KR100727434B1 - Transparent silver ink composition and thin film formation method using the same - Google Patents
Transparent silver ink composition and thin film formation method using the same Download PDFInfo
- Publication number
- KR100727434B1 KR100727434B1 KR1020050018364A KR20050018364A KR100727434B1 KR 100727434 B1 KR100727434 B1 KR 100727434B1 KR 1020050018364 A KR1020050018364 A KR 1020050018364A KR 20050018364 A KR20050018364 A KR 20050018364A KR 100727434 B1 KR100727434 B1 KR 100727434B1
- Authority
- KR
- South Korea
- Prior art keywords
- silver
- ink composition
- ammonium
- thin film
- silver ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 148
- 239000004332 silver Substances 0.000 title claims abstract description 148
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 146
- 239000000203 mixture Substances 0.000 title claims abstract description 117
- 239000010409 thin film Substances 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 57
- 230000015572 biosynthetic process Effects 0.000 title description 2
- 150000001875 compounds Chemical class 0.000 claims abstract description 72
- -1 ammonium carbonate compound Chemical class 0.000 claims abstract description 60
- 239000003381 stabilizer Substances 0.000 claims abstract description 34
- 229940100890 silver compound Drugs 0.000 claims abstract description 20
- 150000003379 silver compounds Chemical class 0.000 claims abstract description 20
- 239000001099 ammonium carbonate Substances 0.000 claims abstract description 17
- BVCZEBOGSOYJJT-UHFFFAOYSA-N ammonium carbamate Chemical compound [NH4+].NC([O-])=O BVCZEBOGSOYJJT-UHFFFAOYSA-N 0.000 claims abstract description 16
- KXDHJXZQYSOELW-UHFFFAOYSA-N carbonic acid monoamide Natural products NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims abstract description 16
- 235000012501 ammonium carbonate Nutrition 0.000 claims abstract description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 48
- 239000002904 solvent Substances 0.000 claims description 40
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 22
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 20
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 18
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 17
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 15
- JMPXSWBXXUOKFP-UHFFFAOYSA-N 2-ethylhexylazanium;n-(2-ethylhexyl)carbamate Chemical compound CCCCC(CC)C[NH3+].CCCCC(CC)CNC([O-])=O JMPXSWBXXUOKFP-UHFFFAOYSA-N 0.000 claims description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 15
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 15
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 15
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 12
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 claims description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 10
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 10
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 10
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 10
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical group [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 8
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 claims description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 8
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims description 8
- ZSIQJIWKELUFRJ-UHFFFAOYSA-N azepane Chemical compound C1CCCNCC1 ZSIQJIWKELUFRJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910001923 silver oxide Inorganic materials 0.000 claims description 8
- 239000001569 carbon dioxide Substances 0.000 claims description 7
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 7
- 238000011282 treatment Methods 0.000 claims description 7
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical group [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 6
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- NMRPBPVERJPACX-UHFFFAOYSA-N octan-3-ol Chemical compound CCCCCC(O)CC NMRPBPVERJPACX-UHFFFAOYSA-N 0.000 claims description 6
- TZRORHHMAGATLL-UHFFFAOYSA-N propan-2-ylazanium;propan-2-yl carbonate Chemical compound CC(C)[NH3+].CC(C)OC([O-])=O TZRORHHMAGATLL-UHFFFAOYSA-N 0.000 claims description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 6
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 claims description 6
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 5
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 5
- WRJRTLNJQQNHLC-UHFFFAOYSA-N 2-ethylhexylazanium;2-ethylhexyl carbonate Chemical compound CCCCC(CC)C[NH3+].CCCCC(CC)COC([O-])=O WRJRTLNJQQNHLC-UHFFFAOYSA-N 0.000 claims description 5
- CCTFMNIEFHGTDU-UHFFFAOYSA-N 3-methoxypropyl acetate Chemical compound COCCCOC(C)=O CCTFMNIEFHGTDU-UHFFFAOYSA-N 0.000 claims description 5
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims description 5
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 5
- 235000011187 glycerol Nutrition 0.000 claims description 5
- 238000007646 gravure printing Methods 0.000 claims description 5
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000005060 rubber Substances 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- 150000003335 secondary amines Chemical class 0.000 claims description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 5
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 claims description 4
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 claims description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 4
- HTBCQGGKQJBADY-UHFFFAOYSA-N 2-methoxyethylazanium;2-methoxyethyl carbonate Chemical compound COCC[NH3+].COCCOC([O-])=O HTBCQGGKQJBADY-UHFFFAOYSA-N 0.000 claims description 4
- FEPKTMACMPNCGN-UHFFFAOYSA-N 2-methoxyethylazanium;n-(2-methoxyethyl)carbamate Chemical compound COCC[NH3+].COCCNC([O-])=O FEPKTMACMPNCGN-UHFFFAOYSA-N 0.000 claims description 4
- KDSNLYIMUZNERS-UHFFFAOYSA-N 2-methylpropanamine Chemical compound CC(C)CN KDSNLYIMUZNERS-UHFFFAOYSA-N 0.000 claims description 4
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 claims description 4
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910002651 NO3 Inorganic materials 0.000 claims description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical group [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 4
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical group [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims description 4
- 229920002873 Polyethylenimine Polymers 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 claims description 4
- SCJNFWUKTOYSRT-UHFFFAOYSA-N butylazanium;butyl carbonate Chemical compound CCCC[NH3+].CCCCOC([O-])=O SCJNFWUKTOYSRT-UHFFFAOYSA-N 0.000 claims description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 4
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 claims description 4
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine group Chemical group NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 4
- BMFVGAAISNGQNM-UHFFFAOYSA-N isopentylamine Chemical compound CC(C)CCN BMFVGAAISNGQNM-UHFFFAOYSA-N 0.000 claims description 4
- 150000002576 ketones Chemical class 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 229920000083 poly(allylamine) Polymers 0.000 claims description 4
- 150000003141 primary amines Chemical class 0.000 claims description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 claims description 4
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 4
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 claims description 4
- 229910001958 silver carbonate Inorganic materials 0.000 claims description 4
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims description 3
- UDXBSNUCGGXUNH-UHFFFAOYSA-N 2-cyanoethylazanium;2-cyanoethyl carbonate Chemical compound [NH3+]CCC#N.[O-]C(=O)OCCC#N UDXBSNUCGGXUNH-UHFFFAOYSA-N 0.000 claims description 3
- BHRGYSLLXICIEL-UHFFFAOYSA-N 2-cyanoethylazanium;n-(2-cyanoethyl)carbamate Chemical compound [NH3+]CCC#N.[O-]C(=O)NCCC#N BHRGYSLLXICIEL-UHFFFAOYSA-N 0.000 claims description 3
- LFTWYPLGYKQPMV-UHFFFAOYSA-N 2-ethylhexylazanium;hydrogen carbonate Chemical compound OC([O-])=O.CCCCC(CC)C[NH3+] LFTWYPLGYKQPMV-UHFFFAOYSA-N 0.000 claims description 3
- SZVUQKOTOXVFTL-UHFFFAOYSA-N 2-methylpropylazanium;2-methylpropyl carbonate Chemical compound CC(C)C[NH3+].CC(C)COC([O-])=O SZVUQKOTOXVFTL-UHFFFAOYSA-N 0.000 claims description 3
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 claims description 3
- IENDUPQOSWAYMW-UHFFFAOYSA-N 3-triethoxysilylpropylazanium;n-(3-triethoxysilylpropyl)carbamate Chemical compound CCO[Si](OCC)(OCC)CCC[NH3+].CCO[Si](OCC)(OCC)CCCNC([O-])=O IENDUPQOSWAYMW-UHFFFAOYSA-N 0.000 claims description 3
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 claims description 3
- HWVVYUPLWARZKN-UHFFFAOYSA-N N-butylbutan-1-amine dibutyl carbonate Chemical compound CCCCNCCCC.CCCCOC(=O)OCCCC HWVVYUPLWARZKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- 239000005662 Paraffin oil Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical group [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical group [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 claims description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 3
- QJLWYBRKZCYIEK-UHFFFAOYSA-N benzylazanium;benzyl carbonate Chemical compound [NH3+]CC1=CC=CC=C1.[O-]C(=O)OCC1=CC=CC=C1 QJLWYBRKZCYIEK-UHFFFAOYSA-N 0.000 claims description 3
- CGABNMAUJREYGO-UHFFFAOYSA-N benzylcarbamic acid;phenylmethanamine Chemical compound NCC1=CC=CC=C1.OC(=O)NCC1=CC=CC=C1 CGABNMAUJREYGO-UHFFFAOYSA-N 0.000 claims description 3
- DDWQBJYWGXHLCN-UHFFFAOYSA-N butan-1-amine;butylcarbamic acid Chemical compound CCCC[NH3+].CCCCNC([O-])=O DDWQBJYWGXHLCN-UHFFFAOYSA-N 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 150000007942 carboxylates Chemical class 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- IBAHLNWTOIHLKE-UHFFFAOYSA-N cyano cyanate Chemical group N#COC#N IBAHLNWTOIHLKE-UHFFFAOYSA-N 0.000 claims description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- FNPQBMYFLGSBBI-UHFFFAOYSA-N decyl(methyl)azanium;n-decyl-n-methylcarbamate Chemical compound CCCCCCCCCC[NH2+]C.CCCCCCCCCCN(C)C([O-])=O FNPQBMYFLGSBBI-UHFFFAOYSA-N 0.000 claims description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 3
- LXSFGVACVWCFRS-UHFFFAOYSA-N dibutylazanium;n,n-dibutylcarbamate Chemical compound CCCC[NH2+]CCCC.CCCCN(C([O-])=O)CCCC LXSFGVACVWCFRS-UHFFFAOYSA-N 0.000 claims description 3
- WVDBSYPGKQYWSS-UHFFFAOYSA-N dioctadecylazanium;hydrogen carbonate Chemical compound OC([O-])=O.CCCCCCCCCCCCCCCCCC[NH2+]CCCCCCCCCCCCCCCCCC WVDBSYPGKQYWSS-UHFFFAOYSA-N 0.000 claims description 3
- 238000003618 dip coating Methods 0.000 claims description 3
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 claims description 3
- 238000010894 electron beam technology Methods 0.000 claims description 3
- COIHLIVFSZCCQI-UHFFFAOYSA-N ethanamine;ethyl carbamate Chemical compound CCN.CCOC(N)=O COIHLIVFSZCCQI-UHFFFAOYSA-N 0.000 claims description 3
- WAAUVORLARCBAF-UHFFFAOYSA-N ethylazanium;ethyl carbonate Chemical compound CC[NH3+].CCOC([O-])=O WAAUVORLARCBAF-UHFFFAOYSA-N 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 150000002367 halogens Chemical group 0.000 claims description 3
- 150000002391 heterocyclic compounds Chemical group 0.000 claims description 3
- RGEULEMUWRTZMP-UHFFFAOYSA-N hydrogen carbonate;2-methoxyethylazanium Chemical compound OC([O-])=O.COCC[NH3+] RGEULEMUWRTZMP-UHFFFAOYSA-N 0.000 claims description 3
- YCADFRFBAHDVOS-UHFFFAOYSA-N hydrogen carbonate;propan-2-ylazanium Chemical compound CC(C)[NH3+].OC([O-])=O YCADFRFBAHDVOS-UHFFFAOYSA-N 0.000 claims description 3
- NZYYSSZGIPELSX-UHFFFAOYSA-N hydrogen carbonate;pyridin-1-ium Chemical compound OC(O)=O.C1=CC=NC=C1 NZYYSSZGIPELSX-UHFFFAOYSA-N 0.000 claims description 3
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Chemical group SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 claims description 3
- 239000011707 mineral Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- BTDGNUHTDOIMKX-UHFFFAOYSA-N octadecan-1-amine octadecyl carbamate Chemical compound CCCCCCCCCCCCCCCCCCN.CCCCCCCCCCCCCCCCCCOC(N)=O BTDGNUHTDOIMKX-UHFFFAOYSA-N 0.000 claims description 3
- XKFXSYSPQZRVOY-UHFFFAOYSA-N octadecylazanium;octadecyl carbonate Chemical compound CCCCCCCCCCCCCCCCCC[NH3+].CCCCCCCCCCCCCCCCCCOC([O-])=O XKFXSYSPQZRVOY-UHFFFAOYSA-N 0.000 claims description 3
- 238000007645 offset printing Methods 0.000 claims description 3
- 238000007649 pad printing Methods 0.000 claims description 3
- 239000000123 paper Substances 0.000 claims description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 claims description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical group OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical group [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Chemical group 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 235000015096 spirit Nutrition 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000011593 sulfur Chemical group 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 229940116411 terpineol Drugs 0.000 claims description 3
- XKXIQBVKMABYQJ-UHFFFAOYSA-M tert-butyl carbonate Chemical compound CC(C)(C)OC([O-])=O XKXIQBVKMABYQJ-UHFFFAOYSA-M 0.000 claims description 3
- YSEKXGQQTHQQMK-UHFFFAOYSA-N tert-butylazanium;hydrogen carbonate Chemical compound OC([O-])=O.CC(C)(C)[NH3+] YSEKXGQQTHQQMK-UHFFFAOYSA-N 0.000 claims description 3
- XBXCNNQPRYLIDE-UHFFFAOYSA-N tert-butylcarbamic acid Chemical compound CC(C)(C)NC(O)=O XBXCNNQPRYLIDE-UHFFFAOYSA-N 0.000 claims description 3
- 150000003512 tertiary amines Chemical class 0.000 claims description 3
- 239000013008 thixotropic agent Substances 0.000 claims description 3
- 239000000080 wetting agent Substances 0.000 claims description 3
- 239000002023 wood Substances 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 claims description 2
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 claims description 2
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 claims description 2
- QKWWDTYDYOFRJL-UHFFFAOYSA-N 2,2-dimethoxyethanamine Chemical compound COC(CN)OC QKWWDTYDYOFRJL-UHFFFAOYSA-N 0.000 claims description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 2
- OKUWOEKJQRUMBW-UHFFFAOYSA-N 2-[2-(2-methoxyethoxy)ethoxy]ethanamine Chemical compound COCCOCCOCCN OKUWOEKJQRUMBW-UHFFFAOYSA-N 0.000 claims description 2
- HLCPWBZNUKCSBN-UHFFFAOYSA-N 2-aminobenzonitrile Chemical compound NC1=CC=CC=C1C#N HLCPWBZNUKCSBN-UHFFFAOYSA-N 0.000 claims description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 claims description 2
- XEXHIBLRARSXCL-UHFFFAOYSA-N 2-cyanoethylazanium;hydrogen carbonate Chemical compound OC([O-])=O.[NH3+]CCC#N XEXHIBLRARSXCL-UHFFFAOYSA-N 0.000 claims description 2
- YNVZDODIHZTHOZ-UHFFFAOYSA-K 2-hydroxypropanoate;iron(3+) Chemical compound [Fe+3].CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O YNVZDODIHZTHOZ-UHFFFAOYSA-K 0.000 claims description 2
- ASUDFOJKTJLAIK-UHFFFAOYSA-N 2-methoxyethanamine Chemical compound COCCN ASUDFOJKTJLAIK-UHFFFAOYSA-N 0.000 claims description 2
- IUPKRHGZXTZBKD-UHFFFAOYSA-N 2-methylpropan-1-amine 2-methylpropyl carbamate Chemical compound CC(C)CN.CC(C)COC(N)=O IUPKRHGZXTZBKD-UHFFFAOYSA-N 0.000 claims description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- SKRSRJOKBARNAS-UHFFFAOYSA-N 3-triethoxysilylpropylazanium;3-triethoxysilylpropyl carbonate Chemical compound CCO[Si](OCC)(OCC)CCC[NH3+].CCO[Si](OCC)(OCC)CCCOC([O-])=O SKRSRJOKBARNAS-UHFFFAOYSA-N 0.000 claims description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- LPULCTXGGDJCTO-UHFFFAOYSA-N 6-methylheptan-1-amine Chemical compound CC(C)CCCCCN LPULCTXGGDJCTO-UHFFFAOYSA-N 0.000 claims description 2
