KR100651816B1 - Head module for component mounter and component mounter having same - Google Patents

Abstract

An object of the present invention is to provide a head mounter for a component mounter and a component mounter having the same, which are mounted to be detachable to a horizontal moving mechanism due to a simple structure of the head module. The rotating housing is supported by the body to be lowered by rotation and load, and has a plurality of spindle receiving holes formed on the same circumference from the center thereof, and is accommodated in each of the spindle receiving holes. A nozzle raising mechanism having a plurality of nozzle spindles having a nozzle, a clutch shaft lowering the nozzle spindle by pressing the nozzle spindle upper surface while descending by driving of the nozzle raising and lowering driving unit and the nozzle raising and lowering drive unit, and interlocking with the nozzle raising mechanism So that the rotary housing is lowered by its own load, Provided is a head module for a component mounter having a housing elevating mechanism having a elevating control member for contacting and raising the rotary housing while interlocking with the nozzle elevating mechanism.

Description

 Head module for component mounter and component mounter having same {Head module for chip mounter and chip mounter including the same}

1 is a perspective view showing a head assembly for a conventional component mounter,

2 is a cross-sectional view taken along the line I-I of FIG.

3 is a perspective view of a head module according to the present invention;

4 is a cross-sectional view taken along the line II-II of FIG. 3,

5 is an exploded perspective view illustrating the nozzle elevating mechanism of FIG. 3.

FIG. 6 is a plan view illustrating a state in which the nozzle spindle of FIG. 3 simultaneously adsorbs two electronic components.

7 is a side view of FIG. 3,

8 is a perspective view illustrating the housing rotating mechanism of FIG. 3;

9 is a perspective view illustrating the nozzle rotating mechanism of FIG. 3;

10 is a perspective view illustrating a modification of FIG. 9;

FIG. 11 is a perspective view illustrating the air supply structure of FIG. 3;

12 is an exploded perspective view of FIG. 11;

FIG. 13 is a cross-sectional view taken along line III-III of FIG. 12,

FIG. 14 is a schematic plan view of FIG. 13 from above;

15 is a plan view showing a component mounter according to a preferred embodiment in another aspect of the present invention,

16 is an exploded perspective view illustrating the separation of the head module and the module mounting unit from FIG. 15;

17 is a side view of FIG. 16.

Explanation of symbols on major parts of partial drawings

100: parts mounting machine 102: parts supply unit

103: horizontal moving mechanism 106: conveyor portion

130: module mounting portion 132: guide member insertion groove

140: toggle clamping device 201, 301: head module

210, 310: body 230: rotating housing

232: spindle receiving hole 240: nozzle spindle

242: nozzle 245: nozzle return spring

250 and 350: housing rotation mechanism 252: rotation drive unit

253: housing drive transmission 254: housing drive gear

258: housing driven gear 260, 360: nozzle rotating mechanism

262: nozzle rotation drive unit 264: nozzle drive gear

268: nozzle driven gear 270, 370: nozzle lifting mechanism

272: nozzle lifting drive unit 276: clutch shaft

280, 380: housing elevating mechanism 281: elevating control member

283: hanger 284: guide hole

288: linear guide portion 289: lowering stopper

290: air supply structure 291: air supply

292: fixing part 295: rotating part

298: connector 312: guide member

AR: air sealed flow part B: printed circuit board

O: center of rotating housing SN: space inside nozzle

RA1: first supply line RA2: second supply line

The present invention relates to a head module for a component mounter and a component mounter having the same, and more particularly, to a component mounter for mounting an electronic component such as an integrated circuit, a diode, a capacitor, a resistor, and the like on a printed circuit board. The present invention relates to a revolver-type head module provided and a component mounter including the head module.

The component mounter is a core equipment of the component mounting assembly equipment for mounting a component on a printed circuit board (PCB). The component mounting equipment receives various components from a component supplier and transfers them to the mounting position of the printed circuit board, and then mounts them on the printed circuit board.

In general, a component mounter includes an X and Y-axis feeder that guides a printed circuit board to a predetermined position and functions as a substrate support stage, a component supply unit that supports various electronic components to be mounted on the printed circuit board, and the component. In order to mount an electronic component supported on the supply unit on a printed circuit board, the head assembly includes a head assembly which vertically moves to adsorb or detach the component.

Recently, a plurality of nozzle spindles for adsorbing a plurality of electronic components in turn or simultaneously, moving the adsorbed plurality of electronic components simultaneously to the conveyor unit, and mounting the electronic components moved to the conveyor unit sequentially or simultaneously on a printed circuit board. Are installed in the head assembly side by side.

However, the nozzle spindles installed side by side become larger in size, thereby increasing the overall size of the head assembly. Therefore, the number of nozzle spindles installed in the head assembly is inevitably limited.

In order to solve this problem, as shown in Fig. 1, in the head portion 10 provided in the component mounter disclosed in Japanese Patent Laid-Open No. 2003-273582, a plurality of revolved head assemblies 11 are provided. It is arranged in a line. Each nozzle spindle 40 provided in each head assembly 11 is arranged spaced apart from each other on the same circumference from the center of the spline shaft 35 (see FIG. 2) to be described later, and the suction nozzle 50 is coupled to the lower side thereof. do. These head assemblies 11 are fixed by the head frame 12.

