KR100680569B1 - Pattern processing method of light guide plate - Google Patents
Pattern processing method of light guide plate Download PDFInfo
- Publication number
- KR100680569B1 KR100680569B1 KR1020040088531A KR20040088531A KR100680569B1 KR 100680569 B1 KR100680569 B1 KR 100680569B1 KR 1020040088531 A KR1020040088531 A KR 1020040088531A KR 20040088531 A KR20040088531 A KR 20040088531A KR 100680569 B1 KR100680569 B1 KR 100680569B1
- Authority
- KR
- South Korea
- Prior art keywords
- pattern
- guide plate
- light guide
- processing
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0036—2-D arrangement of prisms, protrusions, indentations or roughened surfaces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Planar Illumination Modules (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Light Guides In General And Applications Therefor (AREA)
Abstract
본 발명이 이루고자 하는 기술적 과제는 가공면을 직접 타격하여 다양한 형태와 크기의 패턴을 가장 빠른 시간 내에 효율적으로 제조할 수 있도록 하기위한 것이다.The technical problem to be achieved by the present invention is to hit the processing surface directly to be able to efficiently produce a pattern of various shapes and sizes in the fastest time.
본 발명의 기술적 과제는 설계된 패턴의 위치, 사이즈 데이터와 이에 대응되는 타격력 데이터를 다이아몬드 팁을 갖는 타격장치에 입력하여 패턴을 형성하는 단계; 가공면을 마이크로스코프로 확인하여 이상이 있는 경우 가공면을 연마기로 밀어내고 가공조건을 조절한후 재가공 하는 타격 방식에 의한 도광판의 패턴 가공 방법과 이에 사용되는 다양한 형태의 팁이 장착되는 타격방식 가공 장치에 의하여 달성되어진다.Technical problem of the present invention comprises the steps of forming a pattern by inputting the position, the size data of the designed pattern and the striking force data corresponding thereto to the striking device having a diamond tip; If there is a problem by checking the machining surface with a microscope, the pattern processing method of the light guide plate by the hitting method which pushes the machining surface with a grinder, adjusts the processing conditions, and reprocesses, and the machining of the impact method equipped with various types of tips used therein. Achieved by the device.
도광판, 패턴Light guide plate pattern
Description
도 1은 본 발명의 패턴 가공 방법을 설명하기 위한 도면1 is a view for explaining the pattern processing method of the present invention.
도 2는 본 발명에 있어서 타격력에 따른 패턴 가공깊이 및 사이즈 변화를 보인 도면2 is a view showing a pattern processing depth and size change according to the impact force in the present invention
도 3은 본 발명에 있어서 팁 각도에 따른 패턴 변화를 보인 도면3 is a view showing a pattern change according to the tip angle in the present invention
도 4는 본 발명에 있어서 팁 형상에 따른 패턴의 모양 변화를 보인 도면Figure 4 is a view showing the shape change of the pattern according to the tip shape in the present invention
본 발명은 타격 방식에 의한 도광판의 패턴 가공 방법에 관한 것으로 특히 팁을 사용하여 가공면을 직접 타격하여 다양한 형태의 패턴을 가장 빠른 시간 내에 효율적으로 제조할 수 있도록 하기 위한 것이다.The present invention relates to a pattern processing method of a light guide plate by a hit method, in particular to be able to efficiently produce various types of patterns in the fastest time by directly hitting the processing surface using a tip.
일반적으로 알려진 패턴 구현 방식으로는 다음과 같은 것들이 있다.Commonly known pattern implementations include:
1) 도광판을 사출을 위한 금형의 코아에 원하는 패턴 모양대로 부식을 진행하여 코아를 완성하는 부식방식1) Corrosion method that completes core by corroding light guide plate to mold core for injection
2) 도금처리된 얇은 금속판에 패턴 형상을 새겨 넣고 이를 금형에 부착하여 사출하는 스탬퍼(stamper) 방식2) A stamper method that inscribes a pattern shape on a plated thin metal plate and attaches it to a mold for injection.
