KR100673777B1 - Polyphenylene sulfide thermoplastic resin composition and molded article thereof - Google Patents
Polyphenylene sulfide thermoplastic resin composition and molded article thereof Download PDFInfo
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- KR100673777B1 KR100673777B1 KR1020050134884A KR20050134884A KR100673777B1 KR 100673777 B1 KR100673777 B1 KR 100673777B1 KR 1020050134884 A KR1020050134884 A KR 1020050134884A KR 20050134884 A KR20050134884 A KR 20050134884A KR 100673777 B1 KR100673777 B1 KR 100673777B1
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- polyphenylene sulfide
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- 239000004734 Polyphenylene sulfide Substances 0.000 title claims abstract description 53
- 229920000069 polyphenylene sulfide Polymers 0.000 title claims abstract description 53
- 239000011342 resin composition Substances 0.000 title claims abstract description 50
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 75
- 239000011347 resin Substances 0.000 claims abstract description 75
- 239000004695 Polyether sulfone Substances 0.000 claims abstract description 22
- 229920006393 polyether sulfone Polymers 0.000 claims abstract description 22
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 18
- -1 aminopropyl group Chemical group 0.000 claims description 14
- 229910000077 silane Inorganic materials 0.000 claims description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000003063 flame retardant Substances 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 2
- 150000001336 alkenes Chemical group 0.000 claims description 2
- 125000006267 biphenyl group Chemical group 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical group C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000000314 lubricant Substances 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- DCSZWJQOHDKICC-UHFFFAOYSA-N CCO[SiH](OCC)OCC.CCO[SiH](OCC)OCC Chemical compound CCO[SiH](OCC)OCC.CCO[SiH](OCC)OCC DCSZWJQOHDKICC-UHFFFAOYSA-N 0.000 claims 1
- 229920000491 Polyphenylsulfone Polymers 0.000 claims 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 10
- 150000001282 organosilanes Chemical class 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000002485 combustion reaction Methods 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 239000000155 melt Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- GPAPPPVRLPGFEQ-UHFFFAOYSA-N 4,4'-dichlorodiphenyl sulfone Chemical compound C1=CC(Cl)=CC=C1S(=O)(=O)C1=CC=C(Cl)C=C1 GPAPPPVRLPGFEQ-UHFFFAOYSA-N 0.000 description 1
- KSYGTCNPCHQRKM-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KSYGTCNPCHQRKM-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 241000220259 Raphanus Species 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 235000019395 ammonium persulphate Nutrition 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000007942 carboxylates Chemical group 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229940125773 compound 10 Drugs 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Chemical group 0.000 description 1
- 239000002184 metal Chemical group 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000019394 potassium persulphate Nutrition 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/04—Polysulfides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
- C08L23/28—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment by reaction with halogens or halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/22—Thermoplastic resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 폴리페닐렌 설파이드 수지 및 이와 비상용성인 폴리에테르 술폰 수지로 구성된 수지조성물에 유기 실란계 상용화제 및 불소화 폴리올레핀계 수지를 첨가하여 제조되는 것을 특징으로 하는 폴리페닐렌 설파이드 열가소성 수지조성물 및 이로부터 제조된 성형품이 제공되는 것으로 상용성, 강성, 외관, 충격 강도 및 난연성이 우수한 특성을 가지고 있어, 이러한 특성이 요구되는 전기전자기기 부품, 자동차용 부품, 또는 화학기기 부품 등에 유용하게 사용될 수 있다. The present invention is prepared by adding an organosilane compatibilizer and a fluorinated polyolefin resin to a resin composition composed of a polyphenylene sulfide resin and a polyether sulfone resin which is incompatible with the polyphenylene sulfide resin, and a polyphenylene sulfide thermoplastic resin composition Since the molded article is provided, it has excellent compatibility, rigidity, appearance, impact strength, and flame retardancy, and thus may be usefully used in electrical and electronic device parts, automotive parts, or chemical device parts requiring such properties.
Description
본 발명은 상용성, 난연성이 향상된 폴리페닐렌 설파이드 열가소성 수지조성물 및 그 성형품에 관한 것으로 보다 상세하게는, 기계적 강도 및 난연성, 내화학성이 우수한 폴리페닐렌 설파이드 수지와 우수한 내열성, 고강성의 특성을 지닌 폴리에테르 술폰의 블렌드에 유기 실란계(Organic silane) 화합물과 불소화 폴리올레핀계 수지를 첨가하여 이들의 상용성을 극대화 시킴과 동시에 난연성을 크게 개선시킨 폴리페닐렌 설파이드 열가소성 수지조성물 및 그 성형품에 관한 것이다.The present invention relates to a polyphenylene sulfide thermoplastic resin composition and its molded article having improved compatibility and flame retardancy, and more particularly, to a polyphenylene sulfide resin having excellent mechanical strength, flame retardancy, and chemical resistance, and excellent heat resistance and high rigidity characteristics. The present invention relates to a polyphenylene sulfide thermoplastic resin composition and a molded article of which an organic silane compound and a fluorinated polyolefin resin are added to a blend of a polyether sulfone having a maximal compatibility and greatly improved flame retardancy. .