- RBWNDBNSJFCLBZ-UHFFFAOYSA-N 7-methyl-5,6,7,8-tetrahydro-3h-[1]benzothiolo[2,3-d]pyrimidine-4-thione Chemical compound N1=CNC(=S)C2=C1SC1=C2CCC(C)C1 RBWNDBNSJFCLBZ-UHFFFAOYSA-N 0.000 claims description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Natural products OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 2
- HTJDQJBWANPRPF-UHFFFAOYSA-N Cyclopropylamine Chemical compound NC1CC1 HTJDQJBWANPRPF-UHFFFAOYSA-N 0.000 claims description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 2
- 239000001263 FEMA 3042 Substances 0.000 claims description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 2
- WJYIASZWHGOTOU-UHFFFAOYSA-N Heptylamine Chemical compound CCCCCCCN WJYIASZWHGOTOU-UHFFFAOYSA-N 0.000 claims description 2
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- GMPKIPWJBDOURN-UHFFFAOYSA-N Methoxyamine Chemical compound CON GMPKIPWJBDOURN-UHFFFAOYSA-N 0.000 claims description 2
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 claims description 2
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- OFLXLNCGODUUOT-UHFFFAOYSA-N acetohydrazide Chemical compound C\C(O)=N\N OFLXLNCGODUUOT-UHFFFAOYSA-N 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 229920000180 alkyd Polymers 0.000 claims description 2
- 239000000908 ammonium hydroxide Substances 0.000 claims description 2
- 235000010323 ascorbic acid Nutrition 0.000 claims description 2
- 229960005070 ascorbic acid Drugs 0.000 claims description 2
- 239000011668 ascorbic acid Substances 0.000 claims description 2
- YOHNGYMCCGLBIL-UHFFFAOYSA-N azane azepane Chemical compound N.C1CCCNCC1 YOHNGYMCCGLBIL-UHFFFAOYSA-N 0.000 claims description 2
- BVIXDZIQDYXWQL-UHFFFAOYSA-N azane;morpholine Chemical compound N.C1COCCN1 BVIXDZIQDYXWQL-UHFFFAOYSA-N 0.000 claims description 2
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 2
- AGSPXMVUFBBBMO-UHFFFAOYSA-N beta-aminopropionitrile Chemical compound NCCC#N AGSPXMVUFBBBMO-UHFFFAOYSA-N 0.000 claims description 2
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 claims description 2
- 230000005587 bubbling Effects 0.000 claims description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 125000004802 cyanophenyl group Chemical group 0.000 claims description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 2
- NISGSNTVMOOSJQ-UHFFFAOYSA-N cyclopentanamine Chemical compound NC1CCCC1 NISGSNTVMOOSJQ-UHFFFAOYSA-N 0.000 claims description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 claims description 2
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 claims description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 2
- HSFZJWNDRZGOKZ-UHFFFAOYSA-N dioctadecyl carbonate N-octadecyloctadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC.CCCCCCCCCCCCCCCCCCOC(=O)OCCCCCCCCCCCCCCCCCC HSFZJWNDRZGOKZ-UHFFFAOYSA-N 0.000 claims description 2
- AYGOKHJRGBNMGQ-UHFFFAOYSA-N dioctadecylazanium;n,n-dioctadecylcarbamate Chemical compound CCCCCCCCCCCCCCCCCC[NH2+]CCCCCCCCCCCCCCCCCC.CCCCCCCCCCCCCCCCCCN(C([O-])=O)CCCCCCCCCCCCCCCCCC AYGOKHJRGBNMGQ-UHFFFAOYSA-N 0.000 claims description 2
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 229960002089 ferrous chloride Drugs 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- LRBQNJMCXXYXIU-QWKBTXIPSA-N gallotannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@H]2[C@@H]([C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-QWKBTXIPSA-N 0.000 claims description 2
- 239000008103 glucose Substances 0.000 claims description 2
- 229960001031 glucose Drugs 0.000 claims description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims description 2
- 229910000043 hydrogen iodide Inorganic materials 0.000 claims description 2
- 238000010884 ion-beam technique Methods 0.000 claims description 2
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 claims description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 2
- TYQCGQRIZGCHNB-JLAZNSOCSA-N l-ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(O)=C(O)C1=O TYQCGQRIZGCHNB-JLAZNSOCSA-N 0.000 claims description 2
- 238000013532 laser treatment Methods 0.000 claims description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 2
- 150000002739 metals Chemical group 0.000 claims description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- NPHYYTMURMCAQE-UHFFFAOYSA-N morpholin-4-ium;n-morpholin-4-ylcarbamate Chemical compound C1COCC[NH2+]1.[O-]C(=O)NN1CCOCC1 NPHYYTMURMCAQE-UHFFFAOYSA-N 0.000 claims description 2
- ZNCFDYXWEGLXGS-UHFFFAOYSA-N n-ethyl-n-hexylcarbamate;pyridin-1-ium Chemical compound C1=CC=[NH+]C=C1.CCCCCCN(CC)C([O-])=O ZNCFDYXWEGLXGS-UHFFFAOYSA-N 0.000 claims description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- FJDUDHYHRVPMJZ-UHFFFAOYSA-N nonan-1-amine Chemical compound CCCCCCCCCN FJDUDHYHRVPMJZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- WCVVIGQKJZLJDB-UHFFFAOYSA-N o-butylhydroxylamine Chemical compound CCCCON WCVVIGQKJZLJDB-UHFFFAOYSA-N 0.000 claims description 2
- AQFWNELGMODZGC-UHFFFAOYSA-N o-ethylhydroxylamine Chemical compound CCON AQFWNELGMODZGC-UHFFFAOYSA-N 0.000 claims description 2
- ZCYWLWVJCJEYPJ-UHFFFAOYSA-N o-hexan-2-ylhydroxylamine Chemical compound CCCCC(C)ON ZCYWLWVJCJEYPJ-UHFFFAOYSA-N 0.000 claims description 2
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 claims description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 150000002894 organic compounds Chemical class 0.000 claims description 2
- BHAAPTBBJKJZER-UHFFFAOYSA-N p-anisidine Chemical compound COC1=CC=C(N)C=C1 BHAAPTBBJKJZER-UHFFFAOYSA-N 0.000 claims description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 2
- 239000003208 petroleum Substances 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims description 2
- WSQPMYJWTYRPQR-UHFFFAOYSA-N propan-2-amine;propan-2-yl carbamate Chemical compound CC(C)N.CC(C)OC(N)=O WSQPMYJWTYRPQR-UHFFFAOYSA-N 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 229960004889 salicylic acid Drugs 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims description 2
- 229940071536 silver acetate Drugs 0.000 claims description 2
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 claims description 2
- 229940098221 silver cyanide Drugs 0.000 claims description 2
- FJOLTQXXWSRAIX-UHFFFAOYSA-K silver phosphate Chemical compound [Ag+].[Ag+].[Ag+].[O-]P([O-])([O-])=O FJOLTQXXWSRAIX-UHFFFAOYSA-K 0.000 claims description 2
- 229940019931 silver phosphate Drugs 0.000 claims description 2
- 229910000161 silver phosphate Inorganic materials 0.000 claims description 2
- 229910001494 silver tetrafluoroborate Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000001509 sodium citrate Substances 0.000 claims description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 229940033123 tannic acid Drugs 0.000 claims description 2
- 235000015523 tannic acid Nutrition 0.000 claims description 2
- 229920002258 tannic acid Polymers 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims description 2
- 229940038773 trisodium citrate Drugs 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims 6
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 5
- 125000001424 substituent group Chemical group 0.000 claims 4
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 claims 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 2
- 125000002723 alicyclic group Chemical group 0.000 claims 2
- 229920000728 polyester Polymers 0.000 claims 2
- 125000000547 substituted alkyl group Chemical group 0.000 claims 2
- 239000008096 xylene Substances 0.000 claims 2
- OQXSRALAOPBHPM-UHFFFAOYSA-N 2-hydroxypropanoic acid;silver Chemical compound [Ag].CC(O)C(O)=O OQXSRALAOPBHPM-UHFFFAOYSA-N 0.000 claims 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- CACQZOYYEGDOBA-UHFFFAOYSA-N N-methoxy-2-(2-methoxyethoxy)ethanamine Chemical compound COCCOCCNOC CACQZOYYEGDOBA-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000003570 air Substances 0.000 claims 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 229910052786 argon Inorganic materials 0.000 claims 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims 1
- OGXVOKLHWKEWAL-UHFFFAOYSA-N azepane;carbonic acid Chemical compound OC(O)=O.C1CCCNCC1 OGXVOKLHWKEWAL-UHFFFAOYSA-N 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- 239000001913 cellulose Substances 0.000 claims 1
- 229920002678 cellulose Polymers 0.000 claims 1
- 238000007606 doctor blade method Methods 0.000 claims 1
- 150000008282 halocarbons Chemical class 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 150000002912 oxalic acid derivatives Chemical class 0.000 claims 1
- UDFWUWKGBBKQAF-UHFFFAOYSA-N oxalic acid;silver Chemical compound [Ag].OC(=O)C(O)=O UDFWUWKGBBKQAF-UHFFFAOYSA-N 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- FOWDZVNRQHPXDO-UHFFFAOYSA-N propyl hydrogen carbonate Chemical compound CCCOC(O)=O FOWDZVNRQHPXDO-UHFFFAOYSA-N 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- KKKDGYXNGYJJRX-UHFFFAOYSA-M silver nitrite Chemical compound [Ag+].[O-]N=O KKKDGYXNGYJJRX-UHFFFAOYSA-M 0.000 claims 1
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 claims 1
- 229910000367 silver sulfate Inorganic materials 0.000 claims 1
- 229920006305 unsaturated polyester Polymers 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 claims 1
- 238000000059 patterning Methods 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 98
- 239000000853 adhesive Substances 0.000 description 40
- 230000001070 adhesive effect Effects 0.000 description 40
- 238000010304 firing Methods 0.000 description 33
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000012046 mixed solvent Substances 0.000 description 5
- 150000003378 silver Chemical class 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- VZGDMQKNWNREIO-UHFFFAOYSA-N carbon tetrachloride Substances ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000006072 paste Substances 0.000 description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 3
- FSYKKLYZXJSNPZ-UHFFFAOYSA-N sarcosine Chemical compound C[NH2+]CC([O-])=O FSYKKLYZXJSNPZ-UHFFFAOYSA-N 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- 150000001242 acetic acid derivatives Chemical class 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000007647 flexography Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920003055 poly(ester-imide) Polymers 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- YXAHLCBENNUJLN-UHFFFAOYSA-N (carboxyamino)-propan-2-ylcarbamic acid Chemical compound CC(C)N(C(O)=O)NC(O)=O YXAHLCBENNUJLN-UHFFFAOYSA-N 0.000 description 1
- KPZGRMZPZLOPBS-UHFFFAOYSA-N 1,3-dichloro-2,2-bis(chloromethyl)propane Chemical compound ClCC(CCl)(CCl)CCl KPZGRMZPZLOPBS-UHFFFAOYSA-N 0.000 description 1
- QWCGXANSAOXRFE-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanamine Chemical compound COCCOCCN QWCGXANSAOXRFE-UHFFFAOYSA-N 0.000 description 1
- KXLKRDONYDSHID-UHFFFAOYSA-N 2-methylpropylazanium;n-(2-methylpropyl)carbamate Chemical compound CC(C)C[NH3+].CC(C)CNC([O-])=O KXLKRDONYDSHID-UHFFFAOYSA-N 0.000 description 1
- VWOQKKXMLQFRCC-UHFFFAOYSA-K C(OC(C)C)([O-])=O.[Al+3].C(C)(C)OC([O-])=O.C(C)(C)OC([O-])=O Chemical compound C(OC(C)C)([O-])=O.[Al+3].C(C)(C)OC([O-])=O.C(C)(C)OC([O-])=O VWOQKKXMLQFRCC-UHFFFAOYSA-K 0.000 description 1
- KNEYLNTWIGSMMJ-UHFFFAOYSA-N C(OC(CCCCCCCCC)C)([O-])=O.[NH4+] Chemical compound C(OC(CCCCCCCCC)C)([O-])=O.[NH4+] KNEYLNTWIGSMMJ-UHFFFAOYSA-N 0.000 description 1
- JKZFBQPGAKUFTD-UHFFFAOYSA-N C([O-])([O-])=O.C([O-])(O)=O.C(#N)CC[NH3+].C(#N)CC[NH3+].C(#N)CC[NH3+] Chemical compound C([O-])([O-])=O.C([O-])(O)=O.C(#N)CC[NH3+].C(#N)CC[NH3+].C(#N)CC[NH3+] JKZFBQPGAKUFTD-UHFFFAOYSA-N 0.000 description 1
- CHKUCKZKCWZMLI-UHFFFAOYSA-N CCCCCC(CC)OC(=O)N.C1=CC=NC=C1 Chemical compound CCCCCC(CC)OC(=O)N.C1=CC=NC=C1 CHKUCKZKCWZMLI-UHFFFAOYSA-N 0.000 description 1
- PYPBPYRRAUUNSM-UHFFFAOYSA-N CCCCCCCCCCNC.CCCCCCCCCCOC(OC)=O Chemical compound CCCCCCCCCCNC.CCCCCCCCCCOC(OC)=O PYPBPYRRAUUNSM-UHFFFAOYSA-N 0.000 description 1
- XXLLQFSAHHLZBJ-UHFFFAOYSA-N CCCOC(O[Si](OCC)(OCC)OCC)=O.CCO[Si](CCCN)(OCC)OCC Chemical compound CCCOC(O[Si](OCC)(OCC)OCC)=O.CCO[Si](CCCN)(OCC)OCC XXLLQFSAHHLZBJ-UHFFFAOYSA-N 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 229920003232 aliphatic polyester Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- GXKUHFXYUOPYJF-UHFFFAOYSA-N azane dioctadecyl carbonate Chemical compound N.CCCCCCCCCCCCCCCCCCOC(=O)OCCCCCCCCCCCCCCCCCC GXKUHFXYUOPYJF-UHFFFAOYSA-N 0.000 description 1
- GHFDYTIELHTMGV-UHFFFAOYSA-N benzyl carbamate;phenylmethanamine Chemical compound NCC1=CC=CC=C1.NC(=O)OCC1=CC=CC=C1 GHFDYTIELHTMGV-UHFFFAOYSA-N 0.000 description 1
- OTPBAANTTKRERC-UHFFFAOYSA-N benzyl(dodecyl)azanium;chloride Chemical compound Cl.CCCCCCCCCCCCNCC1=CC=CC=C1 OTPBAANTTKRERC-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- KQIFRYIYNPGWEK-UHFFFAOYSA-N cyclohexylazanium;n-cyclohexylcarbamate Chemical compound NC1CCCCC1.OC(=O)NC1CCCCC1 KQIFRYIYNPGWEK-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JKZDDFARANSOQU-UHFFFAOYSA-N diazanium;morpholine;carbonate Chemical compound [NH4+].[NH4+].[O-]C([O-])=O.C1COCCN1.C1COCCN1 JKZDDFARANSOQU-UHFFFAOYSA-N 0.000 description 1
- 229940043279 diisopropylamine Drugs 0.000 description 1
- HKUFIYBZNQSHQS-UHFFFAOYSA-O dioctadecylazanium Chemical compound CCCCCCCCCCCCCCCCCC[NH2+]CCCCCCCCCCCCCCCCCC HKUFIYBZNQSHQS-UHFFFAOYSA-O 0.000 description 1
- MJIVAZUPHYQSTQ-UHFFFAOYSA-L disilver nitrous acid sulfate Chemical compound S(=O)(=O)([O-])[O-].[Ag+].N(=O)O.[Ag+] MJIVAZUPHYQSTQ-UHFFFAOYSA-L 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229940094506 lauryl betaine Drugs 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- YNAVUWVOSKDBBP-UHFFFAOYSA-O morpholinium Chemical compound [H+].C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-O 0.000 description 1
- DVEKCXOJTLDBFE-UHFFFAOYSA-N n-dodecyl-n,n-dimethylglycinate Chemical compound CCCCCCCCCCCC[N+](C)(C)CC([O-])=O DVEKCXOJTLDBFE-UHFFFAOYSA-N 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- BYHCEONEBSDRMS-UHFFFAOYSA-N octylazanium;octyl carbonate Chemical compound CCCCCCCC[NH3+].CCCCCCCCOC([O-])=O BYHCEONEBSDRMS-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- MPXHWRXXJUKENG-UHFFFAOYSA-N propan-2-ylazanium;n-propan-2-ylcarbamate Chemical compound CC(C)[NH3+].CC(C)NC([O-])=O MPXHWRXXJUKENG-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical compound [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- LMEWRZSPCQHBOB-UHFFFAOYSA-M silver;2-hydroxypropanoate Chemical compound [Ag+].CC(O)C([O-])=O LMEWRZSPCQHBOB-UHFFFAOYSA-M 0.000 description 1
- LLISFGHXLYQOBX-UHFFFAOYSA-M silver;hexanoate Chemical compound [Ag+].CCCCCC([O-])=O LLISFGHXLYQOBX-UHFFFAOYSA-M 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000001757 thermogravimetry curve Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/36—Inkjet printing inks based on non-aqueous solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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Abstract
본 발명은 화학식 1로 표시되는 하나 이상의 은 화합물과 화학식 2, 화학식 3 또는 화학식 4로 표시되는 하나 이상의 암모늄 카바메이트 또는 암모늄 카보네이트계 화합물을 반응시켜 얻어지는 은 착체 화합물, 그리고 아민 화합물이나 화학식 2, 화학식 3 또는 화학식 4의 화합물 또는 최소한 1개 이상의 이들 혼합물의 안정화제를 포함하는 투명한 은 잉크 조성물, 이의 제조방법 및 이를 이용한 박막형성방법에 관한 것이다.The present invention provides a silver complex compound obtained by reacting at least one silver compound represented by Formula 1 with at least one ammonium carbamate or ammonium carbonate compound represented by Formula 2, Formula 3, or Formula 4, and an amine compound, Formula 2, Formula The present invention relates to a transparent silver ink composition comprising a compound of Formula 3 or Formula 4 or at least one or more of these mixtures, a method for preparing the same, and a method for forming a thin film using the same.
