure, wherein the second coupling portions are each electrically connected to the first coupling portions by mechanical contacts, and the package structures are mounted on the interposer and provide a space for receiving the LSI. And permit the heat dissipation member to be located on the surface of the LSI, the heat dissipation member having a thermal connection relationship with the LSI.

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According to another feature of the invention,
An LSI package is provided having a configuration disposed on a mounting board and mounted with a heat dissipation member, which LSI package,
An LSI configured to process signals, the LSI having a surface coupled to signal input / output terminals and the heat dissipation member;
First signal terminals configured to mount the LSI, electrically connected to signal input / output terminals of the LSI, second electrical terminals for electrically connecting the LSI to the mounting board, and the first signal terminals An interposer including an internal wiring electrically connected to the first wiring, and a first coupling part electrically connected to the internal wiring; And
Signal transmission lines configured to transmit signals externally and receive signals externally, a second coupling portion electrically connected to the signal transmission lines, and a package configured to support the signal transmission lines and the second coupling portion Including an interface module containing a structure,
The package structure is mounted on the interposer and has space to receive the LSI to allow the heat dissipation member to be located on the surface of the LSI, wherein the second coupling portion is connected to the first coupling portion. Electrically connected, the first or second coupling portion, or both coupling portions, having a mechanism for adjusting a gap height between the interface module and the interposer, wherein the heat dissipation member is in a thermal connection relationship to the LSI. Has

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According to another feature of the invention,
A method of assembling an LSI package disposed on a mounting board and configured to have a heat dissipation member is provided, which method of assembling an LSI package,
An interposer configured to process signals and configured to mount an LSI having signal input / output terminals and a surface coupled to the heat dissipation member, the interposer being a first signal terminal electrically connected to signal input / output terminals of the LSI. And second electrical terminals, internal wirings electrically connected to the first signal terminals, and a first coupling portion electrically connected to the internal wirings;
Mounting the interposer to a mounting board and electrically connecting the LSI to the mounting board through the second electrical terminals;
Providing an interface module comprising a signal transmission line configured to transmit signals, and a second coupling portion electrically connected to the transmission line; And
Aligning the second coupling portion with the first coupling portion, mounting the LSI to the mounting board, and electrically and mechanically connecting the second coupling portion to the first coupling portion, respectively.
Including,
The package structure is mounted on the interposer and has space to receive the LSI to allow the heat dissipation member to be located on the surface of the LSI, the heat dissipation member having a thermal connection relationship to the LSI. .
According to another feature of the invention,
An LSI package is provided that is disposed on a mounting board and configured to have a heat dissipation member, which LSI package,
An LSI configured to process signals and having signal input / output terminals;
First signal terminals configured to mount the LSI, electrically connected to signal input / output terminals of the LSI, second electrical terminals for electrically connecting the LSI to the mounting board, and the first signal terminals An interposer including an internal wiring electrically connected to the first wiring, and a first coupling part electrically connected to the internal wiring; And
Optical waveguides that transmit output optical signals to and receive input optical signals from outside, convert input optical signals from the optical waveguides into electrical signals, convert electrical signals into output optical signals, and output output signals An interface module comprising an optical element configured to lead to an optical waveguide and an interface integrated circuit configured to drive the optical element
Including,
A second coupling portion is electrically connected to the optical element, the second coupling portions are each electrically connected to the first coupling portion by mechanical contact, and the heat dissipation member has a thermal connection relationship to the LSI.

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Some embodiments of an LSI package including a high speed optical interface module of the present invention will be described below with reference to the accompanying drawings.

(First embodiment)

1 is a cross-sectional view showing the configuration of an LSI package, that is, an LSI assembled unit, including a high speed interface module according to a first embodiment of the present invention before the optical interface module is connected to the LSI package. 2 is a cross-sectional view showing a configuration including an LSI package shown in FIG. 1 and an optical interface module connected thereto.

1 and 2, reference numeral 1 denotes an LSI, that is, a signal processing LSI. As shown in the figure, the LSI 1 includes a signal input / output terminal electrically connected to the interposer 2 by the solder bumps 3. The underfill resin 11 surrounds the connection of the solder bumps 3. High speed signal wires 4 capable of transmitting signals at high speed are disposed in the interposer 2. A pad is formed at one end of the wiring 4, the pad is connected to the solder bump 3, and the solder bump allows the signal input / output terminal of the LSI 1 to be connected thereto. The high speed signal wire 4 is connected to the jack structure, that is, the electrical connection terminal 10 mounted on the front side of the interposer 2 at the other end.

As shown in FIGS. 1 and 2, the optical interface module 7 is disposed on the LSI 1 and the interposer 2. The module 7 comprises, for example, an interface IC, an optical element, and an optical fiber 8. In the optical interface module 7, an obliquely ground optical fiber is fixedly arranged on top of the active region of the optical element so that the light beam from the optical element is guided into the optical fiber, and the light beam from the optical fiber is directed to the optical element. Induced. By a specific structure, the optical element and the optical fiber are optically connected to each other. In addition, the connecting pin of the optical interface module 7, that is, the electrical connecting terminal 9, is inserted into the jack structure 10 and fixed. In addition, a power supply, a ground line, or a low speed control signal line is similarly connected to the LSI 1 through the wiring of the interposer 2. The interposer 2 is connected to the electrical wiring on the mounting board 6 by the solder bumps 5.

According to the above-described configuration, the interposer 2 is mounted to the mounting board 6 as shown in FIG. 1 by a process substantially the same as in the case of mounting a normal Ball Grid Array (BGA) package LSI, The optical interface module 7 is then electrically and mechanically connected to the interposer 2 as shown in FIG. 2. That is, after the interposer 2 is electrically mounted with the mounting board 6 together with the other components, i.e. after heat treatment such as reflow or AH laser heating, the optical interface module 7 causes the interposer 2 to It can be mounted on. This particular configuration has a high affinity with electrical mounting.

