KR100683773B1 - Method for manufacturing plasma display panel and plasma display panel manufactured thereby - Google Patents

Abstract

The present invention discloses a method for manufacturing a plasma display panel. In the method of manufacturing a plasma display panel according to an exemplary embodiment of the present invention, a plasma display panel is manufactured by fabricating a front substrate side and a rear substrate side and sealing each other based on a plurality of partition walls partitioning discharge cells formed therebetween. A method of manufacturing a back substrate side may include: assembling a plurality of unit back substrates to form a back substrate; Forming a planarization film on an upper surface of the assembled back substrate; Forming a sustain electrode pair on an upper surface of the planarization film; Forming a dielectric layer to bury the sustain electrode pair on an upper surface of the back substrate on which the sustain electrode pair is formed; And forming a protective film on an upper surface of the dielectric layer.

Description

Manufacturing method of plasma display panel and plasma display panel manufactured by the same {Manufacturing method of plasma display panel, and plasma display panel thereby}

1 is an exploded perspective view illustrating a part of a conventional transmissive plasma display panel.

2 is a vertical cross-sectional view showing the internal structure of the conventional plasma display panel shown in FIG.

3 is a flowchart illustrating a method of manufacturing a plasma display panel.

4 is a flowchart illustrating a detailed process of an embodiment of a back substrate side manufacturing step of the method of manufacturing a plasma display panel according to the present invention of FIG. 3.

5 is an exploded perspective view of a plasma display panel manufactured according to the method of FIG. 4.

FIG. 6 is an assembled vertical cross-sectional view of the plasma display panel shown in FIG. 5.

7 is a flowchart illustrating a detailed process of another embodiment of the back substrate side fabrication step of the manufacturing process of FIG. 3.

FIG. 8 is an exploded perspective view of a plasma display panel manufactured according to the process of FIG. 7.

FIG. 9 is an assembled vertical cross-sectional view of the plasma display panel shown in FIG. 8.

Explanation of symbols on the main parts of the drawings

110a, 110b, 110c: unit back board

113, 114: sustain electrode pair 116: first dielectric layer

117: planarization film 119: protective layer

120: front substrate 122: address electrode

124: bus electrode 125: bridge

126: second dielectric layer 128: partition wall

129 phosphor layer 130 discharge cell

S1: front substrate layer production step S2: back substrate side production step

S3: Assembly and sealing step S4: Discharge gas injection step

S5: aging step S2a: assembling a plurality of back substrates

S2b: Step of Forming Flattening Film S2c: Step of Forming Sustaining Electrode Pair

S2d: dielectric layer forming step S2e: protective film forming step

S2a ': back substrate preparation step S2b': sustain electrode pair formation step

S2c ': dielectric layer forming step S2d': protective film forming step

S2e '': Back Board Assembly Step

The present invention relates to a method for manufacturing a plasma display panel and a plasma display panel manufactured by the same, and more particularly, a plurality of unit back substrates are assembled to form one rear substrate side and combined with a front substrate side to produce one plasma display panel. It relates to a plasma display panel manufacturing method and a plasma display manufacturing method produced thereby.

Plasma display panels (PDPs), which form images using electrical discharges, have excellent display performance, such as brightness and viewing angle, and their use is increasing day by day. In the plasma display panel, a discharge occurs in a gas between the electrodes by a direct current or an alternating voltage applied to the electrode, and phosphors are excited by the radiation of ultraviolet rays accompanying the gas discharge process to emit visible light.

1 and 2 illustrate a conventional general reflective plasma display panel. In FIG. 2, only the rear substrate is rotated by 90 ° to show the internal structure of the plasma display panel of FIG. 1 more clearly. For the purpose of understanding, the discharge having a repetitive structure is not shown in FIG. 1. The cell is shown. The front surface herein means the direction in which the image is displayed.

