KR100688626B1 - LED package and backlight unit using same - Google Patents

Abstract

The present invention relates to a package for a light emitting diode and a backlight unit using the same, wherein a metal housing accommodating the light emitting diode is formed of a material such as copper having a relatively high thermal conductivity, and has a larger area on the lower surface of the metal housing than the metal housing. A heat sink is joined, and the inside and the outside of the metal housing communicate with the through hole, and a heat spreader and an expansion heat sink having higher heat conduction efficiency are further attached to the heat sink, or the heat spreader or cooling fins are integral to the metal housing. It is bonded to the to improve the cooling efficiency of the metal housing is to be able to emit light with a higher efficiency light emitting diode accommodated in the metal housing.

LED package, backlight unit

Description

LIGHT EMITTING DIODE PACKAGE AND BACK LIGHT UNIT USING IT}

1 is a partially cutaway perspective view of a light emitting diode package according to the present invention;

2 is a cross-sectional view of a light emitting diode package according to the present invention;

3A is a perspective view of a light emitting diode package heat spreader according to the present invention;

3B is a perspective view of the LED package heat sink according to the present invention;

4A and 4B are perspective views of a light emitting diode package and a heat sink according to the present invention;

5 and 7 are perspective views of the backlight unit according to the present invention,

6 is a cross-sectional view of the backlight unit according to the present invention;

8 and 9 are perspective views of a backlight unit according to another embodiment of the present invention.

<Description of Major Symbols in Drawing>

10-Light Emitting Diode Package 11-Backlight Unit

12-Circuit Board 20-Light Emitting Diode

30-metal housing 31-side wall

32-Bottom Wall 33-Slope

34-Lens mounting recess 35-Through hole

40-Lens 50-Metal Lead

51-insulation 60-heat sink

61-Heat spreader 62-Expansion heat sink

63-Cooling fin 64-Spacer member

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package and a backlight unit using the same to discharge and cool heat generated from the light emitting diode to the outside of the light emitting diode package.

In general, a light emitting diode (LED) generates light using an electric field emission phenomenon generated by applying a voltage to a semiconductor. Recently, a light emitting diode is used as a backlight unit of a liquid crystal display (LCD). The used one is widely used.

The light emitting diode is an all-light conversion semiconductor device having a structure in which a p-type semiconductor crystal and an n-type semiconductor crystal are bonded to each other, and are used as various display light source devices because of the property of converting an electrical signal into light.

The light emitting diode is a compound semiconductor formed by combining Group III (Al, Ga, In) and Group V (As, P, N, Sb) elements on the periodic table. The wavelength of light varies depending on the material.

In addition, the light efficiency of the light emitting diode is determined by the reflective structure of the package, and the reliability is determined by the ability of heat dissipation from the lead frame structure including the package.

Here, the structure of the light emitting diode and the light emitting diode package is disclosed in Korea Patent Publication No. 10-2004-98191 (light emitting diode and its package structure and manufacturing method) or Korea Utility Model Publication No. 20-370479 (structure of the light emitting diode) As disclosed, a reflector is mounted on an upper end of the base layer, a light emitting diode is installed on an upper end of the reflector, and wires are connected to both ends of the light emitting diode, and are extended outwards to be connected to an external electrode. It is common to consist of a lens overlaid on top.

However, the conventional light emitting diode package as described above has a limited structure capable of effectively dissipating heat generated from the light emitting diode composed of the semiconductor, thereby causing damage and malfunction of other components due to heat generation of the light emitting diode. there was.

In addition, in the case of the light emitting diode applied to the liquid crystal display, there is a problem that the components of the liquid crystal display are damaged due to the heat generation of the light emitting diode.

Accordingly, conventionally, Korean Patent Application Publication No. 10-2004-33434 (a manufacturing method for adding a heat dissipation structure to the outside of the light emitting diode) has a structure capable of dissipating heat generated by the light emitting diode.

Here, in the manufacturing method of adding a heat dissipation structure to the outside of the light emitting diode, a heat sink is installed on the top of the base, and the light emitting diode is installed on the top of the heat sink, and heat generated from the light emitting diode is transferred to the heat sink. The heat transmitted to the heat sink is discharged to the outside through some heat sinks exposed to the outside of the light emitting diode package, which is relatively small in area where the heat sink is exposed to the outside of the light emitting diode package. As the close contact with the upper end of the base, the heat dissipation is only through a portion of the upper surface of the heat sink, there is a problem that does not sufficiently release the heat generated by the light emitting diode.