일반적으로 폴리페닐렌 설파이드 수지는 기계적 강도, 내화학성, 난연성, 유동성 등이 우수한 고융점의 내열 수지이다. 그러나, 일반적인 결정성 수지와 마찬가지로 폴리페닐렌 설파이드 수지는 충격에 약하고 부서지기 쉬운 단점이 있어, 최근에는 내열성, 강성, 인성이 우수한 폴리에테르 술폰 수지와 함께 블렌드 함으로써 충격 강도, 내열성이 우수하면서도 난연성이 크게 개선된 폴리페닐렌 설파이드 수지조성물에 대한 연구가 계속되어 왔다.Generally, polyphenylene sulfide resin is a high melting point heat resistant resin having excellent mechanical strength, chemical resistance, flame retardancy, and fluidity. However, like general crystalline resins, polyphenylene sulfide resins are disadvantageous in terms of impact resistance and brittleness. In recent years, polyphenylene sulfide resins are blended together with polyether sulfone resins having excellent heat resistance, rigidity and toughness, and thus have excellent impact strength, heat resistance and flame resistance. There has been a continuing search for greatly improved polyphenylene sulfide resin compositions.
최근 전기전자기기 부품, 자동차기기 부품 또는 화학기기 부품 등의 재료로 서 기계적 강도, 내열성, 난연성, 내화학성 등의 특성이 우수한 기능성 수지가 요구되고 있다. 이러한 요구를 충족시키는 열가소성 수지 중 하나로 폴리페닐렌 설파이드 수지가 있으나, 폴리페닐렌 설파이드 수지는 고온에 있어서의 강성의 저하가 크고, 유리 전이 온도가 약 90°C 정도로 그 자체의 내열성이 좋지 않은 것으로 보고되었다. Recently, functional resins having excellent properties such as mechanical strength, heat resistance, flame resistance, and chemical resistance have been demanded as materials for electric and electronic device parts, automotive device parts, and chemical device parts. One of the thermoplastic resins that satisfies these requirements is polyphenylene sulfide resin, but polyphenylene sulfide resin has a large drop in rigidity at high temperature, and its heat resistance is not good as the glass transition temperature is about 90 ° C. Reported.
상기 문제를 해결하기 위한 방안으로 고함량의 유리섬유 등의 무기 충진제를 사용하여 기계적 강도와 내열도를 높이는 방법이 제시되었으나, 이러한 경우 성형품의 외관이 불량해지는 문제점이 있다.In order to solve the above problem, a method of increasing mechanical strength and heat resistance using an inorganic filler such as glass fiber having a high content has been proposed.
따라서, 폴리페닐렌 설파이드 수지의 물성을 개선하기 위해서 다양한 열가소성 수지와 블렌드 하는 방법이 시도되었으며, 그 중에서 폴리에테르 술폰 수지는 우수한 내열성, 고온 강성, 인성, 치수 안정성의 특성을 지니고 있어 폴리페닐렌 설파이드 수지와 블렌드 하기에 적합한 수지로 널리 이용되어 왔다. Therefore, in order to improve the physical properties of polyphenylene sulfide resin, a method of blending with various thermoplastic resins has been attempted. Among them, polyether sulfone resin has excellent heat resistance, high temperature rigidity, toughness, and dimensional stability, and thus polyphenylene sulfide It has been widely used as a resin suitable for blending with resins.
그러나, 단순한 블렌드 계에서는 두 수지간의 상용성이 불충분하여 압출성이 불량하고, 상분리가 생겨 성형품의 외관도 불량하며, 특히 비보강 수지 제품에서 연소시 수지의 적하 현상이 발생하는 문제점이 있다. However, in a simple blend system, the compatibility between the two resins is insufficient, poor extrudability, the phase separation occurs, and the appearance of the molded product is also poor, in particular, there is a problem that the dropping of the resin during combustion in the non-reinforced resin products.
이러한 문제점을 해결하기 위해 두 수지간의 상용성을 향상시키려는연구가 진행되어 왔다. 예를 들면, 일본 특개소 59-164360에는 노볼락(novolac)형 에폭시(epoxy)수지를 첨가하여 상용성 및 내충격성을 향상시킨 수지조성물이 개시되었고, 일본 특개평 9-3325에는 알칼리 금속염을 상용화제로 사용한 수지조성물이 개시되었다. In order to solve this problem, studies have been conducted to improve compatibility between two resins. For example, Japanese Patent Laid-Open No. 59-164360 discloses a resin composition in which novolak-type epoxy resins are added to improve compatibility and impact resistance, and Japanese Laid-Open Patent Publication No. 9-3325 commercializes alkali metal salts. A resin composition used zero has been disclosed.
그러나 최근에 폴리페닐렌 설파이드 수지 재료에 대한 요구가 구체화되고, 더욱 우수한 기계적 특성, 내열성 및 난연성과 함께 인장신율 특성 등 다양한 물성의 향상을 요구함에 따라 종래의 기술로서는 원하는 수준의 물성을 확보할 수 없는 문제점이 있었다. However, in recent years, the demand for polyphenylene sulfide resin materials has been materialized, and as a result of demanding improvement of various physical properties such as tensile elongation characteristics along with better mechanical properties, heat resistance and flame retardancy, the prior art can secure desired levels of physical properties. There was no problem.
본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로, 본 발명의 목적은 폴리페닐렌 설파이드 수지와 폴리에테르 술폰 수지에 유기 실란계 상용화제 및 불소화 폴리올레핀계 수지를 배합하여 두 수지의 상용성을 극대화시키고, 기계적 강도 및 내화학성 등의 폴리페닐렌 설파이드 수지 본래의 특성을 유지하면서 내충격성, 내열성, 신율 등의 물성이 향상된 폴리페닐렌 설파이드 열가소성 수지조성물을 제공하는 것이다.The present invention has been made to solve the above problems, and an object of the present invention is to combine the organic silane-based compatibilizer and fluorinated polyolefin-based resin in polyphenylene sulfide resin and polyether sulfone resin for compatibility of the two resins. The present invention provides a polyphenylene sulfide thermoplastic resin composition which maximizes physical properties such as impact resistance, heat resistance, and elongation while maintaining original properties of polyphenylene sulfide resin such as mechanical strength and chemical resistance.