(화학식 1) (Formula 1)
(화학식 2) (Formula 2)
(화학식 3) (Formula 3)
(화학식 4) (Formula 4)
은 착체 화합물, 안정화제, 은 잉크, 박막, 패터닝 Silver Complex Compound, Stabilizer, Silver Ink, Thin Film, Patterning
Description
도 1은 실시예 2의 은 잉크 조성물의 TGA 열분해곡선(thermogram)1 is a TGA thermogram of the silver ink composition of Example 2;
도 2은 실시예 32의 잉크 젯 프린터를 이용하여 출력한 도면FIG. 2 is a diagram output using the ink jet printer of Example 32
(A) : 페트(PET) 필름, (B) : 이미드(IMIDE) 필름, (C) : 유리판 (A): PET film, (B): imide film, (C): glass plate
도 3은 실시예 33의 실크 스크린 인쇄기를 이용하여 페트(PET) 필름에FIG. 3 shows a PET film using the silk screen printing machine of Example 33.
인쇄한 도면Printed Drawing
도 4는 실시예 34의 그라비아 인쇄기를 이용하여 페트(PET) 필름에4 is a PET film using the gravure printing machine of Example 34.
인쇄한 도면 Printed Drawing
본 발명은 특수한 구조를 가지는 은 착체 화합물과 그 착체 화합물을 안정화하는 안정화제를 포함하는 투명한 은 잉크조성물 및 이를 이용한 박막형성방법을 제공하는 것이다. The present invention provides a transparent silver ink composition comprising a silver complex compound having a special structure and a stabilizer for stabilizing the complex compound, and a thin film forming method using the same.
Ullmann's Encyclopedia of Ind. Chem., Vol. A24, 107(1993)에서는 은 (silver)은 귀금속으로서 쉽게 산화되지 않고 전기 및 열전도도가 우수하며 촉매 및 항균작용 등을 가지고 있기 때문에 은 및 은 화합물은 합금, 도금, 의약, 사진, 전기전자, 섬유, 세제, 가전 등 산업전반에 널리 사용된다고 기술하고 있다. 또한 은 화합물은 유기물 및 고분자 합성에 촉매로 사용할 수 있으며, 특히 최근에 전기전자부품 회로에서 납 사용의 규제 및 저 저항 금속배선, 인쇄회로기판(PCB), 연성회로기판(FPC), 무선인식(RFID) 태그(tag)용 안테나, 전자파 차폐 그리고 플라즈마 디스플레이(PDP), 액정디스플레이(TFT-LCD), 유기발광다이오드(OLED), 플렉시블 디스플레이 및 유기박막 트렌지스터(OTFT) 등과 같은 새로운 분야에서 금속패턴을 필요로 하거나 전극으로 사용하는 등 은에 대한 관심이 증가하고 있다. Ullmann's Encyclopedia of Ind. Chem. , Vol. In A24, 107 (1993), silver is a precious metal that is not easily oxidized, has excellent electrical and thermal conductivity, and has a catalytic and antibacterial effect. Therefore, silver and silver compounds are used in alloys, plating, medicine, photography, electrical and electronics, It is widely used in industries such as textiles, detergents and home appliances. In addition, silver compounds can be used as catalysts for the synthesis of organic materials and polymers, and in particular, the use of lead in electrical and electronic component circuits, low resistance metallization, printed circuit boards (PCB), flexible printed circuit boards (FPC), and wireless recognition ( RFID pattern antennas, electromagnetic shielding and metal patterns in new fields such as plasma displays (PDPs), liquid crystal displays (TFT-LCDs), organic light emitting diodes (OLEDs), flexible displays and organic thin film transistors (OTFTs). There is a growing interest in silver, which is needed or used as an electrode.
은을 사용할 경우 대부분 나노 입자 또는 분말, 플레이크 상의 은과 바인더 수지나 용제가 포함된 은 페이스트 상으로 만들어 직접 사용하거나 질산은과 같은 은 화합물을 수용액 또는 유기용매 상에서 다른 화합물과 반응시켜 콜로이드나 미세 입자를 형성시켜 다양한 형태의 은 및 유기 은 화합물을 제조하여 사용하고 있다. 이러한 유기 은 화합물은 화학증착(CVD), 플라즈마 증착, 스퍼터링, 전기도금, 노광(photolithography), 전자 선(electron beam), 레이저(laser) 등 다양한 방법으로 금속패턴을 형성시키는데 사용되고 있다.When silver is used, most of it is made of nano particles or powder, silver paste on flake and silver paste containing binder resin or solvent and used directly or silver compound such as silver nitrate is reacted with other compounds in aqueous solution or organic solvent to collect colloid or fine particles. It forms and uses various forms of silver and organic silver compounds. Such organic silver compounds are used to form metal patterns by various methods such as chemical vapor deposition (CVD), plasma deposition, sputtering, electroplating, photolithography, electron beams, and lasers.
유기 은 화합물 중에서 착체 화합물(Organic Silver Complexes)의 배위자로서 일반적으로 가장 잘 알려진 것으로는 카르복실산(Prog. Inorg. Chem., 10, p233 (1968))으로 은을 포함한 금속 카르복실레이트 착체는 일반적으로 빛에 민감하고 유기용매에서 용해도가 낮으며(J. Chem. Soc.,(A)., p514(1971), 미국 특허 제 5,534,312호(1996. 7. 9)) 분해온도가 높기 때문에 제조상의 용이함에도 불구하고 응용에 한계가 있다. 이러한 문제점을 해결하기 위하여 J. Inorg. Nucl. Chem., 40, p1599(1978), Ang. Chem., Int. Ed. Engl., 31, p770(1992), Eur. J. Solid State Inorg. Chem., 32, p25(1995), J. Chem. Cryst., 26, p99(1996), Chem. Vapor Deposition, 7, 111(2001), Chem. Mater., 16, 2021(2004), 미국 특허 제 5,705,661호(1998. 1. 6), 대한민국 특허공개공보 제 2003-0085357호(2003. 11. 5)에서는 여러 가지 방법들이 제안되고 있는데, 예를 들면 카르복실산 중에서 알킬사슬이 긴 화합물을 사용하거나 아민화합물이나 포스핀화합물 등을 포함시키는 방법 등을 들 수 있다. 그러나 지금까지 은에서 유도되는 화합물의 유도체는 한정되어 있고 더구나 이들이 안정성 및 용해성이 결여되거나 금속으로의 패턴을 형성하기에는 분해온도가 높고 분해속도가 느린 단점이 있다. Among the organic silver compounds, the most commonly known ligands of Organic Silver Complexes are carboxylic acids ( Prog. Inorg. Chem., 10 , p233 (1968)). Light sensitive, low solubility in organic solvents ( J. Chem. Soc., (A)., P514 (1971), US Patent No. 5,534,312 (July 9, 1996)) Despite its ease, there are limitations to the application. To solve this problem, J. Inorg. Nucl. Chem. , 40, p 1599 (1978), Ang. Chem., Int. Ed. Engl. , 31, p 770 (1992), Eur. J. Solid State Inorg. Chem. , 32, p 25 (1995), J. Chem. Cryst. , 26, p99 (1996), Chem. Vapor Deposition , 7, 111 (2001), Chem. Mater. , 16, 2021 (2004), U.S. Patent No. 5,705,661 (January 6, 1998), and Korean Patent Publication No. 2003-0085357 (Nov. 5, 2003). And a method of using a compound having a long alkyl chain in an acid or including an amine compound or a phosphine compound. However, until now, derivatives of compounds derived from silver are limited, and furthermore, they have a disadvantage in that the decomposition temperature is high and the decomposition rate is slow to form a pattern with metals, which lack stability and solubility.
본 발명자들도 한국특허 출원 번호 제 2005-11475호 및 2005-11478호에서와 같이 안정하고 용해성이 우수한 은 착체 화합물 및 이의 제조 방법을 제시하고 있으나, 상기와 같은 금속 패턴을 이용하여 다양한 응용제품을 성공적으로 제조하기 위해서는 고도의 잉크 조성물이 필요하다.The present inventors also present a silver complex compound having a stable and excellent solubility and a method for producing the same as in Korean Patent Application Nos. 2005-11475 and 2005-11478, but using a metal pattern as described above for various applications Highly successful ink compositions are required for successful manufacture.
따라서 본 발명자들은 이러한 문제점을 해결하기 위하여 부단히 노력한 결과 성공적으로 본 발명에 도달하게 되었다. 즉, 본 발명은 부단한 실험을 통하여 안정성 및 용해성이 매우 우수하여 박막형성이 용이하고, 150℃ 이하의 낮은 온도에서도 쉽게 소성되어 기판의 종류에 관계없이 높은 전도도를 갖으면서 균일하고 치밀한 박막 또는 패턴 형성이 가능하여, 이를 이용한 다양한 응용제품이 가능한 투명 한 은 잉크 조성물 및 이의 제조방법을 제공한다. Accordingly, the present inventors have successfully reached the present invention as a result of diligent efforts to solve these problems. That is, the present invention has excellent stability and solubility through continuous experiments, so that the thin film is easily formed, and is easily baked even at a low temperature of 150 ° C. or lower, and thus uniform and dense thin film or pattern is formed while having high conductivity regardless of the type of substrate. It is possible to provide a transparent silver ink composition and a method for manufacturing the same, which can be applied to various applications using the same.
본 발명의 목적은 특수한 구조를 가지는 은 착체 화합물과 아민 화합물이나 화학식 2, 화학식 3 또는 화학식 4의 화합물 또는 최소한 1개 이상의 이들 혼합물의 안정화제를 포함하는 투명한 은 잉크 조성물 및 이의 제조방법을 제공하는 것이다. SUMMARY OF THE INVENTION An object of the present invention is to provide a transparent silver ink composition comprising a silver complex compound having a special structure and an amine compound or a stabilizer of a compound of formula (2), (3) or (4) or at least one or more of these mixtures, and a method for preparing the same. will be.
본 발명의 또 다른 목적은 안정성 및 용해성이 우수하고 기판의 종류에 관계없이 박막형성이 용이한 투명한 은 잉크 조성물 및 이의 제조방법을 제공하는 것이다. Still another object of the present invention is to provide a transparent silver ink composition excellent in stability and solubility and easy to form a thin film regardless of the type of substrate, and a method of manufacturing the same.
본 발명의 또 다른 목적은 150℃ 이하의 낮은 온도에서도 쉽게 소성되어 높은 전도도의 균일하고 치밀한 은 박막 또는 패턴 형성이 용이한 투명한 은 잉크 조성물 및 이의 제조방법을 제공하는 것이다. It is still another object of the present invention to provide a transparent silver ink composition which is easily calcined even at a low temperature of 150 ° C. or less, and which is easy to form a uniform and dense silver thin film or pattern having high conductivity, and a method of manufacturing the same.
상기의 목적을 달성하기 위해, 본 발명자는 많은 연구를 한 결과 하기 화학식 1로 표시되는 하나 이상의 은 화합물과 화학식 2, 화학식 3 또는 화학식 4로 표시되는 하나 이상의 암모늄 카바메이트 또는 암모늄 카보네이트계 화합물을 반응시켜 얻어지는 은 착체 화합물, 그리고 아민 화합물이나 화학식 2, 화학식 3 또는 화학식 4의 화합물 또는 최소한 1개 이상의 이들 혼합물인 안정화제를 포함하는 투명 한 은 잉크 조성물 및 이의 제조방법을 발명하였다.In order to achieve the above object, the present inventors have conducted a number of studies and react one or more silver compounds represented by the following Chemical Formula 1 with one or more ammonium carbamate or ammonium carbonate-based compounds represented by Chemical Formula 2, Chemical Formula 3 or Chemical Formula 4; The present invention has been invented a transparent silver ink composition comprising a silver complex compound and a stabilizer which is an amine compound, a compound of formula (2), (3) or (4) or at least one of these mixtures, and a method for preparing the same.