In the configuration shown in FIGS. 1 and 2, the optical interface module 7 is individually packaged. Thus, it is possible to improve the reliability of the optical interface module 7. In addition, it becomes possible to inspect the optical interface module 7 itself, thereby suppressing a decrease in the yield of the mounting board 6 caused by a defective optical element. In addition, since the optical interface module 7 can be mounted by electrical mounting without employing heat treatment, the limitation of mounting involving the adoption of a pigtail system can be suppressed. It should also be noted that the high speed signal is transmitted from the interposer 2 to the optical interface module 7 via the connecting pin 9 and not through the wiring of the mounting board 6, so that the transmission distance is shortened, and thus High frequency signals can be transmitted.

In addition, in the configuration shown in FIGS. 1 and 2, the digital signal can be transmitted between the interface IC housed in the optical interface module 7 and the signal processing LSI 1. The analog electrical signal is also supplied to and transmitted from an optical element housed in the optical interface module 7. Analog electrical signals are transmitted over very short distances. As a result, when transmitting a high frequency signal of 10 Gbps or more, it is possible to form a wiring having a high resistance to noise. As a result, it is possible to secure a wide design margin of the interposer 2, effectively reducing the manufacturing cost of the entire apparatus. It should be noted that the high speed signal line does not need to be formed on the mounting board 6, so that the design of the mounting board 6 can be very easy. In addition, a low cost material such as ordinary FR4 may be used to form the mounting board 6. In addition, the reduction of the cost of the overall system can be facilitated.

In addition, instead of the configuration in which the optical fiber 8 is connected by using the connector, the optical interface module 7 can be directly connected to the interposer 2 to miniaturize the optical interface module 7. In addition, since the optical fiber 8 is inserted in the lateral direction, the thickness of the optical interface module 7 can be further reduced. Accordingly, the height of the upper surface of the optical interface module 7 related to the interposer 2 can be made smaller than in the case of the LSI 1, thus providing a large installation space of the heat sink 21 for the LSI 1. Secure.

3 is a diagram showing an actual mounting state of an LSI package including a high speed interface module according to a first embodiment of the present invention.

The interposer 2 on which the signal processing LSI 1 is mounted together with other mounts is mounted to the mounting board 6. Thereafter, the connecting pin 9 of the optical interface module 7 is inserted into the jack structure 10 of the interposer 2 as indicated by the arrow in the figure to finish preparation of the package. In FIG. 3, reference numeral 13 denotes a wiring on the mounting board 6, and reference numeral 14 denotes a chip portion on the mounting board 6. In addition, an optical connector 12 for connection to an optical fiber outside the device is connected to an optical fiber 8 extending from the optical interface module 7.

As described above, the optical connector 12 is disposed away from the optical interface module 7 and the external optical fiber is connected to the optical connector 12. Accordingly, the previously mentioned optical connector structure is enlarged to remove the limitation on mounting. In addition, the electrical connection between the optical interface module 7 and the interposer 2 is made by the connecting pin 9 and the jack structure 10 shown in FIGS. 2 and 3. These pin and jack structures are connected to each other on four sides around the signal processing LSI 1. Thus, the force applied to the connecting pin 9 during the connection can be evenly distributed. As a result, the force is agglomerated to a specific pin to break the pin, and an uneven force is applied to the interposer 2 to suppress the inconvenience of breaking the soldered portion.

In addition, electrical mounting requires that the interposer 2, to which the signal processing LSI 1 is mounted, has a chip portion, such as capacitors and resistors, peripheral LSIs or ICs, by means of normal reflow processes or coupling with the socket. This can be done by having the soldering done with other mounts, such as After the end of the mounting, the interface module 7 can later be mounted to the interposer 2 with only a mechanical connection without conveying thermal history to the interface module 7. Thus, the transmission line used for the interface module 7 can be selected without being limited by the mounting process. As a result, it becomes possible to select an optimal material that matches the transmission distance, frequency or cost, thereby reducing the overall cost of the device.

(2nd Example)

4 is a cross-sectional view schematically illustrating a configuration of an LSI package including a high speed interface module according to a second embodiment of the present invention. In addition, the elements of the package shown in FIG. 4 are the same as those shown in FIG. 1, and the detailed description is omitted since they are denoted by the same reference numerals.

When the number of signal lines is increased in order to increase the band of signals in the configuration of the first embodiment, it is necessary to modify the connector of the optical interface module 7. Specifically, it is necessary to reduce the pitch of the connection pin 9 to a fine structure. In this case, when the connecting pin 9 is connected to the jack structure 10, high precision is required when positioning the connecting pin 9 and the jack structure 10.

In this situation, in the second embodiment of the present invention, shown in FIG. 4, a guide pin 16 for position alignment is formed in the optical interface module 7 and the guide hole 16 into which the guide pin 15 is inserted. This is formed in the interposer 2.

The specific structure for the second embodiment is that the connecting pin 9 and the jack structure 10 when the connecting pin 9 is connected to the jack structure 10 by simply inserting the guide pin 15 into the guide hole 16. High aligning accuracy can be realized. As a result, an effect similar to that obtained in the first embodiment can be obtained. Further, the case where the pitch of the connector of the optical interface module 7 is reduced to a fine structure can be sufficiently coped with.

(Third Embodiment)

5 is a schematic cross-sectional view of a configuration of an LSI package including a high speed interface module according to a third embodiment of the present invention. In addition, the components of the package shown in FIG. 5 are the same as those shown in FIG. 1, denoted by the same reference numerals, and a detailed description thereof is omitted.

