KR100698926B1 - 기판 코팅 장치 - Google Patents
기판 코팅 장치 Download PDFInfo
- Publication number
- KR100698926B1 KR100698926B1 KR1020050111629A KR20050111629A KR100698926B1 KR 100698926 B1 KR100698926 B1 KR 100698926B1 KR 1020050111629 A KR1020050111629 A KR 1020050111629A KR 20050111629 A KR20050111629 A KR 20050111629A KR 100698926 B1 KR100698926 B1 KR 100698926B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- drying unit
- slit nozzle
- photoresist
- coating apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 103
- 239000011248 coating agent Substances 0.000 title claims abstract description 51
- 238000000576 coating method Methods 0.000 title claims abstract description 49
- 238000001035 drying Methods 0.000 claims abstract description 73
- 239000002904 solvent Substances 0.000 claims abstract description 33
- 238000002347 injection Methods 0.000 claims abstract description 17
- 239000007924 injection Substances 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000001704 evaporation Methods 0.000 claims abstract description 13
- 238000007599 discharging Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims 3
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 128
- 239000007789 gas Substances 0.000 description 32
- 238000000034 method Methods 0.000 description 13
- 230000008020 evaporation Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- 239000003570 air Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
- B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (12)
- 기판 코팅 장치에 있어서,기판 위에 설치되어 기판과 상대 이동하고 상기 기판에 코팅제를 토출하는 토출구가 횡방향으로 길게 형성된 슬릿 노즐과,상기 슬릿 노즐을 따라 이동하며 슬릿 노즐에 의해 토출된 코팅제 내에 포함된 용제를 증발시키기 위한 건조 유닛과,상기 건조 유닛을 따라 이동하며 증발된 용제를 흡입하는 흡입 유닛을 포함하는 것을 특징으로 하는 기판 코팅 장치.
- 청구항 1에 있어서, 상기 건조 유닛은 기판 상에 도포된 코팅제를 향하여 형성된 분사구를 포함하여, 상기 건조 유닛은 상기 분사구를 통하여 고온의 가스를 상기 도포된 코팅제에 분사하는 것을 특징으로 하는 기판코팅 장치.
- 청구항 2에 있어서, 상기 고온의 가스가 유동하는 건조 유닛의 내부는 단열처리된 것을 특징으로 하는 기판 코팅 장치.
- 청구항 2에 있어서, 상기 건조 유닛 내에는 가열 수단이 구비된 것을 특징으로 하는 기판 코팅 장치.
- 청구항 4에 있어서, 상기 가열 수단은 그물 또는 코일 형상으로 형성된 열선 을 포함하는 것을 특징으로 하는 기판 코팅 장치.
- 청구항 1에 있어서, 상기 건조 유닛은 기판 상에 도포된 코팅제를 향하여 마련된 가열 수단을 포함하는 것을 특징으로 하는 기판 코팅 장치.
- 청구항 2 내지 청구항 5 중 어느 한 항에 있어서, 상기 분사구는 하나 이상의 슬릿, 노즐 중 어느 하나로 구성되는 것을 특징으로 하는 기판 코팅 장치.
- 청구항 1 내지 청구항 6 중 어느 한 항에 있어서, 상기 건조 유닛은 상기 슬릿 노즐과 일체로 형성된 것을 특징으로 하는 기판 코팅 장치.
- 청구항 8에 있어서, 상기 건조 유닛과 슬릿 노즐 사이는 단열처리된 것을 특징으로 하는 기판 코팅장치.
- 청구항 1에 있어서, 상기 흡입 유닛은 진공펌프에 연결되어 부압에 의해 증발된 용제를 흡입하는 것을 특징으로 하는 기판 코팅장치.
- 청구항 1에 있어서, 상기 흡입 유닛은 상기 건조유닛 및 슬릿 노즐과 일체로 형성된 것을 특징으로 하는 기판 코팅 장치.
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050111629A KR100698926B1 (ko) | 2005-11-22 | 2005-11-22 | 기판 코팅 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050111629A KR100698926B1 (ko) | 2005-11-22 | 2005-11-22 | 기판 코팅 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100698926B1 true KR100698926B1 (ko) | 2007-03-23 |
Family
ID=41564270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050111629A Expired - Fee Related KR100698926B1 (ko) | 2005-11-22 | 2005-11-22 | 기판 코팅 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100698926B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100953850B1 (ko) | 2007-07-24 | 2010-04-20 | 도오꾜오까고오교 가부시끼가이샤 | 도포 장치 및 도포 방법 |
KR20210002157A (ko) * | 2019-06-26 | 2021-01-07 | 세메스 주식회사 | 기판 코팅 장치 |
CN113751230A (zh) * | 2020-06-02 | 2021-12-07 | 细美事有限公司 | 用于处理基板的方法和装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960007186A (ko) * | 1994-08-10 | 1996-03-22 | 미따라이 하지메 | 잉크 제트 인쇄 방법 및 장치 |
KR19990000033A (ko) * | 1997-06-02 | 1999-01-15 | 구자홍 | 산란층을 구비한 액정표시소자 및 그 제조방법 |
KR20040036534A (ko) * | 2002-10-25 | 2004-04-30 | 동경 엘렉트론 주식회사 | 레지스트 도포방법 및 레지스트 도포장치 |
KR20050019767A (ko) * | 2002-06-19 | 2005-03-03 | 가부시키가이샤 리코 | 화상처리장치, 화상형성장치, 프린터 드라이브,화상처리방법 및 컴퓨터 판독가능 저장 매체 |
-
2005
- 2005-11-22 KR KR1020050111629A patent/KR100698926B1/ko not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960007186A (ko) * | 1994-08-10 | 1996-03-22 | 미따라이 하지메 | 잉크 제트 인쇄 방법 및 장치 |
KR19990000033A (ko) * | 1997-06-02 | 1999-01-15 | 구자홍 | 산란층을 구비한 액정표시소자 및 그 제조방법 |
KR20050019767A (ko) * | 2002-06-19 | 2005-03-03 | 가부시키가이샤 리코 | 화상처리장치, 화상형성장치, 프린터 드라이브,화상처리방법 및 컴퓨터 판독가능 저장 매체 |
KR20040036534A (ko) * | 2002-10-25 | 2004-04-30 | 동경 엘렉트론 주식회사 | 레지스트 도포방법 및 레지스트 도포장치 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100953850B1 (ko) | 2007-07-24 | 2010-04-20 | 도오꾜오까고오교 가부시끼가이샤 | 도포 장치 및 도포 방법 |
KR20210002157A (ko) * | 2019-06-26 | 2021-01-07 | 세메스 주식회사 | 기판 코팅 장치 |
KR102292367B1 (ko) * | 2019-06-26 | 2021-08-23 | 세메스 주식회사 | 기판 코팅 장치 |
CN113751230A (zh) * | 2020-06-02 | 2021-12-07 | 细美事有限公司 | 用于处理基板的方法和装置 |
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Comment text: Notification of reason for refusal Patent event date: 20061109 Patent event code: PE09021S01D |
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Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20070315 |
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Comment text: Registration of Establishment Patent event date: 20070316 Patent event code: PR07011E01D |
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