In addition, in the case of a liquid crystal display requiring relatively bright light, that is, a high luminous efficiency, the brightness of the liquid crystal display may be limited due to the high temperature heat generated from the light emitting diode, or the light emitting diode may be applied to the liquid crystal display. There was no problem.

The present invention has been invented to solve the above problems, the light emitting diode package and the backlight unit using the same to achieve a cooling of the light emitting diode package is installed by smoothly dissipating heat generated from the light emitting diode The purpose is to provide.

Another object of the present invention is to provide a package for a light emitting diode and a backlight using the same, which can be easily applied to a liquid crystal display device which requires cooling of heat generated from a light emitting diode so that light having a relatively high efficiency and consequently high temperature heat generation is required. The purpose is to provide a unit.

The present invention for achieving the above object, a metal including a closed wall surface and the inner space in which the light emitting diode is mounted, and a through hole formed in the closed wall surface to provide an electrical connection from the outside to the inner space A metal lead having a housing and a cross-sectional area smaller than that of the through hole of the metal housing and inserted into the through hole from the outside to provide an electrical connection from the outside to the inner space of the metal housing; the through hole of the metal housing and the metal housing. It is characterized by consisting of an insulating member filled in the space between the metal lead inserted into the through hole of the metal housing and the metal lead to provide insulation.

Another feature of the invention, the metal housing, the side wall and the bottom wall is closed and the upper surface has an open shape, the side wall has an inclined surface acting as a light emitting reflective surface of the light emitting diode, the light emitting diode is And mounted on an upper surface of the bottom wall.

Another feature of the invention is characterized in that the lens mounting recess is formed around the upper surface of the side wall.

Another feature of the present invention is that the through hole is a through hole penetrating the bottom wall up and down, the metal housing further extends from the lower end of the side wall to the through hole, the lower portion of the metal lead insertion groove portion is further opened; By including, the metal lead is characterized in that it provides an electrical connection to the inner space through the metal lead insertion groove portion and the through hole from the outside.

Another feature of the present invention is characterized in that the through hole is a through hole penetrating the side wall in the transverse direction, and the metal lead is characterized in that it provides an electrical connection to the inner space through the through hole from the outside.

Another feature of the invention is characterized in that the metal housing is made integrally by any one selected from the group consisting of pure copper and copper alloys.

Another feature of the invention is characterized in that the metal lead is made of any one selected from the group consisting of pure copper, copper alloys, iron or nickel-iron alloys, invar alloys, and coba alloys.

Another feature of the invention is characterized in that the insulating member is made of any one selected from the group consisting of glass and insulating polymer.

Another feature of the invention is characterized in that the heat sink is bonded or mounted on the bottom of the metal housing.

Another feature of the present invention is that the heat sink is made of aluminum, and a copper (Cu) or a copper alloy layer (Cu alloy), silver (Ag) or silver alloy (Ag alloy) on the upper surface or upper and lower surfaces of the heat sink. ) Is formed of a heat spreader layer, the metal housing is bonded or mounted on the heat spreader made of the copper or copper alloy layer or silver (Ag) or silver alloy (Ag alloy) layer.

Another feature of the present invention is that the copper, silver (Ag) or copper, silver (Ag) alloy layer forming the heat spreader, or another surface on which the heat spreader is not provided, that is, the heat spreader alloy layer The copper or copper alloy or carbon composite structure having an extended heat dissipation structure is joined or mounted to increase the heat dissipation area on the other side which is not formed. That is, a copper or copper alloy or carbon composite structure having an extended heat dissipation structure is joined or mounted to increase the heat dissipation area on the other side where the metal housing accommodating the light emitting diode is not joined or mounted.

In another aspect of the present invention, the heat sink and the bottom surface of the metal lead have a gap, and the circuit board can be inserted into the gap to connect the metal lead to the surface mount type on the circuit board.

Another feature of the invention is characterized in that a heat spreader is provided on the bottom of the metal housing.

Another feature of the invention is characterized in that the cooling fin is provided on the bottom surface of the metal housing to increase the heat dissipation area.