Referring to FIG. 1 and FIG. 2, the conventional transmissive plasma display panel includes a back substrate 10 and a front substrate 20 each having a single sheet facing each other. On the upper surface of the back substrate 10, a plurality of sustain electrode pairs 13 and 14 are arranged at predetermined intervals, and the sustain electrode pairs 13 and 14 are embedded by the first dielectric layer 16. As shown in FIG. A protective layer 19 of MgO component is formed on the upper surface of the first dielectric layer 16.

The front substrate 20 is a transparent substrate through which visible light can be transmitted, and is mainly made of glass and combined with the rear substrate 10. A plurality of address electrodes 22 in a stripe form are formed on the bottom surface of the front substrate 20 in a direction orthogonal to the sustain electrode pairs 13 and 14. Since the address electrode 22 is made of ITO, which is a transparent conductive material having a relatively high resistance, a bus electrode 23 made of a highly conductive metal material is connected to each of the address electrodes 22 in order to reduce line resistance. The bus electrode is embedded with the address electrode 22 by the second dielectric layer 26, and the bus electrode 24 and the address electrode 22 are provided with a bridge 25 for electrically connecting them.

Meanwhile, a plurality of barrier ribs 28 are formed on the bottom of the second dielectric layer 26 to be spaced apart at predetermined intervals so as to partition the discharge cells 30 to prevent electrical and optical interference between the discharge cells. The phosphor layer 29 is coated on the inner surface of the discharge cell 30 partitioned by the partition wall 28.

However, in the conventional reflective plasma display panel having such a structure, the sustain electrode pairs 13 and 14, the first dielectric layer 16 and the protective layer 19 are formed on the back substrate 10 formed of a single glass substrate. Since the structure is formed by stacking, if there are some defects in the structure of the discharge cell formed on the back substrate, there is a problem that the entire back substrate is to be replaced, there is a problem in terms of manufacturing cost and flexibility of the process.

In order to solve the above problems, the back substrate of the plasma display panel is not composed of one glass substrate, but the back substrate is assembled by assembling a plurality of glass substrates or a unit back surface of a metal or plastic material. An object of the present invention is to provide a plasma display panel.

In order to achieve the above object, a plasma display panel manufacturing method according to an embodiment of the present invention,

A method of manufacturing a plasma display panel by fabricating a front substrate side and a rear substrate side and assembling and sealing each other based on a plurality of partition walls partitioning discharge cells formed therebetween.

The step of manufacturing the back substrate side,

Assembling a plurality of unit back substrates to form a back substrate;

Forming a planarization film on an upper surface of the assembled back substrate;

Forming a sustain electrode pair on an upper surface of the planarization film;

Forming a dielectric layer to bury the sustain electrode pair on an upper surface of the back substrate on which the sustain electrode pair is formed;

And forming a protective film on an upper surface of the dielectric layer.

Here, the back substrate formed by assembling the plurality of unit back substrates is formed flat.

In addition, an assembly line between the plurality of unit rear substrates is formed at a position corresponding to the partition wall in the rear substrate on which the plurality of unit rear substrates are assembled.

On the other hand, the unit back substrate may be made of a metallic material or a plastic material.

A plasma display panel according to an exemplary embodiment of the present invention is manufactured by the above manufacturing method.

On the other hand, the plasma display panel manufacturing method according to another preferred embodiment of the present invention, the front substrate side and the back substrate side fabricated and assembled to each other based on a plurality of partition walls partitioning the discharge cells formed therebetween, the plasma display panel As a method of manufacturing

Producing the back substrate side,

Preparing a plurality of unit back substrates;

Forming a sustain electrode pair on an upper surface of each unit back substrate;

Forming a dielectric layer filling the sustain electrode pair on the upper surface of each unit back substrate on which the sustain electrode pair is formed;

Forming a protective film on an upper surface of each dielectric layer;

And assembling each unit back substrate of the laminated structure to each other.

Here, the assembled unit back boards are assembled flat to each other.

In addition, an assembly line between the assembled plurality of unit back substrates is formed at a position corresponding to the partition wall.

In the plasma display panel manufacturing method according to another embodiment of the present invention, the unit back substrate may be made of a metal material.

Optionally, the unit back substrate may be made of a plastic material.

The plasma display panel is manufactured according to the plasma display panel manufacturing method according to the second embodiment.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a flowchart showing each step of the method of manufacturing the plasma display panel according to the preferred embodiment of the present invention, and FIG. 4 is a flowchart of the first embodiment showing the detailed steps of the back substrate side fabrication step of FIG.

Referring to FIG. 3, as each step of the manufacturing method of a general plasma display panel, a front substrate side fabrication for manufacturing a front substrate side (hereinafter referred to as “front substrate side”), which is a front substrate assembly composed of a front substrate and a laminated structure thereof. Step S1 and a back substrate side fabrication step S2 for fabricating a back substrate side (hereinafter referred to as "back substrate side"), which is a back substrate assembly having a back substrate and a laminated structure thereof, are performed independently.

The present invention relates in particular to a method of manufacturing a transmissive plasma display panel in which a pair of sustain electrodes are formed on a rear substrate, and a method of manufacturing a transmissive plasma display panel. The method of manufacturing a front substrate side is a method of manufacturing a front substrate side in a conventional general transmissive plasma display panel. It is the same as, so it is not explained in detail.

In particular, the present invention, since the rear substrate side manufacturing step has a different feature from the conventional rear substrate side manufacturing step will be described with reference to the rear substrate side manufacturing step.

Referring to FIG. 3, after the manufacturing process of the front substrate side and the rear substrate side is performed, the front substrate side and the rear substrate side are assembled and sealed to each other by being assembled and sealed (S3), and then the front substrate is performed. A discharge gas injection step S4 of injecting a discharge gas into a discharge cell formed between the side and the back substrate side is performed. Next, an aging step S5 is performed to complete the plasma display panel.

Here, in order to describe the back substrate side fabrication step S2 in more detail, referring to FIG. 4, the back substrate side fabrication step S2 includes assembling the back substrate with a plurality of unit back substrates (S2a); In order to compensate for the height difference between the assembled substrates on the assembled back substrate, a step S2b is performed.

When the step of forming the planarization film (S2b) is performed, the surface of the back substrate assembled with the plurality of unit back substrates becomes one rear substrate as a whole due to the planarization film. Here, the plurality of unit back substrates are bonded by assembling each side surface using a predetermined adhesive, so that the back substrate on which the plurality of substrates are assembled has a flat surface. The assembled back substrate has a size corresponding to the front substrate.

Next, on the back substrate on which the planarization film is formed, a pair of sustain electrodes is formed on the planarization film. As mentioned in the prior art, the sustain electrode pair is, for example, a sustain electrode pair consisting of a stripe-shaped X electrode and a Y electrode. Meanwhile, a dielectric layer forming step (S2d) of forming a dielectric layer to fill the sustain electrode pairs formed on the planarization film is performed so that the sustain electrode pairs are completely embedded in the dielectric layer.

After such a step, a passivation layer forming step S2e in which a passivation layer for protecting the sustain electrode pairs is formed on the dielectric layer is performed.

FIG. 5 is an exploded perspective view partially showing a transmissive plasma display panel manufactured according to a method of manufacturing a transmissive plasma display panel according to a first embodiment of the present invention, and FIG. 6 is an assembled internal structure of the transmissive plasma display panel of FIG. 5. It is a vertical cross-sectional view shown. In FIG. 6, only the rear substrate is rotated 90 ° in order to clearly show the internal structure of the plasma display panel. In order to show the structure of the rear substrate having a larger area, discharge having a repetitive shape compared with FIG. 5 is shown. More cells are shown left and right compared to FIG. 5.

5 and 6 together, the transmissive plasma display panel manufactured by the method of manufacturing a transmissive plasma display panel of the first embodiment of the present invention is assembled with unit back substrates 110a, 110b, and 110c formed of predetermined units. A flattening film 117 is formed integrally with the configured rear substrate to form a flat surface without protruding portions formed on the rear substrate.

A plurality of sustain electrode pairs 113 and 114 are formed on a top surface of the planarization film in a predetermined pattern, and a first dielectric layer filling the sustain electrode pairs is buried on a top surface of the planarization film 117 on which the sustain electrode pairs are formed. 116 is formed, and a passivation layer 119 is formed on an upper surface of the first dielectric layer. In addition, the transmissive plasma display panel manufactured by the method of manufacturing a transmissive plasma display panel of the present invention includes a transparent front substrate 120 which is coupled to face the rear substrate, and a pair of sustain electrodes formed on a bottom surface of the front substrate 120. A plurality of address electrodes 122 having a stripe shape formed in a direction orthogonal to 113 and 114, a second dielectric layer 126 formed on a bottom surface of the front substrate 120 on which the address electrodes are formed, and filling the address electrodes; A plurality of partitions 128 formed on the bottom surface of the second dielectric layer at predetermined intervals to partition the discharge cells 130 to prevent electrical and optical interference between the discharge cells, and discharges partitioned by the partitions 128. The phosphor layer 129 formed on the inner surface of the cell 130 is provided. Meanwhile, the first dielectric layer 116 may be formed by applying a white dielectric material to a thickness of about 15 μm to 40 μm on the top surface of the back substrate 110.

Meanwhile, as shown in FIG. 6, a protective layer 119 is formed on the top surface of the first dielectric layer 116. The protective layer 119 serves to prevent the first dielectric layer 116 and the sustain electrode pairs 113 and 114 from being damaged by sputtering of plasma particles and to lower the discharge voltage and the sustain voltage by emitting secondary electrons. do. The protective layer 119 may be formed by applying, for example, magnesium oxide (MgO) to a thickness of about 0.2 μm to 2 μm on an upper surface of the first dielectric layer 116.

Here, the back substrate configured by assembling the unit back substrates 110a, 110b, and 110c does not need to be transparent, and may be molded of a material that is easy to mold. For example, the back substrate on which the unit back substrates 110a, 110b, and 110c are assembled may be formed of a metallic material or a plastic material.

On the other hand, the front substrate 120 is mainly made of glass as a transparent substrate through which visible light can be transmitted. In addition, Ne, Xe, or a mixed discharge gas thereof is injected into the discharge cell 130, and red (red) is formed on the bottom surface of the second dielectric layer 126 surrounding the discharge cell 130 and the side surface of the partition wall 128. R), green (G), and blue (B) phosphor layers are applied to a predetermined thickness. In FIG. 6, each of the discharge cells 130 is indicated by R, G, and B according to red, green, and blue according to the type of phosphor to be applied.

The stripe-shaped address electrode 122 disposed on the bottom surface of the front substrate 120 is made of indium tin oxide (ITO), which is a transparent conductive material to allow visible light to pass therethrough, whereas the unit back substrates 110a, 110b, and 110c are formed. The sustain electrode pairs 113 and 114 disposed on the top surface of the back substrate may be made of a general conductive metal material because transparency is not required.

Since the address electrode 122 is made of ITO, which is a transparent conductive material having a relatively high resistance as described above, a bus electrode 124 made of a highly conductive metal material is connected to each of the address electrodes 122 in order to reduce line resistance. It is preferable to be. The bus electrode is also buried by the second dielectric layer 126 together with the address electrode 122. A bridge 125 may be provided between the bus electrode and the address electrode 122 to electrically connect them, and a plurality of bridges may be provided at predetermined intervals along the longitudinal direction of the bus electrode. In addition, the bus electrode may be disposed at a position corresponding to the partition wall 128 so as not to obstruct the transmission of visible light.

The configuration of the transmissive plasma display panel according to the present invention having such a configuration is largely divided into driving for address discharge and driving for sustain discharge. The address discharge includes the address electrode 126 disposed on the front substrate 120 and the pair of sustain electrodes 113 and 114 disposed on the rear substrate formed by flattening the unit back substrates 110a, 110b, and 110c. It occurs between any one of the sustain electrodes 114, at which time wall charges are formed. The sustain discharge is caused by the potential difference between the pair of sustain electrodes 113 and 114 positioned in the discharge cell 130 where the wall charges are formed. For reference, as already mentioned, the sustain electrode 114 used for the address discharge is referred to as the Y electrode, and the sustain electrode 113 used only for the sustain discharge is also referred to as the X electrode. The phosphor layer 129 of the discharge cell 130 is excited by ultraviolet rays generated from the discharge gas during the sustain discharge, and visible light is emitted, and the visible light passes through the phosphor layer 129 and the front substrate 120. As it exits, it forms an image that the user can recognize.

FIG. 7 is a flowchart of a second embodiment showing the detailed steps of the back substrate side fabrication step of FIG.

As described above in the description of the first embodiment, referring to FIG. 3, as each step of the manufacturing method of a general plasma display panel, a front substrate side manufacturing step of manufacturing a front substrate side composed of a front substrate and a laminated structure thereof. (S1) and the back substrate side fabrication step (S2) for fabricating the back substrate side made of the back substrate and its laminated structure are performed independently of each other.

In particular, the present invention relates to a method of manufacturing a transmissive plasma display panel in which a pair of sustain electrodes are formed on a rear substrate, and a method of manufacturing a transmissive plasma display panel according to the second embodiment. Since it is the same as the manufacturing method of the front substrate side, it will not be described in detail separately.

In particular, the manufacturing method of the plasma display panel according to the second embodiment of the present invention also has the same characteristics as the manufacturing method of the back substrate side, which is different from the conventional back substrate side manufacturing step, as in the first embodiment. To explain.

Referring to FIG. 3, after the front substrate side and the back substrate side fabrication steps are performed, the front substrate side and the back substrate side are assembled and sealed to each other by being assembled and sealed, and then the front substrate is performed. A discharge gas injection step S4 of injecting a discharge gas into a discharge cell formed between the side and the back substrate side is performed. Next, an aging step S5 is performed to complete the plasma display panel.

Here, in order to describe the back substrate side fabrication step S2 in more detail, referring to FIG. 7, the back substrate side fabrication step S2 includes preparing a plurality of unit back substrates (S2a ') and each unit. A sustain electrode pair forming step (S2b ′) in which sustain electrode pairs are formed on the rear substrate is performed. As mentioned in the prior art, the sustain electrode pair is a sustain electrode pair consisting of, for example, a stripe-shaped X electrode and a Y electrode. On the other hand, a dielectric layer forming step (S2c ′) of forming a dielectric layer to fill the sustain electrodes formed on each unit back substrate is performed so that the pair of sustain electrodes is completely embedded in the dielectric layer.

After such a step, a protective film forming step (S2d ′) in which a protective film for protecting the sustain electrode pair is formed on the dielectric layer is performed.

As shown in FIG. 7, the stacking process of each unit back substrate is performed in the same process, and the unit back substrates formed in a stacked manner in the back substrate assembly step S2e 'are assembled to each other to form a back substrate side. .

FIG. 8 is an exploded perspective view partially showing a transmissive plasma display panel manufactured according to a method of manufacturing a transmissive plasma display panel according to a second embodiment of the present invention, and FIG. 9 is an assembled internal structure of the transmissive plasma display panel of FIG. 8. It is a vertical cross-sectional view shown. In FIG. 9, only the rear substrate is rotated 90 ° in order to clearly show the internal structure of the plasma display panel. In order to show the structure of the rear substrate having a larger area, discharge having a repetitive shape compared with FIG. 8 is shown. More cells are shown left and right as compared to FIG. 8.

8 and 9 together, in the transmissive plasma display panel manufactured by the method of manufacturing a transmissive plasma display panel according to the second embodiment of the present invention, the upper surfaces of the unit back substrates 210a, 210b, and 210c made of predetermined units A plurality of sustain electrode pairs 213 and 214 are provided in a predetermined pattern on the first dielectric layer to fill the sustain electrode pair on the upper surface of each unit back substrate 210a, 210b and 210c on which the sustain electrode pairs are formed. 216a, 216b, and 216c are formed, respectively, and protective films 219a, 219b, and 219c are formed on an upper surface of the first dielectric layer, respectively.

The stacked structures on the unit back substrates formed as described above are assembled flat to each other to form the back substrate side.

In addition, the transmissive plasma display panel manufactured by the method of manufacturing a transmissive plasma display panel according to the second embodiment of the present invention is transparent to be coupled to face each other and the back substrate consisting of the unit back substrate (210a, 210b, 210c) The front substrate 220, a plurality of address electrodes 222 having a stripe shape formed in a direction orthogonal to the sustain electrode pairs 213 and 214 on the bottom surface of the front substrate 220, and the front substrate on which the address electrodes are formed ( The second dielectric layer 226 formed on the bottom surface of 220 to fill the address electrode and the bottom surface of the second dielectric layer are spaced apart at predetermined intervals to partition the discharge cells 230 to prevent electrical and optical interference between the discharge cells. A plurality of barrier ribs 228 to be prevented and a phosphor layer 229 formed on the inner surface of the discharge cell 230 partitioned by the barrier ribs 228 are provided. Meanwhile, each of the first dielectric layers 216a, 216b, and 216c is coated with a white dielectric material having a thickness of about 15 μm to 40 μm on the upper surface of each of the unit substrates 210a, 210b, and 210c forming the back substrate. It can be formed by.

Meanwhile, as illustrated in FIG. 9, protective layers 219a, 219b, and 219c are formed on the top surfaces of the first dielectric layers 216a, 216b, and 216c, respectively. The protective layer prevents the first dielectric layers 216a, 216b, and 216c and the sustain electrode pairs 113 and 114 from being damaged by the sputtering of plasma particles and lowers the discharge voltage and the sustain voltage by emitting secondary electrons. Do it. The protective layers 219a, 219b, and 219c may be formed by, for example, applying magnesium oxide (MgO) to a thickness of about 0.2 μm to 2 μm on the top surfaces of the first dielectric layers 216a, 216b, and 216c.

Here, the back substrate configured by assembling the unit surface substrates 210a, 210b, and 210c does not need to be transparent, and may be molded of a material that is easy to mold. For example, the back substrate made of the unit back substrates 210a, 210b, and 210c may be formed of a metallic material or a plastic material.

Meanwhile, the front substrate 220 is mainly made of glass as a transparent substrate through which visible light can be transmitted. In addition, Ne, Xe, or a mixed discharge gas thereof is injected into the discharge cell 230, and red (red) is formed on the bottom surface of the second dielectric layer 226 surrounding the discharge cell 230 and the side surface of the partition wall 228, respectively. R), green (G), and blue (B) phosphor layers are applied to a predetermined thickness. In FIG. 9, each of the discharge cells 230 is represented by R, G, and B according to red, green, and blue according to the type of phosphor to be applied.

The stripe-shaped address electrode 222 disposed on the bottom surface of the front substrate 220 is made of indium tin oxide (ITO), which is a transparent conductive material for transmitting visible light, whereas the unit back substrates 210a, 210b, and 210c are formed. The sustain electrode pairs 213 and 214 disposed on the top surface of the back substrate may be made of a common conductive metal material because transparency is not required.

Since the address electrode 222 is made of ITO, which is a transparent conductive material having a relatively high resistance as described above, a bus electrode 224 made of a highly conductive metal material is connected to each of the address electrodes 222 to reduce line resistance. It is preferable to be. The bus electrode is also buried by the second dielectric layer 226 together with the address electrode 222. A bridge 225 may be provided between the bus electrode 224 and the address electrode 222 to electrically connect them, and a plurality of bridges may be provided at predetermined intervals along the longitudinal direction of the bus electrode. In addition, the bus electrode may be disposed at a position corresponding to the partition wall 228 so as not to obstruct the transmission of visible light.

