KR100696835B1 - Plasma Display Device Having Resin Layer Chassis Base - Google Patents

Abstract

The present invention provides a plasma display panel including two substrates, a partition wall, a driving electrode, a phosphor, a discharge gas, and the like, a circuit portion for generating a driving signal on the driving electrode, and a chassis for supporting the circuit portion and the panel. In the display device, the chassis base forming the main body of the chassis is basically provided with a resin layer, and holes or grooves are formed in the resin layer. In this case, the hole or the groove may be formed to connect at least two sides of the up, down, left and right sides based on the screen direction.

Therefore, when using the chassis base with less heat transfer, it is possible to smoothly play a role of collecting ambient heat and emitting it to the atmosphere.

Description

Plasma display device having a resin layer chassis base {Plasma display device including chassis of resin layer}

1 and 2 are schematic side and perspective views illustrating a chassis in which a conventional plasma display device is installed.

3 and 4 are a perspective view, a partial perspective view schematically showing the concept of hole or groove formation in the embodiment of the plastic chassis base of the present invention;

5 is a cross-sectional view of the hole in a cross section perpendicular to the longitudinal direction in which the hole is formed in the embodiments of the present invention;

FIG. 6 is a partial perspective view illustrating a form in which an aluminum tube is inserted into a chassis base round hole in an embodiment of the present invention; FIG.

7 is a partial perspective view illustrating a form in which an intermediate connection hole is formed toward the rear surface of the chassis base in the middle of the hole in one embodiment of the present invention;

Figure 8 is a partial perspective view showing that a hole connecting the upper side and the left and right side is formed in one embodiment of the present invention,

FIG. 9 is an exploded perspective view illustrating a state in which a panel, a protection circuit board, and a chassis in which a plurality of circular holes are formed are coupled in an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

10,710: Panel 20: double sided tape

25: heat transfer medium 30,730: chassis base

31,731: Boss 40,740: Circuit Board

133,336,337,338,437,533,636: Hall 235: Home

4371: aluminum tube 534: intermediate connection hole

The present invention relates to a plasma display device, and more particularly, to a plasma display device to which a chassis base made of a resin material is applied.

Plasma display devices include a plasma display panel (PDP), which forms a partition wall between two substrates facing each other, an electrode for discharge, and is formed by injecting a discharge gas thereinto and sealing the plasma substrate. It refers to a flat panel display device using a).

Since the plasma display device can be thin, it is suitable for realizing a light large screen with a relatively small volume. In addition, since the plasma display device is driven by a passive matrix method, it is not necessary to form active elements such as thin film transistors. Since the plasma display device is a self-luminous method, the plasma display device has a general characteristic of wide viewing angle and high luminance.

The plasma display device is formed by forming a plasma display panel and installing elements necessary for screen realization, such as a driving circuit unit connected to each electrode of the panel. On the other hand, since the panel is a form in which two glass substrates are combined, it is difficult to directly attach the driving circuit unit to the panel, and there is a high risk of damage during the process or use. Thus, the panel is stably fixed to a separate frame or chassis, and most drive circuits are mounted to the rear of the chassis to connect with the panel electrodes.

Conventional chassis is formed by attaching various types of reinforcement to the metal plate called the chassis base, or by bending the periphery of the chassis base itself to form the reinforcement. In general, the chassis base is formed of iron or aluminum to secure strength, and the chassis base serves as a heat sink and a ground base in the plasma display device.

As the size of the plasma display device continues to increase, the weight of the metal chassis base used in the chassis increases, and the cost of forming the same increases. In order to achieve low power, high quality, and low weight, the chassis is required to be thinner and lighter as a quality improvement task for securing marketability of the plasma display device.

However, there is a limitation in forming a thin metal plate constituting the chassis base to perform a necessary function such as a frame for installing a panel and a protective circuit board. Therefore, to cope with future demands on the chassis, a method of forming the chassis base from a resin material such as plastic has been studied.

In order to use the chassis base of the plasma display device as a resin material, a configuration such as replacing a conventional metal chassis base with a resin material plate in the form of an injection molded product and installing a boss for installing a circuit board together is considered. However, in such a configuration, the chassis base has many aspects of merely changing an existing metal plate to a resin plate.

1 and 2 are schematic perspective and side cross-sectional views showing a form in which such a resin chassis base is combined with a panel and a driving circuit portion.

