KR100714749B1 - Light emitting device package module and manufacturing method thereof - Google Patents

Abstract

The light emitting device package module according to an aspect of the present invention includes a metal substrate, a first insulating layer, a second insulating layer, a metal pattern layer, and a light emitting device. The metal substrate has a plurality of depressions having a flat bottom surface on a surface thereof, and each of the depressions has a trench formed along an edge of the bottom surface to surround the first metal portion and the trench. And a second metal portion outside the trench. The first insulating layer is formed by filling an insulating material in the trench and surrounds the first metal part to electrically separate the first metal part and the second metal part from each other. The second insulating layer includes a plurality of openings formed on the metal substrate and respectively formed to correspond to some bottom surfaces of the depressions. The metal pattern layer is formed on the second insulating layer. The light emitting device is disposed on the conductive metal pattern layer corresponding to the opening of the second insulating layer and is thermally connected to the first metal part. The light emitting device package module is excellent in heat dissipation characteristics and excellent in luminous efficiency and reliability.

Description

Light emitting device packaging module and method of manufacturing the same

1 is a perspective view showing a light emitting device package module according to an embodiment of the present invention.

FIG. 2 is a perspective cross-sectional view illustrating a light emitting device package module cut along the line II ′ of FIG. 1.

3 is a vertical cross-sectional view illustrating a light emitting device package module cut along the line II ′ of FIG. 1.

4 is a perspective view illustrating a portion of a portion 'A' of FIG. 1;

FIG. 5 is a perspective view illustrating a rear surface of the light emitting device package module shown in FIG. 4.

6 is an exploded perspective view illustrating a unit pixel structure of a light emitting device package module.

7 is a perspective view showing a light emitting device package module according to another embodiment of the present invention.

FIG. 8 is a perspective cross-sectional view illustrating a light emitting device package module cut along the line II-II ′ of FIG. 7.

FIG. 9 is a perspective view illustrating a second insulating layer formed on portion 'B' (unit pixel) of FIG. 7.

FIG. 10 is a cross-sectional view illustrating a metal pattern layer formed on a unit pixel of FIG. 8.

FIG. 11 is a cross-sectional view illustrating a light emitting device package module cut along the line II-II ′ of FIG. 7.

12 is a vertical cross-sectional view showing a light emitting device package module according to another embodiment of the present invention.

13 is a vertical cross-sectional view showing a light emitting device package module according to another embodiment of the present invention.

14 is a perspective view illustrating the light emitting device package module of FIG. 13.

15 is a cross-sectional view illustrating a method of manufacturing a light emitting device package module according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: metal substrate 120: first metal part

140: second metal part 220: first insulating layer

240: second insulating layer 300: metal pattern layer

350 and 370: sub metal pattern layer 420: conductive adhesive member

440: conductive ball 500: light emitting element

515: conductive wire 700: light emitting device package module

The present invention relates to a light emitting device package module and a method of manufacturing the light emitting device package module, and more particularly, to a light emitting device package and a light emitting device package module having excellent luminous efficiency and reliability.

In recent years, the amount of heat generated from the inorganic light emitting device has also increased rapidly in accordance with the trend of high power and high brightness of the inorganic light emitting device chip (LED chip). However, there is a problem that can lead to a sharp decrease in LED performance as the temperature rises.

In addition, in order to apply to a backlight, an illumination bulb, etc. of the liquid crystal display device, an LED array can be driven and a light and small package structure is required.

The present invention has been made in view of the above problems and needs, and provides a light emitting device package module that can easily emit heat to improve light emitting efficiency and reliability of a light emitting device.

The present invention also provides a manufacturing method that can improve the efficiency and economics of the manufacturing process of the light emitting device package module.

The light emitting device package module according to an aspect of the present invention includes a metal substrate, a first insulating layer, a second insulating layer, a metal pattern layer, and a light emitting device.