The nozzle spindles 40 provided in the head assemblies 11 are selected by the nozzle selector 70 to descend, and are lowered by the nozzle lifter 80. In addition, each nozzle spindle 40 revolves by the nozzle rotating mechanism 60. That is, as the spline shaft rotates by the nozzle rotating mechanism 60, the nozzle spindles coupled to the spline shaft revolve.

The head assembly 11 provided in the component mounter having such a structure will be described in detail with reference to FIG. 2, and one head assembly 11 has a plurality of nozzles installed on the same circumference based on the spline shaft 35. The spindle 40 is provided.

The nozzle holder 45 is coupled to the spline shaft 35, and the nozzle spindles 40 are disposed on the same circumference with respect to the spline shaft 35 of the nozzle holder 45 to move upward and downward.

The nozzle spindle 40 is installed to be elevated. In addition, the spline shaft 35 rotates according to the driving of the nozzle rotating mechanism 60 which is a motor for rotating the nozzle, and thus the nozzle holder 45 and the nozzle spindle 40 coupled to the spline shaft 35 rotate. To be installed.

Meanwhile, in order for the nozzle spindles 40 to be selected and lowered separately, the head assembly 11 is provided with a nozzle selecting mechanism 70 and a nozzle raising mechanism 80. The nozzle selection mechanism 70 includes a compressed air supply chamber 71 and a nozzle selection valve 72, and injects compressed air into the pressurized air supply chamber 32 corresponding to the nozzle spindle 40 selected downward. In this case, the pressurized air supply chamber 32 may be coupled to the head assembly 11 and may be connected to the nozzle spindle 40 as a space in the air cylinder block 30 disposed above the nozzle holder 45, respectively.

Therefore, when the positive pressure air flows into the pressurized air supply chamber disposed above the selected nozzle spindle 40 down, the piston 52 formed in the pressurized supply chamber and the air cylinder shaft 53 coupled to the lower side of the piston descend, The lower end portion 53a of the air cylinder shaft 53, the upper end portion 40a of the nozzle spindle joined to the lower end portion 53a, and the upper surface portion 85a of the step portion 85a of the spline nut 85 are in the same height position. Thus, the air cylinder shaft 53, the nozzle spindle 40, and the spline nut 85 are integrated. Here, the spline nut 85 is moved up and down by being coupled with the nozzle lifting mechanism 80 having the cam follower 84, the eccentric cam 82, and the drive motor 81, and thus the spline nut 85. The nozzle spindle 40 coupled with is lowered.

In addition, in order to adsorb the electronic components, a vacuum suction device 90 is provided, in which negative pressure air from the outside is supplied with negative pressure air from the negative pressure air supply chamber 91 to the outside of the nozzle holder 45. The nozzle spindle 40 is individually sucked by the electronic component by being provided in the nozzle spindle 40 by the installed valves 92. The revolver-type head portion has a merit of being able to mount a large number of electronic components while having a small size.

However, the conventional head assembly 11 for each component mounter of such a structure requires the nozzle selection mechanism 70 and the nozzle lifting mechanism 80 to lower the nozzle spindle 40. Thus, the lifting mechanism is complicated.

In addition, the nozzle selection mechanism 70 is provided with a compressed air supply chamber 71 and a nozzle selection valve 72, and the nozzle lifting mechanism 80 has an eccentric cam 82, a cam follower 84, and a spline nut ( Due to the 85), the weight is increased and it takes up a lot of space, making it difficult to cope with various working environments.

In addition, by using pneumatic pressure to lower the nozzle spindle, the working speed is slowed down and the accuracy is lowered, and the nozzle selection valve 72 for lowering the nozzle spindle and the occlusion for mounting and mounting the electronic parts. The wear valve 92 must be provided separately.

As a result, there is a problem that the head assembly is difficult to be modular.

On the other hand, in the component mounting machine, a tolerance that occurs in the process of assembling the conveyor unit side by side on the X axis, or a plurality of printed circuit boards may occur in parallel with the conveyor unit. Due to these tolerances, when the Y-axis position of one head assembly is aligned with the corresponding printed circuit board, the Y-axis position of the other head assembly is not the same as the corresponding printed circuit board, so that the component mounting There is a problem in that the nozzle spindles provided in at least two or more head assemblies provided in the machine are simultaneously lowered to mount an electronic component on a printed circuit board.

The present invention is to solve a variety of problems including the above problems, a plurality of nozzle spindle is made of a revolver shape, and can absorb and mount the electronic components at high speed, and can absorb and mount a large number of electronic components An object of the present invention is to provide a head module and a component mounter having the same.

Another object of the present invention is a nozzle module for lowering the nozzle spindle, the head module having a simple structure, a small number of components are used to reduce the total weight, increase the high-speed accuracy, modular structure and having the same It is to provide a component mounter.