When the ground wire and the power supply of the optical interface module 7 are shared by the signal processing LSI 1 of the configuration for the first embodiment, the switching noise of the LSI 1 and the module 7 will interfere with each other, resulting in signal noise It is considered to occur. In order to avoid the above problem, it is necessary to perform decoupling, for example, by using the capacitance of a region very adjacent to each power line of the optical interface module 7 and the signal processing LSI 1 on the interposer 2. . However, the size of the free space on the interposer 2 is limited and does not provide sufficient allowance to allow additional chip part mounting required by the mounting of the optical interface module 7.

In this situation, the power supply and ground wire for the optical interface module 7 are derived directly from the power supply wiring 17 of the mounting board 6, for example, the mounting board of the third embodiment of the present invention shown in FIG. Decoupling is performed by the capacitance chip or the noise filter chip 18 on the back side of (6). In the third embodiment, the connection between the mounting board 6 and the optical interface module 7 is performed by the pin-jack structure mechanism as in the connection of the interposer 2.

The particular arrangement described above makes it possible to place the additional chip portion required by adding the optical interface module 7 on the mounting board 6. Thus, it is possible to obtain an effect similar to that obtained in the first embodiment. In addition, since the limitation of the size is relaxed, it is possible to apply stronger decoupling even if there is no large change on the interposer 2 side.

(Example 4)

In each of the first to third embodiments described above, a signal processing LSI and an electrical connection terminal are disposed on the surface of the interposer 2. However, it is also possible to arrange the signal processing LSI and the electrical connection terminals as shown in Figs.

6 is a cross-sectional view showing a state before the optical interface module is connected to the interposer 2, and FIG. 7 is a cross-sectional view showing a state after the optical interface module is connected to the interposer 2.

In the configuration shown in FIGS. 6 and 7, the signal processing LSI is housed in a cavity 31 in the interposer 2. More specifically, the signal processing LSI 1 is housed and arranged under the interposer 2. The pin jack structure 10 is formed in the outer peripheral region of the upper part of the interposer 2. The pin jack structure 10 is connected to the wiring in the interposer 2. In addition, a wiring line is connected to the signal input / output terminal of the LSI 1 via the solder bumps 3. As shown in FIG. 6, the optical interface module 7 is arranged on the interposer 2. Thereafter, the optical interface module 7 is fixed on the interposer 2 as shown in FIG. Accordingly, the signal processing LSI is not exposed to the outside of the package, and thus the specific structure is excellent in terms of processing performance and reliability.

(Example 5)

8 is a cross-sectional view showing a state before the optical interface module 7 is connected to the interposer 2, and FIG. 9 is a cross-sectional view showing a state after the optical interface module 7 is connected to the interposer 2. to be.

In the configuration shown in FIGS. 8 and 9, the electrical connection terminal 10 is arranged on the side of the interposer 2. In addition, the optical interface module 7 is arranged laterally of the interposer 2 and connected to and fixed to the interposer 2. Thus, in the configuration shown in Figs. 8 and 9, the thickness of the entire apparatus is reduced, making it possible to reduce the apparatus.

(Example 6)

10 and 11 show an LSI package including a high speed interface module according to a sixth embodiment of the present invention, where FIG. 10 is a cross-sectional view showing a state before the optical interface module is connected to the interposer 2, 11 is a cross-sectional view showing a state after the optical interface module is connected to the interposer 2. FIG. 12 is a cross-sectional view illustrating a configuration of the electrical connection unit illustrated in FIG. 11. FIG. 13 is a perspective view illustrating the LSI package illustrated in FIG. 10 in a perspective manner. FIG. 14 is an inclination diagram illustrating the LSI package shown in FIG. 12 in a perspective manner. In addition, the components of the package illustrated in FIGS. 10 to 14 are the same as those illustrated in FIG. 1, and the same reference numerals are denoted to omit detailed description thereof.

As shown in FIG. 10, a heat sink 21 is formed on the top surface of the optical interface module 7. The heat sink 21 is fixed to the top surface of the optical interface module 7 by a thermally conductive adhesive layer 20 of appropriate thickness. The interposer 2 on which the signal processing LSI 1 is mounted is soldered to the mounting board 6 by the solder bumps 5. In addition, the signal processing LSI 1 has an appropriate thickness and is attached to the heat sink 21 to which the optical interface module 7 is mounted through a thermally conductive paste material layer 19 formed on the upper surface of the signal processing LSI 1. Attached. When attaching the LSI 1, a connecting pin 9 is inserted into the jack structure 10 on the interposer 2 for electrical connection as shown in FIG. 12.

As shown in FIG. 12, the jack structure 10 includes, for example, a conductor 10-1 and a conductor (10-1) connected to a high-speed signal wire 4 formed on an inner surface of a coupling hole formed in the interposer 2. And a flexible conductive spring 10-2 electrically connected to 10-1). The spring 10-2 keeps the conductor 10-1 in electrical contact with the connecting pin 9, and a configuration having a tolerance between the tip of the connecting pin 9 and the bottom of the coupling hole is interposer 2 Formed in In certain configurations, the connecting pin 9 can be moved in the up and down direction while maintaining the electrical connection to the jack structure 10. Depending on the length of the connecting pin 9 and the depth of the coupling hole, the moving range of the connecting pin 9 is about several hundred microns.

According to this particular configuration, the optical interface module 7 is fixed to the heat sink 21 with a thermally conductive adhesive layer 20 of appropriate thickness, as shown in FIGS. 10 and 13, as shown in FIGS. 11 and 14. It is possible to attach the heat sink 21 to the backside of the signal processing LSI 1 with the thermally conductive paste layer 19 interposed therebetween with an appropriate thickness. As a result, it becomes possible to set the respective thicknesses of the signal processing LSI 1 and the optical interface module 7 to appropriate values to suppress the increase in thermal resistance. It is also possible to maintain an electrical connection between the LSI and the optical interface module. In addition, it is possible to facilitate control of the thickness by pressurization using a thermally conductive sheet which does not exhibit fluidity instead of the thermally conductive paste layer 19.