3) 다이아몬드 공구를 사용하여 도광판 표면에 V자 형태의 그루브 패턴을 만드는 절삭 방식3) Cutting method to make V-shaped groove pattern on the surface of LGP using a diamond tool
4) 도광판 표면에 레이저를 발사하여 패턴을 새겨 넣는 레이저 방식4) Laser method to engrave a pattern by firing a laser on the light guide plate surface
그러나 부식 방식은 균일한 부식 깊이 및 형상의 제어에 한계가 있으며 사출후 패턴 수정 및 보완을 하기 위해서는 많은 시간이 소요되는 문제점이 있었고, 스탬퍼 방식은 코아의 재질이 연하여 스템퍼의 수명이 짧고 다루는데 특별한 주의가 필요하며 고가이기 때문에 생산 비용이 증가 될 뿐만 아니라 사출후 패턴수정 및 보완을 하기 위해서는 많은 시간이 소요되는 문제점이 있었다.However, the corrosion method has a limitation in controlling the uniform corrosion depth and shape, and there is a problem that it takes a lot of time to correct and supplement the pattern after injection, and the stamper method has a short life of the stamper due to the soft material of the core. Special care is required and expensive, not only increases the production cost, but also has a problem that takes a long time to modify and supplement the pattern after injection.
또한 다이아몬드 공구를 이용한 절삭 방식은 불량률이 높고 취급이 어려워 생산성이 저하되는 문제점이 있었으며, 레이저 가공 방식은 생산 비용이 높고 고열에 의해 제품에 변형이 발생됨으로써 생산성 및 수율이 저하되는 문제점이 있었다.In addition, the cutting method using a diamond tool has a problem that the productivity is lowered due to high defect rate and difficult handling, and the laser processing method has a problem in that productivity and yield are reduced due to high production cost and deformation in the product due to high heat.
본 발명이 이루고자 하는 기술적 과제는 팁을 사용하여 가공면을 직접 타격하여 다양한 형태와 크기의 패턴을 가장 빠른 시간 내에 효율적으로 형성할 수 있게 하기 위한 것이다.The technical problem to be achieved by the present invention is to be able to efficiently form a pattern of various shapes and sizes by hitting the processing surface directly using the tip in the fastest time.
본 발명의 기술적 과제는 설계된 패턴의 위치, 사이즈 데이터와 이에 대응되는 타격력 데이터를 다이아몬드 팁을 갖는 타격장치에 입력하여 경면을 이루는 가공면을 타격함으로써 패턴을 형성하는 단계; 가공면을 마이크로스코프로 확인하여 이상이 있는 경우 가공면을 연마기로 밀어내고 가공조건을 조절한후 재가공 하는 타격방식에 의한 도광판의 패턴 가공 방법과 이에 사용되는 다양한 형태의 팁을 갖는 가공 장치에 의하여 달성되어진다.Technical problem of the present invention comprises the steps of forming a pattern by hitting the machining surface forming a mirror surface by inputting the position, size data and the corresponding force data of the designed pattern to the striking device having a diamond tip; If there is an error by checking the machining surface with a microscope, the pattern processing method of the light guide plate by the blow method which pushes the machining surface with the grinder, adjusts the machining conditions, and then reprocesses, and the machining device having various types of tips used therein Is achieved.
본 발명의 바람직한 실시예를 첨부 도면에 의거 상세히 설명하면 다음과 같다.Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 도광판의 패턴 가공 방법을 설명하기 위한 도면이다.1 is a view for explaining the pattern processing method of the light guide plate of the present invention.
본 발명은 설계된 패턴의 위치, 패턴의 사이즈 데이터와 이에 대응되는 타격력 데이터를 팁을 갖는 타격장치에 입력하여 경면을 이루는 가공면을 타격함으로써 패턴을 형성하는 단계; 가공면을 마이크로스코프(Microscope)로 확인하여 이상이 있는 경우 가공면을 연마기로 밀어내고 가공조건을 조절한후 재가공 하는 단계;로 이루어진 도광판의 패턴 가공 방법에 관한 것이다.The present invention comprises the steps of forming a pattern by hitting the machining surface forming a mirror surface by inputting the position of the designed pattern, the size data of the pattern and the corresponding force data corresponding to the tip; Checking the machining surface with a microscope (Microscope), if there is an abnormality pushes the machining surface with a polishing machine, and adjusting the processing conditions and then rework; relates to a pattern processing method of a light guide plate consisting of.