Another feature of the invention is a metal housing comprising a closed wall surface and an inner space in which the light emitting diode is mounted, and a through hole formed in the closed wall surface to provide an electrical connection from the outside to the inner space; A metal lead having a smaller cross-sectional area than that of the through hole of the metal housing and inserted into the through hole from the outside to provide an electrical connection from the outside to the inner space of the metal housing, and into the through hole of the metal housing and the through hole of the metal housing; An insulating member filled in the space between the formed metal leads to provide insulation between the metal housing and the metal lead, a heat sink formed to have a gap from a bottom surface of the metal lead while being in contact with the bottom surface of the metal housing; And inserted into the gap between the metal lead and the heat sink so that the metal lead and the It is characterized by consisting of a circuit board that is connected in a way.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 shows a light emitting diode package 10 according to the present invention, FIG. 2 shows a light emitting diode package 10 according to the present invention mounted on a heat sink 60, and FIG. 3a according to the present invention. It is shown that the heat spreader 61 is attached to the upper surface of the heat sink 60, Figure 3b shows that the expansion heat sink 62 is attached to the lower surface of the heat sink 60 according to the present invention, Figures 4a and 4B illustrates that the LED package 10 and the heat sink 60 according to the present invention are bonded to each other, FIG. 5 illustrates the backlight unit 11 according to the present invention, and FIG. 6 illustrates the backlight according to the present invention. 7 shows an internal configuration of the unit 11, FIG. 7 shows a backlight unit 11 in which a plurality of light emitting diode packages 10 are installed, and FIG. 8 shows a metal housing 30 according to the present invention. Integrally formed with heat spreader 61 9 shows that the heat spreader 61 is integrally formed in the metal housing 30 according to the present invention, and the cooling fins 63 are coupled to the bottom surface of the heat spreader 61.

The present invention discloses a light emitting diode package 10 and a backlight unit 11 formed to emit heat generated from the light emitting diode 20 to the outside.

Representative structure of a light emitting diode package 10 that can accommodate a single or multiple light emitting diode elements according to the present invention, as shown in Figs. 1 to 4b, the light emitting diode 20 and the metal housing 30 And a lens 40, a metal lead 50, and a heat sink 60.

The light emitting diode 20 is a conventional light emitting diode which is configured to generate light due to the electric field emission phenomenon of a semiconductor, and a semiconductor, an electrode, or the like is formed on the upper surface of the submount. The electrode of the light emitting diode is electrically connected to the metal lead 50 by wire bonding.

As shown in FIGS. 1 and 2, the metal housing 30 is formed of copper having a relatively high thermal conductivity (Copper: 397W / mK) in the present embodiment, and may accommodate the light emitting diode 20. It is formed into a box shape.

In addition, the metal housing 30 is formed of a metal such as copper (Copper: 397W / mK) or aluminum (Aluminum: 230W / mK) and an alloy thereof having higher heat dissipation efficiency than conventional materials such as ceramics, and silver ( Silver: 428W / mK) is provided as an outer coating (plating) layer, and is preferably formed of copper or copper alloy having high thermal conductivity while being easy to use industrially.

In addition, the molding of the metal housing 30, the polymer compound and the powder of the copper and copper alloy is mixed, and the mixture is put into the mold of the metal housing shape, that is, a mold, and then pressurized to achieve injection, thus high pressure It is a process of removing and sintering the polymer compound by applying heat to the polymer compound contained in the metal injected from the, the metal housing 30 formed in this way has a relatively high density of metal properties A molded article of the metal housing is obtained.

The metal housing 30 includes a bottom wall 32, a side wall 31, and an inclined surface 33.

The bottom wall 32 is formed of a lower portion of the metal housing 30 and is formed in a flat plate shape so that the light emitting diodes 20 are seated.

The side wall 31 is composed of an upper portion of the metal housing 30, and a central portion thereof is formed in a tubular shape opened by an upper surface opening of the metal housing 30.

The inclined surface 33 is formed to have an inclination in which the inner wall surface of the upper opening of the upper side of the metal housing 30 is narrowed downward, and is formed as an inner surface of the opening opened from the upper end to the lower end of the side wall 31. Is done.

In addition, the metal housing 30 is configured to include a through hole (35).

The through hole 35 is formed by penetrating a portion of the bottom wall 32 on both sides of the light emitting diode 20 seated on the bottom wall 32 of the metal housing 30.

In addition, the through hole 35 is vertically penetrated again at the upper and lower portions of the bottom wall 32 extending to both outside of the bottom wall 32 to insert metal leads, which will be described later. The lead insertion groove is formed through.

In addition, the through hole 35 may be formed to penetrate through the outer side of the side wall 31 from the inclined surface 33 formed by the opening in the center of the side wall 31 of the metal housing 30.

In addition, the metal housing 30 is configured to include a lens mounting recess 34 on the upper surface.