As shown, the chassis base 30 formed of a resin material is attached to the panel by an adhesive means such as a double-sided tape 20 provided around the panel 10. A heat transfer medium 25 is installed between the panel and the chassis base 30 to attach to the back of the panel.

The back of the chassis base 30 is provided with a circuit board 40 that forms a driving circuit portion through a boss 31 or the like provided on the chassis base. Although not shown, an electrical connection is made between each electrode terminal of the panel and the terminals of the driving circuit unit through a connecting means such as a tape carrier package (TCP), a flexible printed circuit (FPC), or the like.

However, since the plastic is not a heat transfer material, even when the back surface of the heat transfer medium is in contact with or adjacent to the plastic chassis base, the chassis base receives heat from the panel and releases the heat to the outside, thereby hardly cooling the panel. Rather, the chassis base may block the heat dissipation of the panel, making it difficult to dissipate heat. The plastic chassis base must be very thin in order to be able to receive heat from the heat transfer medium and release heat well to the outside. In this case, there is a risk that the chassis will not hold enough mechanical strength to support the panel well and protect the panel from external impacts. Therefore, there is a need for suitable means for dissipating the heat of the panel to the outside.

In addition, the chassis is required to efficiently perform the role of receiving heat from heat sources such as TCP or other driving circuit parts and discharging it to the outside, like a conventional metal chassis.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display device having a resin layer chassis base configured to receive heat from the surroundings and to release heat to the outside.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display device employing a resin layer chassis base having, in one aspect, a heat dissipating function and a structure capable of increasing its mechanical strength against external forces.

An object of the present invention is to provide a plasma display device employing a resin layer chassis base having a configuration capable of preventing noise or vibration of a panel or a circuit portion from diffusing to surroundings or causing resonance.

In order to achieve the above object, the present invention provides a plasma display panel (hereinafter simply referred to as “panel”) comprising two substrates, a partition, a driving electrode, a phosphor, and a discharge gas, and a driving signal to the driving electrode. In the plasma display device comprising a circuit portion for generating a circuit and a chassis for supporting the circuit portion and the panel, the chassis base constituting the main body of the chassis is basically provided with a resin layer, and holes or grooves are formed in the resin layer. It features. At this time, the hole or the groove may be made to connect at least two sides of the upper, lower, left and right sides based on the screen direction, and basically provided with a resin layer is mainly made of a resin layer, but the metal mesh or metal plate is installed inside or outside It does not exclude being.

In the present invention, the hole or the groove may be formed long in the longitudinal direction with respect to the screen, and the hole or the groove may be additionally provided with a member having excellent heat transfer capability such as a metal pipe or a heat pipe. At this time, these pipes may be installed in the chassis base by the insert injection method while forming the chassis base by injection molding.

On the other hand, the chassis base may be formed with an intermediate connection hole connected to the middle of the path of the hole connecting the two sides. For example, the intermediate connection hole may be formed to branch to the rear side of the chassis base or to the left and right side in the middle of the hole formed in the longitudinal direction connecting the upper and lower sides of the chassis base.

In addition, in the present invention, the groove may be formed such that the inlet is directed toward the side with the panel or the opposite side with respect to the chassis base in a cross section perpendicular to the direction in which the groove is formed, and the jaw at the inlet is narrower than the width inside the groove. It may have a form.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

3 and 4 are perspective and partial perspective views schematically illustrating the concept of hole or groove formation in the embodiment of the plastic chassis base of the present invention. Here, the chassis base is represented with the bosses attached to the protection circuit portion or other members attached to the chassis base omitted. A hole 133 or a groove 235 is formed in the resin layers constituting the chassis bases 130 and 230 in the vertical direction to connect the upper and lower sides thereof.

The groove 235 of FIG. 4 is substantially the same shape as the hole 133 of FIG. 3, and a part of the rear side of the wall of the chassis base 230 forming the hole is open. Therefore, if the horizontal section perpendicular to the longitudinal direction of the groove 235 is simulated, the jaw is formed in the entrance toward the rear surface of the groove 235 naturally.

When viewed from the horizontal cross-section, when the inlet of the groove 235 is directed toward the front substrate, heat can be easily transferred from the heat transfer medium to facilitate heat dissipation on the panel side. Usually, since the space is exposed on the back side where the driving circuit part is formed, heat radiation is easily conducted in the air without using the hole 133 or the groove 235. Therefore, the groove 235 is preferably formed so that the inlet facing the front side. The groove 235 directly communicates with only a portion of the heat transfer medium (not shown). However, if the heat transfer medium is a material having high lateral thermal conductivity such as graphite or metal, the temperature difference problem of the panel due to partial heat dissipation does not occur.

