KR100656182B1 - 유기박막 소자의 양산 제작용 선형의 증착 공정 장치와 기판 이송 장치 - Google Patents
유기박막 소자의 양산 제작용 선형의 증착 공정 장치와 기판 이송 장치 Download PDFInfo
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- KR100656182B1 KR100656182B1 KR1020040064144A KR20040064144A KR100656182B1 KR 100656182 B1 KR100656182 B1 KR 100656182B1 KR 1020040064144 A KR1020040064144 A KR 1020040064144A KR 20040064144 A KR20040064144 A KR 20040064144A KR 100656182 B1 KR100656182 B1 KR 100656182B1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Robotics (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (10)
- 다수개의 기판 이송 챔버(40)들이 선형으로 연결되어, 각각은 측면에 진공 로봇 용기(41)를 가지며, 진공 로봇 용기와 유기 소자 공정 챔버(10)들은 게이트 밸브(30)를 사이에 두고 연결되는 유기소자 박막 제작의 선형의 양산용 증착 장치
- 제 1항에 있어서, 진공 로봇 용기(41) 내에는 상기 기판 이송 챔버(40) 또는 유기 소자 공정 챔버(10)에 대면적 기판과 대면적 금속마스크를 이송하는 소형 진공 로봇(60)이 구비되는 것을 특징으로 하는 유기소자 박막 제작의 선형 양산용 증착 장치.
- 제 1항에 있어서, 기판 이송 챔버(40) 내에는 양끝에 두개의 ㄷ자 모양의 기판 고정 장치(52)가 연결부(53)로 연결되고, 기판 고정 장치 양안쪽 상부에는 기판 안착 홈(51)을 가지는 기판 이송기(50)를 가지는 유기소자 박막 제작의 선형 양산용 증착 장치
- 제 1항에 있어서, 기판 이송 챔버(40) 내에는 양안쪽 상부에 금속 마스크 안착 홈(72)을 가지고,ㄷ자 모양의 금속 마스크 이송기(70)를 가지는 유기소자 박막 제작의 선형 양산용 증착 장치
- 제 2항에 있어서, 소형의 진공 로봇(60)은 두개의 팔이 하나의 관절로 연결되어 바깥쪽 팔의 끝 상부에 엔드이펙터 높낮이 조절기(61)를 가지는 유기소자 박막 제작의 선형 양산용 증착 장치
- 제 1항에 있어서, 기판 이송 챔버(40) 내에는 상부에 기판 이송기(50)가 상부 선형 레일(90)에 고정되어 일정거리를 왕복 이송하고, 하부에 금속 마스크 이송기(70)가 하부 선형 레일(80)에 고정되어 자유롭게 선형 이송하는 장치를 가지는 유기소자 박막 제작의 선형 양산용 증착 장치
- 삭제
- 제 6항에 있어서, 기판 이송 챔버(40) 내에 있는 상부의 기판 이송기(50)와, 하부의 금속 마스크 이송기(70)가 각각, 대면적의 기판과 대면적의 금속 마스크를 선형 이송이 가능하여 대면적 유기소자 박막 제작에 사용되는 것을 특징으로 하는 유기소자 박막 제작의 선형 양산용 증착 장치
- 삭제
- 제 6항에 있어서, 기판 이송 챔버(40) 내의 금속 마스크 이송기(70)를 사용하여, 양산 공정 시, 파손 된 기판의 이송이나, 기판을 이전의 공정 챔버로 역 이송하여 공정이 가능 하도록 하는 것을 특징으로 하는 유기소자 박막 제작의 선형 양산용 증착 장치
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040064144A KR100656182B1 (ko) | 2004-08-16 | 2004-08-16 | 유기박막 소자의 양산 제작용 선형의 증착 공정 장치와 기판 이송 장치 |
PCT/KR2005/000268 WO2006019214A1 (en) | 2004-08-16 | 2005-01-29 | Linear deposition apparatus for forming organic thin layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040064144A KR100656182B1 (ko) | 2004-08-16 | 2004-08-16 | 유기박막 소자의 양산 제작용 선형의 증착 공정 장치와 기판 이송 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060015788A KR20060015788A (ko) | 2006-02-21 |
KR100656182B1 true KR100656182B1 (ko) | 2006-12-12 |
Family
ID=35907590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040064144A Expired - Fee Related KR100656182B1 (ko) | 2004-08-16 | 2004-08-16 | 유기박막 소자의 양산 제작용 선형의 증착 공정 장치와 기판 이송 장치 |
Country Status (2)
Country | Link |
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KR (1) | KR100656182B1 (ko) |
WO (1) | WO2006019214A1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100722803B1 (ko) * | 2006-03-06 | 2007-05-30 | (주) 디오브이 | 유기전계 발광 디스플레이 소자 봉지장치 |
KR100780042B1 (ko) * | 2006-03-06 | 2007-11-27 | (주) 디오브이 | 유기전계 발광 디스플레이 소자 증착장치 |
EP2135970A1 (en) * | 2008-06-20 | 2009-12-23 | Applied Materials, Inc. | Processing system and method for processing a substrate |
JP5173699B2 (ja) * | 2008-09-25 | 2013-04-03 | 株式会社日立ハイテクノロジーズ | 有機elデバイス製造装置 |
EP2802619B1 (de) | 2012-01-13 | 2016-03-09 | Styrolution Europe GmbH | Terpolymer-formmassen mit geringem gelbwert, verfahren zu deren herstellung sowie deren verwendung |
KR20130129728A (ko) * | 2012-05-21 | 2013-11-29 | 롬엔드하스전자재료코리아유한회사 | 승화 정제 장치 및 방법 |
KR102038816B1 (ko) * | 2012-12-11 | 2019-10-31 | 엘지디스플레이 주식회사 | 유기발광소자 박막 증착 장치 및 유기발광소자 제조방법 |
JP2013151760A (ja) * | 2013-04-25 | 2013-08-08 | Hitachi High-Technologies Corp | シャドウマスク交換方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0689837A (ja) * | 1992-09-08 | 1994-03-29 | Fujitsu Ltd | 基板処理装置 |
TW309503B (ko) * | 1995-06-27 | 1997-07-01 | Tokyo Electron Co Ltd | |
KR100370868B1 (ko) * | 2000-08-31 | 2003-02-05 | (주)케이.씨.텍 | 반도체 기판 처리 시스템 |
WO2002021583A1 (fr) * | 2000-09-06 | 2002-03-14 | Nikon Corporation | Aligneur et procede de fabrication de dispositif |
-
2004
- 2004-08-16 KR KR1020040064144A patent/KR100656182B1/ko not_active Expired - Fee Related
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2005
- 2005-01-29 WO PCT/KR2005/000268 patent/WO2006019214A1/en active Application Filing
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Publication number | Publication date |
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WO2006019214A1 (en) | 2006-02-23 |
KR20060015788A (ko) | 2006-02-21 |
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