The lens mounting recess 34 is recessed inwardly around an outer circumference of the upper surface of the upper surface of the side wall 31 of the metal housing 30, so that the outer circumference is inserted and fixed when the hemispherical lens 40 to be described later is inserted. The lower surface of the lens 40 is formed of a groove recessed in the same circular shape as the outer circumference.

The lens 40 is formed in a hemispherical shape so that the lower end is inserted into and fixed to the lens mounting recess 34, and the lens 40 is formed to be transparent so that light emitted from the light emitting diode 20 is transmitted.

The metal lead 50 is connected to the electrode of the light emitting diode 20 by wire bonding so as to be energized by the light emitting diode 20 and configured to be connected to the outside of the light emitting diode package 10.

The metal housing 50 is inserted into the through-hole 35 which is penetrated in the transverse direction from the top surface of the bottom wall 32 on which the light emitting diode 20 is seated to the bottom surface of the bottom wall 32. When the through hole 35 extends in the up / down direction of the 30 and extends to penetrate the outer surface of the bottom wall 32, the metal lead 50 follows the shape of the through hole 35. It is bent in the vertical direction is formed to extend to the outside of the through hole (35).

Here, the metal lead 50 is preferably installed so as to be spaced apart from the inner wall surface of the through hole 35 in the central portion of the through hole 35.

In addition, the metal lead 50 is formed in a rectangular or plate shape having a larger area so that wire bonding with the electrodes of the light emitting diode is easy.

In addition, the metal lead 50 is formed to extend from the upper surface of the bottom wall 32 to the through hole 35, and extends to the outside of the metal housing 30 along the through hole 35, The lower surface of the face wall 32, that is, the light emitting diode package 10 is spaced apart from the bottom by a predetermined interval is preferably formed to generate heat through the upper and lower surfaces of the metal lead 50 formed in the plate shape.

In addition, as shown in FIG. 2, a part of the metal lead 50 may be bent to be connected to another component from the outside of the light emitting diode package 10, and in the present embodiment, the metal lead ( 50 is bent in the direction in which the circuit board 12 is formed, that is, in the bottom surface direction of the light emitting diode 20 so as to be connected to the circuit board 12 which will be described later.

Here, in the state where both ends of the metal lead 50 is connected to the circuit board 12, most of the metal leads 50 may be formed to be spaced apart from the upper surface of the circuit board 12 by a predetermined interval. .

In addition, the coupling portion of the metal housing 30 of the metal lead 50 is insulated by the insulating member 51, as shown in Figs.

In addition, the metal lead 50 is preferably made of any one of metals such as pure copper, copper alloys, iron alloys, nickel-iron alloys, invar alloys, coba alloys or metal groups to which the metals belong so as to enable energization. .

The insulating member 51 is positioned such that the metal lead 50 is in contact with the metal housing 30 formed of the metal while the metal lead 50 is positioned to reach the top surface of the bottom wall 32 of the metal housing 30. It is formed to be wrapped around the outer periphery of the lead 50 and bonded to the inner wall surface of the through hole 35 on the upper surface of the bottom wall 32.

In addition, the insulating member 51 is preferably made of any one of a group consisting of glass and / or insulating polymer so that the current is interrupted.

As shown in FIGS. 2 to 3B, the heat sink 60 is composed of a plate on which the light emitting diode package 10 is seated, and has a relatively high heat dissipation efficiency and aluminum or aluminum alloy having a predetermined strength. It is preferably formed, and may be made of any metal having a strength and heat dissipation efficiency of the degree to which the metal housing 30 is fixed.

In addition, the heat sink 60 may further include a heat spreader 61 and a heat dissipation plate 62.

The heat spreader 61 is formed in the same plate shape as the shape of the heat sink 60 to be in contact with the upper surface of the heat sink 60 to be in direct contact with the light emitting diode package 10.

In addition, the heat spreader is preferably made of a material having a heat dissipation efficiency higher than the heat dissipation efficiency of the heat sink 60, in this embodiment the heat sink 60 is made of aluminum (Aluminum: 230W / mK) As formed, the heat spreader 61 is made of copper (Copper: 397 W / mK) or silver or an alloy thereof having higher thermal conductivity than the heat sink 60.

The heat spreader 61 is preferably made of any one selected from the group consisting of copper, silver, a copper alloy and a silver alloy.