Soldering the optical interface module 7 to the interposer 2 can also be considered. However, soldering is undesirable. Note that in this connection, in the soldering structure, both the signal processing LSI 1 and the optical interface module 7 are attached to the heat sink 21 using a thermally conductive adhesive. However, in this configuration, the difference in level resulting from the difference in thickness between the LSI 1 and the optical interface module 7 must be absorbed by changing the thickness of the thermally conductive adhesive layer.

The thermal conductivity of the thermally conductive adhesive is about 30 to 60 W / m / K, which is lower than 240 W / m / K for aluminum which is widely used as heat sink material and 150 W / m for silicon used as LSI material. Lower than / K Accordingly, from the viewpoint of heat dissipation, it is advantageous that the thermally conductive adhesive layer becomes thin. However, as the thickness of the thermally conductive adhesive layer decreases, the bonding strength is lowered, and there is a tendency that cracks are caused at the same time. When the LSI is thin, the thermally conductive adhesive layer becomes thick on the LSI side, and when the LSI is thick, the adhesive layer becomes thick on the side of the optical interface module. In this system, it is difficult for the thermally conductive adhesive layer to have an appropriate thickness simultaneously on both sides. That is, since the difference in level is absorbed by the thickness of the adhesive layer, the adhesive layer is required to include a thick portion, which causes a problem that the heat resistance of the adhesive layer is increased in the thick portion, thereby lowering the heat dissipation performance.

On the other hand, in the configuration shown in Figs. 10 to 12, the height can be adjusted using the connecting pin 9 and the jack structure 10, and the level between the signal processing LSI 1 and the optical interface module 7 The difference of can be absorbed by the height adjusting mechanism to overcome the problem caused by the occurrence of the level difference.

10 to 12, the electrical connection of the optical interface module 7 is arranged on four sides around the signal processing LSI 1 shown in Figs. 13 and 14, and is connected from the connection stage to the connection. Make the applied force uniform. Thus, when the thermally conductive paste layer 19 is pushed against the rear surface of the signal processing LSI 1, the pushing force can be applied uniformly, so that the thickness of the thermally conductive paste layer can be easily uniformed. There is an effect of suppressing the planar distribution of the thickness. Similar to the case of the thermally conductive sheet, the pressure can be made uniform to suppress an increase in thermal resistance caused by partial pressurization. In addition, the force is concentrated on a specific pin and a non-uniform force is applied, so that in the case of board mounting, it is possible to suppress the defect of breaking the soldered portion.

The structure which produces the said specific effect is not limited to the structure for connection of four sides. For example, a similar effect can be generated from the configuration for the connection on two sides. Also, not all electrical connection terminals need to be electrically connected, for example, the optical fiber is present only on one side, so that only the corresponding terminal is electrically connected to the optical fiber, and the remaining terminals are It is possible to mechanically support the LSI formed on the side surface.

The configuration of the electrical connection between the optical interface module 7 and the interposer 2 is not limited to the configuration shown in FIG. It is possible to appropriately modify the configuration of the electrical connection. For example, it is possible to adopt a configuration in which an anisotropic conductive film is formed on the interposer 2 side, and an electrode pad is formed on the module 7 side. The anisotropic conductive film is adaptable to pressurization and sinks in an amount of tens of microns to several hundred microns depending on the pushing pressure (depending on the thickness of the film), thus absorbing nonuniformity in the level difference between the LSI 1 and the optical interface module 7 It is possible to do

When using an anisotropic conductive film, the adjustable range of the height is smaller than when employing the fin structure described above. However, by a conventional process, for example, by forming a coupling hole for embedding the jack structure 10 in the interposer 2 without adding a special process for attaching the pin to the optical interface module 7. Certain configurations can be formed resulting in the cost savings of the interposer 2 and the optical interface module 7.

(Example 7)

15 and 16 show an LSI package including a high speed interface module according to a seventh embodiment of the present invention, where FIG. 15 is a cross-sectional view showing a state before the optical interface module is connected to the interposer 2, and FIG. 16 is a cross-sectional view showing a state after the optical interface module is connected to the interposer 2. FIG. 17 is a cross-sectional view showing the structure of the electrical connecting portions shown in FIGS. In addition, the components of the package shown in FIGS. 15 to 17 are the same as those shown in FIG. 1, and the same reference numerals are denoted so that detailed description thereof will be omitted.

As shown in Fig. 15, the signal processing LSI 1 is mounted to the interposer 2, and the input / output terminals of the signal processing LSI 1 are connected to the interposer (4) through the electrical wiring 4 in the interposer 2; Is connected to the pad 4-2 at the periphery of the signal processing LSI 1 on the surface of 2). Thus, the input signal to the signal processing LSI 1 is transmitted from the input pad 402 via the electrical wire 4 in the interposer 2, and the output signal generated from the signal processing LSI 1 is transmitted to the interposer 2. Is transmitted to the output pad 402 via the electrical wiring 4 in the circuit.

As shown in Fig. 17, the signal wire 4 in the interposer 2 is exposed to the surface through the metal post 4-1, and the electrode pad 4-2 is formed in the exposed portion thereof. In addition, an anisotropic conductive film 24 that is adaptable to pressurization is attached to the interposer 2 to be in contact with the electrode pad 4-2. The anisotropic conductive film 24 becomes adaptive and sinks in an amount of tens to hundreds of microns when the film 24 is electrically connected as shown in FIG. 16, so that the film 24 is optically interfaced with the LSI 1. It is possible to absorb the level difference between the modules 7.