The metal substrate has a plurality of depressions having a flat bottom surface on a surface thereof, and each of the depressions has a trench formed along an edge of the bottom surface to surround the first metal portion and the trench. And a second metal portion outside the trench. The first insulating layer is formed by filling an insulating material in the trench and surrounds the first metal part to electrically separate the first metal part and the second metal part from each other. The second insulating layer includes a plurality of openings formed on the metal substrate and respectively formed to correspond to some bottom surfaces of the depressions. The metal pattern layer is formed on the second insulating layer. The light emitting device is disposed on the conductive metal pattern layer corresponding to the opening of the second insulating layer and is thermally connected to the first metal part.

The depression has a closed curve when viewed in plan.

The metal pattern layer includes a plurality of sub metal patterns electrically separated from each other and electrically connected to one light emitting device.

The light emitting device is coupled to the sub metal pattern by a conductive adhesive member.

The light emitting device includes an upper electrode and a lower electrode, and the upper electrode is electrically connected to any one adjacent sub metal pattern through a conductive wire.

Alternatively, the light emitting device includes both a first electrode and a second electrode on a surface thereof, and the first electrode and the second electrode each have a sub metal pattern below the light emitting device and any one sub adjacent to each other by conductive balls. It can be electrically connected to the metal pattern.

Meanwhile, the upper electrode of the light emitting device may be electrically connected to an adjacent sub metal pattern through a plurality of conductive wires.

The sub metal pattern may include a protruding pattern protruding from one side and an opening pattern extending inwardly from the other side. The opening pattern of the sub metal pattern is inserted to be electrically separated from the protruding pattern of any one of the adjacent sub metal patterns.

The upper electrode of the light emitting device may be electrically connected to the protrusion of the adjacent sub metal pattern through a conductive wire.

The light emitting device may include an organic light emitting device as well as an inorganic light emitting device.

The light emitting device package module may further include a heat dissipation member coupled to the lower surface of the metal substrate by an insulating adhesive member.

The light emitting device package module may include a light emitting device array in which a plurality of light emitting devices each expressing different colors are regularly arranged. In this case, it is preferable that the light emitting elements are electrically connected to each other in series between light emitting elements expressing the same color.

The metal pattern layer may be formed of a single metal layer or alternatively may include a plurality of metal layers different from each other.

In order to manufacture a light emitting device package module according to an aspect of the present invention, first, a surface of a metal substrate may be processed to form a plurality of depressions having a flat bottom surface on the metal substrate. A trench is formed in the metal substrate along an edge of the bottom surface. The trench is filled with an insulating material to form a first insulating layer having a horizontal cross section. An insulating material is applied and patterned on the metal substrate to form a second insulating layer having an opening that can expose a portion of the bottom surface. The lower surface of the metal substrate is polished to expose the first insulating layer. A metal material layer is deposited and patterned on the second insulating layer to cover the second insulating layer and the opening to form a metal pattern layer having a plurality of sub metal patterns electrically separated from each other. A light emitting device is disposed on the conductive metal pattern layer corresponding to the opening, and the light emitting device is thermally connected to at least a portion of the metal substrate surrounded by the first insulating layer. The light emitting device is electrically connected to another adjacent sub metal pattern. Thus, a light emitting device package module according to an embodiment of the present invention can be completed.

As described above, in the light emitting device package module according to the present invention, the heat generated from the light emitting device is intensively and efficiently discharged to the outside through the metal part surrounded by the first insulating layer because the first insulating layer is inserted into the metal substrate. Can be.

Accordingly, the light emitting device package module may prevent the function of the light emitting device from being degraded, thereby improving reliability and efficiency of the device.

Hereinafter, with reference to the accompanying drawings, it will be described in detail the present invention.

Light emitting device package module

1 is a perspective view showing a light emitting device package module according to an embodiment of the present invention. FIG. 2 is a perspective cross-sectional view illustrating a light emitting device package module cut along the line II ′ of FIG. 1. 3 is a vertical cross-sectional view illustrating a light emitting device package module cut along the line II ′ of FIG. 1.

1 to 3, the light emitting device package module 700 according to the present exemplary embodiment may include a metal substrate 100, a first insulating layer 220, a second insulating layer 240, and a metal pattern layer 300. And a light emitting device 500.