As shown in FIG. 3B, the expansion heat dissipation plate 62 is in close contact with the bottom surface of the heat sink 60 to form the same plate shape as the heat sink, and the plurality of heat sinks 60 are arranged in the up / down direction of the heat sink 60. The opening is formed in a shape (a honeycomb structure in this embodiment).

Here, as a plurality of openings are formed in the expansion heat sink 62, the heat dissipation area of the expansion heat sink 62 is expanded to further increase the release of heat transferred from the heat sink 60.

In addition, the expansion heat dissipation plate 62 is preferably made of any one selected from the group consisting of relatively high thermal conductivity of copper, silver, copper alloy, and silver alloy.

4A and 4B illustrate the light emitting diode package 10 mounted on the heat sink 60.

Here, the through hole 35 formed in the metal housing 30 of the light emitting diode package 10 is formed to penetrate to the outside of the metal housing 30, and through the through hole 35, the light emitting diode 20 and the light emitting diode 20 are formed. An electrically connected metal lead 50 protrudes, and the metal lead 50 is spaced apart from the upper surface of the heat sink 60 to form a predetermined gap.

5 to 7 illustrate the backlight unit 11 according to the present invention. Since the light emitting diode package 10 is electrically connected to an external circuit board 12 and the like, the light emitting diode package 10 is connected to the light emitting diode package 10. The circuit board 12 is connected, and in this case, the circuit board 12 is seated and assembled on an upper surface of the heat sink 60 outside the light emitting diode package 10, and the connection portion of the circuit board 12 is Inserted into the gap between the heat sink 60 and the metal lead 50 is connected to the metal lead 50.

In addition, a soldering pad having a plurality of electrodes projecting convexly in the direction of the metal lead is formed in the connection portion of the metal lead 50 of the circuit board 12 to be electrically connected to the metal lead 50. Do.

In addition, the circuit board 12 and the heat sink 60 or the heat spreader 61 is a spacer member protruding upward from the upper surface of the heat sink 60 or the heat spreader 61 so as to be spaced apart from each other ( 64 may be further provided.

In addition, the spacer member 64 protrudes downward from the lower surface of the circuit board 12 so that the lower end of the spacer member 64 is in contact with the upper surface of the heat sink 60 or the heat spreader 61. Of course, the substrate 12 and the heat sink 60 or the heat spreader 61 may be spaced apart from each other.

7 shows that a plurality of light emitting diode packages 10 are assembled to a single circuit board 12.

8 and 9 illustrate still another embodiment according to the present invention. In the present invention shown in FIG. 8, the heat spreader 61 is integrally formed on a lower surface of the metal housing 30 to form the heat sink. 60, the metal housing 30 and the heat spreader 61 are both made of copper, and the heat sink is made of aluminum, so that the metal housing 30 and the heat spreader 61 are bonded to each other. ) Is integrally formed so as to be seated in the groove formed on the upper surface of the heat sink 60.

In the present invention illustrated in FIG. 9, the cooling fins 63 are fastened to the lower surface of the heat spreader 61 seated on the heat sink 60.

The cooling fins 63 are configured in such a manner that a plurality of plates are arranged in a direction perpendicular to the heat sink to achieve cooling while air is flowed between the plurality of cooling fins 63 plates, and the heat spreader 61 is joined. The heat sink of the portion is penetrated and connected to the heat spreader 61 through the through hole.

In addition, the cooling fin 63 may be directly connected to the lower surface of the heat sink 60, of course.

Next will be described the manufacturing process and operation of the light emitting diode package and a backlight unit using the same.

The metal housing 30 is formed of a material such as copper or a copper alloy having a relatively high thermal conductivity so as to help the heat dissipation of the light emitting diode 20, and preferably, a silver film is coated on the surface of the metal housing 30.

The metal lead 50 extending to both sides of the metal housing 30 is inserted into and coupled through the through hole 35 and the metal lead insertion recess formed in the bottom wall 32 forming the lower portion of the metal housing 30.

The metal housing 30 is preferably produced by injection molding copper and copper alloy.

At this time, the insulating member 51 of a material having electrical insulation so that the metal lead 50 and the metal housing 30 is insulated between the upper end of the metal lead 50 and the upper inner wall surface of the through hole 35. Coupling to surround the metal lead (50).

The metal lead 50 is preferably selected from the group consisting of copper or copper alloys or iron-based alloys or nickel-iron alloys or invar alloys or coba alloys.

In addition, the insulating member is preferably selected from the group consisting of glass and insulating polymer.

