KR100726001B1 - Light emitting diode package and its manufacturing method - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode package and a method for manufacturing the same, wherein the first lead frame is formed in an insulating layer and a plate shape, one side of which is fixed to one side of the insulating layer, the bottom of the substrate is in close contact with the substrate, and the circuit is formed on the substrate And a second lead frame having one surface fixed to the other surface of the insulating layer and connected to the circuit, a light emitting diode chip mounted on the top surface of the first lead frame, and electrically connected to the first and second lead frames, and a light emitting diode. It includes a lens unit for covering and coupling the chip, the bottom surface of the first lead frame is formed to have a larger surface area than the bottom surface of the second lead frame, by conducting the heat generated from the light emitting diode chip to the substrate to emit, The production cost is reduced, the manufacturing process is simplified, mass production of the product is easy, and the light emitting efficiency of the light emitting diode chip is increased.

Description

LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREFORE}

1 is an exploded perspective view of a light emitting diode package according to a first embodiment of the present invention.

Figure 2a is a plan view of a first leadframe according to the first embodiment of the present invention.

Figure 2b is a front view of the first leadframe according to the first embodiment of the present invention.

3A is a plan view of a second leadframe according to the first embodiment of the present invention.

3B is a front view of a second leadframe according to the first embodiment of the present invention.

4 is a perspective view of a strip in which first and second lead frames and an insulating layer are coupled according to a first embodiment of the present invention.

5 is a perspective view of a light emitting diode package according to a first embodiment of the present invention;

Figure 6 is a perspective view of a light emitting diode package coupled to the lens unit according to the first embodiment of the present invention.

7 is a perspective view of a light emitting diode package according to a second embodiment of the present invention.

8 is a front view of FIG. 7;

9 is a perspective view of a light emitting diode package coupled to the lens unit according to the second embodiment of the present invention.

10 is a perspective view of a light emitting diode package having a second lead frame and an insulating layer according to a third embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: first lead frame

200: second lead frame

300: light emitting diode chip

400: insulation layer

500: lens unit

600: Strip

The present invention relates to a light emitting diode package and a method of manufacturing the same.

Light Emitting Diode is a kind of semiconductor used to send and receive electric signals by converting electric signals into infrared rays or light by using the characteristics of compound semiconductors. Backlight) It is used in various fields such as light source and lighting.

In general, the light emitting diode is electrically connected to the lead frames of the anode and the cathode to receive power and to convert electrical energy into light energy. In general, a separate heat sink is provided to be in contact with the light emitting diode chip. Due to the heat generated by the operation, it is possible to prevent the light output degradation caused by the ambient temperature of the LED chip rises.

The conventional LED package has a problem in that the structure of the product is complicated and the manufacturing cost increases because the LED package is assembled by separately providing a power supply lead frame and a cooling heat sink.

The present invention provides a light emitting diode package excellent in heat resistance and a method of manufacturing the same.

In addition, the present invention provides a light emitting diode package and a method of manufacturing the same, which is simple to assemble and the production cost is reduced.

According to an aspect of the present invention, an insulating layer, a first lead frame is formed in a plate shape, one side is fixed to one surface of the insulating layer, the bottom surface is in close contact with the substrate and connected to the circuit formed on the substrate, and one surface is an insulating layer A second lead frame fixed to the other surface of the second lead frame, the light emitting diode chip mounted on the top surface of the first lead frame, and electrically connected to the first and second lead frames, and coupled to the light emitting diode chip. A light emitting diode package including a lens unit, wherein a bottom surface of the first lead frame is formed to have a larger surface area than a bottom surface of the second lead frame, thereby conducting and emitting heat generated from the light emitting diode chip to the substrate.

The insulating layer is provided with an insulating material in a separate solid state, and is bonded to and fixed to the first or second lead frame, respectively, or the first and second lead frames are bonded and fixed as a fluid insulating adhesive material and then hardened to a solid state. Can be.

Short-circuit prevention steps are formed at the end where the first or second lead frame is coupled with the insulating layer, so that the portion between the first lead frame and the second lead frame is coupled between the first lead frame and the second lead frame through the insulating layer. Since the distance is spaced by the step, the occurrence of the short can be reduced.