Still another object of the present invention is to provide a head module having a structure in which a plurality of nozzle spindles provided in one head assembly are simultaneously lowered to adsorb a component, and a component mounter having the same.

In addition, a plurality of nozzle spindles are lowered at the same time to provide a head module and a component mounter having the structure that can be mounted at the same time accurately and easily in accordance with the degree of rotation of the printed circuit board while mounting electronic components at the same time will be.

Still another object of the present invention is to provide a component mounter having a simple structure in which the head module is mounted on a horizontal moving mechanism and excellent in mounting and detaching force.

In order to achieve the above object, the component module head module according to the first embodiment of the present invention, the component mounting to be mounted on the printed circuit board after absorbing the electronic component from the component supply unit to move to the horizontal moving mechanism The apparatus includes a body, a rotating housing, a plurality of nozzle spindles, a nozzle raising mechanism, and a housing raising mechanism.

The rotary housing is supported by the body so as to be lowered by rotation and load, and a plurality of spindle receiving holes are formed on the same circumference from the center thereof.

The nozzle spindle is accommodated in each of the spindle housing holes of the rotary housing, and a nozzle is formed at the bottom to suck and mount the electronic component.

The nozzle lift mechanism includes a nozzle lift drive and a clutch shaft. The clutch shaft lowers the nozzle spindle by pressing the nozzle spindle upper surface while descending by driving the nozzle lift drive unit.

The housing elevating mechanism includes a elevating control member, which elevates with the nozzle elevating mechanism to lower and lower the rotary housing by its own load, and moves up and down with the nozzle elevating mechanism. It may also be raised in contact with it.

Preferably, the nozzle elevating drive unit is a motor coupled to the body to be positioned above the down-selected nozzle spindle, and the clutch shaft is coupled to the nozzle elevating drive unit by a mechanical mechanism.

The housing lifting mechanism may further include a latch. In this case, the hook is formed over the top and down, the guide hole in which the lifting control member is inserted is formed on the inside, and is mounted on the rotary housing to be elevated together with the rotary housing. In addition, the elevating control member may be stopped at a predetermined height to prevent the hanger from falling because the upper portion of the hanger is caught, and the hanger may be lowered by the load of the rotating housing while the hanger is held thereon.

On the other hand, it is preferable that the head module further includes an air supply mechanism for introducing air of positive pressure and negative pressure into the internal space of the nozzles. In this case, the air supply mechanism has a fixing portion, a rotating portion, and a plurality of connecting tubes.

The air supply unit has a plurality of supply valves for controlling the air supply to the respective nozzles to supply air of positive pressure and negative pressure.

The fixing part has a hollow shape and is fixedly disposed on an upper side of the nozzle spindle of the body and has a plurality of first supply lines connected to a plurality of supply valves for supplying air of positive pressure and negative pressure and arranged at different heights. do.

The rotating part is disposed in an inscribed manner in the fixed part, and a plurality of air-tight flows connected to supply holes formed on the surface of the nozzle in the same number as the nozzles and connected to the respective first supply lines and sealed along outer circumferential surfaces having different heights. And a plurality of second supply lines connecting between the closed flow portion and the corresponding supply hole, and rotate at the same speed as the rotary housing.

A connecting pipe connects between the respective supply holes and the internal space of the nozzle.

In addition, the head module may further include a housing rotating mechanism for rotating the rotating housing. In this case, the housing rotating mechanism may include a rotary driving unit, a driving rotating shaft, a housing driving gear, and a housing driven gear. .

A housing rotation drive unit mounted to the body is connected to a drive rotation shaft extending from the housing rotation drive unit and rotating by driving of the housing rotation drive unit. The housing drive gear is mounted along the outer circumference of the drive shaft. A housing driven gear is mounted to the rotary housing and connected to and interlocked with the housing drive gear. In this case, it is preferable that the rotating part is connected to the housing rotation driving part to rotate by driving of the housing rotation driving part.

On the other hand, the component mounting device in another aspect of the present invention, at least one head module for absorbing the electronic component in the component supply unit for supplying the component mounted on the printed circuit board; And a horizontal moving mechanism for horizontally moving the head module. In this case, the head module includes: a body; A rotating housing rotatably supported by the body and having a plurality of spindle receiving holes formed on the same circumference from a central portion thereof; A plurality of nozzle spindles accommodated in each of the spindle receiving holes; A nozzle elevating mechanism for lowering the nozzle spindle; And a housing elevating mechanism including an elevating control member which is interlocked with the nozzle elevating mechanism to lower the rotary housing by its own load and contacts the elevating rotary housing while interlocking with the nozzle elevating mechanism. desirable. In addition, it is preferable that the horizontal moving mechanism includes a module mounting portion to which the head module is detachably mounted.

In this case, the module mounting portion is provided with a toggle clamping device, the body is preferably clamped mounted to the module mounting portion.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a perspective view illustrating a head module for a component mounter according to an exemplary embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along the line II-II of FIG. 3. 3 and 4, the head module 201 for a component mounter according to an exemplary embodiment of the present invention may include a body 210, a rotation housing 230, a plurality of nozzle spindles 240, And a nozzle elevating mechanism 270 and a housing elevating mechanism 280.