5 is a cross-sectional view of the hole in a cross section perpendicular to the longitudinal direction in which the hole is formed.

In FIG. 5, the holes 336, 337 and 338 are in the form of rectangles, circles, ellipses or tracks. The shape of these holes can be selected as needed when forming the chassis base. When the resin layer chassis base is formed by injection molding, if the resin layer has grooves, the molding becomes difficult, so that the cross-sectional shape of the hole may be determined in consideration of difficulty.

6 illustrates a circular hole 437 formed in the chassis base 430 and an aluminum tube 4371 inserted into the circular hole 437 in the embodiment of the present invention. The aluminum tube 4371 may be installed together during the injection molding of the chassis base 430. In this embodiment as well, the air layer causes convection through the holes 437 to take heat away from the periphery of the holes 437 to facilitate heat dissipation. At the same time, the aluminum tube 4371 is a heat transfer conductor, and thus serves to transfer heat to the convective air in the hole 437 more easily around the hole. When the temperature is partially high, the heat transferred there is spread through the aluminum tube 4371 itself to the inner wall of the tube. Therefore, the heat transfer to the air can be made with time over a large area of the entire aluminum tube 4371, and the heat transfer efficiency to the air can also be increased.

In some cases, similarly to the embodiment of FIG. 6, a heat pipe may be provided in a groove or a hole formed in the chassis base, and a heat radiation structure may be used for heat radiation. Pipes, which are heat transfer conductors installed in grooves or holes, may act to prevent deformation due to external force of the entire chassis base by its mechanical strength. It can also serve as a shield to save material, reduce chassis base weight, and create space to prevent vibration and noise from being transmitted.

Meanwhile, an intermediate connection hole may be formed in the resin layer chassis base in the middle of a path of a hole connecting at least two sides of the top, bottom, left, and right sides of the screen, excluding the back and the front, based on the screen. For example, as illustrated in FIG. 7, the intermediate connection hole 534 may be formed to branch toward the rear surface of the chassis base 530 in the middle of a hole 533 formed in the longitudinal direction connecting the upper and lower sides of the chassis base 530. The inlet of the intermediate connection hole 534 may be formed around a driving circuit element that emits a lot of heat in the back of the chassis base, a converter of a power board, and the like.

8 illustrates an embodiment in which holes 633 and 636 connecting upper and left and right sides are formed. In this embodiment the inlet through which the cooling convection air is introduced is on the left or right side of the chassis base and the outlet is on the upper side of the chassis base. Although not shown in the drawing, there may be a portion of the lower side of the chassis base 630 that emits a large amount of heat, such as a chip portion of a tape carrier package TCP that applies a voltage signal to an address electrode among electrodes for discharging the plasma display device. . In this case, the incoming air itself may already receive a lot of heat from the chip in TCP and may not be suitable for cooling other parts. In this case, the hole inlet is formed on the left and right sides of the chassis base 630 so that air of a relatively low temperature is introduced to increase the cooling efficiency.

Although not shown, it is possible to form holes in the chassis base in many other forms. For example, the exit of the hole may be formed on the left and right sides, and the entrance of the hole may be formed on the lower side. In this case, all the heat generated in the plasma display device may be discharged to the upper side of the device to reduce the problem that may be present. For this configuration, it may be desirable to form the heat dissipation holes on the left and right sides of the outer case of the plasma display device.

9 is a schematic perspective view illustrating an exploded perspective view of a plasma display device according to an exemplary embodiment of the present invention.

The plasma display apparatus according to the present exemplary embodiment includes a panel 710, a heat conductive sheet 725 (heat transfer medium), an adhesive member 720, a plastic chassis base 730, and a circuit board 740.

The panel 710 may include, for example, a front substrate 712 having a plurality of scan electrodes and sustain electrodes formed therebetween, a plurality of address electrodes formed in a direction crossing the electrodes of the front substrate, and the front substrate 712. It may have a lower substrate including the formed phosphor layer. A partition wall is formed between the front substrate 712 and the rear substrate 714 for partitioning the discharge cells, and the internal space is filled with a gas capable of increasing the discharge efficiency in a state where air is removed.