본 발명의 다른 목적은 상기 폴리페닐렌 설파이드 열가소성 수지조성물로 제조되어 외관 및 난연성이 향상된 폴리페닐렌 설파이드 열가소성 수지조성물의 성형품을 제공하는 것이다.Another object of the present invention is to provide a molded article of the polyphenylene sulfide thermoplastic resin composition prepared by the polyphenylene sulfide thermoplastic resin composition improved appearance and flame retardancy.
본 발명의 그 밖의 목적, 특정한 장점 및 신규한 특징들은 이하의 발명의 상세한 설명과 바람직한 실시예로부터 더욱 분명해질 것이다.Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description of the invention and the preferred embodiments.
상기 목적을 달성하기 위한 본 발명의 하나의 양상은 One aspect of the present invention for achieving the above object is
(A) 폴리페닐렌 설파이드 수지 0.1~30 중량부; 및(A) 0.1 to 30 parts by weight of polyphenylene sulfide resin; And
(B) 폴리에테르 술폰 수지 70~99.9 중량부로 구성되는 수지 조성물 100중량 부에 대하여 (B) To 100 parts by weight of the resin composition composed of 70 to 99.9 parts by weight of polyether sulfone resin
(C) 유기 실란계 상용화제 0.01~10 중량부; (C) 0.01 to 10 parts by weight of an organic silane compatibilizer;
(D) 불소화 폴리올레핀계 수지 0.01~10 중량부; 0.01 to 10 parts by weight of (D) fluorinated polyolefin resin;
를 포함하는 것을 특징으로 하는 폴리페닐렌 설파이드 열가소성 수지조성물에 관계한다.It relates to a polyphenylene sulfide thermoplastic resin composition comprising a.
이하, 본 발명의 열가소성 수지조성물의 각 성분인 (A) 폴리페닐렌 설파이드 수지, (B) 폴리에테르 술폰 수지, (C) 유기 실란계 상용화제 및(D) 불소화 폴리올레핀계 수지에 대하여 상세히 설명한다.Hereinafter, (A) polyphenylene sulfide resin, (B) polyether sulfone resin, (C) organic silane compatibilizer and (D) fluorinated polyolefin resin which are each component of the thermoplastic resin composition of this invention are demonstrated in detail. .
(A) 폴리페닐렌 설파이드 수지(A) polyphenylene sulfide resin
본 발명의 수지조성물에 사용되는 폴리페닐렌 수지는 하기 [화학식 1]로 표시되는 구조 단위를 70몰% 이상 함유한 폴리페닐렌 수지인 것이 바람직하다. 이 반복 단위를 70몰% 이상 함유한 경우, 결정성 폴리머의 특징인 결정화도가 높고, 내열성, 내약품성 및 강도에서도 뛰어나기 때문이다.It is preferable that the polyphenylene resin used for the resin composition of this invention is a polyphenylene resin which contains 70 mol% or more of structural units represented by following [Formula 1]. When 70 mol% or more of this repeating unit is contained, it is because crystallinity which is a characteristic of a crystalline polymer is high, and it is excellent also in heat resistance, chemical resistance, and strength.
[화학식 1][Formula 1]
폴리페닐렌 설파이드 수지는 그 제조 방법에 따라 분지 또는 가교 구조를 갖지 않는 선형 분자구조, 또는 분지나 가교를 갖는 분자구조일 수 있지만 본 발명에 있어서는 그 어느 쪽 구조라도 무방하다. 가교형 폴리페닐렌 설파이드 수지의 대표 적인 제조 방법은 일본 특공소 45-3368호에, 선형 폴리페닐렌 설파이드 수지의 대표적인 제조 방법은 일본 특공소 52-12240에 각각 개시되어 있다. 이러한 폴리페닐렌 설파이드 수지는 하기 [화학식2]~[화학식 9]로 표시되는 다른 공중합 구성 단위를 50몰%미만, 바람직하게는 30몰%미만 포함할 수 있다.The polyphenylene sulfide resin may be a linear molecular structure having no branched or crosslinked structure or a molecular structure having a branched or crosslinked structure depending on the production method thereof, but any structure may be used in the present invention. Representative methods for producing crosslinked polyphenylene sulfide resins are disclosed in Japanese Patent Application No. 45-3368, and representative methods for producing linear polyphenylene sulfide resins are disclosed in Japanese Patent Application No. 52-12240. Such polyphenylene sulfide resin may contain less than 50 mol%, preferably less than 30 mol% of other copolymerized structural units represented by the following [Formula 2] to [Formula 9].