The light emitting diode package 10 is brought into close contact with an upper surface of the heat spreader formed on one surface of the heat sink 60 to complete the assembly of the light emitting diode 20. In this case, the metal lead of the light emitting diode package 10 is completed. 50 is configured to be spaced apart from the heat sink 60 by a predetermined interval to dissipate through the upper and lower surfaces of the metal lead 50, and to provide an electrical connection so that the circuit board 12 can be assembled. .

The circuit board 12 is fastened to an upper surface of the heat sink 60 outside of the light emitting diode 20 while the light emitting diode package 10 and the heat sink 60 are coupled to each other.

In this case, the metal lead 50 connection part or the soldering pad of the circuit board 12 is electrically connected to the lower surface of the metal lead 50, so that the light emitting diode 20 and the circuit board 12 are electrically connected. As a result, the backlight unit 11 is formed.

Here, the space between the metal lead 50 of the light emitting diode package 10 and the top surface of the heat sink 60 in a state in which the light emitting diode package 10 and the heat spreader formed on the heat sink 60 are coupled to each other. The light emitting diode package 10 and the circuit board 12 are coupled to each other in a surface mount type by pushing the circuit board 12 and the soldering pad portion to be bonded to each other, and are configured to make an electrical connection. Do.

In addition, the circuit board 12 mounted on the top surface of the heat sink 60 or the heat spreader 61 may be disposed on an upper end of the spacer member 64 protruding from the top surface of the heat sink 60 or the heat spreader 61. The bottom surface of the circuit board is installed while being spaced apart from the heat sink 60 or the heat spreader 61 by a predetermined distance, and the heat emitted from the heat sink 60 or the heat spreader 61 is spaced apart from the heat sink 60. It radiates heat to the outside without directly affecting (12).

When power is applied from the circuit board 12 or an external power source connected to the circuit board 12, a voltage difference occurs between the metal leads 50 on both sides of the light emitting diode package 10 due to the electrical action of the circuit board 12. As a result, an electric field for current conduction is formed in the wires connected to both metal leads 50 and the light emitting diodes 20, and the light emitted from the electric field is irradiated to the outside of the light emitting diodes 20.

The light irradiated from the light emitting diode is irradiated to the open outer side of the light emitting diode, that is, to the top of the bottom wall 32 of the metal housing 30, and to the side wall 31 which forms the upper portion of the metal housing 30. The light is reflected from the formed inclined surface 33 and irradiated to the upper opening of the metal housing 30.

Light irradiated to the upper surface opening of the metal housing 30 is irradiated to the outside while being reflected or refracted through the lens 40 formed on the upper surface opening.

In this case, heat is generated due to the electric field formed in the light emitting diodes 20, and heat generated by the light emitting diodes 20 is emitted to the outside of the light emitting diodes 20.

Heat emitted to the outside of the light emitting diodes 20 is continuously heated while being transferred to the metal housing 30 and the lens 40 surrounding the light emitting diodes 20, or convex around the light emitting diodes 20.

The heat transferred to the metal housing 30 is discharged to the outside through the outer outer surface of the metal housing 30 and cooled, and the heat transferred through the bottom surface of the metal housing 30 is transferred to the metal housing ( 30 is delivered to the heat spreader and heat sink 60 in close contact with the bottom surface.

At this time, as the heat spreader 61 is bonded to the upper surface of the heat sink 60, the heat transferred from the metal housing 30 is transferred to the heat spreader 61 so that the heat spreader 61 is exposed to the outside. Is cooled through the front.

In addition, heat that has not been cooled by the heat spreader 61 is transferred to the heat sink 60, and heat transferred to the heat sink 60 is discharged to the outside through the bottom surface of the heat sink 60. .

In addition, when the expansion heat sink 62 is attached to the lower surface of the heat sink 60, the surface area of the lower surface of the heat sink 60 is further expanded, so that the expanded heat sink 60 and the expansion heat sink 62 Heat is more smoothly discharged through the front surface of the light emitting diode package 10.

In addition, some of the heat transferred to the metal housing 30 is discharged to the outside through the through holes 35 penetrated to both sides of the metal housing 30 to be cooled, and convection around the light emitting diode 20. Some of the heat is transferred to the metal leads 50 fastened to both sides of the light emitting diodes 20.

The heat transferred to the metal lead 50 is transferred to the upper and lower surfaces of the metal lead 50 protruding to the outside of the light emitting diode package 10 through the through hole 35 according to the shape of the metal lead 50. The heat is cooled while the heat is discharged through the upper and lower surfaces of the metal lead 50 that is transmitted and exposed to the outside of the light emitting diode package 10.