The first or second leadframe is formed of any one selected from the group consisting of copper, aluminum, silver, tungsten, molybdenum, beryllium, and alloys thereof, which are excellent in thermal conductivity and conductivity, so that the first or second leadframe itself A heat sink for heat dissipation and a connection terminal with a circuit formed at the same time can be performed.

The light emitting diode chip is wire-bonded with the first and second lead frames to be electrically connected to each other, and the lens unit may be formed in a molding manner while surrounding the light emitting diode chip, or a separate solid state lens unit may be combined. It includes a lens having a cavity (cavity) inside and a light-transmitting filling material filled in the cavity, the light emitting diode chip and the wire is accommodated in the cavity, the wire and the light emitting diode chip is preferably protected from external impact or other foreign matters Do.

According to another aspect of the invention, the first lead frame is formed in an insulating layer, the plate shape is fixed to one side of the insulating layer on one side, the bottom surface is in close contact with the substrate, and connected to the circuit formed on the substrate, the first lead A second light emitting diode chip mounted on an upper surface of the frame, a vertical portion fixed to the other surface of the insulating layer, a horizontal portion insulated from the surface of the first lead frame and extending to approach the light emitting diode chip, and a bottom surface connected to the circuit; A lead frame, connection connecting means for electrically connecting the light emitting diode chip to the first and second lead frames, and a lens unit covering and coupled to the light emitting diode chip, wherein the bottom of the first lead frame includes There is provided a light emitting diode package having a larger surface area than the bottom surface, which conducts and releases heat generated from the light emitting diode chip to a substrate.

The lens unit closes a predetermined area including the mounting area of the light emitting diode chip in the upper surface of the first lead frame, and a part of the heat generated from the light emitting diode chip causes convection with outside air in contact with the open upper surface of the first lead frame. Since it can be emitted through the combined cooling method through conduction and convection can be improved heat radiation efficiency of the light emitting diode. Grooves or protrusions are formed on the open upper surface of the first lead frame to increase the contact area with the outside air, thereby further improving the cooling efficiency of the first lead frame through the convection.

The light emitting diode chip is electrically connected to the first or second lead frame through a connection connecting means such as a bonding wire, and the lens portion is formed in a molding manner while surrounding the light emitting diode chip or a separate solid state lens portion is used to form the light emitting diode chip. Can be combined to cover.

When the lens unit receives and couples the wire and the lens unit, the size of the lens unit increases in proportion to the length of the bonding wire. The length of the bonding wire becomes shorter as the portion extending from the second lead frame approaches the LED chip. As the size of the lens unit is reduced, the unit cost of molding is reduced, and the area of the open upper surface of the first lead frame is increased to increase the contact area with the outside air, thereby facilitating cooling of the first lead frame through convection.

According to another aspect of the invention, there is provided a step of providing a plate-shaped first lead frame and a second lead frame having a lower surface area than the bottom surface of the first lead frame, and the first and second lead frames in the strip Bonding the spacers at intervals, injecting an insulating adhesive material between the gaps, fixing the first and second lead frames to each other, and attaching the light emitting diode chip to the upper surface of the first lead frame. A light emitting diode package manufacturing method comprising the steps of, and wire bonding a light emitting diode chip with a first or second lead frame is provided.

Hereinafter, a preferred embodiment of a light emitting diode package according to the present invention will be described in detail with reference to the accompanying drawings, in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and duplicated thereto. The description will be omitted.

As shown in FIG. 1, the light emitting diode package according to the first embodiment of the present invention includes the first and second lead frames 100 and 200 made of an electrically conductive material, and the first and second lead frames respectively on one side and the other side thereof. The insulating layer 400 to which the 100 and 200 are coupled, the light emitting diode chip 300 supplied with power through the first and second lead frames 100 and 200, and the light emitted from the light emitting diode chip 300 are dispersed. It is configured to include a lens unit 500.

The first or second lead frames 100 and 200 may be formed of any one selected from the group consisting of copper, aluminum, silver, tungsten, molybdenum, beryllium, and alloys thereof having excellent thermal conductivity and electrical conductivity, and may be electrically connected to the light emitting diode chip 300. It is connected to the power supply for light emitting power of the light emitting diode chip 300 and at the same time serves as a heat sink to emit heat according to the operation of the light emitting diode chip.