[화학식 2][Formula 2]
[화학식 3][Formula 3]
[화학식 4] [Formula 4]
[화학식 5] [Formula 5]
[화학식 6][Formula 6]
[화학식 7][Formula 7]
(상기 식 중, R은 알킬기, 니트로기, 페닐기, 알콕시기, 카르복실기 또는 메 탈 카르복실레이트기 임)(Wherein R is an alkyl group, nitro group, phenyl group, alkoxy group, carboxyl group or metal carboxylate group)
[화학식 8][Formula 8]
[화학식 9] [Formula 9]
열안정성이나 작업성을 고려하여 폴리페닐렌 설파이드 수지조성물은 2.16 kg의 하중하, 316℃에서 용융지수(MI)가 10 ~ 300 g/10분인 것이 바람직하다. 용융지수가 10 g/10분 미만인 경우 혼련성 및 사출 공정시 작업성 저하가 문제되고, 300 g/10분을 초과하는 경우 강도 저하의 문제가 발생한다.In consideration of thermal stability and workability, the polyphenylene sulfide resin composition preferably has a melt index (MI) of 10 to 300 g / 10 min at 316 ° C. under a load of 2.16 kg. If the melt index is less than 10 g / 10 minutes, the workability during the kneading and injection process is a problem, and when the melt index exceeds 300 g / 10 minutes, a problem of strength decreases.
본 발명의 수지조성물에 있어서, 폴리페닐렌 설파이드 수지는 바람직하게는 0.1~30 중량부, 더욱 바람직하게는 10~30 중량부 범위로 사용한다0.1 중량부 미만인 경우 수지의 흐름성이 떨어져 압출 및 사출시 가공성이 저하될 수 있으며, 30 중량부를 초과하는 경우 내열성이 낮아져 고온에서 열변형이 되기 쉽다. In the resin composition of the present invention, the polyphenylene sulfide resin is preferably used in the range of 0.1 to 30 parts by weight, more preferably in the range of 10 to 30 parts by weight. When the workability may be lowered, and if it exceeds 30 parts by weight, the heat resistance is lowered, which tends to become thermal deformation at a high temperature.
(B) 폴리에테르 술폰 수지(B) polyether sulfone resin
본 발명에 사용되는 폴리에테르 술폰 수지는 어느 한 곳에 하나 이상의 파라 페닐렌기가 위치하고, 다른 곳에는 비페닐(biphenyl)기 또는 페닐 에테르기가 위치하는 공중합체를 포함하는 것을 특징으로 한다. The polyether sulfone resin used in the present invention is characterized in that it comprises a copolymer in which at least one para phenylene group is located at one place and a biphenyl group or a phenyl ether group is located at another place.
구체적으로 폴리에테르 술폰 수지는 [화학식 10]~[화학식 25]로 표시되는 화합물로 구성된 군으로부터 선택된 어느 하나인 것을 특징으로 한다.Specifically, the polyether sulfone resin is characterized in that it is any one selected from the group consisting of compounds represented by [Formula 10] to [Formula 25].
[화학식 10][Formula 10]
[화학식 11][Formula 11]
[화학식 12][Formula 12]
[화학식 13][Formula 13]
[화학식 14][Formula 14]
[화학식 15][Formula 15]
[화학식 16][Formula 16]
[화학식 17][Formula 17]
[화학식 18][Formula 18]
[화학식 19][Formula 19]
[화학식 20][Formula 20]
[화학식 21][Formula 21]
[화학식 22][Formula 22]
[화학식 23][Formula 23]
[화학식 24][Formula 24]
[화학식 25][Formula 25]
(상기 식 중, n은 10이상의 정수이고, 페닐기는 수소나 알킬기로 치환 가능하다.)(In the formula, n is an integer of 10 or more, and the phenyl group can be substituted with hydrogen or an alkyl group.)
상기 화합물 중 [화합물 10]이 특히 바람직하며, 본 발명에 사용되는 폴리에테르 술폰은 2.16㎏ 하중하 380℃에서 용융 점도가 바람직하게는 20~85 g/6분이며, 더욱 바람직하게는 50~70 g/6분이다. [Compound 10] is particularly preferable among the above compounds, and the polyether sulfone used in the present invention has a melt viscosity of preferably 20 to 85 g / 6 minutes at 380 ° C under 2.16 kg load, more preferably 50 to 70 g / 6 minutes.
폴리에테르 술폰 수지의 대표적인 제조 방법은 일본 특공소 호, 일본 특개소 52-38000호 등에 개시되어 있는 바와 같이 4,4'-디클로로디페닐술폰(4,4'-dichlorodiphenylsulfone)과 2,2'-비스(4-히드록시페닐)프로판(2,2'-bis(4-hydroxy-phenyl)propane)에 의해 제조할 수 있다.Representative methods for producing polyether sulfone resins include 4,4'-dichlorodiphenylsulfone and 2,2'- as disclosed in Japanese Patent Application Laid-Open No. 52-38000 and the like. It can be prepared by bis (4-hydroxyphenyl) propane (2,2'-bis (4-hydroxy-phenyl) propane).
본 발명에서 사용된 폴리에테르 술폰은 바람직하게는 70~99.9 중량부이며, 더욱 바람직하게는 70~90 중량부이다. 70 중량부 미만인 경우 내열성이 낮아져 고 온에서 열변형이 되기 쉬운 문제가 있으며, 99.9 중량부를 초과하는 경우 기계적 물성이 저하되는 문제점이 있다.The polyether sulfone used in the present invention is preferably 70 to 99.9 parts by weight, more preferably 70 to 90 parts by weight. If it is less than 70 parts by weight, the heat resistance is low, there is a problem that tends to be thermal deformation at high temperature, if it exceeds 99.9 parts by weight there is a problem that the mechanical properties are lowered.