The metal substrate 100 is made of a metal material such as copper, aluminum having excellent thermal conductivity. A depression 50 is formed on the surface of the metal substrate 100. Each of the layers 240 and 300 formed on the metal substrate 100 is also stacked to maintain the structure of the depression 50. The depression 50 has a shape of a closed curve surrounded by a closed curve when viewed in a plan view.

The depression 50 has an edge 52 formed of a closed curve and a flat bottom surface 54 formed therein.

The first insulating layer 220 is formed in the metal substrate 100 corresponding to the edge 52. The first insulating layer 220 is formed by filling an insulating material in a trench formed in the metal substrate 100 corresponding to the edge 52.

The first insulating layer 220 includes a coating such as benzocyclobutene (BCB), spin on glass (SOG), polyimide, and the like, and an organic or inorganic material having excellent volatility.

The metal substrate 100 is divided into a first metal part 120 and a second metal part 140 by the first insulating layer 220. That is, the first metal part 120 is a part surrounded by the first insulating layer 220 and the second metal part 240 is a part located outside the first insulating layer 220. The first metal part 120 and the second metal part 140 are electrically separated from each other by the first insulating layer 220.

The first metal part 220 serves as heat dissipation for effectively dissipating heat generated from the light emitting device 500 to the outside.

The second insulating layer 240 is formed on the metal substrate 100. The second insulating layer 240 may include polyimide or a general photoresist (PR) material. As shown in FIG. 3, an opening 242 is formed in the second insulating layer 240. The opening 242 serves to expose at least a portion of the surface of the first metal portion 220. Therefore, heat generated in the light emitting device 500 may be effectively transferred to the first metal part 220 through the opening 242.

The metal pattern layer 300 is formed on the second insulating layer 240 to cover the second insulating layer 240 and the opening 242. The metal pattern layer 300 may be formed of a single metal layer. However, the metal pattern layer 300 includes two different metal layers, that is, the lower metal pattern layer 310 and the upper metal pattern layer 320. In general, the upper metal pattern layer 320 is made of a metal that prevents oxidation by external oxygen, moisture, or the like and has excellent light reflectance. The lower metal pattern layer 310 may be made of a multilayer metal material such as chromium, copper, or gold, and the upper metal pattern layer may be made of a metal material such as silver having excellent reflectance.

The metal pattern layer 300 functions not only as an electrode for supplying power to the light emitting device 500, but also as a reflecting plate for reflecting light generated from the light emitting device 500 to the front.

Referring back to FIG. 1, the metal pattern layer 300 includes a plurality of sub metal patterns 350 and 370 electrically separated from each other. One light emitting device 500 is disposed on the one sub metal pattern 350 and 370. That is, the sub metal patterns 350 and 370 correspond to unit pixels of the light emitting device package module. The sub metal patterns 350 and 370 are spaced apart from each other by a predetermined distance so as to be electrically separated from each other, and the second insulating layer 240 is exposed between the spaced spaces.

The light emitting device 500 disposed on the sub metal pattern 350 may be electrically connected to an adjacent sub metal pattern 370. Therefore, the sub metal patterns 350 and 370 may have various shapes of patterns for the electrical connection.

The light emitting device 500 may include an inorganic light emitting device (LED) or an organic light emitting device (OLED). The light emitting device 500 is formed on the metal pattern layer 300. Specifically, it is formed in one region of the metal pattern layer 300 corresponding to the opening 242 of the second insulating layer 240. Therefore, heat generated from the light emitting device 500 may be transferred to the outside through the opening 242. In the present embodiment, the light emitting device 500 is coupled on the metal pattern layer 300 by a conductive adhesive member 420. Since the conductive adhesive member 420 has electrical conductivity as well as adhesive performance, when the power is applied to the metal pattern layer 400 from the outside, the conductive adhesive member 420 functions as an electrical passage to supply power to the light emitting device 500. The conductive adhesive member 150 is made of a material such as PbSn, AuSn.

The light emitting device 500 transfers heat to the conductive adhesive member 420, and the transferred heat moves to the first metal part 120 via the metal pattern layer 300. The first metal part 120 emits the heat to the outside of the light emitting device 500.