The anisotropic conductive film 24 has a smaller height adjustable range than in the case of employing the fin structure described above. However, for example, the usual process by forming coupling holes for embedding the jack structure 10 in the interposer 2 without adding a special process for attaching the pin 9 to the optical interface module 7. The specific configuration can be formed by. As a result, it is possible to reduce the cost of the interposer 2 and the optical interface module 7. In addition, this configuration produces the effect of having side mounting tolerances corresponding to the size in the planar direction of the electrode pads 4-2 and 23.

On the other hand, the optical interface module 7 is fixed to the heat sink 21 by a thermally conductive adhesive layer 20 of a suitable thickness as shown in FIG. The electrical input / output unit 22 of the optical interface module 7 is formed of, for example, a flexible wiring film including a polyimide film as a base material, and the solid electrode on the upper surface is formed by the heat sink 21 by the adhesive layer 30. It is fixed to). Since little heat is generated from the electrical input / output unit 22, the adhesive layer 30 does not need to have thermal conductivity. The electrode post 23 exposed to the surface is mounted with the flexible wiring film 22. When the heat sink 21 is pushed by the LSI, the electrode post 23 is pushed by the anisotropic conductive film 24 to obtain electrical contact as shown in FIG. 17.

The electrode post 23 of the flexible wiring film 22 is led into the package of the body of the optical interface module 7 and electrically connected to the interface IC 25 of the exposed portion in the package by gold wire or solder bumps. Connected. The optical element 26 electrically connected to the interface IC 25 by gold wire or solder bumps and the optical fiber 8 is housed in a package, and the optical element 26 and the optical fiber 8 are optically coupled to each other. Ring.

As in the other embodiments described above, it is possible to arrange the interface IC 5, the optical element 26 and the optical fiber 8 outside of the interposer 2. However, according to the configuration for the seventh embodiment, the thickness of the optical interface module 7 disposed on the interposer 2 is almost equal to the sum of the thickness of the flexible wiring film 22 and the thickness of the adhesive layer 30. It is enough to be the same. Thus, in this case, the signal processing LSI 1 can be made very thin, so that the margin between the interposer 2 and the heat sink 21 is very small so that, for example, the pins can be connected to the optical interface module 7. The above specific configuration can be applied if it becomes difficult to mount on.

For example, it is possible to reduce the thickness of the adhesive layer 30 and the thickness of the wiring film 22 to about 30 µm and 50 µm, respectively. In addition, the thickness of the anisotropic conductive film 24 can be reduced to about 100 μm (for example, an MT-T type film manufactured by Shin-etsu Polmer K.K). Thus, the above specific configuration can be realized even when the thickness of the signal processing LSI 1 is reduced to about 200 mu m. Further, according to the above specific configuration, the optical interface module 7 is sufficient to have an appropriate thickness as long as the optical interface module 7 can be disposed between the heat sink 21 and the mounting board 6, and the optical interface The nonuniformity in the level difference between the module 7 and the signal processing LSI 1 need not be taken into account. Further, since the nonuniformity in the thickness difference between the signal processing LSI 1 and the electrical input / output unit 22 can be absorbed by the amount of sink of the flexible anisotropic conductive film 24, the heat sink 21 can be used conventionally. have.

According to the configuration shown in Fig. 15, the wiring for the high speed transmission is disposed inside the package substrate, and the pins do not need to be connected to the coupling mechanism, so that the wiring for the high speed transmission can be formed only by the surface layer wiring. Accordingly, the impedance can be easily controlled to obtain the effect of improving the high frequency characteristics.

The mounting procedure of this embodiment will now be described with reference to FIG. As shown in FIG. 18, the optical interface module 7 is fixed to the heat sink 21 by a thermally conductive adhesive layer or a solder layer of appropriate thickness, and the electrical input / output unit 22 is connected by another adhesive layer 30. It is fixed to the optical interface module 7. A thermally conductive paste layer 19 is inserted over the upper surface of the signal processing LSI 1, i.e., the exposed surface, and the electrical connection terminals are aligned as indicated by the arrows and inserted into the optical interface module including the heat sink to make the electrical connection terminals. To be fitted. The heat sink 21 is pressed by an external holder (not shown) in the direction in which the heat sink 21 is pushed with respect to the LSI 1. In this step, the flexible anisotropic conductive film 24 is sinked to absorb the thickness nonuniformity and pressed until the layer of the thermally conductive paste material on the upper surface of the signal processing LSI is fixed to an appropriate thickness.

Due to the above-described configuration, the interposer 2 and the optical interface module ( 7) Electrical connection between is possible.

In addition, the electrical connection need not be disposed on the top surface of the interposer 2. As will be described later with reference to FIGS. 22 and 23, it is possible for the electrical connection portion to be arranged to be electrically connected to the side of the interposer 2.

The electrical connection is not limited to the case of the above-described embodiment. Specifically, it is possible for the electrical connection portion to be formed using a bump metal such as gold formed on the wiring pad shown in FIGS. 19 and 20.

(Example 8)

19 and 20 show an LSI package including a high speed interface module according to an eighth embodiment of the present invention, where FIG. 19 shows a state before the optical interface module 7 is connected to the interposer 2. 20 is a cross-sectional view showing a state after the optical interface module 7 is connected to the interposer 2. 21A and 21 are cross-sectional views showing the configuration of the electrical connection portion having the height adjustment function shown in FIGS. 19 and 20. 21C is a cross sectional view showing a configuration of an electrical connection portion having a plurality of bumps. In addition, the components of the LSI package shown in FIGS. 19 to 21 are the same as those shown in FIG. 1, and the same reference numerals are denoted so that detailed description thereof will be omitted.

As shown in Figs. 19 and 20, a signal processing LSI 1 is mounted on the interposer 2, and a signal input / output terminal of the signal processing LSI 1 is connected to a pad on the interposer. These pads are connected to the electrical wiring 4 inside the interposer 2 and the electrical wiring 4 is connected to a connection portion formed at the periphery of the signal processing LSI 1 on the surface of the interposer 2.

As shown in FIG. 21A, the signal wire 4 inside the interposer 2 extends over the surface of the interposer 2 through the post metal 4-1 and is exposed to the surface of the interposer 2. It is connected to the electrode pad 4-2 formed in a manner. Further, for example, a bump metal 52 made of Au or Al is formed on the electrode pad 4-2, and the electrode pad 51 is on the interface module 7 in a manner opposite to the bump metal 52. Is formed. The electrode pad 51 is connected by contact bonding to the electrode pad 4-2, and the bump metal 52 is inserted therebetween. Before the electrode pad 51 is connected by contact bonding to the electrode pad 4-2, the electrode pad 51 and the electrode pad 4-2 are maintained in electrical contact with each other to bump as shown in Fig. 21A. The metal 52 is relatively indestructible. On the other hand, after the electrode pad 51 is connected to the electrode pad 4-2 by contact bonding, pressure is applied between the electrode pad 51 and the electrode pad 4-2 to collapse the bump metal 52. As a result, the electrode pad 51 is electrically connected to the electrode pad 4-2 at short connection intervals. In this way, it is possible to control the amount of collapse of the bumps 52 by tens of microns, so that the bumps 52 function as a height adjustment mechanism, resulting in unevenness of the level difference between the LSI 1 and the interface module 7. It is possible to eliminate. Further, when a plurality of bump metals are used to achieve a single electrical connection as shown in Fig. 21C, the electrode pads 4-2 on the side of the interposer 2 and the electrode pads 51 on the interface module side are used. Even if there is a size difference, it is possible to eliminate the deviation of the mounting position laterally.

(Example 9)

22 and 23 show an LSI package including a high speed interface module according to a ninth embodiment of the present invention, where FIG. 22 shows a state before the optical interface module 7 is connected to the interposer 2. 23 is a cross-sectional view showing a state after the optical interface module 7 is connected to the interposer 2. 24A to 24C are cross-sectional views showing the configuration of the electrical connections, respectively, and collectively showing the process of connecting the electrical connections to each other. In addition, the components of the package shown in FIGS. 22 to 24 are the same as those shown in FIG. 1, denoted by the same reference numerals, and a detailed description thereof is omitted.

The electrical connection 10 is formed in the shape of a vertical groove on the periphery of the side of the interposer 2 as shown in FIG. 24A, and the electrical connection 9 of the interface module 7 is shown in FIGS. 24B and 24C. It is inserted into the electrical contact 10 from above as shown. In the configuration employed in the ninth embodiment of the present invention, the position of the electrical contact 9 can be controlled in the vertical direction as shown in FIGS. 22 and 24c while the electrical contact 9 is brought into the electrical contact 10. Keep inserted. According to this specific configuration, the thickness of the electrical connection of the interface module 7 is not limited by the height of the signal processing LSI 1, so that the arrangement of each part is free to some extent.

The present invention is not limited to each of the above-described embodiments and may be modified as follows.

Modification Example

In the various embodiments described above, the optical connection between the optical element and the optical fiber in the optical interface module 7 is made by fixing the obliquely polished optical fiber over the active region of the optical element. As a variant, it is possible for the optical fiber 8 to be supported by the support member 53 so that the edge surface 54 of the optical fiber 8 is exposed to the outside. Further, as shown in FIG. 25, the edge surface 55 of the support member 53 to which the fiber edge surface 54 is exposed to achieve direct optical coupling between the fiber edge surface 54 and the optical element 26. It is possible for the optical element 26 to be disposed. It is also possible for the electrode 56 of the optical element 26 to recede to the side of the support member 53 and be electrically connected to the drive IC. According to this particular configuration, the positional arrangement between the active area of the optical element 26 and the core of the optical fiber 8 need not be controlled, and the optical element 26 and the optical fiber 8 are in a single integrated portion. Can be processed. Accordingly, the mounting performance of the device can be improved, and the cost can be reduced. Further, in the optical interface module 7 shown in FIG. 25, the optical coupling portion, the interface IC, the connection wire, and the like can be molded, for example, of resin. However, it is not necessary to mold these members, and in the case of the MCM configuration sealed outside the module, it is possible to employ a configuration without molding as shown in FIG. The structure 57 shown in FIG. 26 is sealed with the MCM substrate 60 by a heat lid, with an adhesive layer 58 inserted therebetween and thermally connected to the heat sink 21. Pins 59 for wiring to the outside are formed on the MCM substrate 60 so that the MCM substrate 60 is connected to the mounting board 6. This particular configuration reduces the number of parts used to reduce the number of manufacturing processes and consequently the cost.

In addition, the signal processing LSI 1 is not limited to a package using a resin molded substrate or an under-filled BGA substrate. It is possible for an LSI package to be a land grid array (LGA). In certain LSI packages, the LSI package is mounted to the mounting board 6 using an anisotropic conductive resin as shown in FIG. In addition, the electrical connection means between the LSI and the interposer 2 is not limited to bumps. The feature of the package by the LGA is that the pin pitch can be narrower than PGA or BGA, reducing the mounting area. As a result, the LGA package is effective when using a large scale LSI that requires a very large number of pins. Reference numeral 70 shown in FIG. 27 denotes a wire for connecting the signal processing LSI 1 to the electrode of the interposer 2, and reference numeral 68 denotes an anisotropic conductive resin including a conductive particle 69. As shown in FIG.

In addition, in the configuration in which the heat leads 61 are formed on the interposer 2 as shown in FIG. 28, a pin grid array 62 is used for the connection between the interposer 2 and the mounting board. It is possible. In the above specific configuration, since the signal processing LSI 1 is sealed by heat leads, it is possible to prevent breakage such as breakage of the LSI chip when mounting the interface module 7 together with the heat sink 21. In addition, in order to mount the PGA on the mounting board 6, a configuration for mounting the PGA package in the socket 63 may be employed as shown in FIG. In the configuration shown in FIG. 29, the signal processing LSI is mounted on the interposer 2 with a resinous under-fill. The signal processing LSI 1 may be mounted to the interposer 2 using heat leads instead of resinous underfill. Reference numeral 64 shown in FIG. 29 denotes a pressing member of the heat sink 21. The pressing member 64 is caught by a retention 65 disposed on the mounting board 6 such that the heat sink 21 is pushed downward by the elasticity of the pushing component 64. Causing the heat sink 21 to be fixed. In the case of employing the above specific configuration, both the heat sink and the LSI including the interface module can be replaced after mounting, thereby making it possible to handle the replacement due to the occurrence of a defect and the replacement of the version. Reference numeral 66 shown in FIG. 29 denotes a dummy module arranged to face the interface module 7. The dummy module 66 has a mechanical configuration only at the electrical connection to prevent the device from tilting due to the load when the interface module is placed only on one side of the signal processing LSI. It is possible that the mechanism for applying the load is in the form of a screw as shown in FIG. 30. The mechanism for applying the load can more finely control the load applied to the electrical connection between the interposer 2 and the interface module 7. Reference numeral 72 shown in FIG. 30 denotes a screw. The interface module 7 is disposed on the supporting substrate 71 and the load is applied through the mounting holes 6 and the screw holes formed in the supporting substrate 71. In addition, the pushing mechanism has a hook 73 formed in the heat sink 21 as shown in FIG. 31, and the hook 73 is engaged with the interposer 2 to fix the heat sink 21. In this configuration, the hook 73 is expanded once and then locked to prevent the interface module from being erroneously disconnected. In this case, compared to the pushing force just before the locking, the pushing force downward after the locking is slightly lowered. However, the lowered push force can be absorbed by an electrical connection having a height adjustment mechanism such as a contactor.

In addition, in the above-described embodiment, the optical fiber is used as the transmission line. However, similar effects can be obtained when using electrical transmission lines such as coaxial cables, semi-rigid cables or flexible wiring plates. More specifically, line driver ICs for line driving, electrical transmission lines, means for connecting the electrical transmission lines to the output of the line driver ICs (e.g., solder bumps or wire bonding), and signal processing outside the interface module. It is possible to replace the optical interface module with an interface module housing the input and output electrical terminals connected to the input and output signals of the LSI.

As described above, in the present invention, the pigtail-type interface module (a configuration in which one end of the transmission line is included in the interface module) is housed in a separate package together with the optical coupling mechanism and the electrical connection supporting mechanism to miniaturize the device. . In addition, the interface module and the interposer 2 are electrically connected to each other via their electrical connection terminals by mechanical contact. Accordingly, the present invention can solve the above-mentioned problem.

More specifically, since the interface module is directly mounted to the interposer 2, the length of the electrical wiring between the signal processing LSI and the interface module is shortened, so that an interface module having a high throughput can be mounted without requiring an expensive transmission line. can do. In addition, since the external wiring of the interface module is directly coupled instead of the coupling using the connector, the configuration of the interface module is prevented from being complicated. In addition, since the interposer 2 and the interface module can be coupled to each other by an electrical connection terminal, it is possible to prevent the problem of interference between soldering of the interposer and soldering of the interface module.

It should also be noted that it is possible to absorb the height difference between the LSI and the interface module since the interface module is fixed to the heat sink and a height adjustment is given to the electrical connection terminals. As a result, the thickness difference between the LSI and the interface module can be absorbed even when the LSI and the interface module generate a large amount of heat and typically need to use a heat sink. As a result, it is possible to realize an LSI package including an inexpensive interface module capable of suppressing an increase in thermal resistance.

In addition, the above-described second and third embodiments may be appropriately combined with embodiments (ie, fourth through eighth embodiments) except for the first embodiment. Of course, the invention can be modified in various other ways within the technical scope of the invention.

Those skilled in the art will readily be able to take additional advantages and modifications. Thus, in a broader sense, the invention is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

Claims (21)