(C) 유기 실란계 상용화제(C) Organosilane Compatibilizer
본 발명의 수지조성물에 사용되는 유기 실란계 상용화제는 바람직하게는 에폭시기(Epoxy group) 또는 아미노기(Amino group)와, 메톡시기(Methoxy group)또는 에톡시기(Ethoxy)로 구성된 실란(Silane)화합물이며, 더욱 바람직하게는 하기 [화학식 26]로 표현되는 트리에톡시실란(Triethoxysilane) 또는 하기 [화학식 27]로 표현되는 트리메톡시실란(Trimethoxysilane) 중에서 선택되는 1종 이상이다.The organosilane-based compatibilizer used in the resin composition of the present invention is preferably a silane compound composed of an epoxy group or an amino group and a methoxy group or an ethoxy group. More preferably, it is 1 or more types chosen from the triethoxysilane represented by the following [Chemical Formula 26], or the trimethoxysilane represented by the following [Chemical Formula 27].
[화학식 26] [Formula 26]
A-Si(OCH2CH3)3 A-Si (OCH 2 CH 3 ) 3
[화학식 27][Formula 27]
A-Si(OCH3)3 A-Si (OCH 3 ) 3
(상기 식 중, A는 (Wherein A is
① 메틸기, 에틸기와 같은 알킬기, ① alkyl group such as methyl group, ethyl group,
② 비닐기와 같은 올레핀기, ② olefin group such as vinyl group,
③ 에폭시기 또는 아미노기, ③ epoxy group or amino group,
④ 아미노프로필기, 글라이시독시프로필(glycidoxypropyl)기와 같은, 상기 ①에 해당하는 기와 상기 ③에 해당하는 기가 결합된 기이거나,④ is a group in which a group corresponding to ① and a group corresponding to ③ are bonded, such as an aminopropyl group and a glycidoxypropyl group,
⑤ 메톡시기 또는 에톡시기임.)⑤ It is a methoxy group or an ethoxy group.)
본 발명의 수지조성물에 사용되는 유기 실란계 상용화제의 양은 상기 폴리페닐렌 설파이드 수지 및 폴리에테르 술폰 수지로 구성되는 수지조성물 100 중량부에 대하여 바람직하게는 0.01~10 중량부이며, 더욱 바람직하게는 0.1~5 중량부이다. 0.01 중량부 미만인 경우나 10 중량부를 초과하는 경우 두 수지간의 상분리가 일어나 사출 성형품 외관에 박리 현상이 생기거나, 기계적 강도와 내충격성 등의 물성이 떨어질 수 있다. The amount of the organic silane-based compatibilizer used in the resin composition of the present invention is preferably 0.01 to 10 parts by weight, more preferably to 100 parts by weight of the resin composition composed of the polyphenylene sulfide resin and the polyether sulfone resin. 0.1 to 5 parts by weight. Less than 0.01 parts by weight or 10 When the weight part exceeds the weight part, the separation of the two resins may occur, resulting in peeling of the appearance of the injection molded article, or physical properties such as mechanical strength and impact resistance may be deteriorated.
(D) 불소화 폴리올레핀계 수지(D) fluorinated polyolefin resin
불소화 폴리올레핀계 수지는 본 발명의 다른 구성성분 수지와 함께 혼합하여 압출시킬 때, 수지내에서 섬유상 망상(fibrillar network)을 형성하여 연소시에 수지의 흐름 점도를 저하시키고 수축율을 증가시켜서 수지의 적하 현상을 방지한다.When the fluorinated polyolefin resin is mixed and extruded together with the other component resins of the present invention, a fibrillar network is formed in the resin to lower the flow viscosity of the resin during combustion and increase the shrinkage rate to increase the shrinkage of the resin. To prevent.
본 발명의 수지조성물에 사용되는 불소화 폴리올레핀계 수지(D)는 종래부터 이용가능한 수지로서 폴리테트라플루오로에틸렌, 폴리비닐리덴플루오라이드, 테트라플루오로에틸렌/비닐리덴플루오로라이드 공중합체, 테트라플루오로에틸렌/헥사플루오로프로필렌 공중합체 및 에틸렌/테트라플루오로에틸렌 공중합체 등을 예로 들 수 있다. 이들은 서로 독립적으로 사용될 수도 있고, 서로 다른 2종 이상이 병용될 수도 있다.Fluorinated polyolefin-based resins (D) used in the resin composition of the present invention are conventionally available resins such as polytetrafluoroethylene, polyvinylidene fluoride, tetrafluoroethylene / vinylidene fluoride copolymer, and tetrafluoro. Ethylene / hexafluoropropylene copolymer, ethylene / tetrafluoroethylene copolymer, and the like. These may be used independently from each other, and two or more different types may be used together.
본 발명의 수지조성물의 제조에 바람직하게 사용될 수 있는 불소화 폴리올레 핀계 수지로는 평균 입경이 0.05∼1,000μm이고, 비중이 1.2∼2.3 g/cm3 인 폴리테트라플루오로에틸렌을 들 수 있다.Fluorinated polyolefin resins that can be preferably used in the preparation of the resin composition of the present invention has an average particle diameter of 0.05 to 1,000μm, specific gravity of 1.2 to 2.3 g / cm 3 Phosphorus polytetrafluoroethylene is mentioned.