In addition, when the through-hole 35 is formed in the upper side wall 31 of the metal housing 30, the heat generated from the light emitting diode 20 is convection is raised to the upper portion of the opening of the metal housing 30, The elevated heat is cooled while being discharged to the outside through the through hole 35 opened in the upper portion of the metal housing 30.

In addition, when the metal housing 30 and the heat spreader 61 are integrally formed, heat generated from the light emitting diode 20 and transferred to the metal housing 30 is transferred through the outer surface of the metal housing 30. In addition to being discharged, it is delivered to the heat spreader 61 integrally formed in the metal housing 30 and cooled while being discharged to the outside through the outer surface of the heat spreader 61 positioned outside the metal housing 30.

In addition, when the cooling fins 63 are formed on the lower surface of the metal housing 30 or the heat spreader 61, heat transferred to the metal housing 30 or the heat spreader 61 is transferred to the cooling fins 63. The metal housing 30 is cooled while being transferred, and the heat transferred to the cooling fins 63 is cooled by the air flowing through the air flow path of the cooling fins 63.

Accordingly, the heat generated from the light emitting diodes 20 is cooled while being discharged to the outside through the metal housing 30 formed of a material such as copper having a relatively high thermal conductivity, and penetrates to both sides of the metal housing 30. As the light emitting diode package 10 is cooled at a higher efficiency while being emitted through the through hole 35, the limited light emitting efficiency is further increased due to the heat generation of the light emitting diode 20.

In addition, the heat generated from the light emitting diodes 20 is discharged to the outside through the metal housing 30 and the through hole 35 and cooled, as well as to the outside by the heat sink 60 in contact with the metal housing 30. As it is discharged to achieve cooling, the cooling efficiency of the light emitting diode package 10 is increased.

In addition, as the heat spreader 61 and the heat dissipation plate 62 are further attached to the upper and lower surfaces of the heat sink 60, the cooling efficiency of the light emitting diode package 10 is further increased. Can be increased.

In addition, the heat spreader 61 is integrally formed in the metal housing 30 to improve heat transfer efficiency, thereby further increasing the cooling efficiency, and cooling fins in the heat sink 60 or the heat spreader 61. Further attaching the (63) can further increase the cooling efficiency of the light emitting diode package 10 by cooling through the air flow of the cooling fin (63).

As described above, the present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by those skilled in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes are within the scope of the claims.

As described above, according to the present invention, the metal housing for accommodating the light emitting diode package and the light emitting diode applied to the backlight unit is formed of a material having high thermal conductivity such as copper, thereby improving cooling efficiency of the light emitting diode package and the backlight unit. It works.

Another effect of the present invention, the through-holes are formed in the metal housing applied to the light emitting diode package and the backlight unit to the inside and the outside, through the through the heat is to be discharged in the light emitting diode package and the backlight unit The cooling efficiency of the light emitting diode package and the backlight unit is improved.

Another effect of the present invention, through the through-hole is formed in the metal housing applied to the light emitting diode package and the backlight unit, as the metal lead protrudes to the outside, the heat is released through the through, Heat is emitted through the entire outer surface of the metal lead to further improve the cooling efficiency of the LED package and the backlight unit.

Another effect of the present invention is that as the metal housing of the light emitting diode package and the backlight unit is seated on the heat sink outside the light emitting diode package and the backlight unit, the heat sink and the heat sink having a larger area of heat of the metal housing While emitted to the outside through a heat spreader or an expansion heat sink to increase the thermal conductivity, there is an effect that the cooling efficiency of the light emitting diode package and the backlight unit is improved.

Another effect of the present invention is that the heat spreader is integrally formed in the metal housing of the light emitting diode package and the backlight unit, thereby increasing the heat dissipation efficiency of the metal housing.

Another effect of the present invention, the cooling fins are further attached to a heat sink or heat spreader bonded to the metal housing of the light emitting diode package and the backlight unit to cool the light emitting diode package and the backlight unit by cooling through the air flow of the cooling fins. The efficiency is further increased.