가공면을 타격하는 타격장치의 팁은 단결정의 공업용 다이아몬드 또는 로크웰경도로 91 이상인 탄화텅스텐 계열의 초경합금이 사용된다.The tip of the striking device that strikes the machined surface is a single crystal industrial diamond or tungsten carbide series cemented carbide with Rockwell hardness of 91 or more.
도광판에 패턴이 양각으로 형성되는 방식에서 팁이 타격하는 가공면은 사출 코아가 되며, 패턴이 음각으로 형성되는 방식에서는 가공면이 도광판 자체가 된다.In the manner in which the pattern is embossed on the light guide plate, the machining surface hit by the tip becomes an injection core, and in the manner in which the pattern is intaglio is formed, the processing surface becomes the light guide plate itself.
도광판과 사출 코아는 열처리된 고강도의 스테이박스(Stavax) 재질의 것을 사용하며, 도광판 또는 사출 코아의 가공면은 난반사를 최대한 억제하며 손실을 감소시켜 최상의 광효율을 얻을 수 있도록 형상정밀도(PV)가 2㎛이하가 되도록 경면 처리 한다.The light guide plate and the injection core are made of heat-treated high strength Stavax material, and the processed surface of the light guide plate or the injection core has the shape precision (PV) of 2 to minimize the diffuse reflection and reduce the loss to obtain the best light efficiency. Mirror the surface to be less than or equal to
가공면이 갖는 정밀도는 도광판의 휘도 및 균일도에 직결되며, 가공면을 연마 가공하여 경면화 한다는 것은 궁극적으로 설계된 패턴에 가장 가까운 제품을 얻 을 수 있게 하는 기본적인 조건이 된다.The precision of the machined surface is directly related to the brightness and uniformity of the light guide plate, and polishing the machined surface by mirroring it becomes the basic condition that ultimately obtains the product closest to the designed pattern.
도 2는 본 발명의 도광판의 패턴 가공 장치에 장착되는 팁의 타격력에 따른 패턴의 가공깊이를 보인 도면으로써, 도시된 바와 같이 팁의 타격력과 가공깊이는 비례하게 되며, 타격 장치는 팁의 타격력에 대응하는 가공깊이, 패턴사이즈에 대한 데이터를 갖는다.2 is a view showing the processing depth of the pattern according to the impact force of the tip mounted on the pattern processing apparatus of the light guide plate of the present invention, as shown, the impact force and the processing depth of the tip is proportional, the impact device is to the impact force of the tip It has data on the corresponding processing depth and pattern size.
도 3은 도 2와 같이 팁의 모양이 V자형을 이루더라도 각도에 따라 패턴의 사이즈가 달라지는 상태를 보인 도면이고, 도 4는 팁 모양이 원형, 마름형, 오각형, 육각형 등으로 다양하게 구성된 상태를 보인 도면이다.3 is a view showing a state in which the size of the pattern is different depending on the angle even if the shape of the tip is V-shaped, as shown in Figure 2, Figure 4 is a state in which the tip shape is variously composed of a circle, a diamond, a pentagon, a hexagon Figure is shown.
이렇게 팁을 바꿔주는 것만으로 다양한 모양의 패턴을 구현할 수 있다는 것은 가공 조건 때문에 패턴의 모양이 원형, 마름모로 제한되어 패턴 설계에 영향을 미치는 종래의 방법과는 달리 본 발명은 패턴 설계시 패턴의 모양에 제한을 받지 않게 된다는 잇점이 있다.In this way, the shape of the pattern can be realized only by changing the tip. Unlike the conventional method in which the shape of the pattern is limited to circular or rhombus due to the processing conditions, and thus affects the pattern design, the present invention has a shape of the pattern in the pattern design. The advantage is that it is not restricted.
팁의 끝부분이 구형인 경우에도 곡률을 달리하는 것만으로 패턴의 가공깊이, 사이즈가 다른 패턴을 구현할 수 있다.Even if the tip of the tip is spherical, by changing the curvature, it is possible to realize a pattern having a different processing depth and size.
이와같이 본 발명은 팁을 바꿔주는 것만으로 다양한 형태의 패턴을 설계하고 시도해 볼 수 있도록 함으로써 최적의 광효율을 갖는 도광판을 제작하는데 크게 기여할 수 있을 것으로 기대한다.As such, the present invention is expected to contribute greatly to manufacturing a light guide plate having an optimal light efficiency by designing and attempting various types of patterns by changing the tip.