본 발명의 수지조성물의 제조에 사용되는 불소화 폴리올레핀계 수지는 공지의 중합방법을 이용하여 제조될 수 있으며, 예를 들면 압력 7∼71 kg/cm2, 온도 0∼200℃, 바람직하게는 20∼100℃에서 나트륨, 칼륨 또는 암모늄 퍼옥시디설페이트 등의 자유 라디칼 형성 촉매가 들어있는 수성 매질 중에서 제조될 수 있다.The fluorinated polyolefin resin used in the preparation of the resin composition of the present invention may be prepared using a known polymerization method, for example, a pressure of 7 to 71 kg / cm 2, a temperature of 0 to 200 ℃, preferably 20 to 100 It can be prepared in an aqueous medium containing free radical forming catalysts such as sodium, potassium or ammonium peroxydisulfate at < RTI ID = 0.0 >
불소화 폴리올레핀계 수지는 에멀젼(emulsion) 상태 또는 분말(powder) 상태로 사용될 수 있다. 그러나, 에멀젼 상태의 불소화 폴리올레핀계 수지를 사용하면 전체 수지조성물 내에서의 분산성은 양호하지만, 제조공정이 복잡해지는 단점이 있으므로 불소화 폴리올레핀계 수지가 전체 수지조성물내에 적절히 분산되어 섬유상 망상을 형성할 수 있는 경우에는 분말상태로 사용하는 것이 바람직하다.The fluorinated polyolefin resin may be used in an emulsion state or a powder state. However, when the fluorinated polyolefin resin in an emulsion state is used, the dispersibility in the entire resin composition is good, but the manufacturing process is complicated. Therefore, the fluorinated polyolefin resin can be properly dispersed in the whole resin composition to form a fibrous network. In this case, it is preferable to use in powder form.
본 발명의 수지조성물에 사용되는 불소화 폴리올레핀계 수지는 상기 폴리페닐렌 설파이드 수지 및 폴리에테르 술폰 수지로 구성되는 수지조성물 100 중량부에 대하여 0.01~10 중량부를 사용하는 것이 바람직하며, 보다 바람직하기로는 0.05~ 5 중량부의 범위로 사용한다. 0.01 중량부 미만인 경우 연소 시간 증가 및 수지의 적하 발생으로 난연도가 저하될 수 있으며, 10 중량부를 초과하는 경우 수지의 용융 점도가 너무 높아 압출 특성이 저하되는 문제점이 있을 수 있다. The fluorinated polyolefin resin used in the resin composition of the present invention is based on 100 parts by weight of the resin composition composed of the polyphenylene sulfide resin and the polyether sulfone resin. It is preferable to use 0.01-10 weight part, More preferably, it uses it in 0.05-5 weight part. If the amount is less than 0.01 part by weight, the flame retardancy may decrease due to the increase in the combustion time and the dropping of the resin, and when the amount exceeds 10 parts by weight, the melt viscosity of the resin may be too high, thereby reducing the extrusion characteristics.
본 발명의 열가소성 수지조성물은 상기의 구성성분 외에도 산화방지제, 이형제, 난연제, 윤활제, 안료나 염료 등의 착색제, 소량의 다종 폴리머, 열가소성 일 래스토머 등을 적절히 첨가하여 다양한 용도로 사용할 수 있다.In addition to the above components, the thermoplastic resin composition of the present invention can be used for various purposes by appropriately adding an antioxidant, a mold release agent, a flame retardant, a lubricant, a colorant such as a pigment or a dye, a small amount of a multi polymer, a thermoplastic elastomer, and the like.
본 발명의 수지조성물은 공지의 방법으로 제조할 수 있다. 예를 들면, 본 발명의 구성성분과 기타 첨가제들을 동시에 혼합한 후에, 압출기 내에서 용융 압출하고 펠렛 형태로 제조할 수 있다.The resin composition of the present invention can be produced by a known method. For example, the components of the present invention and other additives may be mixed simultaneously, then melt extruded in an extruder and made into pellets.
상기 목적을 달성하기 위한 본 발명의 다른 양상은 폴리페닐렌 설파이드 열가소성 수지조성물로부터 제조되는 것을 특징으로 하는 외관 및 난연성이 크게 개선된 성형품에 관계한다.Another aspect of the present invention for achieving the above object relates to a molded article greatly improved appearance and flame retardancy, characterized in that it is produced from a polyphenylene sulfide thermoplastic resin composition.
본 발명에 따른 열가소성 수지조성물로부터 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 알려진 방법으로 성형품을 제조할 수 있다. 예를 들어 플런저 타입(plunger type)의 입식 사출기를 이용하여 전선 스토파, 플러그 등의 초소형 성형품을 제조할 수 있고, 스크류 타입(screw type)의 사출기를 이용하여 플런저 방식을 사용한 경우에 비해 정밀한 엔지니어링 플라스틱 수지의 소형 인서트 성형품을 제조할 수도 있다.From the thermoplastic resin composition according to the present invention, the molded article may be manufactured by a method known to those skilled in the art. For example, it is possible to manufacture micro-molded products such as wire stoppers and plugs by using a plunger type injection molding machine, and more precise engineering than when using a plunger method using a screw type injection machine. It is also possible to produce small insert molded articles of plastic resin.
이외에도 본 발명의 조성물은 여러 가지 제품의 성형에 사용될 수 있으며, 특히 내충격성 및 우수한 내열 특성으로 인해 램프 리플렉터(Lamp reflector)나 전기전자 부품 또는 정밀부품 등의 성형품에 사용될 수 있다.In addition, the composition of the present invention can be used in the molding of various products, in particular, due to the impact resistance and excellent heat resistance properties can be used in molded products such as lamp reflector (Lamp reflector), electrical and electronic components or precision parts.