The body 210 is equipped with a rotatable rotating housing 230. The rotary housing 230 has a plurality of spindle receiving holes 232 are formed on the same circumference of the center portion, each of the spindle receiving holes 232 to the nozzle spindle 240 so as to be lifted and rotated. This insert is accommodated. The nozzle spindles 240 may revolve in conjunction with the rotation of the rotary housing 230, and may rotate by itself. In this case, a nozzle 242 having an internal space formed therein is coupled to a lower portion of the nozzle spindle 240 to suck and mount the electronic component C. When negative pressure air flows into the internal space of the nozzle 242, the electronic component is attracted to the nozzle. When positive pressure air flows into the internal space of the nozzle, the electronic component is separated from the nozzle 242.

As a result, the nozzle 242 is supplied with a negative pressure thereon and at the same time descends to pick up the electronic component (C), ascends and moves horizontally, and then descends again to supply a positive pressure therein so as to supply the electronic component on the printed circuit board. Mount it.

The nozzle elevating mechanism 270 serves to elevate the nozzle spindle, and includes a nozzle elevating driver 272 and a clutch shaft 276. The nozzle elevating driver 272 may be mounted on the body 210 to correspond to the nozzle spindles 240 disposed opposite to the center of the rotary housing 230 as described below.

The clutch shaft 276 is connected to the nozzle raising and lowering driver 272 to lower by lowering the selected nozzle spindle 240 in accordance with the driving of the nozzle raising and lowering driver 272.

The clutch shaft 276 provided in the nozzle lifting mechanism 270 may be coupled to the nozzle lifting driving unit 272 by a mechanical mechanism. As an example of this, in particular, as shown in FIG. 5, the clutch shaft 276 may be connected with the nozzle lift drive 272 through the timing belt 274 and the ball screw 275. Therefore, when the nozzle elevating drive unit 272 is driven, the clutch shaft 276 receives the rotational movement by the timing belt 274, and the rotational movement is changed to the vertical movement by the ball screw 275, whereby the clutch shaft 276 drops in linear motion. Alternatively, the nozzle lift driver 272 may be a voice coil motor, and the clutch shaft 276 may be connected to the voice coil motor to move up and down. A nozzle spindle 240 is disposed below the clutch shaft 276, so that the clutch spindle 276 depresses the nozzle spindle 240, resulting in the nozzle spindle 240 descending.

In the present invention, the clutch shaft 276 and the nozzle elevating drive unit 272 are not limited to the timing belt 274 and the ball screw 275, in contrast, in the case of mechanical coupling such as gear coupling, cam coupling, etc. It is included in the present invention.

Alternatively, the nozzle lift driver 272 may be a valve for introducing air, and the clutch shaft 276 may be lifted by hydraulic pressure through the valve, but the nozzle lift driver 272 may be a clutch shaft 276. And by a mechanical mechanism is more desirable because of the advantage of reduced components and the ability to lower the nozzle spindle 240 quickly.

As described above, by lowering the nozzle spindle 240 by pressing the upper surface of the nozzle spindle 240, the lowering speed of the nozzle spindle 240 can be increased, and the accuracy of the lowering position is also increased. In addition, a plurality of valve portions are unnecessary to lower the nozzle spindle, thereby reducing the volume and weight of the head module 201.

It is preferable that the nozzle return spring 245 is formed outside or inside the rotating nozzle spindle 240, so that the nozzle only when the clutch shaft 276 exerts a force greater than or equal to the elastic force of the nozzle return spring 245. This is because the spindle spindle 240 may be lowered, and when the nozzle spindle 240 is lowered, the nozzle spindle 240 may rise again when a force greater than the elastic force of the nozzle return spring 245 is removed.

On the other hand, as shown in Figs. 5 and 6, the interval K between the nozzle spindles 240 arranged opposite to the housing center portion O is adjacent to the neighboring component supply portion 102 seated to adsorb these electronic components. At least the rotation so that the nozzle elevating mechanisms 270 can simultaneously press the nozzle spindles 240 facing the center of the rotating housing O at the same time. It is preferably disposed at both ends of the housing 230.

This is because the nozzle spindles 240 provided in one head module 201 and disposed so as to face each other from the center portion O of the rotating housing can be simultaneously lowered to suck the electronic component C from the component supply portion 102. to be.

That is, the distance K between two nozzle spindles 240 facing the center portion O of the rotating housing is equal to, or twice, 3, the distance P between the centers of the corresponding component supply parts 102. When placed at an integer multiple, such as a ship, two nozzle spindles 240 can adsorb a plurality of parts C at the same time. In addition, since the rotatable housing 230 is rotatable, after the two nozzle spindles 240 simultaneously adsorb the component C, the rotatable housing 240 rotates at an angle θ so that the next two nozzle spindles ( 240 may be located on the component supply 102 so that the two nozzle spindles 240 may repeat the process of adsorbing the component C, thereby reducing the time for adsorbing the component.