Referring back to FIG. 2, the light emitting device 500 includes upper and lower electrodes formed on the upper and lower portions of the light emitting device 500, respectively, although not shown (vertical type). The lower electrode is electrically connected to the metal pattern layer 300 by the conductive adhesive member 420. In addition, the upper electrode is coupled to the conductive wire 515 and electrically connected to any other sub metal pattern adjacent thereto. That is, when the conductive wires 515 are connected, the light emitting device 500 and the light emitting devices of the adjacent sub metal patterns have an electrical series relationship.

As shown in FIG. 2, the sub metal pattern 370 includes a protruding pattern 372 protruding from one side and an opening pattern 374 extending in a predetermined distance from the other side.

The protruding pattern 372 is patterned to be inserted into the opening pattern of the adjacent sub metal pattern 350. However, the protruding pattern 372 and the opening pattern 374 are electrically separated from each other.

In the present embodiment, the upper electrode of the light emitting device 500 is electrically coupled to the protruding pattern of the adjacent sub metal pattern through the conductive wire 515.

4 is a perspective view illustrating a portion of a portion 'A' of FIG. 1; FIG. 5 is a perspective view illustrating a rear surface of the light emitting device package module shown in FIG. 4.

4 and 5, the first insulating layer 220 is exposed on the rear surface of the light emitting device package module. Therefore, the first insulating layer 220 may electrically separate the first metal part 120 and the second metal part 140.

6 is an exploded perspective view illustrating a unit pixel structure of a light emitting device package module.

Referring to FIG. 6, the unit pixel of the light emitting device package module has three layer structures including a metal substrate 100, a second insulating layer 240, and a metal pattern layer 300. Each of the layers 100, 240, and 300 are stacked to maintain a recessed structure.

The first insulating layer 220 is inserted into the metal pattern layer 300. An opening 242 is formed in the second insulating layer 240 to correspond to the light emitting device 500.

A transparency protective member 10 may be further formed on the light emitting device 500 to protect the light emitting device 500.

7 is a perspective view showing a light emitting device package module according to another embodiment of the present invention. FIG. 8 is a perspective cross-sectional view illustrating a light emitting device package module cut along the line II-II ′ of FIG. 7. FIG. 9 is a perspective view illustrating a second insulating layer formed on portion 'B' (unit pixel) of FIG. 7. FIG. 10 is a cross-sectional view illustrating a metal pattern layer formed on a unit pixel of FIG. 8. FIG. 11 is a cross-sectional view illustrating a light emitting device package module cut along the line II-II ′ of FIG. 7. Compared to the light emitting device package module of FIG. 1, the light emitting device package module according to the present exemplary embodiment may include a second insulating layer, a light emitting device, a metal pattern layer, and other components and structures except for a coupling relationship between the light emitting device and the metal pattern layer. Is the same. Therefore, the description of duplicate parts will be omitted and the same reference numerals will be used for the same components.

7 to 11, the light emitting device package module 1000 according to the present exemplary embodiment may include a metal substrate 100, a first insulating layer 220, a second insulating layer 250, and a metal pattern layer 600. And a light emitting element 520.

The metal pattern layer 600 includes a plurality of sub metal patterns 620 and 640 electrically separated from each other. Each sub metal pattern 620 and 640 corresponds to a unit pixel of the light emitting device package module 1000.

The light emitting device 520 has a structure in which both the first electrode 522 and the second electrode 544 are formed below.

The light emitting device 520 and the metal pattern layer 600 are electrically connected to each other by the conductive balls 440.

The first electrode 522 is electrically connected to the sub metal pattern 620 corresponding to the unit cell in which the light emitting device 600 is disposed, and the second electrode 544 is adjacent to another sub metal pattern ( 640 is electrically connected.

Referring to FIG. 9, a second insulating layer 250 is formed on the surface of the metal substrate 100. An opening 254 having a predetermined shape is formed in the second insulating layer 250. The opening 254 has a shape corresponding to the first electrode 522 of the light emitting device 600. Therefore, heat generated in the light emitting device 600 is transmitted through the conductive ball 440 connected to the first electrode 522, and the heat is again passed through the sub metal pattern 620 and the opening 254. The first metal part 120 of the metal substrate 100 is transferred. The heat transferred to the first metal part 120 is discharged to the outside.