본 발명은 설계된 패턴이 갖는 광효율이 마이크로스코프로 확인한 결과 기대에 미치지 못할 경우 가공면을 연마기로 밀어내 경면처리 한후 타격장치의 타격력을 조절하거나 팁의 각도, 타격 간격의 조절 등에 따라 패턴의 깊이 및 사이즈, 밀 도 조절을 간편하게 조절할 수 있어 설계와 시뮬레이션에 의한 결과와 가장 근접한 도광판을 가장 빠른 시간에 제작할 수 있다.According to the present invention, when the light efficiency of the designed pattern does not meet the expectations as confirmed by the microscope, the surface of the pattern is adjusted according to the adjustment of the force of the striking device or the angle of the tip, the distance of the striking after the mirror surface treatment by pushing the machining surface with a polishing machine. Easy adjustment of size and density control enables the fastest time to manufacture a light guide plate closest to the results of design and simulation.
또한 본 발명은 기 입력된 패턴 데이터 및 팁의 타격력 데이터에 의해 동일한 조건하에서 패턴이 가공되기 때문에 항상 동일한 패턴를 가공할 수 있으며, 본원출원인이 실시해 본 결과 2.0"의 소형 코아의 경우 1시간 이내에 패턴 작업을 완료할 수 있었다.In addition, the present invention can process the same pattern at all times because the pattern is processed under the same conditions by the pre-input pattern data and the impact force data of the tip. Could finish.
아래 표는 동일한 디자인으로 설계된 패턴을 부식방식과 본 발명의 타격방식으로 제작한 코아로 도광판을 사출하여 측정한 광특성 비교표이다.The following table is an optical characteristic comparison table measured by injecting a light guide plate with a core designed by the corrosion method and the striking method of the present invention.
비교예 1)Comparative Example 1)
비교예 2)Comparative Example 2)
위 비교예 1,2에서 확인되는 바와 같이 본 발명의 타격 방식은 종래의 부식방식과 대비할 때 균일도에서 8∼10%의 향상된 결과를 얻을 수 있었다.As confirmed in Comparative Examples 1 and 2, the hitting method of the present invention was able to obtain an improved result of 8 to 10% in uniformity as compared with the conventional corrosion method.
이와같이 본 발명은 팁을 정밀하게 연삭 가공으로 경면처리된 가공면에 설계된 패턴에 대하여 데이터화된 타격력으로 타격을 가해 가장 빠른 시간내에 광효율이 우수한 패턴을 가공할 수 있게 함으로써 다음과 같은 효과를 갖도록 한것이다.In this way, the present invention is to apply the impact to the pattern designed on the mirror-finished processing surface by precise grinding, so that it can process the pattern with excellent light efficiency in the fastest time by applying the impact to the data designed impact force .
첫째, 팁을 사용하여 코아의 가공면을 직접 타격하기 때문에 패턴의 가공면의 조도가 거의 경면에 가깝게 가공되어 난반사를 최대한 억제하며 손실을 감소시켜 최상의 광효율을 얻을 수 있게 된다.First, because the tip directly hits the machining surface of the core, the roughness of the processing surface of the pattern is processed almost close to the mirror surface, thereby suppressing diffuse reflection as much as possible and reducing losses to obtain the best light efficiency.
둘째, 타격을 가하는 팁의 모양에 따라 다양한 형상과 사이즈를 갖는 패턴을 가공할 수 있어 그 만큼 다양한 형태의 패턴 설계를 시도해 볼 수 있게 된다.Second, it is possible to process a pattern having a variety of shapes and sizes depending on the shape of the tip to strike, it is possible to try a variety of patterns design.
셋째, 열처리된 고강도의 도광판 또는 사출 코아에 패턴을 직접 가공 함으로써 내구성이 향상되며 이에 따른 생산비용도 대폭 절감된다.Third, by directly processing the pattern on the heat-treated high-strength light guide plate or injection core, the durability is improved and the production cost is greatly reduced accordingly.