Claims (19)

The side wall and the bottom wall are closed and the top surface is open, so that the wall includes a closed wall, and has an interior space for mounting one or more light emitting diodes on the bottom wall. A metal housing comprising a through hole communicated with the A metal lead having a small cross-sectional area compared to that of the metal housing through hole and inserted into the through hole from the outside to provide an electrical connection from the outside to the inner space of the metal housing; A package for a light emitting diode, comprising: an insulating member filled in a space between a metal housing hole and a metal lead inserted into the metal housing hole to provide insulation between the metal housing and the metal lead. It includes a closed wall surface and the inner space in which the light emitting diode is mounted, a through-hole formed to penetrate the closed wall surface to communicate with the interior space, and a cooling fin formed to extend the heat dissipation area on the closed wall and closed A metal housing in which a wall and a cooling fin are formed in one body, A metal lead having a small cross-sectional area compared to that of the metal housing through hole and inserted into the through hole from the outside to provide an electrical connection from the outside to the inner space of the metal housing; A package for a light emitting diode, comprising: an insulating member filled in a space between a metal housing hole and a metal lead inserted into the metal housing hole to provide insulation between the metal housing and the metal lead. The method of claim 1, The side wall has an inclined surface that acts as a light emitting reflective surface of the light emitting diode, and a package for mounting a light emitting diode, characterized in that the lens mounting groove for mounting the lens is formed around the upper surface. The method of claim 1, The through hole is a through hole penetrating the bottom wall up and down, and the metal housing further includes a groove for inserting the metal lead, which extends from the bottom of the side wall to the through hole and has a lower portion open. Package for light emitting diodes, characterized in that to provide an electrical connection to the internal space through the groove and the through hole. The method of claim 1, The through-hole is a through-hole penetrating the side wall in the transverse direction, the light emitting diode package, characterized in that the metal lead provides an electrical connection to the interior space through the through-hole. The method according to claim 1 or 2, The metal housing is integrally formed by any one selected from the group consisting of pure copper and copper alloys. The method according to claim 1 or 2, The metal lead is made of any one selected from the group consisting of pure copper, copper alloys, iron alloys, nickel-iron alloys, invar alloys and coba alloys. The method according to claim 1 or 2, The insulating member is a package for a light emitting diode, characterized in that made by any one selected from the group consisting of glass and insulating polymer. The method according to any one of claims 1 to 5, Package for light emitting diodes, characterized in that the heat sink is bonded or integrally formed on the bottom of the metal housing. The method of claim 9, The heat sink comprises a heat spreader made of aluminum, and formed of a material having better thermal conductivity than aluminum, and the heat spreader is bonded or integrally formed on the bottom of the metal housing. The method of claim 10, The heat spreader is formed of any one selected from the group consisting of copper, silver, copper alloy, silver alloy package for a light emitting diode. The method of claim 10, The package for light-emitting diodes, characterized in that the expansion heat sink is bonded or integrally formed to increase the heat dissipation area on the surface where the heat spreader is not formed. The method of claim 9, The bottom surface of a heat sink and a metal lead has a clearance gap, and can insert a circuit board into a clearance gap, and can connect a metal lead to a surface mount type on a circuit board, The package for light emitting diodes characterized by the above-mentioned. The method of claim 13, A package for light emitting diodes, wherein the remaining metal lead portions are separated from the circuit board, the heat spreader and the heat sink except for the connection portions of the metal leads and the circuit board. The method of claim 14, A separate spacer member is provided between the bottom surface of the circuit board and the top surface of the heat sink, so that the circuit board is inserted while being spaced apart from the heat sink. The method according to any one of claims 1 to 5, A package for a light emitting diode, characterized in that the heat spreader is bonded or integrally formed with a metal housing. The method according to any one of claims 1 and 3 to 5, A package for a light emitting diode, characterized in that the cooling fins to increase the heat dissipation area in the metal housing are bonded or integrally formed. A metal housing including a closed wall surface and an inner space in which one or more light emitting diodes can be mounted, and a through hole formed to penetrate the closed wall surface and communicating from the outside to the inner space; At least one light emitting diode mounted in the inner space, A metal lead having a small cross-sectional area compared to the cross-sectional area of the through hole of the metal housing and inserted into the through hole from the outside to provide an electrical connection from the outside to the inner space of the metal housing; An insulating member filled in the space between the through hole of the metal housing and the metal lead inserted into the through hole of the metal housing to provide insulation between the metal housing and the metal lead; A connection member electrically connecting one end of the light emitting diode to the metal lead; And a circuit board positioned adjacent to the metal housing and electrically connected to the other end of the metal lead. The method of claim 18, The metal housing is a backlight unit, characterized in that one or more of the heat sink, the heat spreader and the cooling fins are bonded or integrally formed.

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