In this case, it is preferable that the distance between the nozzle spindles 240 formed in the one rotary housing 230 and mutually adjacent to each other is the same, thereby allowing the rotation angle of the rotary housing to be constant. That is, as illustrated in FIG. 6, if eight nozzle spindles are arranged in one head module 201, the electronic component C may be sucked while rotating by 45 degrees.

On the other hand, in order to improve the mounting efficiency for mounting the electronic component (C), it is preferable that the nozzle spindle lowering movement distance to the component mounting position of the printed circuit board is short. To this end, it is preferable to lower the rotary housing 230 by a predetermined period, and then lower the selected nozzle spindle 240 to the component supply unit 102 (see FIG. 6) or the upper surface of the printed circuit board.

Therefore, this invention is equipped with the housing lifting mechanism 280 which raises and lowers a rotary housing. The housing elevating mechanism 280 includes an elevating control member 281, which elevates and lowers the nozzle elevating mechanism 270 so that the rotary housing 230 is driven by its own load. In some cases, the rotary housing 230 is raised while contacting with the nozzle elevating mechanism 270. In this case, the elevating control member 281 has the nozzle in a protruding protrusion shape in which the elevating control member 281 protrudes from the outer circumferential surface of the nozzle spindle 240 in order to descend and interlock with the nozzle elevating mechanism 270. It may be coupled to the spindle 240.

That is, in the present invention, the housing elevating mechanism 280 is moved in conjunction with the nozzle elevating mechanism 270. Therefore, by using the nozzle lifting drive unit 272 can be raised and lowered by the rotary housing 230, the lifting mechanism of the rotary housing 230 is simplified, and the weight of the head module is reduced. Become. In addition, the accuracy of the lowering degree is also excellent by using a mechanical method for lowering the rotary housing.

In this case, it is preferable that the housing elevating mechanism 280 includes a latch 283 together with the elevating control member 281. In particular, as shown in FIG. 7, the hanger 283 is mounted upwardly on at least one side of the rotary housing 230, and a guide hole 284 is formed on the inner side. The elevating control member 281 is inserted into the guide hole 284.

The raising and lowering control member 281 stops at a predetermined height to prevent the latch 283 from falling due to the upper portion 285 of the latch being stopped, and the upper portion 285 of the latch is lowered while the lowering is lowered. It descends by the load of the rotating housing 230 in the state spanned over (283). In this case, it is preferable that at least one linear guide portion 288 is mounted on the body 210 to guide the up and down movement of the rotary housing 230.

In detail, the rotary housing 230 is mounted to the body 210 to naturally move up and down in accordance with its own load and the guide of the linear guide 288. On at least one side of the rotary housing 230, a lifting control member 281 for controlling the lowering of the rotary housing 230 is inserted into the guide hole 284 of the hanger 283. Accordingly, if the elevating control member 281 is fixedly stopped at a certain height, the lower surface of the upper portion of the hanger 285 is in contact with the upper surface of the elevating control member 281 so that the hanger 283 can be lowered further. As a result, the rotary housing 230 coupled with the hanger 283 does not lower.

In order for the rotary housing 230 to descend, the elevation control member 281 moves downward. Accordingly, the latch 283 is lowered in contact with the upper portion 285, and as a result, the rotary housing 230 coupled with the latch 283 is lowered by its own load.

In this case, it is preferable that the lowering stopper 289 is installed on the body 210 to prevent the rotary housing 230 from lowering over a predetermined section. As one example thereof, as shown in FIG. 7, a lowering stopper 289 is disposed below the rotary housing 230 of the body 210, and the lowering stopper 289 of the rotary housing 230 is disposed. It must be greater than the load and have a resistance to work upwards. Therefore, when the rotary housing 230 is lowered and is in contact with the lowering stopper 289, even if the elevating control member 281 is lowered, the rotary housing 230 is no longer caused by the resistance of the lowering stopper 289. It is fixed without falling.

In order to raise the rotary housing 230, the elevating control member 281 moves upward with a lifting force greater than the load of the rotary housing 230. Accordingly, the lifting and lowering control member 281 lifts the latch 283 in a state in contact with the upper portion 285 of the latch, and as a result, the rotary housing 230 is raised.

In this case, the elevating control member 281 is preferably coupled to the clutch shaft 276 to protrude. That is, when the clutch shaft 276 provided in the nozzle elevating mechanism 270 is lowered to lower the selected nozzle spindle 240, the elevating control member 281 coupled to the clutch shaft 276 is linked thereto. As a result, the nozzle spindle 240 and the rotary housing 230 are not relatively lowered, so that the entire rotary housing 230 including the nozzle spindle is lowered.

When the rotary housing 230 is lowered by the nozzle lifting mechanism 270 for a predetermined period, the lower surface of the rotary housing 230 is in contact with the lowering stopper 289. Therefore, even if the elevating control member 281 is further lowered, the rotary housing 230 does not lower, and the nozzle spindle 240 pressed against the clutch shaft 276 is lowered. For this reason, it is possible to lower the rotary housing 230 at the same time by using one nozzle elevating mechanism 270.

On the other hand, the head module 201 may be provided with a housing rotation mechanism 250. The housing rotating mechanism rotates the rotating housing 230 to revolve the nozzle spindles 240 mounted to the rotating housing 230. Therefore, the plurality of nozzle spindles 240 revolve according to the positional deviation of the electronic component C seated in the component supply unit 102 (refer to FIG. 6) so that a plurality of electronic components may be simultaneously adsorbed.

In addition, even when the electronic component is mounted on the printed circuit board, the nozzle spindle 240 is disposed at the correct mounting position while revolving, so that the electronic component can be absorbed at the correct position on the printed circuit board.

In the present invention, as shown in FIGS. 3 and 8, the housing rotating mechanism 250 that rotates the rotating housing 230 includes a rotation driving unit 252 and a housing driving transmission unit 253. In general, the housing rotation driver 252 mounted on the body 210 is a servo motor, and rotates the rotation housing 230 by driving the housing driving transmission part 253. The housing drive transmission 253 may be composed of a plurality of gear assemblies, or alternatively, may be a belt or a chain.

In this case, as shown in FIG. 8, if the housing drive transmission part 253 is formed of a gear assembly composed of a plurality of gears, the housing drive transmission part 253 is the housing drive gear 254 and the housing driven gear 258. It may be provided. The housing driving gear 254 is formed at one end of the housing rotation driving unit 252 so that the housing driving gear 254 rotates in association with the rotation of the housing rotation driving unit 252. In this case, the housing driving gear 254 may be coupled along the outer circumferential surface of the spline shaft 256 so as to freely move up and down in conjunction with the rotary housing. This spline shaft 256 may be coupled to the housing rotation drive 252 via a coupling device 255.

A housing driven gear 258 is coupled to the rotary housing 230, and the housing driven gear 258 is connected to the housing driving gear 254 to rotate. In this case, the housing driven gear 258 may be disposed along the outer circumferential surface of the rotary housing 230.

Although not shown in FIG. 8, at least one connecting gear may be disposed between the housing driving gear 254 and the housing driven gear 258. The connecting gears are arranged to be engaged with each other one or more according to the shape of the head module, thereby minimizing the size of the head module 201 and connecting the housing driving gear 254 and the housing driven gear 258 at the same time. Function

In this case, the housing driven gear 258 is preferably backlash (backlash) is prevented, and also to support the smooth rotational movement of the rotary housing 230 between the rotary housing 230 and the body 210. At least one bearing 235 is preferably arranged.

Referring to the operation of the housing rotation mechanism 250 having such a structure, when the housing rotation drive unit 252 is driven, the housing drive gear 254 disposed at one end of the housing rotation drive unit 252 is rotated, This causes the housing driven gear 258 which is engaged with the housing drive gear 254 to rotate. Since the housing driven gear 258 is coupled on the outer circumference of the rotary housing 230, the rotary housing 230 rotates as a result.

On the other hand, the nozzle spindle 240 is preferably able to rotate to mount the electronic component in the correct position according to the rotated angle of the printed circuit board. That is, when the printed circuit board is rotated at a predetermined angle, the rotating housing 230 is rotated about its center portion O to revolve the nozzle spindle 240 at a predetermined angle in accordance with the rotated angle of the printed circuit board. The position of the electronic component C can be corrected.

In this case, the electronic components adsorbed on the nozzle spindle 240 rotate by a predetermined angle due to the idle of the nozzle spindle 240, so that the electronic components may not be positioned at the correct mounting position of the printed circuit board. Accordingly, the nozzle spindle 240 may be rotated to correct the rotated angle of the electronic component, thereby accurately correcting the position of the electronic component required for adsorption according to the rotated angle of the printed circuit board. This is also necessary when mounting the electronic component C on two or more printed circuit boards B at the same time.

3 and 9, the nozzle rotating mechanism 260 may be provided in the present invention.

The nozzle rotating mechanism 260 includes a nozzle rotating drive 262, a nozzle driving gear 264, and a nozzle driven gear 268. The nozzle rotating driver 262 coupled to the body is typically connected to the nozzle driving gear 264 as a servo motor. In this case, the nozzle drive gear 264 is formed at one end of the nozzle rotation drive unit 262 and rotates in conjunction with the rotation of the nozzle rotation drive unit 262. In this case, the nozzle driving gear 264 is coupled along the outer circumferential surface of the spline shaft 266, and the spline shaft 266 is coupled to the nozzle rotating drive unit 262 through the coupling device 265, thereby allowing the nozzle driving gear to be connected. 264 may engage with the nozzle driven gears 268 to move up and down.

The nozzle driven gear 268 is coupled to the outer circumferential surface of each nozzle spindle 240. Accordingly, the nozzle spindle 240 rotates as the nozzle driven gear 268 rotates.

The nozzle drive gear 264 may be directly engaged with each nozzle driven gear 268. In this case, a nozzle driving gear 264 is located at the center of the rotary housing 230, and a plurality of nozzle driven gears 268 formed along the outer circumferential surface of the plurality of nozzle spindles 240 disposed on the same circumference as the rotary housing. Engage with the fields. Therefore, when one nozzle drive gear 264 is rotated, the nozzle driven gears 268 engaged therewith may rotate.

Alternatively, as shown in FIG. 10, the nozzle driving gear may be connected to the nozzle driven gear 268 through the ring gear 269. That is, the nozzle drive gear 264 and the nozzle follower gear 268 are respectively connected to the ring gear 269 coupled to the rotary housing 230 so as to allow relative rotation. The ring gear 269 has a hollow cylinder shape and is formed along the outer circumferential surface of the rotary housing 230. An outer gear portion 269a formed on the outer circumferential surface of the ring gear 269 is connected to the nozzle driving gear 264. The inner gear part 269b formed on the inner circumferential surface of the ring gear 269 is connected to each of the nozzle driven gears 268. Accordingly, the ring gear 269 rotates in accordance with the rotation of the nozzle driving gear 264, and the nozzle driven gears 268 engaged therewith rotate, such that the nozzle spindle coupled with the nozzle driven gear 268. 240 will rotate.

Here, at least one connection gear 267 may be further provided to connect between the ring gear 269 and the nozzle driving gear 264. The connecting gear 267 is arranged in an appropriate number according to the structure of the head module, so that the rotational force of the nozzle drive gear 264 can be transmitted to the ring gear 269 while reducing the size of the entire head module. In this case, the nozzle driven gear 268, the ring gear 269 and the connecting gear are preferably formed so as to prevent backlash.

In such a structure, the nozzle drive gear 264 disposed at one end of the nozzle rotation drive part rotates in association with the driving of the nozzle rotation drive part 262. As a result, the ring gear 269 having the outer gear portion 269a engaged directly with the nozzle drive gear or the connecting gear rotates, and consequently the nozzle driven gear 268 engaged with the inner gear portion 269b of the ring gear. Will rotate. Since the nozzle driven gear 268 is fixed to the outer circumferential surface of the nozzle spindle 240, the nozzle spindle 240 rotates as a result.

On the other hand, as shown in Figure 4, the electronic component (C) is adsorbed by the negative pressure of the internal space (SN) of the nozzle 242, the electronic component (C) by the positive pressure of the internal space of the nozzle (242). It is separated from the nozzle 242. That is, when the negative pressure air is supplied to the nozzle internal space SN, the electronic component C is attracted to the nozzle by the negative pressure, and when the air of the positive pressure is supplied to the nozzle internal space SN, the electronic component is discharged by the positive pressure. (C) is mounted on the printed circuit board.

Therefore, the head module 201 is provided with an air supply mechanism 290 for introducing air of positive pressure and negative pressure into the internal space SN of the nozzle. 11 and 14 together with FIGS. 3 and 4, the air supply mechanism 290 provided in the present invention includes a fixing unit 292, a rotating unit 295, and a connection pipe 298.

In addition, the air supply unit 291 for supplying air to the fixing unit 292 may also be provided. That is, the air supply unit 291 illustrated in FIGS. 3 and 7 includes a plurality of supply valves 291a for controlling the air supply to the respective nozzles 242, and supply air of positive pressure and negative pressure. In this case, the supply valves may be formed separately from the positive pressure supply valves for supplying the constant pressure air and the negative pressure supply valves for supplying the air of the negative pressure, or alternatively, as shown in FIG. The solenoid valve may separately supply the positive pressure and the negative pressure air to one nozzle internal space SN.

11 to 14, the fixing portion 292 is fixedly disposed on the body 210 in a hollow shape, and includes a first supply line supplying air of positive pressure and air of negative pressure to the internal space in each nozzle ( RA1). Each of the first supply lines RA1 is connected to the supply valves 291a through the air inlets 293.

The rotating part 295 is disposed to be inscribed to the fixing part 292. The rotating portion 295 is rotatably coupled to the fixed portion 292 in a cylindrical shape. Therefore, in order for the rotating part 295 to rotate smoothly, it is preferable that a bearing is disposed between the rotating part 295 and the fixing part 292. The rotary part 295 has air sealed flow parts AR and second supply lines RA2. Air sealed flow units AR are connected to the first supply lines RA1, and a second supply line RA2 is provided between the air sealed flow units AR and a supply hole 296 formed on the surface of the rotating unit 295. Connect it.

A connecting pipe 298 connects each of the supply holes 216 and the internal space SN (see FIG. 4) of the nozzle.

In this case, the air sealed flow units AR formed in the rotating unit 295 are sealed at different positions along the outer circumferential surface of the rotating unit 295, respectively. Therefore, even if the position of the nozzle 242 (see FIG. 3) is changed by the rotation of the rotary housing 230 (see FIG. 3), positive and negative air can be supplied smoothly.

In detail, the positive and negative pressure air flows into the air sealed flow unit AR through the first supply line RA1 of the fixing unit 292. In this case, the air sealed flow part AR is sealed along the outer circumferential surface of the rotating part 295, so that air does not flow out even when the rotating part 295 rotates and flows along the air sealed flow part AR. .