넷째, 동일한 팁으로 기 입력된 데이터를 이용하여 타격을 가함으로써 항상 동일한 패턴을 가공 할 수 있으며, 가공공수가 적어 가공시간이 단축된다.Fourth, the same pattern can always be processed by hitting the data using the data already input with the same tip.
다섯째, 타격력의 조절하는 것만으로 패턴의 깊이, 사이즈, 밀도를 용이하게 조절할 수 있어 설계와 시뮬레이현에 의한 결과와 가장 근접한 도광판을 가장 빠른 시간 내에 제작할 수 있는 등의 효과가 있는 것이다.Fifth, the depth, size, and density of the pattern can be easily adjusted by simply adjusting the striking force, so that the light guide plate closest to the result of the design and simulation can be manufactured in the fastest time.
이상에서는 본 발명을 바람직한 실시예에 한정하여 설명하였으나 여기에 한정되는 것은 아니며, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 다양한 변형 실시가 가능함은 물론이다.In the above, the present invention has been limited to the preferred embodiments, but the present invention is not limited thereto, and various modifications can be made without departing from the technical spirit of the present invention.
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040088531A KR100680569B1 (en) | 2004-11-02 | 2004-11-02 | Pattern processing method of light guide plate |
JP2004364566A JP4061600B2 (en) | 2004-11-02 | 2004-12-16 | Pattern processing method for light guide plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040088531A KR100680569B1 (en) | 2004-11-02 | 2004-11-02 | Pattern processing method of light guide plate |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060039956A KR20060039956A (en) | 2006-05-10 |
KR100680569B1 true KR100680569B1 (en) | 2007-02-08 |
Family
ID=36727293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040088531A Expired - Fee Related KR100680569B1 (en) | 2004-11-02 | 2004-11-02 | Pattern processing method of light guide plate |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4061600B2 (en) |
KR (1) | KR100680569B1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101117740B1 (en) * | 2010-05-03 | 2012-03-13 | 양희제 | Apparatus for making a additional pattern for a light guide plate |
WO2015067386A1 (en) * | 2013-11-06 | 2015-05-14 | The Swatch Group Research And Development Ltd | Method for manufacturing a light guide to light a display device, and light guide thus obtained |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1153922A (en) | 1997-08-07 | 1999-02-26 | Copal Co Ltd | Manufacture of light guide member |
KR20030013887A (en) * | 2001-08-10 | 2003-02-15 | 주식회사 인펙 코리아 | Production equipment for wave-guide, and its operating method |
JP2003195057A (en) | 2001-12-25 | 2003-07-09 | Towa Corp | Light guide plate forming method and light guide plate |
KR20040020695A (en) * | 2002-08-31 | 2004-03-09 | 주식회사 솔빛텔레콤 | Method for manufacturing the Light Guide Plate |
-
2004
- 2004-11-02 KR KR1020040088531A patent/KR100680569B1/en not_active Expired - Fee Related
- 2004-12-16 JP JP2004364566A patent/JP4061600B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1153922A (en) | 1997-08-07 | 1999-02-26 | Copal Co Ltd | Manufacture of light guide member |
KR20030013887A (en) * | 2001-08-10 | 2003-02-15 | 주식회사 인펙 코리아 | Production equipment for wave-guide, and its operating method |
JP2003195057A (en) | 2001-12-25 | 2003-07-09 | Towa Corp | Light guide plate forming method and light guide plate |
KR20040020695A (en) * | 2002-08-31 | 2004-03-09 | 주식회사 솔빛텔레콤 | Method for manufacturing the Light Guide Plate |
Also Published As
Publication number | Publication date |
---|---|
JP2006133713A (en) | 2006-05-25 |
JP4061600B2 (en) | 2008-03-19 |
KR20060039956A (en) | 2006-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5414536B2 (en) | Cutting disc for forming scribe lines | |
US20080110869A1 (en) | Method of machining mold surface using laser | |
JP2012006135A (en) | End mill and manufacturing method therefor | |
CN102310315B (en) | Flat machine triangle processing technology | |
RU2009104747A (en) | METHOD FOR MANUFACTURING THE LATTICE OF ABERRATION OPTICAL ELEMENTS | |
CN101318357A (en) | Jewel/jade processing method | |
JP6616094B2 (en) | Method for manufacturing protective film | |
KR100680569B1 (en) | Pattern processing method of light guide plate | |
CN110744205B (en) | Laser depth marking method for titanium-based multilayer composite material | |
WO2025067080A1 (en) | Manufacturing method for light guide structure, and light guide structure | |
JP2005298312A (en) | Microprocessing method for glass and microprocessed glass | |
CN105965045B (en) | A kind of chip-breaker cutter and processing method | |
US11555225B2 (en) | Methods of manufacturing hypoid gears | |
JP2015223794A (en) | Manufacturing method of mold parts | |
CN108583043B (en) | Processing method and transfer printing method of anti-counterfeiting pressing die | |