Thermal Spreader Sheet (TSS) 725 is inserted between the panel 710 and the plastic chassis base 730 to transfer heat generated from the panel 710 evenly in the plane direction when the plasma display device is driven. The heat radiation prevents the temperature of the panel 4 from rising sharply. The thermal conductive sheet 725 serves to transfer the heat of the panel 710 between the panel 710 and the chassis base 730 to the air layer in the hole 733 of the present invention via the chassis base 730.

The adhesive member 720 is formed in a band shape at the edge of the panel 710 to fix the thermal conductive sheet 725 to the plastic chassis base 730. An adhesive, an adhesive sheet, and an adhesive tape may be used as the adhesive member 720.

When the embodiment of FIG. 9 is compared with the conventional example of FIG. 1, a large number of holes 733 are formed in the chassis base 730. The chassis on which the chassis base 730 is centered basically fixes the panel 710 or the thermal conductive sheet 725 with the adhesive member 720, and also the panel 710, the tape carrier package (not shown), and the circuit board. It receives heat from 740 and delivers it to the air passing through the hole 733. The plastic chassis base 730 supports and fixes various printed circuit boards 740 of the driving circuit unit by fastening means such as a boss 731 and a screw. A ground plate for connecting ground powers of the respective driving circuit units may be fixed to the plastic chassis base, and the resin layer of the chassis base may include a metal mesh or a thin metal plate for grounding, or a heat sink may be installed outside.

The circuit board 740 forms a driving circuit unit for driving the PDP. The driving circuit unit may include a power supply unit for supplying power, an address driver unit for supplying a driving signal to the electrodes of the panel, a scan driver unit, a sustain driver unit, and a logic substrate on which control circuits such as a timing controller are formed. In addition, the address driver, the scan driver, and the sustain driver may include a flexible printed cable (or flexible printed cable (FPC)) or a carrier package (Tape Carrier Package (TCP)) in which a driving chip is mounted. Connected with

Each driving unit of the driving circuit unit, that is, the address driving unit, the scan driving unit, and the sustain driving unit includes a separate power supply module (IPM). The power supply module converts the power supplied from the power supply into signal voltages that can be supplied to the respective electrodes under the control of the respective drive units. That is, the power supply module mounted in the address driver generates an address signal supplied to the address electrode under the control of the address driver and the timing controller.

According to the present invention, the holes or the grooves are formed in the chassis base to increase the efficiency of dissipating heat generated in the surroundings through air convection.

In addition, in the case of installing a pipe which is a good conductor of heat provided in a groove or a hole of the present invention, the pipe may serve to prevent deformation due to external force of the entire chassis base by the mechanical strength of the pipe itself.

In addition, to create a hollow space in the chassis base for the groove or hole installation to save material, reduce the weight of the chassis base, it can also serve as a shield to prevent the transmission of vibration or noise by forming a space.

Claims (11)

A plasma display panel including a partition wall partitioning discharge cells between two substrates, a driving electrode for generating discharge in the discharge cells, a phosphor, and a discharge gas; A driving circuit unit generating a driving signal to the driving electrode of the plasma display panel; A plasma display device comprising a plasma display panel and a chassis for supporting the circuit unit. The chassis includes a chassis base having a plate-shaped body to which the plasma display panel is attached, wherein the chassis base is basically provided with a resin layer, and the resin layer has holes or grooves formed therein. Device. The method of claim 1, And the holes or the grooves connect at least two side surfaces of front, rear, left, and right sides of the chassis base. The method of claim 2, And the hole or the groove is formed in the longitudinal direction with respect to the plasma display panel. The method of claim 2, And a metal pipe or a heat pipe is installed in the hole or the groove. The method of claim 4, wherein Wherein the metal pipe or the heat transfer pipe is installed in the chassis base by an insert injection method while forming the chassis base by injection molding. The method of claim 2, And an intermediate connection hole formed in the chassis base and connected to the middle of the path of the hole. The method of claim 6, And the intermediate connection hole is formed on at least one of a rear surface of the chassis base and left and right side surfaces of the chassis base. The method of claim 2, And one end of the hole is located on one of the left and right sides of the chassis base, and the other end is formed on the lower side of the chassis base. The method of claim 2, And the hole is formed such that a cross section cut perpendicular to the direction in which the hole is formed forms one of an ellipse, a circle, and a rectangle. The method of claim 2, And the groove is formed such that an entrance thereof faces toward the side of the plasma display panel in a cross section perpendicular to the longitudinal direction in which the groove is formed. The method of claim 2, And the groove is formed to have a jaw at the entrance in a cross section cut perpendicular to the longitudinal direction in which the groove is formed.

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