On the other hand, a part of the heat generated from the light emitting device 600 is transferred to the adjacent sub metal pattern 640 through the conductive ball 440 connected to the second electrode 524 and the heat is again below the sub metal pattern 640. It is emitted to the outside through the first metal portion 120 of the.

By making the shape of the opening 254 the same as that of the heat generating portion, the efficiency of heat transfer can be optimized.

Referring to FIG. 10, the sub metal pattern 620 includes a protruding pattern 622 protruding from one side and an opening pattern 624 extending in a predetermined distance from the other side.

The protruding pattern 642 of the adjacent sub metal pattern is inserted into the opening pattern 624. However, the protruding pattern 642 and the opening pattern 624 are patterned to be spaced apart by a predetermined distance and are electrically separated from each other.

Referring to FIG. 11, in the light emitting device 500, two adjacent sub metal patterns 620 and 640 are electrically connected to each other through a first electrode and a second electrode, so that two light emitting devices 500 are adjacent to each other. ) Are electrically in series with each other.

In addition, heat generated from the light emitting device 500 may be efficiently discharged through the first metal parts 120 surrounded by the first insulating layer 220 formed under each of the sub metal patterns 620 and 640. .

In particular, since the first insulating layer 220 forms a closed curved surface, the heat dissipation path may be unified (the first metal part) to increase the heat transfer efficiency.

12 is a vertical cross-sectional view showing a light emitting device package module according to another embodiment of the present invention. The light emitting device package module according to the present embodiment is the same as the components and structure of the light emitting device package module of FIG. 1 except for the metal pattern layer and the electrical connection means of the light emitting device, compared to the light emitting device package module of FIG. 1. . Therefore, duplicate description of the same configuration and structure is omitted, and the same reference numerals are used for the same components.

12, the light emitting device 500 of the light emitting device package module 1100 according to the present exemplary embodiment includes a lower electrode and an upper electrode (not shown), and the upper electrode includes two conductive wires 517 and 518. Are electrically connected to adjacent metal pattern layers 820 and 840 by

As such, the electrical connection relationship between the light emitting devices may be various forms as seen in various embodiments.

Each of the light emitting devices 500 and 520 described in the above embodiments may have various arrangements on the light emitting device package module. In addition, the light emitting device package module may include heterogeneous light emitting devices expressing different colors.

In this case, various arrangements are possible, and the efficiency of driving the light emitting device may be improved by grouping the light emitting devices having the same color array and connecting them in series. In addition, the metal pattern layers may have various types of patterns to satisfy a required connection relationship.

13 is a vertical cross-sectional view showing a light emitting device package module according to another embodiment of the present invention. 14 is a perspective view illustrating the light emitting device package module of FIG. 13. The light emitting device package module according to the present embodiment is the same as the light emitting device package module of FIG. 1 except for further including an insulating adhesive member and a heat dissipation member. Therefore, duplicate descriptions will be omitted.

13 and 14, the light emitting device package module 1200 includes a light emitting unit 700 and a heat dissipation member 900. The light emitting unit 700 is coupled to the heat dissipation member 900 by an insulating adhesive member 30.

When the heat generated from the light emitting device 500 is discharged through the first metal part 120 of the metal substrate 100, the heat radiating member 900 effectively dissipates the heat to the outside. When heat is efficiently dissipated by the heat dissipation member 900, the heat transfer efficiency of the inside may also increase.

The heat dissipation member 900 has a repeated corrugated structure or uneven structure, so the surface area is very large. Therefore, the heat generating member 900 is excellent in the heat dissipation area can efficiently dissipate heat to the outside. A general heat sink and the like may be used as the heat radiation member.

As the insulating adhesive member 30, an adhesive material having excellent insulation and thermal conductivity may be used.

Hereinafter, a method of manufacturing the light emitting device package module will be described in detail.