CN104907616A (en) | Integral quenched steel corner back gouging test piece and high-speed milling process method thereof | |
JP3938540B2 (en) | Method and apparatus for grinding mold of microlens array | |
JP5908367B2 (en) | Manufacturing method of mold for optical member manufacturing | |
TWM544638U (en) | Light guide plate and mold device for shaping same | |
CN110845131B (en) | Cutting method of glass plate and glass plate | |
CN108819300B (en) | Thick-wall part lens mold with microstructure and processing method thereof | |
Peeters et al. | Selective laser hardening of injection mould components on multi-axis machining centers | |
CN108274647B (en) | Self-adaptive trimming tool rest for cutting monocrystalline material and cutting method | |
JP4813395B2 (en) | Method for roughening flange surface of lens and mold for lens molding | |
JP4409402B2 (en) | Manufacturing method of light guide for surface light source device and cutting tool used therefor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
AMND | Amendment | ||
E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
J201 | Request for trial against refusal decision | ||
PJ0201 | Trial against decision of rejection |
St.27 status event code: A-3-3-V10-V11-apl-PJ0201 |
|
AMND | Amendment | ||
E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
PB0901 | Examination by re-examination before a trial |
St.27 status event code: A-6-3-E10-E12-rex-PB0901 |
|
B701 | Decision to grant | ||
PB0701 | Decision of registration after re-examination before a trial |
St.27 status event code: A-3-4-F10-F13-rex-PB0701 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
PR1002 | Payment of registration fee |
Fee payment year number: 1 St.27 status event code: A-2-2-U10-U11-oth-PR1002 |
|
PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 4 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 5 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 6 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
FPAY | Annual fee payment |
Payment date: 20130122 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 7 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 St.27 status event code: A-5-5-R10-R13-asn-PN2301 |
|
PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 St.27 status event code: A-5-5-R10-R13-asn-PN2301 |
|
FPAY | Annual fee payment |
Payment date: 20131127 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 8 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
P14-X000 | Amendment of ip right document requested |
St.27 status event code: A-5-5-P10-P14-nap-X000 |
|
FPAY | Annual fee payment |
Payment date: 20141229 Year of fee payment: 9 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 9 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
FPAY | Annual fee payment |
Payment date: 20160129 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 10 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
FPAY | Annual fee payment |
Payment date: 20170201 Year of fee payment: 11 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 11 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
P14-X000 | Amendment of ip right document requested |
St.27 status event code: A-5-5-P10-P14-nap-X000 |
|
FPAY | Annual fee payment |
Payment date: 20180202 Year of fee payment: 12 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 12 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
P14-X000 | Amendment of ip right document requested |
St.27 status event code: A-5-5-P10-P14-nap-X000 |
|
FPAY | Annual fee payment |
Payment date: 20190207 Year of fee payment: 13 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 13 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
R17-X000 | Change to representative recorded |
St.27 status event code: A-5-5-R10-R17-oth-X000 |
|
FPAY | Annual fee payment |
Payment date: 20200103 Year of fee payment: 14 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 14 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 15 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
PR1001 | Payment of annual fee |
Fee payment year number: 16 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
PC1903 | Unpaid annual fee |
Not in force date: 20230203 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE St.27 status event code: A-4-4-U10-U13-oth-PC1903 |
|
P14-X000 | Amendment of ip right document requested |
St.27 status event code: A-5-5-P10-P14-nap-X000 |
|
P14-X000 | Amendment of ip right document requested |
St.27 status event code: A-5-5-P10-P14-nap-X000 |
|
PC1903 | Unpaid annual fee |
Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20230203 St.27 status event code: N-4-6-H10-H13-oth-PC1903 |
|
R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |