KR100756522B1 - 기판 건조용 에어나이프 장치 - Google Patents
기판 건조용 에어나이프 장치 Download PDFInfo
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- KR100756522B1 KR100756522B1 KR1020070011790A KR20070011790A KR100756522B1 KR 100756522 B1 KR100756522 B1 KR 100756522B1 KR 1020070011790 A KR1020070011790 A KR 1020070011790A KR 20070011790 A KR20070011790 A KR 20070011790A KR 100756522 B1 KR100756522 B1 KR 100756522B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 238000001035 drying Methods 0.000 title claims abstract description 22
- 239000011538 cleaning material Substances 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 description 8
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Drying Of Solid Materials (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (6)
- LCD 패널과 같은 기판의 상측에, 그 기판에 수직인 축을 기준으로 경사지게 배치되는 제1블럭과, 상기 제1블럭과 함께 공기유동통로를 형성하도록 그 제1블럭에 결합되고, 상기 기판에 수직인 축을 기준으로 경사지게 배치되는 제2블럭을 구비하여서, 상기 공기유동통로로 유입된 공기를 상기 기판에 분사시켜 기판에 잔류된 세척물질을 제거하는 기판 건조용 에어나이프 장치에 있어서,상기 제2블럭은, 상기 기판이 상기 제1블럭 측으로 이송되어 올 때 상기 제1블럭보다 상기 기판으로부터 멀리 배치되어 있으며,상기 제2블럭은, 상기 제1블럭의 하단부보다 상기 기판 방향으로 연장되는 연장부를 구비하여서, 상기 공기유동통로를 통해 외부로 배출되는 공기가 상기 연장부를 타고 상기 기판에 분사되도록 구성되며,상기 공기유동통로는, 원통형의 제1유동공간과; 상기 제1유동공간보다 상기 기판에 가까운 위치에 형성되어 있는 원통형의 제2유동공간과; 상기 제1유동공간에 유입된 공기가 상기 제2유동공간으로 안내되도록, 상기 제1유동공간과 제2유동공간 사이에 마련되는 가이드채널;을 포함하여 이루어지며,상기 제1블럭에는, 상기 가이드채널의 일측벽으로부터 그 가이드채널의 중심방향으로 연장되는 다수의 제1가이드리브들이 마련되고,상기 제2블럭에는, 상기 가이드채널의 타측벽으로부터 그 가이드채널의 중심방향으로 연장되고, 상기 제1가이드리브들과 함께 상기 가이드채널을 작은 공간을 가지는 다수의 소채널로 구획하도록, 상기 제1가이드리브들에 각각 결합되는 다수의 제2가이드리브들이 마련되어 있는 것을 특징으로 하는 기판 건조용 에어나이프 장치.
- 제1항에 있어서,상기 제1유동공간에 동축적으로 삽입되고, 내부로 유입된 공기가 상기 제1유동공간으로 유입될 수 있도록 다수의 공기유입공을 가지는 공기유입관을 더 구비하는 것을 특징으로 하는 기판 건조용 에어나이프 장치.
- 제1항에 있어서,상기 제2유동공간은 상기 제1유동공간의 내경보다 작은 내경을 가지며,상기 가이드채널의 내경은, 상기 제1유동공간 측에서 상기 제2유동공간 측으로 갈수록 점점 작아지도록 구성된 것을 특징으로 하는 기판 건조용 에어나이프 장치.
- 제1항에 있어서,상기 제1블럭과 제2블럭의 외면은 각각, 면과 면 사이에 마련되고 곡면 형상을 가지는 라운드부를 포함하여 이루어지는 것을 특징으로 하는 기판 건조용 에어나이프 장치.
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070011790A KR100756522B1 (ko) | 2007-02-05 | 2007-02-05 | 기판 건조용 에어나이프 장치 |
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KR1020070011790A KR100756522B1 (ko) | 2007-02-05 | 2007-02-05 | 기판 건조용 에어나이프 장치 |
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Publication Number | Publication Date |
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KR100756522B1 true KR100756522B1 (ko) | 2007-09-10 |
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KR1020070011790A KR100756522B1 (ko) | 2007-02-05 | 2007-02-05 | 기판 건조용 에어나이프 장치 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100939445B1 (ko) * | 2009-04-01 | 2010-01-29 | 이재성 | 비접촉식 유체 제거장치 |
KR101021227B1 (ko) * | 2008-12-19 | 2011-03-11 | 에프엔에스테크 주식회사 | 에어 나이프 |
CN101992154A (zh) * | 2009-08-24 | 2011-03-30 | 显示器生产服务株式会社 | 流体喷射装置 |
KR101099589B1 (ko) * | 2009-12-01 | 2011-12-28 | 세메스 주식회사 | 기판 상으로 처리액을 공급하기 위한 액절 나이프 |
KR101728896B1 (ko) * | 2016-02-25 | 2017-04-20 | 주식회사 한빛테크놀로지 | 에어나이프 |
CN113443840A (zh) * | 2021-06-30 | 2021-09-28 | 黄乃凡 | 一种玻璃生产制造用风刀 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001099569A (ja) * | 1999-09-29 | 2001-04-13 | Shibaura Mechatronics Corp | 基板の乾燥処理装置 |
JP2005013988A (ja) * | 2003-06-27 | 2005-01-20 | Dms:Kk | 平板ディスプレイ表面処理用流体噴射装置 |
-
2007
- 2007-02-05 KR KR1020070011790A patent/KR100756522B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001099569A (ja) * | 1999-09-29 | 2001-04-13 | Shibaura Mechatronics Corp | 基板の乾燥処理装置 |
JP2005013988A (ja) * | 2003-06-27 | 2005-01-20 | Dms:Kk | 平板ディスプレイ表面処理用流体噴射装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101021227B1 (ko) * | 2008-12-19 | 2011-03-11 | 에프엔에스테크 주식회사 | 에어 나이프 |
KR100939445B1 (ko) * | 2009-04-01 | 2010-01-29 | 이재성 | 비접촉식 유체 제거장치 |
CN101992154A (zh) * | 2009-08-24 | 2011-03-30 | 显示器生产服务株式会社 | 流体喷射装置 |
KR101099589B1 (ko) * | 2009-12-01 | 2011-12-28 | 세메스 주식회사 | 기판 상으로 처리액을 공급하기 위한 액절 나이프 |
KR101728896B1 (ko) * | 2016-02-25 | 2017-04-20 | 주식회사 한빛테크놀로지 | 에어나이프 |
CN113443840A (zh) * | 2021-06-30 | 2021-09-28 | 黄乃凡 | 一种玻璃生产制造用风刀 |
CN113443840B (zh) * | 2021-06-30 | 2022-07-29 | 福莱特玻璃集团股份有限公司 | 一种玻璃生产制造用风刀 |
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