A non-metal insulating layer 400 is coupled between the first lead frame 100 and the second lead frame 200 to fix the first lead frame 100 and the second lead frame 200 while the positive electrode and the negative electrode Prevent electrical shorts between.

The light of the light emitting diode chip 300 is dispersed or the light of the light emitting diode chip 300 and the light emitting diode chip 300 are disposed on the first or second lead frames 100 and 200 on which the light emitting diode chip 300 is mounted. The lens unit 500 is coupled to protect the connection.

The lens unit 500 is formed of a single translucent synthetic resin wrapped around the light emitting diode chip 300 and the electrical connection in a molding manner, or includes a cavity (not shown) therein and accommodates the light emitting diode chip 300. The light emitting diode chip 300 may include a lens for dispersing light, and a light-transmitting filling material filled in the cavity to protect the electrical connection between the light emitting diode chip and the light emitting diode chip.

The refractive index of the filling material is limited to the refractive index of the lens or less, and the light of the light emitting diode chip 300 is transmitted at the boundary between the filling material and the lens due to the total reflection phenomenon generated when light is transmitted from the dense material of the medium to the small material. It is preferable to prevent the phenomenon of reflection into the inside of the filling material. In addition, the lens unit 500 may contain a fluorescent material for converting light emitted from the light emitting diode chip 300 into white light.

As shown in FIGS. 2A to 4, the surface area of the bottom surface of the first lead frame 103 is greater than the surface area of the bottom surface of the second lead frame 203, so that the light emitting diode chip 300 is formed of the first lead frame. When the upper surface 101 is mounted on the bottom surface 103 of the first lead frame is in close contact with the substrate (not shown) and heat generated from the light emitting diode chip is conducted through the first lead frame 100 in a conductive manner. It is preferable to release easily).

The first and second lead frames 100 and 200 and the insulating layer (400 of FIG. 1) according to the first embodiment of the present invention form one plane in a combined state, and the first lead frame or the second lead frame ( The stepped parts 110 and 210 protruding to the outside are formed at the ends of the parts 100 and 200, and the lens parts (500 of FIG. 1) are formed in the molding method up to the stepped parts 110 and 210 so as to be mounted on the first lead frame 100. (300 of FIG. 1) and the bonding wire (310, 320 of FIG. 5) for electrically connecting the first or second lead frame (100,200), respectively, are coupled.

Short prevention steps for separating the first lead frame 100 and the second lead frame 200 by a predetermined distance at an end where the first or second lead frames 100 and 200 are coupled through the insulating layer 400 ( 120 may be formed.

Referring to FIG. 4, in order to continuously process the assembly process of the LED package, a plurality of first and second lead frames 100 and 200 may be formed in a matrix form on a strip 600 which is a transport frame in a continuous sheet form. After arranging and combining the layers, the processes may be sequentially performed, and the first and second lead frames 100 and 200 may be separated from the strip 600 by a predetermined frame unit.

In order to manufacture the light emitting diode package according to the first embodiment, a plate-shaped first lead frame 100 and a bottom surface (203 in FIG. 3B) having a surface area smaller than that of the bottom surface (103 in FIG. 2B) of the first lead frame are formed. 2 by injecting the lead frame 200 is spaced apart at a predetermined interval to the strip 600, and the insulating adhesive material 400 is injected between the intervals to adhere and fix the first and second lead frame (100,200) to each other After attaching the light emitting diode chip (300 of FIG. 1) to the top surface 101 of the first lead frame, the light emitting diode chip 300 is wire-bonded with the first or second lead frames 100 and 200. can do.

The light emitting diode chip 300 may be mounted after coating the insulating adhesive material 330 on the upper surface of the first lead frame 100. After the wire bonding process is completed, the light emitting diode chip 300 additionally emits light from the lens unit 500 of FIG. 1. The LED chip 300 and the wires 310 and 320 of FIG. 5 may be coupled to each other by molding, or the LED package including the first and second lead frames 100 and 200 may be separated from the strip 600.

When the light emitting diode chip 300 emits light, heat generated from the light emitting diode chip 300 is conducted to the substrate (not shown) through the first lead frame 100 and is emitted. As shown in FIG. 5, the first lead frame 100 is formed in a plate shape having a thickness smaller than a length of a width or length, and closely adheres to a substrate (not shown), thereby to the light emitting diode chip 300 from the light emitting diode chip 300. Heat dissipation through heat conduction can be maximized.

Although not shown, when the bottom surface of the light emitting diode chip 300 is mounted over the first and second lead frames 100 and 200 by an electrically conductive adhesive, the thermal conductivity of the metallic first and second lead frames 100 and 200 is shown. Since the thermal conductivity of the insulating layer 400 made of the non-metallic material is greater than that of the lower surface of the light emitting diode chip 300, the heat flow is reduced.

In addition, thermal stress is generated inside the light emitting diode chip 300 due to an uneven heat flow and a difference in a thermal expansion coefficient therein, and the light emitting diode chip 300 is damaged by the thermal stress, thereby reducing light efficiency. Therefore, as shown in FIG. 5, it is preferable that the entire bottom surface of the LED chip 300 is in contact with the top surface 101 of the first lead frame.

The entire bottom surface of the light emitting diode chip 300 is coupled to one surface of the first lead frame 100 by an insulating adhesive 330, and the light emitting diode chip 300 is connected to the first or second lead frames 100 and 200, respectively. 6 may be wire-bonded and electrically connected. As shown in FIG. 6, the center position of the light emitting diode chip 300 and the lens unit 500 accommodating the bonding wires 310 and 320 may be located at the position of the light emitting diode chip 300. Are combined correspondingly.

The heat flow of the light emitting diode chip 300 is transmitted from the light emitting diode chip 300 to the lower substrate (not shown), and a part of the heat flow is lowered from the light emitting diode chip 300 to the first lead frame 100. Since it is lowered to the side of the first lead frame 100 and flows to the lower side of the substrate (not shown) while flowing in a bypass to the side, the light emitting diode chip 300 when viewed from the aspect of improving the cooling efficiency It is preferable that the side flow is etched away from the insulating layer 400 which is not smooth by a predetermined distance.

When the light emitting diode chip 300 is spaced apart from the insulating layer 400 in which heat flow from the side surface is not smooth, the mounting position of the light emitting diode chip 300 is spaced apart from the insulating layer 400. The length of the wire 320 connecting the light emitting diode chip 300 and the second lead frame 200 increases, and in proportion thereto, the lens unit accommodating the light emitting diode chip 300 and the wire 320 ( 500) increases in size.

As shown in FIGS. 7 to 9, the horizontal portion 220 of the second lead frame 200 extends close to the light emitting diode chip 300, and the light emitting diode chip 300 and the horizontal portion 220 are disposed. By wire bonding, the length of the wires 310 and 320 accommodated in the lens unit 500 is shortened, thereby reducing the size of the lens unit 500 surrounding the light emitting diode chip 300 and the wires 310 and 320 around the production unit. Savings. One surface of the second lead frame perpendicular to the side surface of the first lead frame is coupled through the insulating layer 400, and the horizontal portion of the second lead frame opposite to the top surface 101 of the first lead frame is insulated from each other. The insulation is fixed by the coupling via the medium 230.

In addition, when the size of the lens unit 500 decreases to increase the open portions of the first or second lead frame upper surfaces 101 and 201, the lens unit 500 may be formed of the first and second lead frames 100 and 200 and the insulating layer ( Compared to the case where the upper part of the 400 is closed and molded, the upper surface 101 and 201 of the first or second lead frame is easily contacted with the atmosphere, thereby improving heat dissipation efficiency of the LED chip 300 through convection. .

Although not shown, grooves or protrusions are formed on the upper surfaces 101 and 201 to increase the contact area with the atmosphere, thereby further improving the cooling efficiency of the LED chip 300.

As shown in FIG. 10, one surface of the second lead frame 200 according to the third exemplary embodiment of the present invention is coupled to one surface of the first lead frame 100 having a plate shape through the insulating layer 400. The portion 220 of the second lead frame is spaced apart from the surface of the first lead frame by a predetermined distance and extends to the LED chip 300. The separation distance is to prevent an electrical short between the first lead frame 100 and the second lead frame 200 and the second lead frame 200 is separately insulated from the upper surface 101 of the first lead frame. It may be fixed by the lens unit 500 is fixed to the water 230 or molded on the upper surface (101).

Since the second lead frame 200 is bent in a L shape and fixed to be coupled to only a part of one side of the first lead frame 100, the sizes of the insulating layer 400 and the second lead frame 200 are reduced. It can reduce the production cost.

In addition, since the light emitting diode chip 300 is positioned at the center of the first lead frame 100, the heat generated from the light emitting diode chip 300 is not disturbed by the insulating layer 400, and thus the first lead frame 100 may be used. Since it flows along the side of the substrate and is evenly conducted to the lower substrate (not shown), the conduction speed of the heat flow is increased to improve the heat dissipation efficiency of the light emitting diode chip 300.

The present invention is not limited to the above embodiments, and many variations are possible by those skilled in the art within the spirit of the present invention.

As described above, the light emitting diode package and the method of manufacturing the same according to the present invention use a lead frame as a power supply terminal and a heat sink to simplify the structure of the light emitting diode package, thereby reducing production cost and simplifying the manufacturing process. There is an effect that mass production becomes easy.

In addition, by configuring the lead frame in a shape that facilitates thermal conduction on the substrate, the light emitting efficiency of the light emitting diode chip is increased.

Claims (10)

An insulating layer; A first lead frame formed in a plate shape, one side of which is fixed to one surface of the insulating layer, the bottom surface of the substrate being closely attached to the substrate, and connected to a circuit formed on the substrate; A second lead frame having one surface fixed to the other surface of the insulating layer and connected to the circuit; A light emitting diode chip mounted on an upper surface of the first lead frame and electrically connected to the first and second lead frames; It includes a lens unit for coupling to cover the light emitting diode chip, The bottom surface of the first lead frame has a larger surface area than the bottom surface of the second lead frame, A light emitting diode package that conducts and radiates heat generated from the light emitting diode chip to the substrate. The method of claim 1, The insulating layer is a light emitting diode package formed of an insulating adhesive material. The method of claim 1, A light emitting diode package having a step for preventing a short circuit is formed at an end portion of the first or second lead frame and the insulating layer. The method of claim 1, The light emitting diode chip is wire-bonded with the first and second lead frames and electrically connected thereto. The lens unit includes a lens provided with a cavity (cavity) therein and a transparent filling material filled in the cavity, The cavity accommodates the light emitting diode chip and the wire, The refractive index of the filler material is a light emitting diode package less than the refractive index of the lens. The method of claim 1, The light emitting diode chip is wire-bonded with the first and second lead frames and electrically connected thereto. The lens unit is formed to be molded while surrounding the light emitting diode chip. An insulating layer; Is formed in a plate shape is fixed to one side of the insulating layer on one side and the bottom surface is in close contact with the substrate, A first lead frame connected to a circuit formed on the substrate; A light emitting diode chip mounted on an upper surface of the first lead frame; A second lead frame having a vertical portion fixed to the other surface of the insulating layer, a horizontal portion insulated from the surface of the first lead frame and extending to approach the light emitting diode chip, and a bottom surface connected to the circuit; Connection connecting means for electrically connecting the light emitting diode chip to the first and second lead frames; The lens unit is coupled to cover the light emitting diode chip, The bottom surface of the first lead frame has a larger surface area than the bottom surface of the second lead frame, A light emitting diode package that conducts and radiates heat generated from the light emitting diode chip to the substrate. The method of claim 6, The lens unit includes a mounting area of the light emitting diode chip of the upper surface of the first lead frame to close a predetermined area, Part of the heat generated from the light emitting diode chip is emitted through the convection of the outside air in contact with the open upper surface of the first lead frame. The method of claim 6, A light emitting diode package having a groove or a protrusion formed on an open upper surface of the first lead frame to increase a contact area with outside air. The method of claim 6, The connection connecting means is a bonding wire, The lens unit is formed to be molded while surrounding the light emitting diode chip. Providing a second lead frame having a plate-shaped first lead frame and a bottom surface having a smaller surface area than a bottom surface of the first lead frame; Bonding the first and second leadframes to a strip at a predetermined interval; Injecting an insulating adhesive material between the gaps to fix the first and second lead frames to each other; Attaching a light emitting diode chip to an upper surface of the first lead frame; A method of manufacturing a light emitting diode package comprising wire bonding the light emitting diode chip to the first or second lead frame.

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