Manufacturing method of light emitting device package module

15 is a cross-sectional view illustrating a method of manufacturing a light emitting device package module according to an embodiment of the present invention.

Referring to FIG. 15, the metal base material 90 is processed through an etching process or the like so that the depression 50 may be formed in the metal base material 90. A molding method may be used to form the depression 50 in the metal base material 90 (step A).

The depression 50 forms a closed curve when viewed on a plane. In addition, the edge portion 52 is formed along the shape of the bottom surface 54 of the depression 50.

The trench 105 is formed along the edge portion 52 of the metal base material 90 on which the depression 50 is formed. The trench 105 is formed to a depth of several hundred micrometers. The trench 105 may be formed using an etching process, a discharge process, a lithography process, or the like (step B).

The trench 105 has a horizontal cross section of a closed curve corresponding to the edge portion 52.

The trench 105 is filled with an insulating material to form a first insulating layer 220 (step C).

An additional insulating material is coated and patterned on the metal base 90 to cover the first insulating layer 220 to form a second insulating layer 240. The second insulating layer 240 has an opening 242 formed by a patterning process through a photo mask process or the like. The opening 242 exposes at least a portion of the surface of the metal base material 90 surrounded by the first insulating layer 220 (step D).

When the second insulating layer 240 is formed, the lower surface of the metal base material 90 is polished to expose a horizontal cross section of the first insulating layer 220. As a result, the metal substrate 100 is formed.

The first insulating layer 220 separates the metal substrate 100 into two regions. One area is the first metal part 120 surrounded by the first insulating layer 220 and the other area is the first metal part 140 positioned outside the first insulating layer 220. The first metal part 120 and the second metal part 140 are electrically separated from each other by the first insulating layer 220 (step E).

A metal material is deposited on the first insulating layer 240 to cover the first insulating layer 240 to form a metal material layer. The metal material layer may include a plurality of different metal layers (step F).

In this embodiment, different types of metal material layers are deposited and patterned on the first insulating layer 240 to form a metal pattern layer 300. The metal pattern layer 300 includes a lower metal pattern layer 310 and an upper metal pattern layer 320.

The metal pattern layer 300 includes a plurality of sub metal patterns 350 and 370 electrically separated from each other. One light emitting device is disposed on each of the sub metal patterns 350 and 370. That is, the sub metal patterns 350 and 370 correspond to unit pixels of the light emitting device package module (step G).

The light emitting device 500 is disposed on one sub metal pattern 350 of the metal pattern layer 350. The light emitting device 500 is bonded to and electrically connected to the metal pattern layer 350 by a conductive bonding member 420. The light emitting device 500 is formed in a region corresponding to the opening 242 of the second insulating layer 240. Therefore, the light emitting device 500 is thermally connected to the first metal part 120 of the metal substrate 100.

In the present embodiment, the light emitting device 500 includes a lower electrode and an upper electrode (not shown). The lower electrode is electrically connected to the metal pattern layer 350, and the upper electrode is electrically connected to any one of the adjacent sub metal patterns 370. Therefore, the light emitting device 500 may be electrically connected in series with another adjacent light emitting device. The upper electrode is electrically connected to the adjacent sub metal pattern 370 through the conductive wire 515. Although not shown, electrical connection may be made in various ways such as conductive balls.

Thus, the light emitting device package module according to one embodiment of the present invention is completed.

In the light emitting device package module according to the present invention, an insulating material surrounds a portion of the lower metal substrate, thereby effectively dissipating heat generated from the light emitting device through the enclosed metal portion.

Therefore, the light emitting device package module can prevent functional damage such as brightness reduction of the light emitting device due to heat generation, and thus has excellent reliability and efficiency.

In addition, since the metal pattern layer includes a plurality of sub-metal patterns electrically separated from each other, various arrangements of the light emitting devices are possible, and further, various electrical connection relationships may be configured.

In relation to the manufacturing method, unlike a conventional packaging method in which a single package manufactured in advance is installed on a printed circuit board (PCB) having a conductive pattern, a process cost may be reduced by directly installing a light emitting device in a modular package.