(화학식 1)(Formula 1)
(화학식 2)(Formula 2)
(화학식 3) (Formula 3)
(화학식 4)(Formula 4)
상기의 화학식 1에 있어서 n은 1∼4의 정수이고, X는 산소, 황, 할로겐, 시아노, 시아네이트, 카보네이트, 니트레이트, 나이트라이트, 설페이트, 포스페이트, 티오시아네이트, 클로레이트, 퍼클로레이트, 테트라플로로 보레이트, 아세틸아세토네이트, 카복실레이트 등으로 구체적으로 예를 들면, 산화 은, 티오시아네이트화 은, 황화 은, 염화 은, 시안화 은, 시아네이트화 은, 탄산 은, 질산 은, 아질산 은, 황산 은, 인산 은, 과염소산화 은, 사불소보레이트화 은, 아세틸아세토네이트화 은, 초산 은, 젖산 은, 옥살산 은 및 그 유도체 등을 들 수 있는데 특별히 이에 한정되는 것은 아니지만, 본 발명에서는 산화 은이나 탄산 은을 사용하는 것이 반응성이나 후처리 면에서 더욱 선호된다.In Formula 1, n is an integer of 1 to 4, X is oxygen, sulfur, halogen, cyano, cyanate, carbonate, nitrate, nitrite, sulfate, phosphate, thiocyanate, chlorate, perchlorate, Specific examples of tetrafluoroborate, acetylacetonate, carboxylate and the like include silver oxide, thiocyanated silver, silver sulfide, silver chloride, silver cyanide, silver cyanated silver, silver carbonate, silver nitrate, silver nitrite Silver sulfate, silver phosphate, silver perchlorate, silver tetrafluoroborate, silver acetylacetonated silver, silver acetate, silver lactate, silver oxalate and derivatives thereof, and the like, but are not particularly limited thereto. The use of silver or silver carbonate is more preferred in terms of reactivity and post-treatment.
그리고 화학식 2, 화학식 3 또는 화학식 4에 있어서, R1, R2, R3, R4, R5 및 R6는 서로 같거나 다를 수 있으며, 이들은 각각 수소, 탄소 수 1 내지 30개의 지방족이나 지환족 알킬기 또는 아릴이나 이들의 혼합인 아랄킬(aralkyl)기, 관능기가 치환된 알킬 및 아릴기 그리고 헤테로고리 화합물과 고분자화합물 및 그 유도체로부터 되는 기 등을 들 수 있는데 특별히 이에 한정되는 것은 아니다. 구체적으로 예를 들면, 수소, 메틸, 에틸, 프로필, 이소프로필, 부틸, 이소부틸, 아밀, 헥실, 에틸헥실, 헵틸, 옥틸, 이소옥틸, 노닐, 데실, 도데실, 헥사데실, 옥타데실, 도코데실, 시클로프로필, 시클로펜틸, 시클로헥실, 알릴, 히드록시, 메톡시, 히드록시에틸, 메톡시에틸, 2-히드록시 프로필, 메톡시프로필, 시아노에틸, 에톡시, 부톡시, 헥실옥시, 메톡시에톡시에틸, 메톡시에톡시에톡시에틸, 헥사메틸렌이민, 모폴린, 피페리딘, 피페라진, 에틸렌디아민, 프로필렌디아민, 헥사메틸렌디아민, 트리에틸렌디아민, 피롤, 이미다졸, 피리딘, 카르복시메틸, 트리메톡시실릴프로필, 트리에톡시실릴프로필, 페닐, 메톡시페닐, 시아노페닐, 페녹시, 톨릴, 벤질 및 그 유도체, 그리고 폴리알릴아민이나 폴리에틸렌이민과 같은 고분자 화합물 및 그 유도 체 등을 들 수 있는데 특별히 이에 한정되는 것은 아니다. 화합물로서 구체적으로 예를 들면, 암모늄 카바메이트(ammonium carbamate), 암모늄 카보네이트(ammonium carbonate), 암모늄 바이카보네이트(ammonium bicarbonate), 에틸암모늄 에틸카바메이트, 이소프로필암모늄 이소프로필카바메이트, n-부틸암모늄 n-부틸카바메이트, 이소부틸암모늄 이소부틸카바메이트, t-부틸암모늄 t-부틸카바메이트, 2-에틸헥실암모늄 2-에틸헥실카바메이트, 옥타데실암모늄 옥타데실카바메이트, 2-메톡시에틸암모늄 2-메톡시에틸카바메이트, 2-시아노에틸암모늄 2-시아노에틸카바메이트, 디부틸암모늄 디부틸카바메이트, 디옥타데실암모늄 디옥타데실카바메이트, 메틸데실암모늄 메틸데실카바메이트, 헥사메틸렌이민암모늄 헥사메틸렌이민카바메이트, 모폴리늄 모폴린카바메이트, 피리디늄 에틸헥실카바메이트, 트리에틸렌디아미늄 이소프로필바이카바메이트, 벤질암모늄 벤질카바메이트, 트리에톡시실릴프로필암모늄 트리에톡시실릴프로필카바메이트, 에틸암모늄 에틸카보네이트, 이소프로필암모늄 이소프로필카보네이트, 이소프로필암모늄 바이카보네이트, n-부틸암모늄 n-부틸카보네이트, 이소부틸암모늄 이소부틸카보네이트, t-부틸암모늄 t-부틸카보네이트, t-부틸암모늄 바이카보네이트, 2-에틸헥실암모늄 2-에틸헥실카보네이트, 2-에틸헥실암모늄 바이카보네이트, 2-메톡시에틸암모늄 2-메톡시에틸카보네이트, 2-메톡시에틸암모늄 바이카보네이트, 2-시아노에틸암모늄 2-시아노에틸카보네이트, 2-시아노에틸암모늄 바이카보네이트, 옥타데실암모늄 옥타데실카보네이트, 디부틸암모늄 디부틸카보네이트, 디옥타데실암모늄 디옥타데실카보네이트, 디옥타데실암모늄 바이카보네이트, 메틸데실암모늄 메틸데실카보네이트, 헥사메틸렌이민암모늄 헥사메 틸렌이민카보네이트, 모폴린암모늄 모폴린카보네이트, 벤질암모늄 벤질카보네이트, 트리에톡시실릴프로필암모늄 트리에톡시실릴프로필카보네이트, 피리디늄 바이카보네이트, 트리에틸렌디아미늄 이소프로필카보네이트, 트리에틸렌디아미늄 바이카보네이트 및 그 유도체 등을 들 수 있다. And in Chemical Formula 2, Chemical Formula 3 or Chemical Formula 4, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 may be the same as or different from each other, and are each hydrogen, aliphatic or cycloaliphatic having 1 to 30 carbon atoms. And an alkyl group or an aryl or an aralkyl group which is a mixture thereof, an alkyl and aryl group substituted with a functional group, and a group consisting of a heterocyclic compound, a polymer compound and derivatives thereof, but is not particularly limited thereto. Specifically, for example, hydrogen, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, amyl, hexyl, ethylhexyl, heptyl, octyl, isooctyl, nonyl, decyl, dodecyl, hexadecyl, octadecyl, doco Decyl, cyclopropyl, cyclopentyl, cyclohexyl, allyl, hydroxy, methoxy, hydroxyethyl, methoxyethyl, 2-hydroxy propyl, methoxypropyl, cyanoethyl, ethoxy, butoxy, hexyloxy , Methoxyethoxyethyl, methoxyethoxyethoxyethyl, hexamethyleneimine, morpholine, piperidine, piperazine, ethylenediamine, propylenediamine, hexamethylenediamine, triethylenediamine, pyrrole, imidazole, pyridine, Carboxymethyl, trimethoxysilylpropyl, triethoxysilylpropyl, phenyl, methoxyphenyl, cyanophenyl, phenoxy, tolyl, benzyl and derivatives thereof, and high molecular compounds such as polyallylamine or polyethyleneimine and derivatives thereof Like This is not particularly limited. Specific examples of the compound include, for example, ammonium carbamate, ammonium carbonate, ammonium bicarbonate, ethylammonium ethyl carbamate, isopropylammonium isopropyl carbamate, n-butylammonium n -Butyl carbamate, isobutylammonium isobutyl carbamate, t-butylammonium t-butyl carbamate, 2-ethylhexyl ammonium 2-ethylhexyl carbamate, octadecylammonium octadecyl carbamate, 2-methoxyethylammonium 2 -Methoxyethylcarbamate, 2-cyanoethylammonium 2-cyanoethylcarbamate, dibutylammonium dibutylcarbamate, dioctadecylammonium dioctadecylcarbamate, methyldecylammonium methyldecylcarbamate, hexamethyleneimine Ammonium hexamethyleneiminecarbamate, morpholinium morpholincarbamate, pyridinium ethylhexylcarbamate, triethylenediamine isopro Philbicarbamate, benzylammonium benzylcarbamate, triethoxysilylpropylammonium triethoxysilylpropylcarbamate, ethylammonium ethylcarbonate, isopropylammonium isopropylcarbonate, isopropylammonium bicarbonate, n-butylammonium n-butyl Carbonate, isobutylammonium isobutylcarbonate, t-butylammonium t-butylcarbonate, t-butylammonium bicarbonate, 2-ethylhexylammonium 2-ethylhexylcarbonate, 2-ethylhexylammonium bicarbonate, 2-methoxyethylammonium 2-methoxyethylcarbonate, 2-methoxyethylammonium bicarbonate, 2-cyanoethylammonium 2-cyanoethylcarbonate, 2-cyanoethylammonium bicarbonate, octadecylammonium octadecylcarbonate, dibutylammonium dibutyl Carbonate, dioctadecyl ammonium dioctadecyl carbonate, dioctadecyl ammonium bicarbonate, Tyldecyl ammonium methyldecyl carbonate, hexamethylene imine ammonium hexamethylene imine carbonate, morpholine ammonium morpholin carbonate, benzyl ammonium benzyl carbonate, triethoxysilylpropyl ammonium triethoxysilylpropyl carbonate, pyridinium bicarbonate, triethylene dia Aluminum isopropyl carbonate, triethylene dimethyl bicarbonate, and derivatives thereof.
한편, 상기의 암모늄 카바메이트 또는 암모늄 카보네이트계 화합물의 종류 및 제조방법은 특별히 제한할 필요는 없다. 예를 들면, 미국 특허 제 4,542,214호(1985. 9. 17)에서는 1차 아민, 2차 아민, 3차 아민 또는 최소한 1개 이상의 이들 혼합물과 이산화탄소로부터 암모늄 카바메이트계 화합물이, 그리고 아민 1몰당 물을 0.5몰을 사용하면 암모늄 카보네이트계 화합물이, 그리고 1몰 이상인 경우는 암모늄 바이카보네이트계 화합물을 얻을 수 있다. 이때 상압 또는 가압상태에서 특별한 용매 없이 직접 제조하거나 용매를 사용하는 경우 물, 메탄올, 에탄올, 이소프로판올, 부탄올과 같은 알코올류, 에틸렌글리콜, 글리세린과 같은 글리콜류, 에틸아세테이트, 부틸아세테이트, 카비톨아세테이트와 같은 아세테이트류, 디에틸에테르, 테트라히드로퓨란, 디옥산과 같은 에테르류, 메틸에틸케톤, 아세톤과 같은 케톤류, 헥산, 헵탄과 같은 탄화수소계, 벤젠, 톨루엔과 같은 방향족, 그리고 클로로포름이나 메틸렌클로라이드, 카본테트라클로라이드와 같은 할로겐 치환 용매 또는 이들의 혼합용매 등을 들 수 있고, 이산화탄소는 기상상태에서 버블링(bubbling)하거나 고체상 드라이아이스를 사용할 수 있으며 초임계(supercritical) 상태에서도 반응할 수 있다. 본 발명에서 사용되는 암모늄 카바메이트 또는 암모늄 카보네이트 유도체의 제조에는 상기의 방법 이외에도, 최종 물질의 구조가 같다면 공지의 어떠 한 방법을 사용하여도 무방하다. 즉, 제조를 위한 용매, 반응 온도, 농도 또는 촉매 등을 특별히 한정할 필요는 없으며, 제조 수율에도 무방하다. In addition, the kind and manufacturing method of the said ammonium carbamate or ammonium carbonate type compound do not need to restrict in particular. For example, US Pat. No. 4,542,214 (September 17, 1985) describes ammonium carbamate-based compounds from carbon dioxide and primary amines, secondary amines, tertiary amines or at least one of these mixtures, and water per mole of amine. When 0.5 mol is used, an ammonium carbonate compound is obtained, and when it is 1 mol or more, an ammonium bicarbonate compound can be obtained. In this case, when prepared directly or without using a solvent under normal pressure or pressure, alcohols such as water, methanol, ethanol, isopropanol and butanol, glycols such as ethylene glycol and glycerin, ethyl acetate, butyl acetate, carbitol acetate and Acetates, diethyl ether, tetrahydrofuran, ethers such as dioxane, methyl ethyl ketone, ketones such as acetone, hydrocarbons such as hexane, heptane, aromatics such as benzene, toluene, and chloroform, methylene chloride, carbon Halogen-substituted solvents such as tetrachloride, or a mixed solvent thereof, and the like, and carbon dioxide may be bubbled in a gaseous state or use solid dry ice, and may react in a supercritical state. In addition to the above-described methods, any known method may be used to prepare the ammonium carbamate or ammonium carbonate derivative used in the present invention as long as the final material has the same structure. That is, it does not need to specifically limit the solvent, reaction temperature, a concentration, or a catalyst for manufacture, and can also manufacture yield.