The drive of the transmissive plasma display panel manufactured by the plasma display manufacturing method according to the second embodiment of the present invention having such a configuration is largely driven and maintained for address discharge as in the plasma display panel manufactured by the first embodiment. It is divided into driving for discharging. The address discharge is the sustain electrode of any one of the sustain electrode pairs 213 and 214 disposed on the back substrate formed by assembling the address electrode 226 disposed on the front substrate 220 and the unit back substrates 210a, 210b, and 210c. Between 214, where wall charges are formed. The sustain discharge is caused by the potential difference between the pair of sustain electrodes 213 and 214 located in the discharge cell 230 in which the wall charges are formed. The fluorescent layer 229 of the discharge cell 230 is excited by ultraviolet rays generated from the discharge gas during the sustain discharge, and visible light is emitted, and the visible light penetrates the phosphor layer 229 and the front substrate 220. As it exits, it forms an image that the user can recognize.

As described above, according to the present invention, when a conventional plasma display panel rear substrate is formed on a substrate made of one glass, a laminated structure is formed to form a rear substrate side and assembled with the front substrate side, only a part of the rear substrate is used. Correcting that there was a disadvantage that the entire back substrate could not be used even when a defect occurred, and it was not composed of one board of the back board, but formed of an assembly of a plurality of small boards. Since there is no need to replace the entire back substrate, there is an advantage that can dramatically reduce the efficiency and manufacturing cost according to the treatment of defective products during assembly.

In addition, the assembled back substrate according to the present invention is formed using a material of metal or plastic rather than a glass substrate, so it is easy to assemble a partial substrate of each back substrate and has an advantage of forming an additional shape on the substrate. have.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (11)

A method of manufacturing a plasma display panel by fabricating a front substrate side and a back substrate side and sealing each other on the basis of a plurality of partition walls partitioning discharge cells formed therebetween. Producing the back substrate side, Assembling a plurality of unit back substrates to form a back substrate; Forming a planarization film on an upper surface of the assembled back substrate; Forming a sustain electrode pair on an upper surface of the planarization film; Forming a dielectric layer to bury the sustain electrode pair on an upper surface of the back substrate on which the sustain electrode pair is formed; And forming a protective film on an upper surface of the dielectric layer. The method of claim 1, And a back substrate formed by assembling the plurality of unit back substrates is flat. The method of claim 2, The assembly line between the plurality of unit back substrates in the back substrate assembled with a plurality of unit back substrate is formed in a position corresponding to the partition wall plasma display panel manufacturing method. The method of claim 1, And said back substrate is made of a metallic material. The method of claim 1, And said back substrate is made of a plastic material. delete delete delete A method of manufacturing a plasma display panel by fabricating a front substrate side and a back substrate side and sealing each other on the basis of a plurality of partition walls partitioning discharge cells formed therebetween. Producing the back substrate side, Preparing a plurality of unit back substrates; Forming a sustain electrode pair on an upper surface of each unit back substrate; Forming a dielectric layer filling the sustain electrode pair on the upper surface of each unit back substrate on which the sustain electrode pair is formed; Forming a protective film on an upper surface of each dielectric layer; Assembling each unit back substrate of the laminated structure to each other, The unit back substrate is a plasma display panel manufacturing method, characterized in that made of a metal material. A method of manufacturing a plasma display panel by fabricating a front substrate side and a back substrate side and sealing each other on the basis of a plurality of partition walls partitioning discharge cells formed therebetween. Producing the back substrate side, Preparing a plurality of unit back substrates; Forming a sustain electrode pair on an upper surface of each unit back substrate; Forming a dielectric layer filling the sustain electrode pair on the upper surface of each unit back substrate on which the sustain electrode pair is formed; Forming a protective film on an upper surface of each dielectric layer; Assembling each unit back substrate of the laminated structure to each other, The unit back substrate is a plasma display panel manufacturing method, characterized in that made of a plastic material. A plasma display panel manufactured by the method of any one of claims 1 to 5, 9 or 10.

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