In addition, it is possible to finely form the electrode having a variety of patterns to directly bond the light emitting device of the flip chip type without submount (submount) can reduce the bonding material by using the submount, further reducing the production cost and productivity Improvement is expected.

 Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

Claims (16)

A plurality of depressions having a flat bottom surface are formed on a surface thereof, and each of the depressions has a trench formed along an edge of the bottom surface, and includes a first metal part surrounded by the trench and a first outer portion of the trench. A metal substrate comprising two metal parts; A first insulating layer formed by filling an insulating material in the trench and surrounding the first metal part to electrically separate the first metal part and the second metal part from each other; A second insulating layer formed on the metal substrate and including a plurality of openings respectively formed to correspond to some bottom surfaces of the depressions; A metal pattern layer formed on the second insulating layer; And And a plurality of light emitting devices disposed in a portion of the metal pattern layer corresponding to the opening of the second insulating layer and thermally connected to the first metal part. The light emitting device package module of claim 1, wherein the depression has a closed curved surface when viewed in a plan view. The light emitting device package module of claim 1, wherein the metal pattern layers include a plurality of sub metal patterns electrically separated from each other and electrically connected to one light emitting device. The light emitting device package module of claim 3, wherein the light emitting device is coupled to the sub metal pattern by a conductive adhesive member. The light emitting device package module of claim 4, wherein the light emitting device comprises an upper electrode and a lower electrode, and the upper electrode is electrically connected to any one of the adjacent sub metal patterns through a conductive wire. 4. The light emitting device of claim 3, wherein the light emitting device includes both a positive electrode and a negative electrode on a surface thereof, and each of the positive electrode and the negative electrode is formed by a conductive ball and a submetal pattern below the light emitting device and any one submetal adjacent thereto. Light emitting device package module, characterized in that electrically connected to the pattern. The light emitting device of claim 4, wherein the light emitting device includes an upper electrode and a lower electrode, the lower electrode is electrically connected to a sub metal pattern under the light emitting device, and the upper electrode is formed of a plurality of conductive parts in an adjacent sub metal pattern. Light emitting device package module, characterized in that electrically connected through a wire. The light emitting device package module of claim 5, wherein the sub metal pattern includes a protruding pattern protruding from one side and an opening pattern extending inwardly from the other side. The light emitting device package module according to claim 8, wherein the protruding pattern of any one adjacent sub metal pattern is inserted into the opening pattern of the sub metal pattern in an electrically separated state. The light emitting device package module of claim 9, wherein the upper electrode of the light emitting device is electrically connected to the protrusions of the adjacent sub metal patterns through a conductive wire. The light emitting device package module according to claim 1, wherein the light emitting device comprises an organic light emitting device. The method of claim 1, wherein the light emitting device package module, And a heat dissipation member coupled to the lower surface of the metal substrate by an insulating adhesive member. The light emitting device package module according to claim 1, wherein the light emitting device package module includes a light emitting device array in which a plurality of light emitting devices each of which displays different colors are arranged regularly. The light emitting device package module according to claim 13, wherein the light emitting devices are electrically connected in series between light emitting devices having the same color. The light emitting device package module of claim 1, wherein the conductive metal pattern layer comprises a plurality of metal layers different from each other. Patterning a surface of the metal substrate to form a plurality of depressions having a flat bottom surface on the surface of the metal substrate; Forming a trench along an edge of the bottom surface; Filling an insulating material in the trench to form a first insulating layer having a horizontal cross-section with a closed curve; Applying and patterning an insulating material on the metal substrate to form a second insulating layer having an opening that can expose a portion of the bottom surface; Polishing a bottom surface of the metal substrate to expose the first insulating layer; Depositing and patterning a metal material on the second insulating layer to cover the second insulating layer and the opening to form a conductive metal pattern layer having a plurality of sub metal patterns electrically separated from each other; Disposing a light emitting device on the conductive metal pattern layer corresponding to the opening such that the light emitting device is thermally connected to at least a portion of the metal substrate surrounded by the first insulating layer; And And electrically connecting the light emitting device to another adjacent sub metal pattern.

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