이렇게 제조된 암모늄 카바메이트 또는 암모늄 카보네이트계 화합물과 은 화합물을 반응시켜 유기 은 착체 화합물을 제조할 수 있다. 예를 들면, 화학식 1에 나타낸 바와 같은 최소한 1개 이상의 은 화합물과 화학식 2, 화학식 3 또는 화학식 4에 나타낸 바와 같은 최소한 1개 이상의 암모늄 카바메이트 또는 암모늄 카보네이트 유도체 및 이들의 혼합물을 질소 분위기의 상압 또는 가압상태에서 용매 없이 직접 반응하거나 용매를 사용하는 경우 물, 메탄올, 에탄올, 이소프로판올, 부탄올과 같은 알코올류, 에틸렌글리콜, 글리세린과 같은 글리콜류, 에틸아세테이트, 부틸아세테이트, 카비톨아세테이트와 같은 아세테이트류, 디에틸에테르, 테트라히드로퓨란, 디옥산과 같은 에테르류, 메틸에틸케톤, 아세톤과 같은 케톤류, 헥산, 헵탄과 같은 탄화수소계, 벤젠, 톨루엔과 같은 방향족, 그리고 클로로포름이나 메틸렌클로라이드, 카본테트라클로라이드와 같은 할로겐 치환 용매 또는 이들의 혼합용매 등을 사용할 수 있다. 또한, 은 착체 화합물을 제조하는데 있어서 상기의 방법 이외에 화학식 1의 은 화합물과 1개 이상의 아민화합물이 혼합된 용액을 제조한 후, 이산화탄소를 반응시켜 얻어지는 은 착체화합물을 본 발명에 사용할 수 있다. 이때에도 상기에서와 같이 상압 또는 가압상태에서 용매 없이 직접 반응하거나 용매를 사용하여 반응시킬 수 있다. 그러나 본 발명의 유기 은 착체 화합물 제조 방법에는 특별히 제한할 필요는 없다. 즉, 최종 물질의 구조가 같다면 공지의 어떠한 방법을 사용하여도 무방하다. 예를 들어 제조를 위한 용매, 반응 온도, 농도 또는 촉매 사용 유무 등을 특별히 한정할 필요는 없으며, 제조 수율에도 무방하다. An organic silver complex compound may be prepared by reacting the ammonium carbamate or ammonium carbonate compound and the silver compound thus prepared. For example, at least one silver compound as shown in formula (1) and at least one ammonium carbamate or ammonium carbonate derivative as shown in formula (2), formula (3) or formula (4) and mixtures thereof may be subjected to atmospheric pressure or When reacting directly or without using a solvent under pressure, alcohols such as water, methanol, ethanol, isopropanol, butanol, glycols such as ethylene glycol and glycerin, acetates such as ethyl acetate, butyl acetate and carbitol acetate, Ethers such as diethyl ether, tetrahydrofuran, dioxane, ketones such as methyl ethyl ketone, acetone, hydrocarbons such as hexane and heptane, aromatics such as benzene and toluene, and chloroform, methylene chloride and carbon tetrachloride Halogen substituted solvents or their The sum may be a solvent or the like. In addition, in preparing the silver complex compound, a silver complex compound obtained by reacting carbon dioxide after preparing a solution in which the silver compound of Formula 1 is mixed with one or more amine compounds in addition to the above-described method can be used in the present invention. In this case, as in the above, the reaction may be performed without using a solvent at atmospheric pressure or under pressure, or by using a solvent. However, the organic silver complex compound production method of the present invention does not need to be particularly limited. That is, as long as the structure of the final material is the same, any known method may be used. For example, there is no need to specifically limit the solvent for the preparation, the reaction temperature, the concentration, the presence or absence of the use of a catalyst, and the like, and the production yield is also acceptable.
본 발명의 투명 은 잉크의 조성물은 상기의 은 착체 화합물과 안정화제로서 1차 아민, 2차 아민, 3차 아민 화합물이나 상기의 암모늄 카바메이트, 카보네이트, 바이카보네이트계 화합물 또는 최소한 1개 이상의 이들 혼합물로 구성되어진다. 즉, 안정화제로서 구체적으로 예를 들면 아민화합물로는 메틸아민, 에틸아민, n-프로필아민, 이소프로필아민, n-부틸아민, 이소부틸아민, 이소아밀아민, n-헥실아민, 2-에틸헥실아민, n-헵틸아민, n-옥틸아민, 이소옥틸아민, 노닐아민, 데실아민, 도데실아민, 헥사데실아민, 옥타데실아민, 도코데실아민, 시클로프로필아민, 시클로펜틸아민, 시클로헥실아민, 알릴아민, 히드록시아민, 암모늄하이드록사이드, 메톡시아민, 2-에탄올아민, 메톡시에틸아민, 2-히드록시 프로필아민, 메톡시프로필아민, 시아노에틸아민, 에톡시아민, n-부톡시아민, 2-헥실옥시아민, 메톡시에톡시에틸아민, 메톡시에톡시에톡시에틸아민, 디에틸아민, 디프로필아민, 디에탄올아민, 헥사메틸렌이민, 모폴린, 피페리딘, 피페라진, 에틸렌디아민, 프로필렌디아민, 헥사메틸렌디아민, 트리에틸렌디아민, 2,2-(에틸렌디옥시)비스에틸아민, 트리에틸아민, 트리에탄올아민, 피롤, 이미다졸, 피리딘, 아미노아세트알데히드 디메틸 아세탈, 3-아미노프로필트리메톡시실란, 3-아미노프로필트리에톡시실란, 아닐린, 아니시딘, 아미노벤조니트릴, 벤질아민 및 그 유도체, 그리고 폴리알릴아민이나 폴리에틸렌이민과 같은 고분자 화합물 및 그 유도체 등을 들 수 있는데 특별히 이에 한정되는 것은 아니다. The composition of the transparent silver ink of the present invention is a primary amine, secondary amine, tertiary amine compound or the above ammonium carbamate, carbonate, bicarbonate-based compound or at least one of these mixtures as the silver complex compound and stabilizer. It consists of. That is, specifically as a stabilizer, for example, as an amine compound, methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, isoamylamine, n-hexylamine, 2-ethyl Hexylamine, n-heptylamine, n-octylamine, isooctylamine, nonylamine, decylamine, dodecylamine, hexadecylamine, octadecylamine, docodecylamine, cyclopropylamine, cyclopentylamine, cyclohexylamine , Allylamine, hydroxyamine, ammonium hydroxide, methoxyamine, 2-ethanolamine, methoxyethylamine, 2-hydroxypropylamine, methoxypropylamine, cyanoethylamine, ethoxyamine, n- Butoxyamine, 2-hexyloxyamine, methoxyethoxyethylamine, methoxyethoxyethoxyethylamine, diethylamine, dipropylamine, diethanolamine, hexamethyleneimine, morpholine, piperidine, pipepe Razine, Ethylenediamine, Propylenediamine, Hexamethylenediamine, Tri Ethylenediamine, 2,2- (ethylenedioxy) bisethylamine, triethylamine, triethanolamine, pyrrole, imidazole, pyridine, aminoacetaldehyde dimethyl acetal, 3-aminopropyltrimethoxysilane, 3-aminopropyltri Ethoxysilane, aniline, anisidine, aminobenzonitrile, benzylamine and derivatives thereof, and polymer compounds such as polyallylamine or polyethyleneimine and derivatives thereof, and the like, and the like.
그리고 안정화제로서 암모늄 카바메이트, 카보네이트, 바이카보네이트계 화 합물로 구체적으로 예를 들면 암모늄 카바메이트(ammonium carbamate), 암모늄 카보네이트(ammonium carbonate), 암모늄 바이카보네이트(ammonium bicarbonate), 에틸암모늄 에틸카바메이트, 이소프로필암모늄 이소프로필카바메이트, n-부틸암모늄 n-부틸카바메이트, 이소부틸암모늄 이소부틸카바메이트, t-부틸암모늄 t-부틸카바메이트, 2-에틸헥실암모늄 2-에틸헥실카바메이트, 옥타데실암모늄 옥타데실카바메이트, 2-메톡시에틸암모늄 2-메톡시에틸카바메이트, 2-시아노에틸암모늄 2-시아노에틸카바메이트, 디부틸암모늄 디부틸카바메이트, 디옥타데실암모늄 디옥타데실카바메이트, 메틸데실암모늄 메틸데실카바메이트, 헥사메틸렌이민암모늄 헥사메틸렌이민카바메이트, 모폴리늄 모폴린카바메이트, 피리디늄 에틸헥실카바메이트, 트리에틸렌디아미늄 이소프로필바이카바메이트, 벤질암모늄 벤질카바메이트, 트리에톡시실릴프로필암모늄 트리에톡시실릴프로필카바메이트, 에틸암모늄 에틸카보네이트, 이소프로필암모늄 이소프로필카보네이트, 이소프로필암모늄 바이카보네이트, n-부틸암모늄 n-부틸카보네이트, 이소부틸암모늄 이소부틸카보네이트, t-부틸암모늄 t-부틸카보네이트, t-부틸암모늄 바이카보네이트, 2-에틸헥실암모늄 2-에틸헥실카보네이트, 2-에틸헥실암모늄 바이카보네이트, 2-메톡시에틸암모늄 2-메톡시에틸카보네이트, 2-메톡시에틸암모늄 바이카보네이트, 2-시아노에틸암모늄 2-시아노에틸카보네이트, 2-시아노에틸암모늄 바이카보네이트, 옥타데실암모늄 옥타데실카보네이트, 디부틸암모늄 디부틸카보네이트, 디옥타데실암모늄 디옥타데실카보네이트, 디옥타데실암모늄 바이카보네이트, 메틸데실암모늄 메틸데실카보네이트, 헥사메틸렌이민암모늄 헥사메틸렌이민카보네이트, 모폴린암모늄 모폴린카보네이트, 벤질암모 늄 벤질카보네이트, 트리에톡시실릴프로필암모늄 트리에톡시실릴프로필카보네이트, 피리디늄 바이카보네이트, 트리에틸렌디아미늄 이소프로필카보네이트, 트리에틸렌디아미늄 바이카보네이트 및 그 유도체 등을 들 수 있다. 이러한 안정화제의 사용량은 본 발명의 잉크 특성에 부합되는 한 특별히 제한할 필요는 없다. 그러나 그 함량이 은 화합물에 대하여 몰비로 0.1% ~ 90%, 보다 바람직하게는 1% ~ 50%, 보다 더 바람직하게는 5% ~ 30%가 좋다. 이 범위를 넘는 경우 박막의 전도도의 저하가 생길 수 있고, 이하의 경우 잉크의 저장 안정성이 떨어질 수 있다. 잉크의 저장안정성의 저하는 결국 도막의 불량을 야기시키고, 더구나 상기 안정제는 저장안정성 뿐만아니라 은 잉크 조성물을 코팅한 후 소성하여 도막을 생성하였을 때, 상기 범위의 안정제가 사용되지 않을 경우에는 균일하고 치밀한 박막이 형성되지 못하거나 균열(crack)이 발생하는 문제점이 발생할 수 있다.And as a stabilizer ammonium carbamate, carbonate, bicarbonate-based compound specifically for example ammonium carbamate (ammonium carbamate), ammonium carbonate (ammonium carbonate), ammonium bicarbonate, ethylammonium ethyl carbamate, Isopropylammonium isopropylcarbamate, n-butylammonium n-butylcarbamate, isobutylammonium isobutylcarbamate, t-butylammonium t-butylcarbamate, 2-ethylhexylammonium 2-ethylhexylcarbamate, octadecyl Ammonium Octadecyl Carbamate, 2-methoxyethylammonium 2-methoxyethylcarbamate, 2-cyanoethylammonium 2-cyanoethylcarbamate, dibutylammonium dibutylcarbamate, dioctadecylammonium dioctadecylcarba Mate, methyldecylammonium methyldecylcarbamate, hexamethyleneimineammonium hexamethyleneiminecarbamate, morpholinium morpholinka Mate, pyridinium ethylhexyl carbamate, triethylenediaminium isopropylbicarbamate, benzylammonium benzylcarbamate, triethoxysilylpropylammonium triethoxysilylpropylcarbamate, ethylammonium ethylcarbonate, isopropylammonium isopropylcarbonate , Isopropylammonium bicarbonate, n-butylammonium n-butylcarbonate, isobutylammonium isobutylcarbonate, t-butylammonium t-butylcarbonate, t-butylammonium bicarbonate, 2-ethylhexyl ammonium 2-ethylhexyl carbonate, 2-ethylhexyl ammonium bicarbonate, 2-methoxyethylammonium 2-methoxyethylcarbonate, 2-methoxyethylammonium bicarbonate, 2-cyanoethylammonium 2-cyanoethylcarbonate, 2-cyanoethylammonium bicarbonate Carbonate, octadecylammonium octadecylcarbonate, dibutylammonium dibutylcarbonate, diocta Cyl ammonium dioctadecyl carbonate, dioctadecyl ammonium bicarbonate, methyl decyl ammonium methyl decyl carbonate, hexamethylene imine ammonium hexamethylene imine carbonate, morpholine ammonium morphocarbonate, benzyl ammonium benzyl carbonate, triethoxysilylpropyl ammonium tri Ethoxysilyl propyl carbonate, pyridinium bicarbonate, triethylene dimethyl isopropyl carbonate, tri ethylene dimethyl bicarbonate, its derivatives, etc. are mentioned. The amount of such stabilizer used is not particularly limited as long as it meets the ink characteristics of the present invention. However, the content is preferably 0.1% to 90%, more preferably 1% to 50%, even more preferably 5% to 30% in molar ratio with respect to the silver compound. If it exceeds this range, the conductivity of the thin film may occur, and in the following, the storage stability of the ink may be deteriorated. The deterioration of the storage stability of the ink eventually leads to a failure of the coating film, and furthermore, the stabilizer is not only storage stability but also uniform when the stabilizer in the above range is not used when the coating film is fired after coating the silver ink composition. Problems may occur in which a dense thin film may not be formed or cracks may occur.
그리고 잉크의 점도 조절이나 원활한 박막 형성을 위하여 용매가 필요한 경우가 있는데 이때 사용할 수 있는 용매로는 물, 메탄올, 에탄올, 이소프로판올, 부탄올, 에틸헥실 알코올, 테르피네올과 같은 알코올류, 에틸렌글리콜, 글리세린과 같은 글리콜류, 에틸아세테이트, 부틸아세테이트, 메톡시프로필아세테이트, 카비톨아세테이트, 에틸카비톨아세테이트와 같은 아세테이트류, 메틸셀로솔브, 부틸셀로솔브, 디에틸에테르, 테트라히드로퓨란, 디옥산과 같은 에테르류, 메틸에틸케톤, 아세톤, 디메틸포름아미드, 1-메틸-2-피롤리돈과 같은 케톤류, 헥산, 헵탄, 파라핀 오일, 미네랄 스피릿 과 같은 탄화수소계, 벤젠, 톨루엔과 같은 방향족, 그리고 클로로포름이나 메틸렌클로라이드, 카본테트라클로라이드와 같은 할로겐 치환 용매, 디메틸술폭사이드 또는 이들의 혼합용매 등을 사용할 수 있다. In addition, solvents may be required to control the viscosity of the ink or to form a thin film. At this time, solvents such as water, methanol, ethanol, isopropanol, butanol, ethylhexyl alcohol and terpineol, ethylene glycol and glycerin Such as glycols, ethyl acetate, butyl acetate, methoxypropyl acetate, carbitol acetate, ethyl carbitol acetate, methyl cellosolve, butyl cellosolve, diethyl ether, tetrahydrofuran, dioxane and Ethers such as methyl ethyl ketone, acetone, dimethylformamide, ketones such as 1-methyl-2-pyrrolidone, hexane, heptane, paraffin oil, hydrocarbons such as mineral spirits, aromatics such as benzene, toluene, and chloroform Or halogen-substituted solvents such as methylene chloride and carbon tetrachloride, dimethyl sulfoxide It may be used as the mixed solvents thereof.