실시예Example
이하, 구체적인 실시예 및 비교예를 들어 본 발명의 구성 및 효과를 보다 상세히 설명하지만, 이들 실시예는 단지 본 발명을 보다 명확하게 이해시키기 위한 것일 뿐, 본 발명의 범위를 한정하고자 하는 것은 아니다.Hereinafter, the configuration and effects of the present invention will be described in more detail with reference to specific examples and comparative examples, but these examples are only intended to more clearly understand the present invention, and are not intended to limit the scope of the present invention.
본 발명의 수지조성물을 제조하기 위하여 사용된 각 구성성분은 다음과 같다.Each component used to prepare the resin composition of the present invention is as follows.
(A) 폴리페닐렌 설파이드 수지(A) polyphenylene sulfide resin
대일본 잉크(DIC)사의 선형 폴리페닐렌 설파이드 수지(상표명: KL-02)를 사용하였다.Linear polyphenylene sulfide resin (trade name: KL-02) manufactured by Nippon Ink (DIC) was used.
(B) 폴리에테르 술폰 수지(B) polyether sulfone resin
가르다(GHARDA)사의 GAFONE PES 3500을 사용하였다.GAFONE PES 3500 from GHARDA was used.
(C) 유기 실란계 상용화제(C) Organosilane Compatibilizer
GE사의 액상 감마-글리시독시프로필트리메톡시실란(gamma-Glycidoxypropyltrimethoxysilane, 상품명 : Silquest A-187)을 사용하였다. A liquid gamma-glycidoxypropyltrimethoxysilane (GE: Silquest A-187) was used.
(D) 불소화 폴리올레핀계 수지(D) fluorinated polyolefin resin
미국 Dupont사의 테프론(상품명) 7AJ를 사용하였다US-made Dupont Teflon 7AJ was used.
실시예 1∼3 및 비교예 1∼7Examples 1-3 and Comparative Examples 1-7
전술한 구성성분들을 이용하여 표 2의 실시예 1∼3 및 비교예 1∼7에 나타낸 조성과 같은 수지조성물을 제조하였으며, 이들의 압출특성은 표 1에 난연성은 표 2 에 각각 나타내었다.Using the above-mentioned components were prepared resin compositions with the composition shown in Examples 1 to 3 and Comparative Examples 1 to 7 of Table 2, the extrusion properties thereof are shown in Table 1, flame retardancy is shown in Table 2 , respectively.
* N.B : No Break * N.B: No Break
[물성 평가 방법][Property evaluation method]
(1) 시편 제조(1) specimen manufacture
상기 표 2에 나타낸 조성으로 각 성분을 혼합한 후 산화방지제, 열안정제를 첨가하여 통상의 혼합기에서 혼합하였으며, 이 혼합물을 L/D=36, ¢=45 ㎜인 이축 압출기에 투입하였다. 상기 혼합물을 압출기를 통하여 펠렛 형태의 수지조성물로 제조하였으며, 10 oz 사출기를 이용하여 사출 온도 310℃에서 물성 및 내충격 평가를 위한 시편과 난연 평가를 위한 시편을 제조하였다. After mixing each component with the composition shown in Table 2 , antioxidant and heat stabilizer were added and mixed in a conventional mixer, and the mixture was put into a twin screw extruder having L / D = 36 and ¢ = 45 mm. The mixture was prepared into a resin composition in pellet form through an extruder, and a specimen for evaluating physical properties and impact resistance and a flame retardant was prepared at an injection temperature of 310 ° C. using a 10 oz injection machine.
(2) 열변형온도 및 비노치 아이조드 충격강도(2) Heat deflection temperature and non-notched Izod impact strength
물성 시편 및 내충격 평가를 위한 시편을 온도 23℃, 상대습도 50%에서 48시간 방치한 후, 열변형 온도는 ASTM D648에 따라 측정하였으며, 비노치 아이조드 충격강도(1/8")는 ASTM D256에 따라 측정하였다.After leaving the specimen for evaluation of physical properties and impact resistance for 48 hours at a temperature of 23 ° C. and a relative humidity of 50% for 48 hours, the thermal deformation temperature was measured according to ASTM D648, and the non-notched Izod impact strength (1/8 ”) was determined to ASTM D256. Measured accordingly.
(3) 난연도 및 연소 시간(3) flame retardancy and burning time
난연 시편을 온도 23℃, 상대습도 50%에서 48시간 방치한 후, UL94 규격에 따라 난연도를 측정하였고, 연소 시간을 초단위로 나타내었다. After the flame-retardant specimens were allowed to stand at a temperature of 23 ° C. and a relative humidity of 50% for 48 hours, the flame retardance was measured according to the UL94 standard, and the combustion time was expressed in seconds.
(4) 압출 특성(4) extrusion characteristics
압출 특성은 10분간 압출시 스트랜드(strand)의 단락 유무와 수율(Yields)로 평가하였다.Extrusion characteristics were evaluated by the presence or absence of a short circuit of the strand (yields) during extrusion for 10 minutes.
상기 표 1, 표 2에 나타낸 결과로부터, 폴리페닐렌 설파이드 수지와 폴리에테르 술폰 수지에 유기 실란계 화합물 및 불소화 폴리올레핀계 수지를 더 포함하는 본 발명의 수지조성물의 경우, 비교예에 제시된 수지조성물보다 내열도와 내충격성 특히 UL94 난연도가 크게 향상되는 것을 확인할 수 있었다.In Table 1, from the results shown in Table 2, a polyphenylene sulfide resin and a polyether resin according to the present invention further comprises an organic silane-based compound and a fluorinated polyolefin-based resin to the sulfone resin composition, than the resin compositions shown in Comparative Example It was confirmed that the heat resistance and the impact resistance, particularly UL94 flame retardancy is greatly improved.