An LSI package disposed on a mounting board and configured to have a heat dissipation member, An LSI configured to process signals and having a surface coupled to signal input / output terminals and the heat dissipation member; First signal terminals configured to mount the LSI, electrically connected to signal input / output terminals of the LSI, second electrical terminals for electrically connecting the LSI to the mounting board, and the first signal terminals An interposer including an internal wire electrically connected to the first wire, and an first coupling part electrically connected to the internal wire; And To support signal transmission lines configured to transmit signals to and receive signals from the outside, a second coupling portion electrically connected to the signal transmission lines, and the signal transmission lines and the second coupling portion. An interface module comprising a configured package structure, wherein the second coupling portions are each electrically connected to the first coupling portions by mechanical contacts, and the package structures are mounted on the interposer and provide a space for receiving the LSI. To allow the heat dissipation member to be located on the surface of the LSI, the heat dissipation member having a thermal connection relationship with the LSI. LSI package containing. The method of claim 1, The interposer has a front and a back facing each other, The LSI is mounted on the front side of the interposer and the second electrical terminal is provided on the rear side of the interposer, The interface module further includes an input / output device configured to output signals to the signal transmission lines and input signals from the signal transmission lines, wherein the second coupling portion is electrically connected to the input / output device, and the input / output device is Provided within the package structure LSI package. An LSI package having a configuration disposed on a mounting board and mounted with a heat dissipation member, An LSI configured to process signals, the LSI having a surface coupled to signal input / output terminals and the heat dissipation member; First signal terminals configured to mount the LSI, electrically connected to signal input / output terminals of the LSI, second electrical terminals for electrically connecting the LSI to the mounting board, and the first signal terminals An interposer including an internal wiring electrically connected to the first wiring, and a first coupling part electrically connected to the internal wiring; And Signal transmission lines configured to transmit signals externally and receive signals externally, a second coupling portion electrically connected to the signal transmission lines, and a package configured to support the signal transmission lines and the second coupling portion Interface module containing the structure Including, The package structure is mounted on the interposer and has space to receive the LSI to allow the heat dissipation member to be located on the surface of the LSI, wherein the second coupling portion is connected to the first coupling portion. Electrically connected, the first or second coupling portion, or both coupling portions, having a mechanism for adjusting a gap height between the interface module and the interposer, wherein the heat dissipation member is in a thermal connection relationship to the LSI. Having LSI package. The method of claim 3, The interposer has a front and a back facing each other, The LSI is mounted on a front side of the interposer, the second electrical terminal is provided on a rear side of the interposer, The interface module includes an input / output element configured to output signals to the signal transmission lines and to input signals from the signal transmission lines, The second coupling part is electrically connected to the input / output element, The input / output element is provided in the package structure LSI package. The method of claim 3, One of the first and second coupling parts includes coupling pins, and the other of the first and second coupling parts accommodates the coupling pins and fixes the coupling pins. Including insertion structures configured to LSI package. The method of claim 3, The first and second coupling parts include electrode pads, and an anisotropic conductive film is provided between the electrode pads to couple the electrode pads. LSI package. The method of claim 3, One of the interface module and the interposer includes a guide pin mounted thereon, and the other of the interface module and the interposer includes a guide hole into which the guide pin is inserted. LSI package. The method of claim 3, The interface module further includes third electrical terminals for electrically connecting the interface module to the mounting board. LSI package. The method of claim 4, wherein The interface module further includes a flexible electrical wiring film coupled between the input / output element and the second coupling portion. LSI package. The method of claim 9, Further comprising an anisotropic conductive film having a reversibility of the thickness interposed between the first and second coupling portion LSI package. The method of claim 3, The interposer has a front and a back facing each other, The LSI is mounted on the front of the interposer, The first coupling portion is disposed along two or four sides of the LSI on the front surface of the interposer. LSI package. The method of claim 3, The signal transmission line comprises optical waveguides, The interface module includes an optical element configured to convert electrical signals into output optical signals and direct output optical signals to the optical waveguide, and interface integrated circuits configured to electrically drive the optical elements. LSI package. A method of assembling an LSI package disposed on a mounting board and configured to have a heat dissipation member, the method comprising: An interposer configured to process signals and configured to mount an LSI having signal input / output terminals and a surface coupled to the heat dissipation member, the interposer being a first signal terminal electrically connected to signal input / output terminals of the LSI. And second electrical terminals, internal wirings electrically connected to the first signal terminals, and a first coupling portion electrically connected to the internal wirings; Mounting the interposer to a mounting board and electrically connecting the LSI to the mounting board through the second electrical terminals; Providing an interface module comprising a signal transmission line configured to transmit signals, and a second coupling portion electrically connected to the transmission line; And Aligning the second coupling portion with the first coupling portion, mounting the LSI to the mounting board, and electrically and mechanically connecting the second coupling portion to the first coupling portion, respectively. Including, The package structure is mounted on the interposer and also has space to receive the LSI to allow the heat dissipation member to be located over the surface of the LSI, the heat dissipation member having a thermal connection relationship to the LSI. How to assemble an LSI package. The method of claim 13, Inserting a thermally conductive material into a clearance between the heat dissipation heat sink provided on the interface module and the heat dissipation surface of the LSI; And Pushing the layer of thermally conductive material to a suitable thickness upon mounting of the LSI; LSI package assembly method further comprising. The method of claim 1, The interposer has a front and a back facing each other, The LSI is mounted on the front of the interposer, The first coupling portion is disposed along two or four sides of the LSI on the front surface of the interposer. LSI package. The method of claim 1, The heat sink is fixed to the upper surface of the interface module and disposed above the space of the package structure, and functions as the heat dissipation member. LSI package. The method of claim 1, The first coupling portion is provided on the front surface of the interposer LSI package. The method of claim 3, The first coupling portion is provided on the front surface of the interposer LSI package. The method of claim 3, The second coupling portion is electrically connected to the first coupling portion by a mechanical contact, and thermal coupling between the LSI and the heat dissipating member is maintained when the mechanical contact is provided. LSI package. An LSI package disposed on a mounting board and configured to have a heat dissipation member, An LSI configured to process signals and having signal input / output terminals; First signal terminals configured to mount the LSI, electrically connected to signal input / output terminals of the LSI, second electrical terminals for electrically connecting the LSI to the mounting board, and the first signal terminals An interposer including an internal wiring electrically connected to the first wiring, and a first coupling part electrically connected to the internal wiring; And Optical waveguides that transmit output optical signals to and receive input optical signals from outside, convert input optical signals from the optical waveguides into electrical signals, convert electrical signals into output optical signals, and output output signals An interface module comprising an optical element configured to guide an optical waveguide and an interface integrated circuit configured to drive the optical element Including, A second coupling portion is electrically connected to the optical element, each of the second coupling portions is electrically connected to the first coupling portion by a mechanical contact, and the heat dissipation member has a thermal connection relationship to the LSI. LSI package. The method of claim 20, The interposer has a front and a back facing each other, The LSI is mounted on the front of the interposer, The first coupling portion is disposed along two or four sides of the LSI on the front surface of the interposer. LSI package.

Images