한편, 본 발명의 투명 은 잉크 조성물은 상기의 은 착체 화합물이나 안정화제 및 용매 이외에, 필요에 따라 이미 공지의 사실인 바인더 수지(binder resin)나 환원제 그리고 계면활성제(surfactant), 습윤제(wetting agent), 칙소제(thixotropic agent) 또는 레벨링(levelling)제와 같은 첨가제 등을 잉크 조성물의 구성원으로 사용할 수 있다. 예를 들면, 일반적으로 사용할 수 있는 바인더 수지로서 폴리아크릴산 또는 폴리아크릴산 에스테르와 같은 아크릴계 수지, 에틸 셀룰로스와 같은 셀룰로스계 수지, 지방족 또는 공중합 폴리에스테르계 수지, 폴리비닐부티랄, 폴리비닐아세테이트와 같은 비닐계 수지, 폴리우레탄 수지, 폴리에테르 및 우레아 수지, 알키드 수지, 실리콘 수지, 불소수지, 폴리에틸렌과 같은 올레핀계 수지, 석유 및 로진계 수지 등과 같은 열가소성 수지나 에폭시계 수지, 불포화 폴리에스테르계 수지, 페놀계 수지, 멜라민계 수지 등과 같은 열경화성 수지, 자외선 또는 전자선 경화형의 다양한 구조의 아크릴계 수지, 그리고 에틸렌-프로필렌계 고무, 스티렌-부타디엔계 고무 등도 함께 사용 가능하다. 계면활성제로는 소듐 라우릴 설페이트(sodium lauryl sulfate)와 같은 음이온 계면활성제, 노닐페녹시폴리에톡시에탄올(nonyl phenoxy- polyethoxyethanol), 듀폰사(Dupont)제품의 에프에스엔(FSN)과 같은 비이온성 계면활성제, 그리고 라우릴벤질암모늄 클로라이드 등과 같은 양이온성 계면활성제나 라우릴 베타인(betaine), 코코 베타인과 같은 양쪽성 계면활성제 등이 포함된다. 습윤제 또는 습윤분산제로는 폴리에틸렌글리콜, 에어 프로덕트사(Air Product) 제품의 써피놀 시리즈, 데구사(Deguessa)의 테고 웨트 시리 즈와 같은 화합물을, 그리고 칙소제 또는 레벨링제로는 비와이케이(BYK)사의 비와이케이(BYK) 시리즈, 데구사(Degussa)의 글라이드 시리즈, 에프카(EFKA)사의 에프카(EFKA) 3000 시리즈나 코그니스(Cognis)사의 디에스엑스(DSX) 시리즈 등을 사용할 수 있다. 또한, 소성을 쉽게 하기 위하여 환원제를 첨가하여 사용할 수 있는데 예를 들면, 히드라진, 아세틱히드라자이드, 소디움 또는 포타슘 보로하이드라이드, 트리소디움 시트레이트, 그리고 메틸디에탄올아민, 디메틸아민보란(dimethylamineborane)과 같은 아민화합물, 제1염화철, 유산철과 같은 금속 염, 수소, 요오드화 수소, 일산화탄소, 포름알데히드, 아세트알데히드와 같은 알데히드 화합물, 글루코스, 아스코빅 산, 살리실산, 탄닌산(tannic acid), 피로가롤(pyrogallol), 히드로퀴논과 같은 유기화합물 등을 들 수 있다. 또한, 본 발명의 투명한 은 잉크 조성물을 제조하는데 있어서 상기의 방법이외에 화학식 1의 은 화합물과 1개 이상의 과량의 아민화합물 또는 암모늄 카바메이트 또는 암모늄 카보네이트계 화합물 및 이들의 혼합된 용액을 제조하고 여기에 필요에 따라 상기의 바인더 또는 첨가제 등을 넣은 후 이산화탄소를 반응시켜 얻어지는 은 잉크조성물을 제조하여 사용할 수 있다. 이때에도 상기에서와 같이 상압 또는 가압상태에서 용매 없이 직접 반응하거나 용매를 사용하여 반응시킬 수 있다. Meanwhile, the transparent silver ink composition of the present invention may be a binder resin, a reducing agent, a surfactant, a wetting agent, or the like, in addition to the silver complex compound, the stabilizer and the solvent. , Additives such as thixotropic agents or leveling agents and the like can be used as members of the ink composition. For example, binder resins that can be generally used are acrylic resins such as polyacrylic acid or polyacrylic acid esters, cellulose resins such as ethyl cellulose, aliphatic or copolyester-based resins, vinyl such as polyvinyl butyral, polyvinylacetate Thermoplastic resins, polyurethane resins, polyether and urea resins, alkyd resins, silicone resins, fluorine resins, olefin resins such as polyethylene, thermoplastic resins such as petroleum and rosin resins, epoxy resins, unsaturated polyester resins, phenols Thermosetting resins such as resin-based resins, melamine-based resins, acrylic resins having various structures of ultraviolet or electron beam curing, and ethylene-propylene-based rubbers and styrene-butadiene-based rubbers may also be used. Surfactants include anionic surfactants such as sodium lauryl sulfate, nonionic phenoxy-polyethoxyethanol, and nonionic surfactants such as Dupont's FsN. Active agents, and cationic surfactants such as laurylbenzylammonium chloride and amphoteric surfactants such as lauryl betaine and coco betaine. Wetting agents or wetting dispersants include polyethylene glycols, compounds such as the Suftenol series from Air Products, Tego Wet Series from Deguessa, and BYK from BYK as the thixotropic agents or leveling agents. BYK series, Degussa glide series, EFKA EFKA 3000 series, Cognis DSX series and the like can be used. In addition, reducing agents may be used to facilitate calcination, for example, hydrazine, acetichydrazide, sodium or potassium borohydride, trisodium citrate, and methyldiethanolamine, dimethylamineborane and Amine compounds such as amine compounds, ferrous chloride, ferric lactate, aldehyde compounds such as hydrogen, hydrogen iodide, carbon monoxide, formaldehyde, acetaldehyde, glucose, ascorbic acid, salicylic acid, tannic acid, pyrogarol ( pyrogallol) and organic compounds such as hydroquinone. In addition, in the preparation of the transparent silver ink composition of the present invention, in addition to the above method, a silver compound of Formula 1 and at least one excess amine compound or an ammonium carbamate or ammonium carbonate-based compound and a mixed solution thereof are prepared and If necessary, a silver ink composition obtained by adding carbon dioxide or the like after adding the binder or the additive may be prepared and used. In this case, as in the above, the reaction may be performed without using a solvent at atmospheric pressure or under pressure, or by using a solvent.
본 발명에서 제조된 투명 은 잉크 조성물은 안정성 및 용해성이 우수하여 도포나 다양한 프린팅 공정에 쉽게 적용 가능한데 예를 들면 금속, 유리, 실리콘 웨이퍼, 세라믹, 폴리에스테르나 폴리이미드와 같은 플라스틱 필름, 고무시트, 섬유, 목재, 종이 등과 같은 기판에 코팅하여 박막을 제조하거나 직접 프린팅 할 수 있 다. 이러한 기판은 수세 및 탈지 후 사용하거나 특별히 전처리를 하여 사용할 수 있는데 전처리 방법으로는 플라즈마, 이온빔, 코로나, 산화 또는 환원, 열, 에칭, 자외선(UV) 조사, 그리고 상기의 바인더나 첨가제를 사용한 프라이머(primer) 처리 등을 들 수 있다. 박막 제조 및 프린팅 방법으로는 잉크의 물성에 다라 각각 스핀(spin) 코팅, 롤(roll) 코팅, 스프레이 코팅, 딥(dip) 코팅, 플로(flow) 코팅, 닥터 블레이드(doctor blade)와 디스펜싱(dispensing), 잉크젯 프린팅, 옵셋 프린팅, 스크린 프린팅, 패드(pad) 프린팅, 그라비아 프린팅, 플렉소(flexography) 프린팅, 리소공정(lithography) 등을 선택하여 사용하는 것이 가능하다. The transparent silver ink composition prepared in the present invention has excellent stability and solubility, and thus can be easily applied to coating or various printing processes. For example, metal, glass, silicon wafer, ceramic, plastic film such as polyester or polyimide, rubber sheet, Coatings can be made on substrates such as fibers, wood, paper, etc. to produce thin films or print them directly. Such substrates may be used after washing and degreasing or may be used by pretreatment. Pretreatment methods include plasma, ion beam, corona, oxidation or reduction, heat, etching, ultraviolet (UV) irradiation, and primers using the binder or additives described above. primer) treatment and the like. Thin film manufacturing and printing methods include spin coating, roll coating, spray coating, dip coating, flow coating, doctor blade and dispensing depending on the properties of the ink, respectively. Dispensing, inkjet printing, offset printing, screen printing, pad printing, gravure printing, flexography printing, lithography and the like can be selected and used.
본 발명의 은 잉크 점도는 특별히 제한할 필요는 없다. 즉 상기의 박막 제조 및 프린팅 방법에 문제가 없으면 좋으며 그 방법 및 종류에 따라 다를 수 있지만 보통 0.1 ~ 200,000cps 범위가 바람직하고 1 ~ 10,000cps가 보다 바람직하다. 상기의 프린팅 방법 중에서 예를 들면, 잉크젯 프린팅으로 박막 및 패턴 형성 시에는 잉크의 점도가 중요한데 점도 범위는 0.1 ~ 50cps, 좋게는 1 ~ 20cps, 보다 좋게는 2 ~ 15cps 범위가 좋다. 만약 이 범위보다 낮은 경우는 소성 후 박막의 두께가 충분하지 못해 전도도 저하가 우려되며, 범위보다 높게 되면 원활하게 잉크가 토출되기 어려운 단점이 있다. The silver ink viscosity of the present invention does not need to be particularly limited. That is, it is good if there is no problem in the method of manufacturing and printing the thin film, and may vary depending on the method and type. In the above printing method, for example, ink viscosity is important when forming a thin film and a pattern by inkjet printing, but the viscosity range is 0.1 to 50 cps, preferably 1 to 20 cps, and more preferably 2 to 15 cps. If it is lower than this range, the thickness of the thin film after firing may not be sufficient, so that the conductivity may be lowered. If the thickness is higher than the range, ink may not be smoothly discharged.
이와 같이 하여 얻어진 박막 또는 패턴을 산화 또는 환원 처리나 열처리, 적외선, 자외선, 전자 선(electron beam), 레이저(laser) 처리와 같은 후처리 공정을 통하여 금속 또는 금속산화물 패턴을 형성시키는데도 이용할 수 있다. 상기의 후처리 공정은 통상의 불활성 분위기 하에서 열처리할 수도 있지만 필요에 의해 공기, 질소, 일산화탄소 중에서 또는 수소와 공기 또는 다른 불활성 가스와의 혼합 가스에서도 처리가 가능하다. 열처리는 보통 80 ~ 400℃ 사이, 바람직하게는 80 ~ 300℃, 보다 바람직하게는 120~250℃에서 열처리하는 것이 박막의 물성을 위하여 좋다. 부가적으로, 상기 범위 내에서 저온과 고온에서 2단계이상 가열처리하는 것도 박막의 균일성을 위해서 좋다. 예를 들면 80 ~ 150℃에서 3 ~ 30분간 처리하고, 150 ~ 300℃에서 5 ~ 30분간 처리하는 것이 좋다.The thin film or pattern thus obtained can be used to form a metal or metal oxide pattern through an aftertreatment process such as oxidation or reduction treatment, heat treatment, infrared rays, ultraviolet rays, electron beams, and laser treatments. . The post-treatment step may be heat treated under a normal inert atmosphere, but may be processed in air, nitrogen, carbon monoxide, or even a mixed gas of hydrogen and air or another inert gas, if necessary. Heat treatment is usually between 80 to 400 ℃, preferably 80 to 300 ℃, more preferably 120 to 250 ℃ heat treatment is good for the properties of the thin film. In addition, heat treatment of two or more steps at low and high temperatures within the above range is also good for the uniformity of the thin film. For example, it is good to process for 3 to 30 minutes at 80-150 degreeC, and to process for 5 to 30 minutes at 150-300 degreeC.
이하 본 발명은 실시 예에 의하여 보다 상세히 설명되지만, 실시 예는 본 발명의 예시에 불과할 뿐, 본 발명의 범위가 실시 예에 의하여 한정되는 것은 아니다. Hereinafter, the present invention will be described in more detail with reference to Examples, but the Examples are only illustrative of the present invention, and the scope of the present invention is not limited to the Examples.
[실시예] EXAMPLES
실시예 1Example 1
교반기가 부착된 250밀리리터의 슈렝크(Schlenk) 플라스크에 점성 있는 액체인 2-에틸헥실암모늄 2-에틸헥실카바메이트 32.5그램(107.5 밀리몰)을 100밀리리터의 메탄올에 용해시킨 후 산화 은 10.0그램(43.1 밀리몰)을 첨가하여 상온에서 반응시켰다. 반응이 진행됨에 따라 처음에 검은색 현탁액(Slurry)에서 착화합물이 생성됨에 따라 색이 엷어지다가 최종적으로는 무색의 투명한 용액이 얻어졌다. 이 반응 용액을 진공 하에서 용매를 모두 제거하여 42.0그램의 흰색 은 착체 화합물을 얻었다. 이 은 착체화물 20.0그램에 안정제로서 2-에틸헥실아민 5.3그램을 첨가하 고 용매로 메탄올 8.47그램을 첨가하여 점도 5.7cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 하기의 표1에 기재된 온도에서 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.In a 250 milliliter Schlenk flask with a stirrer, 32.5 grams (107.5 mmol) of 2-ethylhexyl ammonium 2-ethylhexylcarbamate, a viscous liquid, was dissolved in 100 milliliters of methanol, followed by 10.0 grams of silver oxide (43.1). Mmol) was added and reacted at room temperature. As the reaction proceeded, the complex initially formed in a black suspension, the color faded, and finally a colorless transparent solution was obtained. The solvent was removed in vacuo from this reaction solution to obtain 42.0 grams of a white silver complex compound. To 20.0 grams of this silver complex, 5.3 grams of 2-ethylhexylamine was added as a stabilizer, and 8.47 grams of methanol was added as a solvent to prepare a transparent silver ink composition having a viscosity of 5.7 cps. The uniformity and density of the thin film obtained after applying the prepared ink composition was calcined at the temperature shown in Table 1 below, and the conductivity (surface resistance value) and adhesive force results measured after the measurement were shown in Table 1.
비교예 1 Comparative Example 1
실시예 1에서 제조한 은 착체 화합물 20.0그램에 안정제로서 2-에틸헥실아민을 사용하지 않고 메탄올 용매 13.8그램을 사용하여 점도 5.5cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 상기 실시예 1과 동일한 조건에서 도포한 후 얻어지는 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 실시예 1과 비교하여 표1에 나타내었다. 그 결과 상대적으로 전도도가 낮아지거나 접착력이 열세로 나타났으며, 또한 박막이 균일하게 도포되지 못하고 쏠림현상이 보이고 치밀도에 있어서도 균열이 일부 발생하는 등의 문제점이 나타났다.A transparent silver ink composition having a viscosity of 5.5 cps was prepared using 23.8 grams of the silver complex compound prepared in Example 1 without using 2-ethylhexylamine as a stabilizer and 13.8 grams of methanol solvent. The conductivity (surface resistance value) and adhesive force measured after firing the thin film obtained after coating the prepared ink composition under the same conditions as in Example 1 are shown in Table 1 in comparison with Example 1. As a result, the conductivity was lowered or the adhesive strength was inferior, and the thin film was not uniformly applied, the pulling phenomenon was shown, and the cracking occurred in the density.
비교예 2 Comparative Example 2
실시예 1의 은 착체 화합물 대신에 헥산산 은(silver hexanoate) 5.0그램을 사용하고 안정제로서 2-에틸헥실아민 5.3그램과 메탄올 용매 5.54그램을 첨가하여 점도 5.6cps를 갖는 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 상기 실시예 1과 동일한 조건에서 도포한 후 얻어지는 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 실시예 1과 비교하여 표1에 나타내었다. 그 결과 접착력이 현저하게 열세일 뿐만 아니라 전도도도 지나치게 낮아 응용가능성이 거의 없었다.5.0 grams of silver hexanoate was used instead of the silver complex compound of Example 1, and 5.3 grams of 2-ethylhexylamine and 5.54 grams of methanol solvent were added as a stabilizer to prepare a transparent silver ink composition having a viscosity of 5.6 cps. . The conductivity (surface resistance value) and adhesive force measured after firing the thin film obtained after coating the prepared ink composition under the same conditions as in Example 1 are shown in Table 1 in comparison with Example 1. As a result, not only the adhesion was significantly inferior, but the conductivity was too low, and there was little applicability.
실시예 2Example 2
교반기가 부착된 250밀리리터의 슈렝크(Schlenk) 플라스크에 100밀리리터의 메탄올에 녹인 암모늄카보네이트 8.2그램(86밀리몰)과 이소프로필아민 15.0그램(250밀리몰)을 사용하여 혼합시킨 후 산화 은 10.0그램(43.1 밀리몰)을 첨가하여 상온에서 반응시켰다. 반응이 진행됨에 따라 처음에 검은색 현탁액(Slurry)에서 착화합물이 생성됨에 따라 색이 엷어지다가 최종적으로는 무색의 투명한 용액이 얻어졌다. 이 반응 용액을 진공 하에서 용매를 모두 제거하여 28.4그램의 흰색 은 착체 화합물을 얻었다. 이 은 착체화물 20.0그램에 안정제로서 2-에틸헥실아민 5.3그램과 용매로 메탄올 8.47그램을 첨가하여 점도 3.8cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.In a 250 milliliter Schlenk flask with a stirrer, 8.2 grams (86 mmol) of ammonium carbonate dissolved in 100 milliliters of methanol was mixed with 15.0 grams (250 mmol) of isopropylamine, followed by 10.0 grams of silver oxide (43.1). Mmol) was added and reacted at room temperature. As the reaction proceeded, the complex initially formed in a black suspension, the color faded, and finally a colorless transparent solution was obtained. The solvent was removed in vacuo from this reaction solution to obtain 28.4 grams of white silver complex compound. To 20.0 grams of this silver complex, 5.3 grams of 2-ethylhexylamine as a stabilizer and 8.47 grams of methanol were added as a solvent to prepare a transparent silver ink composition having a viscosity of 3.8 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 3 Example 3
실시예 1의 2-에틸헥실암모늄 2-에틸헥실카바메이트 대신에 2-에틸헥실암모늄 2-에틸헥실카보네이트 37.2그램으로 은 착체 화합물을 제조하여 실시예 1과 같은 방법으로 점도 5.6cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면 저항 값) 및 접착력 결과를 표1에 나타내었다.A silver complex compound was prepared from 37.2 grams of 2-ethylhexylammonium 2-ethylhexylcarbonate in place of the 2-ethylhexylammonium 2-ethylhexyl carbamate of Example 1, and a transparent silver ink having a viscosity of 5.6 cps in the same manner as in Example 1. The composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 4 Example 4
실시예 1의 2-에틸헥실암모늄 2-에틸헥실카바메이트 대신에 2-에틸헥실암모늄 2-에틸헥실바이카보네이트 48.6그램으로 은 착체 화합물을 제조하여 실시예 1과 같은 방법으로 점도 5.3cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.A silver complex compound was prepared from 48.6 grams of 2-ethylhexylammonium 2-ethylhexylbicarbonate in place of the 2-ethylhexylammonium 2-ethylhexyl carbamate of Example 1, and was prepared in the same manner as in Example 1. An ink composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 5Example 5
실시예 1의 2-에틸헥실암모늄 2-에틸헥실카바메이트 대신에 n-부틸암모늄 n-부틸카보네이트 32.0그램과 산화은 대신 탄산은 12.0그램으로 은 착체 화합물을 제조하여 실시예 1과 같은 방법으로 점도 8.5cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.Instead of the 2-ethylhexyl ammonium 2-ethylhexyl carbamate of Example 1 to prepare a silver complex compound of 32.0 grams of n-butylammonium n-butylcarbonate and 12.0 grams of silver carbonate instead of silver oxide, the viscosity was 8.5 in the same manner as in Example 1. A cps of clear silver ink composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 6Example 6
실시예 1의 2-에틸헥실암모늄 2-에틸헥실카바메이트 대신에 싸이클로헥실암모늄 싸이클로헥실카바메이트 28.2그램으로 은 착체 화합물을 제조하여 실시예 1과 같은 방법으로 점도 4.3cps를 갖는 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.A silver complex compound was prepared using 28.2 grams of cyclohexylammonium cyclohexylcarbamate in place of the 2-ethylhexylammonium 2-ethylhexyl carbamate of Example 1, and a transparent silver ink composition having a viscosity of 4.3 cps was prepared in the same manner as in Example 1. Prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 7Example 7
실시예 1의 2-에틸헥실암모늄 2-에틸헥실카바메이트 대신에 벤질암모늄 벤질카바메이트 31.2그램으로 은 착체 화합물을 제조하여 실시예 1과 같은 방법으로 점도 5.3cps를 갖는 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.A silver complex compound was prepared using 31.2 grams of benzyl ammonium benzyl carbamate instead of 2-ethylhexylammonium 2-ethylhexyl carbamate of Example 1 to prepare a transparent silver ink composition having a viscosity of 5.3 cps in the same manner as in Example 1. . Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 8Example 8
실시예 1의 2-에틸헥실암모늄 2-에틸헥실카바메이트 대신에 2-메톡시에틸암모늄 2-메톡시에틸바이카보네이트 30.8그램으로 은 착체 화합물을 제조하여 실시예 1과 같은 방법으로 점도 2.8cps를 갖는 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.A silver complex compound was prepared using 30.8 grams of 2-methoxyethylammonium 2-methoxyethylbicarbonate instead of 2-ethylhexylammonium 2-ethylhexylcarbamate of Example 1, and the viscosity was measured in the same manner as in Example 1 to 2.8 cps. To prepare a transparent silver ink composition. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 9Example 9
실시예 1의 2-에틸헥실암모늄 2-에틸헥실카바메이트 대신 이소프로필암모늄 이소프로필바이카보네이트 18.8그램과 옥틸암모늄 옥틸바이카보네이트 25.0그램으 로 은 착체 화합물을 제조하여 실시예 1과 같은 방법으로 점도 2.8cps를 갖는 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.A silver complex compound was prepared using 18.8 grams of isopropylammonium isopropyl bicarbonate and 25.0 grams of octyl ammonium octyl bicarbonate instead of 2-ethylhexylammonium 2-ethylhexyl carbamate of Example 1, and the viscosity was measured in the same manner as in Example 1. A transparent silver ink composition with cps was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 10Example 10
실시예 1의 2-에틸헥실암모늄 2-에틸헥실카바메이트 대신에 2-에틸헥실암모늄 2-에틸헥실카바메이트 19.7그램과 2-메톡시에틸암모늄 2-메톡시에틸카바메이트 12.7그램으로 은 착체 화합물을 제조하여 실시예 1과 같은 방법으로 점도 22.6cps를 갖는 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.Silver complex compound of 19.7 grams of 2-ethylhexyl ammonium 2-ethylhexyl carbamate and 12.7 grams of 2-methoxyethylammonium 2-methoxyethylcarbamate instead of 2-ethylhexylammonium 2-ethylhexyl carbamate of Example 1 To prepare a transparent silver ink composition having a viscosity of 22.6cps in the same manner as in Example 1. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 11Example 11
실시예 5에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 안정제로서 암모늄 카보네이트 1.2그램과 에프카 3650(에프카사) 0.05그램을 첨가하고 용매로 메톡시프로필아세테이트 25.0그램을 첨가하여 점도 3.6cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 20.0 grams of the silver complex compound prepared in the same manner as in Example 5, 1.2 grams of ammonium carbonate and 0.05 grams of Efka 3650 (Efca) were added as stabilizers, and 25.0 grams of methoxypropyl acetate was added as a solvent to obtain a viscosity of 3.6 cps. A clear silver ink composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 12Example 12
실시예 5에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 안정제로서 2,2-에틸렌디옥시비스에틸아민 1.2그램과 에프카 3650(에프카사) 0.05그램을 첨가하고 용매로 메톡시프로필아세테이트 25.0그램을 첨가하여 점도 3.2cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다. To 20.0 grams of the silver complex compound prepared in the same manner as in Example 5, 1.2 grams of 2,2-ethylenedioxybisethylamine and 0.05 grams of Efka 3650 (Efca Co.) were added as a stabilizer, and methoxypropyl acetate 25.0 was used as a solvent. Gram was added to prepare a clear silver ink composition with a viscosity of 3.2 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 13Example 13
실시예 8에서와 같은 방법으로 제조된 은 착체 화합물 12.0그램에 안정제로서 트리프로필아민 0.2그램과 비와이케이 373(비와이케이사) 0.03그램을 첨가하고 용매로 1-메톡시프로판올 20.0그램을 첨가하여 점도 3.3cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 12.0 grams of the silver complex compound prepared in the same manner as in Example 8, 0.2 g of tripropylamine and 0.03 g of BWK 373 (BKK) were added as stabilizers and 20.0 grams of 1-methoxypropanol was added as a solvent. A 3.3 cps clear silver ink composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 14Example 14
실시예 8에서와 같은 방법으로 제조된 은 착체 화합물 12.0그램에 안정제로서 디이소프로필아민 0.2그램과 비와이케이 373(비와이케이사) 0.03그램을 첨가하고 용매로 1-메톡시프로판올 20.0그램을 첨가하여 점도 4.2cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 12.0 grams of the silver complex compound prepared in the same manner as in Example 8, 0.2 g of diisopropylamine and 0.03 g of BWK 373 (BKK) were added as stabilizers and 20.0 grams of 1-methoxypropanol was added as a solvent. A transparent silver ink composition was prepared having a viscosity of 4.2 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 15Example 15
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 12.0그램에 안정제로서 3-메톡시프로필아민 0.2그램과 테고 웨트 505(데구사) 0.03그램을 첨가하고 용매로 에탄올 20.0그램을 첨가하여 점도 4.2cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 12.0 grams of the silver complex compound prepared in the same manner as in Example 3, 0.2 grams of 3-methoxypropylamine and 0.03 grams of Tegowet 505 (Degussa) were added as a stabilizer, and 20.0 grams of ethanol was added as a solvent to give a viscosity of 4.2 cps. A transparent silver ink composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 16Example 16
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 12.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 테고 웨트 505(데구사) 0.03그램을 첨가하고 용매로 에탄올 20.0그램을 첨가하여 점도 4.4cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 12.0 grams of the silver complex compound prepared in the same manner as in Example 3, 3.4 grams of 2-ethylhexylamine and 0.03 grams of Tego Wet 505 (Degussa) were added as a stabilizer, and 20.0 grams of ethanol was added as a solvent to obtain a viscosity of 4.4 cps. A clear silver ink composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 17Example 17
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 12.0그램에 안정제로 서 2-에틸헥실아민 3.4그램과 테고 웨트 505(데구사) 0.03그램 첨가하고 용매로 1-프로판올 20.0그램을 첨가하여 점도 4.6cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 12.0 grams of the silver complex compound prepared in the same manner as in Example 3, 3.4 grams of 2-ethylhexylamine and 0.03 grams of Tego Wet 505 (Degussa) were added as a stabilizer, and 20.0 grams of 1-propanol was added as a solvent to obtain a viscosity of 4.6. A cps of clear silver ink composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 18Example 18
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 12.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 릴라니트 에이치티 엑스트라(코그니스사) 0.02그램을 첨가하고 용매로 메틸셀로솔브 12.7그램을 첨가하여 점도 4.1cps의 투명한 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 12.0 grams of the silver complex compound prepared in the same manner as in Example 3, 3.4 grams of 2-ethylhexylamine and 0.02 grams of Lilanite H. Extra (Cognis) were added as stabilizers, and 12.7 grams of methyl cellosolve was added as a solvent. The addition made a transparent ink composition having a viscosity of 4.1 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 19Example 19
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 에프카 3835(에프카사) 0.03그램을 첨가하고 용매로 에틸아세테이트 12.7그램을 첨가하여 점도 6.5cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 20.0 grams of the silver complex compound prepared in the same manner as in Example 3, 3.4 grams of 2-ethylhexylamine and 0.03 grams of Efka 3835 (Ephca Co.) were added as stabilizers and 12.7 grams of ethyl acetate was added as a solvent to give a viscosity of 6.5 cps. A transparent silver ink composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 20Example 20
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 에프카 3777(에프카사) 0.05그램을 첨가하고 용매로 톨루엔 12.7그램을 첨가하여 점도 6.3cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 20.0 grams of the silver complex compound prepared in the same manner as in Example 3, 3.4 grams of 2-ethylhexylamine and 0.05 grams of Efka 3777 (Efca) were added as stabilizers, and 12.7 grams of toluene were added as a solvent to obtain a viscosity of 6.3 cps. A clear silver ink composition was prepared. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 21Example 21
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 글라이드 410(데구사) 0.03그램을 1-프로판올과 에틸카비톨아세테이트가 2:1의 중량 비율로 혼합된 용매 12.7그램에 첨가하여 점도 6.2cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 20.0 grams of the silver complex compound prepared in the same manner as in Example 3, 3.4 grams of 2-ethylhexylamine and 0.03 grams of Glide 410 (Degussa) were used as stabilizers, and 1-propanol and ethyl carbitol acetate were weight ratios of 2: 1. It was added to 12.7 grams of the mixed solvent to prepare a transparent silver ink composition having a viscosity of 6.2 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 22Example 22
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 디에스엑스 1514(코그니스사) 0.03그램을 N,N-디메틸포름아미드와 N,N-디메틸설포옥사이드와 메탄올이 3:1:1의 중량 비율로 혼합된 용매 12.7그램에 첨가하여 점도 7.8cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 20.0 grams of the silver complex compound prepared in the same manner as in Example 3, 3.4 grams of 2-ethylhexylamine and 0.03 grams of DSX 1514 (Cognis) were used as stabilizers. N, N-dimethylformamide and N, N-dimethyl Sulfooxide and methanol were added to 12.7 grams of a solvent mixed at a weight ratio of 3: 1: 1 to prepare a transparent silver ink composition having a viscosity of 7.8 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 23Example 23