실시예 1~2 및 비교예 4~5를 비교한 결과 폴리페닐렌 설파이드 수지, 폴리에테르 술폰 수지 및 유기 실란계 화합물만으로 구성된 수지조성물의 경우, 압출성은 개선되나 연소시 연소 시간 증가 및 수지의 적하 발생으로 난연도가 저하되는 것을 확인할 수 있었다.As a result of comparing Examples 1 to 2 and Comparative Examples 4 to 5, in the case of the resin composition composed of polyphenylene sulfide resin, polyether sulfone resin, and organic silane compound alone, the extrudability was improved, but the combustion time increased during combustion and the dropping of the resin. It was confirmed that the flame retardancy is reduced by the occurrence.
비교예 1에서는 폴리페닐렌 설파이드 수지만으로 압출한 경우, 폴리페닐렌 설파이드 수지의 낮은 용융 점도로 인해 압출성이 불량하고 내열도와 내충격성이 매우 낮은 것을 확인할 수 있었다. In the comparative example 1, when extruded only by polyphenylene sulfide resin, it was confirmed that extrusion property was bad and heat resistance and impact resistance were very low because of the low melt viscosity of polyphenylene sulfide resin.
또한, 비교예 2~3에서는 폴리페닐렌 설파이드 수지와 유기 실란계 화합물만으로 구성된 수지조성물 또는 폴리에테르 술폰 수지만으로 구성된 수지조성물의 경우, 압출성은 개선되나 난연시 수지의 적하 발생으로 난연도가 저하되는 것을 확인할 수 있었다.Further, in Comparative Examples 2 to 3, in the case of a resin composition composed only of a polyphenylene sulfide resin and an organic silane compound or a resin composition composed of only a polyether sulfone resin, the extrudability is improved, but the flame retardancy is reduced due to the dropping of the resin during flame retardation. I could confirm that.
또한 비교예 6~7을 비교한 결과 유기 실란계 화합물과 불소화 폴리올레핀계 수지를 본 발명의 조성비를 초과하여 사용한 경우, 압출 시 수지의 용융 점도가 너무 높아져 압출이 불가능하였다. In addition, as a result of comparing the Comparative Examples 6-7, when the organic silane compound and the fluorinated polyolefin resin was used in excess of the composition ratio of the present invention, the melt viscosity of the resin during extrusion was so high that extrusion was impossible.
본 발명에 따른 폴리페닐렌 설파이드 열가소성 수지조성물은 우수한 기계적 강도, 내열성, 상용성을 가질 뿐만 아니라, 연소 시간 감소 및 수지의 적하 감소로 인해 압출성이 우수하고, 특히 난연성이 크게 향상된다.The polyphenylene sulfide thermoplastic resin composition according to the present invention not only has excellent mechanical strength, heat resistance and compatibility, but also has excellent extrudability due to a reduction in combustion time and a drop in dropping of the resin, and particularly, greatly improves flame retardancy.
또한 본 발명에 따른 폴리페닐렌 설파이드 열가소성 수지조성물로부터 제조된 성형품은 상기 수지의 특성을 지니고 있어, 난연성이 향상되고 우수한 외관을 가지므로 전기전자기기 부품, 자동차용 부품, 또는 화학기기 부품 등에 유용하게 사용될 수 있다.In addition, the molded article prepared from the polyphenylene sulfide thermoplastic resin composition according to the present invention has the characteristics of the resin, so that the flame retardancy is improved and has an excellent appearance, which is useful for electric and electronic device parts, automotive parts, or chemical device parts. Can be used.
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JPH04185988A (en) * | 1990-11-21 | 1992-07-02 | Dainippon Ink & Chem Inc | Polyallylene sulfide resin lining metal pipe |
JPH093325A (en) * | 1995-06-16 | 1997-01-07 | Mitsubishi Chem Corp | Polyphenylene sulfide resin composition |
JPH10237301A (en) | 1997-02-26 | 1998-09-08 | Toray Ind Inc | Polyphenylene sulfide resin composition |
US6245845B1 (en) | 1998-11-05 | 2001-06-12 | Daikin Industries, Inc. | Fluorine-containing resin composition for parts of electronic and electrical equipment and same parts |
KR20050064808A (en) * | 2003-12-24 | 2005-06-29 | 제일모직주식회사 | Polymer alloy composition including polyphenylene sulfide |
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2005
- 2005-12-30 KR KR1020050134884A patent/KR100673777B1/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59164360A (en) * | 1983-03-10 | 1984-09-17 | Dainippon Ink & Chem Inc | Resin composition |
JPS63218761A (en) | 1987-03-06 | 1988-09-12 | Dainippon Ink & Chem Inc | Block copolymer composition |
JPH04185988A (en) * | 1990-11-21 | 1992-07-02 | Dainippon Ink & Chem Inc | Polyallylene sulfide resin lining metal pipe |
JPH093325A (en) * | 1995-06-16 | 1997-01-07 | Mitsubishi Chem Corp | Polyphenylene sulfide resin composition |
JPH10237301A (en) | 1997-02-26 | 1998-09-08 | Toray Ind Inc | Polyphenylene sulfide resin composition |
US6245845B1 (en) | 1998-11-05 | 2001-06-12 | Daikin Industries, Inc. | Fluorine-containing resin composition for parts of electronic and electrical equipment and same parts |
KR20050064808A (en) * | 2003-12-24 | 2005-06-29 | 제일모직주식회사 | Polymer alloy composition including polyphenylene sulfide |
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