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 에프카 410(에프카사) 0.1그램을 1-메틸-2-피롤리돈과 2-부탄올이 4:1의 중량 비율로 혼합된 용매 12.7그램에 첨가하여 점도 6.7cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 20.0 grams of the silver complex compound prepared in the same manner as in Example 3, 3.4 grams of 2-ethylhexylamine and 0.1 gram of Efka 410 (Efca Co., Ltd.) were used as stabilizers, and 1-methyl-2-pyrrolidone and 2-butanol A transparent silver ink composition having a viscosity of 6.7 cps was added to 12.7 grams of mixed solvent in a weight ratio of 4: 1. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 24Example 24
실시예 3에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 써피놀 465(에어 프로덕트사) 0.05그램을 물과 폴리에틸렌글리콜(PEG) 200과 메탄올이 2:1:1의 중량 비율로 혼합된 용매 12.7그램을 첨가하여 점도 8.9cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 20.0 grams of the silver complex compound prepared in the same manner as in Example 3, 3.4 grams of 2-ethylhexylamine and 0.05 grams of Surinol 465 (Air Products) as a stabilizer were added to water, polyethylene glycol (PEG) 200 and methanol 2: 12.7 grams of mixed solvents were added at a weight ratio of 1: 1 to prepare a transparent silver ink composition having a viscosity of 8.9 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 25Example 25
교반기가 부착된 250밀리리터의 슈렝크(Schlenk) 플라스크에 2-에틸헥실아민 26그램(0.20몰) 과 n-부틸아민 15g(0.20몰)과 용매인 메탄올 10그램에 용해 교반 시킨 후 산화 은 9.3그램(0.04몰)을 첨가하고 난 후 이산화탄소 가스를 상온에서 서서히 버블링시키면서 반응시켰다. 이때 반응이 진행됨에 따라 처음에 검은색 현탁액(Slurry)에서 착화합물이 생성됨에 따라 색이 엷어지다가 최종적으로는 무색의 투명한 용액이 얻어졌다. 이 용액을 0.45마이크론 필터로 여과하여 맑고 투명한 액상 은 착체 화합물을 얻었다. 이 은 착체 화합물 20.0그램에 2-에틸헥실아민 3.5그램과 에프카 3650(에프카사) 0.05그램을 첨가하여 점도 15.4cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.In a 250 milliliter Schlenk flask with a stirrer, 26 g (0.20 mole) of 2-ethylhexylamine, 15 g (0.20 mole) of n-butylamine and 10 g of methanol as a solvent were stirred, followed by 9.3 g of silver oxide. After adding (0.04 mol), carbon dioxide gas was allowed to react while slowly bubbling at room temperature. At this time, as the reaction proceeded, the complex first formed in a black suspension (Slurry), the color faded, and finally a colorless transparent solution was obtained. This solution was filtered through a 0.45 micron filter to obtain a clear transparent liquid silver complex compound. To 20.0 grams of this silver complex compound, 3.5 grams of 2-ethylhexylamine and 0.05 grams of Efka 3650 (Efca Co.) were added to prepare a transparent silver ink composition having a viscosity of 15.4 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 26Example 26
교반기가 부착된 250밀리리터의 가압 용기에 2-에틸헥실아민 26그램(0.20몰)과 n-부틸아민 15.0그램(0.20몰) 그리고 도데실아민 0.24그램 첨가 후 릴라니트 에이치티 엑스트라(코그니스사) 0.03그램과 메탄올 10.0그램을 추가하여 용해 교반 시킨다. 그 후 산화 은 9.3그램(0.04몰)을 첨가하고 난 후 이산화탄소 가스를 상온에서 서서히 주입시키면서 반응시킨 결과 점도가 135.0cps인 맑고 투명한 은 잉크를 얻었다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.After adding 26 grams (0.20 mol) of 2-ethylhexylamine, 15.0 grams (0.20 mol) of n-butylamine and 0.24 grams of dodecylamine to a 250 milliliter pressurized vessel equipped with a stirrer, Leelanite H. Extra (Cognis) Add 0.03 grams and 10.0 grams methanol and stir. After adding 9.3 grams (0.04 mol) of silver oxide, the reaction was carried out while slowly injecting carbon dioxide gas at room temperature to obtain a clear transparent silver ink having a viscosity of 135.0 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 27Example 27
실시예 10에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 에틸셀룰로스 4.8그램을 첨가하여 점도가 2,300cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.4.8 grams of ethyl cellulose was added to 20.0 grams of the silver complex compound prepared in the same manner as in Example 10 to prepare a transparent silver ink composition having a viscosity of 2,300 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 28 Example 28
실시예 10에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 추가로 2-에틸헥실암모늄 2-에틸헥실카바메이트 2.0그램을 첨가하여 점도 19.2cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 20.0 grams of the silver complex compound prepared in the same manner as in Example 10, 2.0 grams of 2-ethylhexylammonium 2-ethylhexylcarbamate was added to prepare a transparent silver ink composition having a viscosity of 19.2 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 29Example 29
실시예 10에서와 같은 방법으로 제조된 은 착체 화합물 20.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 폴리비닐부티랄(바커사 제조 BL-18) 0.8그램과 부틸셀로솔브 4.0그램을 첨가하여 점도 8,000cps의 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다.To 20.0 grams of the silver complex compound prepared in the same manner as in Example 10, 3.4 grams of 2-ethylhexylamine, 0.8 grams of polyvinyl butyral (BL-18 manufactured by Barker), and 4.0 grams of butyl cellosolve were added as stabilizers. A transparent silver ink composition was prepared having a viscosity of 8,000 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 30Example 30
실시예 1의 2-에틸헥실암모늄 2-에틸헥실카바메이트 대신에 이소프로필암모늄 이소프로필카보네이트 20.1그램으로 은 착체 화합물을 제조하고, 이 은 착체 화합물 20.0그램에 안정제로서 2-에틸헥실아민 3.4그램과 용매로 메탄올 대신에 물 12.7그램과 코코 베타인 0.03그램을 첨가하여 점도 3.5cps를 갖는 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다. A silver complex compound was prepared from 20.1 grams of isopropylammonium isopropyl carbonate instead of 2-ethylhexylammonium 2-ethylhexyl carbamate of Example 1, and 3.4 grams of 2-ethylhexylamine as a stabilizer was added to 20.0 grams of the silver complex compound. Instead of methanol, 12.7 grams of water and 0.03 grams of coco betaine were added as a solvent to prepare a transparent silver ink composition having a viscosity of 3.5 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 31Example 31
교반기가 부착된 250밀리리터의 슈렝크(Schlenk) 플라스크에 이소프로필암모늄 이소프로필카보네이트 20.1그램과 물 13.0그램을 첨가하여 교반시킨 후 산화 은 10.0그램(43.1 밀리몰)을 첨가하여 상온에서 반응시켜 물에 녹아 있는 은 착체 화합물을 제조하고, 이 액상 은 착체 화합물 43.1그램에 안정제로서 2-에틸헥실아민 3.4그램과 코코 베타인 0.03그램을 첨가하여 점도 3.5cps를 갖는 투명한 은 잉크 조성물을 제조하였다. 제조된 잉크 조성물을 도포한 후 얻어지는 균일하고 치밀한 박막을 소성시킨 후 측정한 전도도(면저항 값) 및 접착력 결과를 표1에 나타내었다. 20.1 grams of isopropylammonium isopropyl carbonate and 13.0 grams of water were added to a 250 milliliter Schlenk flask equipped with a stirrer and stirred. Then, 10.0 grams (43.1 mmol) of silver oxide was added and reacted at room temperature to dissolve in water. A silver complex compound was prepared, and 3.4 g of 2-ethylhexylamine and 0.03 g of coco betaine were added to 43.1 g of the liquid silver complex compound to prepare a transparent silver ink composition having a viscosity of 3.5 cps. Table 1 shows the conductivity (surface resistance value) and adhesive force results measured after firing the uniform and dense thin film obtained after applying the prepared ink composition.
실시예 32 Example 32
실시예 2에서 제조된 점도가 3.8cps인 투명 은 잉크를 폴리에틸렌 용기에 충진하여 피에조 방식의 잉크젯 프린터 헤드F083000(상표명 엡손사 제조)를 장착한 평판 프린터를 이용하여 페트(PET) 필름 위에 패터닝 하였다. 패터닝이 완료된 샘플을 80℃에서 5분, 그리고 130℃에서 10분간 열처리하였다.A transparent silver ink having a viscosity of 3.8 cps prepared in Example 2 was filled in a polyethylene container and patterned on a PET film using a flatbed printer equipped with a piezo inkjet printer head F083000 (trade name: Epson). The patterned sample was heat-treated at 80 ° C. for 5 minutes and at 130 ° C. for 10 minutes.
실시예 33Example 33
실시예 26에서 제조된 점도가 2,300cps인 투명 은 잉크를 320 메쉬(mesh)의 패터닝 된 실크 스크린 인쇄기를 이용하여 페트(PET) 필름 위에 패터닝 하였다. 패터닝이 완료된 샘플을 100℃에서 3분, 그리고 130℃에서 10분간 열처리하였다.The transparent silver ink having a viscosity of 2,300 cps prepared in Example 26 was patterned on a PET film using a 320 mesh patterned silk screen printing machine. The patterned samples were heat treated at 100 ° C. for 3 minutes and at 130 ° C. for 10 minutes.
실시예 34Example 34
실시예 27에서 제조된 점도가 19.2cps인 투명 은 잉크를 그라비아 인쇄기를 이용하여 폴리비닐부티랄 수지로 전처리 된 페트(PET) 필름 위에 패터닝 하였다. 패터닝이 완료된 샘플을 80℃에서 2분, 100℃에서 3분, 그리고 130℃에서 5분간 열처리하였다.The transparent silver ink having a viscosity of 19.2 cps prepared in Example 27 was patterned on a PET film pretreated with polyvinyl butyral resin using a gravure printing machine. The patterned samples were heat treated at 80 ° C. for 2 minutes, at 100 ° C. for 3 minutes, and at 130 ° C. for 5 minutes.
<표1> 실시 예 및 비교 실시 예에서 제조된 은 도막의 물성 데이터Table 1 Properties data of silver coating films prepared in Examples and Comparative Examples
(1) 접착력평가 : 스카치테이프(상표명: 3M사 제조)를 인쇄면에 붙 인 후 박리하여 접착면에 은막이 전사되는 상태를 평가.(1) Adhesive force evaluation: The state where a silver film is transferred to an adhesive surface is evaluated by sticking Scotch tape (trade name: 3M company make) on a printing surface, and peeling.
○ : 테이프의 접착면에 은 박막의 전사가 없는 경우(Circle): When there is no transfer of a silver thin film in the adhesive surface of a tape
△ : 테이프의 접착면에 은 박막의 일부 전사되어 기제와 분리된 경우(Triangle | delta): When a part of silver thin film is transferred to the adhesive surface of a tape, and it isolate | separates from a base material
× : 테이프의 접착면에 은 박막의 대부분이 전사되어 기제와 분리된 경우 ×: most of the silver thin film is transferred to the adhesive side of the tape and separated from the base
(2) 전도도평가: 패턴 1cm× 3cm의 직사각형 샘플 제작 후 이를 에이아이티 (AIT) CMT-SR1000N으로 면저항 측정. (2) Conductivity evaluation: After making a rectangular sample of pattern 1cm × 3cm, measure the sheet resistance with AIT CMT-SR1000N.
본 발명에 의하여 화학식 1로 표시되는 하나 이상의 은 화합물과 화학식 2, 화학식 3 또는 화학식 4로 표시되는 하나 이상의 암모늄 카바메이트 또는 암모늄 카보네이트계 화합물을 반응시켜 얻어지는 은 착체 화합물과 안정화제로서 1차 아민, 2차 아민, 3차 아민 화합물이나 암모늄 카바메이트, 카보네이트, 바이카보네이트계 화합물 또는 최소한 1개 이상의 이들 혼합물을 포함하는 은 잉크 조성물이 제공되었다.According to the present invention, a silver complex compound obtained by reacting at least one silver compound represented by the formula (1) with at least one ammonium carbamate or ammonium carbonate compound represented by the formula (2), (3) or (4) and a primary amine as a stabilizer, A silver ink composition is provided comprising a secondary amine, tertiary amine compound or ammonium carbamate, carbonate, bicarbonate-based compound or at least one of these mixtures.
상기 잉크 조성물은 안정성 및 용해성이 우수하고 박막형성이 용이하며 150℃ 이하의 낮은 온도에서 쉽게 소성되어 기판의 종류에 관계없이 높은 전도도를 갖는 박막 또는 패턴 형성이 가능하여 금속, 유리, 실리콘 웨이퍼, 세라믹, 폴리에스테르나 폴리이미드와 같은 플라스틱 필름, 고무시트, 섬유, 목재, 종이 등과 같은 기판에 코팅하여 박막을 제조하거나 직접 프린팅 할 수 있다. 박막 제조 및 프린팅 방법으로는 잉크의 물성에 다라 각각 스핀(spin) 코팅, 롤(roll) 코팅, 스프레이 코팅, 딥(dip) 코팅, 플로(flow) 코팅, 닥터 블레이드(doctor blade)와 디스펜싱(dispensing), 잉크젯 프린팅, 옵셋 프린팅, 스크린 프린팅, 패드(pad) 프린팅, 그라비아 프린팅, 플렉소(flexography) 프린팅, 리소공정(lithography) 등 다 양한 방법을 사용할 수 있다. The ink composition has excellent stability and solubility, is easy to form a thin film, and is easily baked at a low temperature of 150 ° C. or lower to form a thin film or pattern having a high conductivity regardless of the type of substrate. It can be coated on a substrate such as plastic film, rubber sheet, fiber, wood, paper, such as polyester or polyimide, can be manufactured or printed directly. Thin film manufacturing and printing methods include spin coating, roll coating, spray coating, dip coating, flow coating, doctor blade and dispensing depending on the properties of the ink, respectively. Various methods such as dispensing, inkjet printing, offset printing, screen printing, pad printing, gravure printing, flexography printing and lithography can be used.
또한 본 발명의 조성물을 이용할 경우 도막이 균일하게 형성되고, 형성된 도막의 전도도 및 접착력이 이 기술 분야에서 적합한 범위로 나타났으며, 상기의 물성과 더불어, 도막의 균열 발생이 일어나지 않아 품질을 현저히 향상시키며 다른 잉크 도막의 색상 또한 명확하게 발현되는 효과를 가진다.In addition, when the composition of the present invention is used, the coating film is uniformly formed, and the conductivity and adhesion of the formed coating film are shown in a suitable range in the technical field. In addition to the above properties, cracking of the coating film does not occur, thereby significantly improving quality. The color of the other ink coating film also has the effect of expressing clearly.
또 본 발명의 잉크를 사용하여 은 분말, 페이스트, 콜로이드 또는 나노 입자 제조에 이용할 수 있으며, 전자파 차폐 재료, 도전성 접착제, 저 저항 금속배선, 인쇄회로기판(PCB), 연성회로기판(FPC), 무선인식(RFID) 태그(tag)용 안테나, 태양전지, 2차전지 또는 연료전지, 그리고 플라즈마 디스플레이(PDP), 액정디스플레이(TFT-LCD), 유기발광다이오드(OLED), 플렉시블 디스플레이 및 유기박막 트렌지스터(OTFT) 등과 같은 분야에서 전극이나 배선 재료로 사용할 수 있는 우수한 조성물을 제공한다. In addition, the ink of the present invention can be used for the production of silver powder, paste, colloid or nanoparticles, electromagnetic shielding material, conductive adhesive, low resistance metallization, printed circuit board (PCB), flexible circuit board (FPC), wireless Antennas for RFID tags, solar cells, secondary or fuel cells, and plasma displays (PDPs), liquid crystal displays (TFT-LCDs), organic light-emitting diodes (OLEDs), flexible displays and organic thin film transistors OTFT) and the like to provide an excellent composition that can be used as an electrode or a wiring material.
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KR100889457B1 (en) | 2006-06-29 | 2009-03-17 | 주식회사 엘지화학 | Metal nano ink for circuit wiring comprising polyethylenimine compound |
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CN101010388B (en) | 2012-06-06 |
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