As a result, even if the position of the second supply line RA2 is changed by the rotation of the rotating unit 295, air can smoothly flow into the second supply line RA2. As a result, unlike the conventional head assembly in which the tube for supplying air is twisted due to the rotation of the rotary housing 230, the air supply mechanism 290 is simple in structure, and the tube is supplied according to the rotation of the rotary housing 230. The air can be supplied smoothly without twisting the instrument.

In this case, it is preferable that sealing members 297 having elasticity and ring shapes are disposed at the outer boundary of the air sealed flow part AR. The sealing members 297 are in contact with the inner surface of the fixing portion 292 to prevent the air flowing in the air sealed flow AR from flowing out.

In this case, as shown in FIGS. 3 and 11, the rotary part 295 may be rotated by a housing rotation driver 252 for rotating the rotary housing 230. That is, the first rotation transmission unit 259 is disposed on the outer circumference of the spline shaft 256 that rotates while connecting the housing rotation driving unit 252 and the housing driving gear 254, and is connected to the first rotation transmission unit 259. The second rotation transmission unit 299 that rotates may be disposed along the outer circumference of the rotation unit 295. The first rotation transmission unit 259 and the second rotation transmission unit 299 may be connected to each other as a connecting means 218 such as a belt or a chain. The two rotation transmission unit 299 may be made of a gear and connected to each other.

That is, by operating the air supply mechanism 290 using the housing rotating mechanism 250 for rotating the rotary housing 230, the total weight and size of the head module 201 is reduced, the head module 201 Reduced components to make the manufacturing cost is reduced.

As a result, it becomes possible to modularize the head module 201, and therefore, as described below, the body 210 is preferably mounted to be detachable to the horizontal moving mechanism.

That is, the component mounter 100 according to the preferred embodiment of the present invention, as shown in FIG. 15, together with the plurality of head modules 301, the component supply part 102 and the horizontal moving mechanism 103. ). In this case, the component supply unit 102 for supplying electronic components and the conveyor unit 106 for transferring the printed circuit board B in the X-axis direction may be mounted on the bed 101.

The horizontal moving mechanism 103 is coupled to the bed 101. The horizontal moving mechanism 103 functions to horizontally move the at least one head module 301 from the component adsorption position of the component supply unit 102 onto the printed circuit board B.

This horizontal moving mechanism 103 generally includes an X-axis feed mechanism 104 for horizontally moving the head module 301 to the X axis and a Y-axis feed mechanism 105 for horizontally moving the head modules 201 to the Y axis. Equipped.

In this case, the head module 201 may be coupled to the X-axis transport mechanism 104 to be horizontally moved along the X-axis transport mechanism 104. In this case, both ends of the X-axis feed mechanism 104 are mounted to the Y-axis feed mechanism 105 which is formed orthogonal to the X-axis feed mechanism 104 so as to be able to move horizontally. Therefore, when the X-axis feed mechanism 104 is moved along the Y-axis feed mechanism 105, the head module 301 mounted on the X-axis feed mechanism 104 is moved horizontally in the Y-axis direction. In addition, the head module 301 moves horizontally along the X-axis transport mechanism 104 in the X-axis direction.

A plurality of nozzle spindles 240 are disposed on the circumference of the one head module 301. In this case, the plurality of head modules 301 are detachably coupled to the horizontal transfer mechanism 103, and the plurality of nozzle spindles 240 provided in the head module 301 are connected to the electronic component from the component supply unit 102. Is picked up and mounted on the printed circuit board (B) disposed on the conveyor section (106).

In this case, a first imaging unit 191 may be disposed between the component supply unit 102 and the conveyor unit 106. The first photographing unit 191 photographs the electronic component adsorbed to the nozzle spindle 240 from the component supply unit 102 and grasps the state thereof, thereby making it possible to obtain the electronic component according to the inclination angle of the printed circuit board B and the like. Correct the position of the part. In addition, although not shown in FIG. 15, the present invention may include a second photographing unit. The second photographing unit photographs a pick-up point of the electronic component seated on the component supply unit 102 and a fiducial mark of the printed circuit board transferred by the conveyor unit, thereby photographing the electronic component or the printed circuit board B. Function to acquire location information. Here, although the first photographing unit 191 is installed in the bed 101, the present invention is not limited thereto, and the second photographing unit may serve as the first photographing unit.

Meanwhile, as shown in FIGS. 16 and 17, the head module 301 included in the component mounter 100 of the present invention may include a body 310, a nozzle spindle 240, and a nozzle lifting mechanism 370. And a housing elevating mechanism 380.

In addition, the horizontal moving mechanism 103 is provided with a module mounting portion 130, the body 310 of the head module 301 is mounted to be detachable to the module mounting portion 130 of the horizontal moving mechanism (103). In this case, the rotary housing 230 is rotatably supported by the body 310 and a plurality of spindle receiving holes 232 are formed on the same circumference from the center thereof. The nozzle spindles 240 are accommodated in each of the spindle receiving holes 232.

The nozzle elevating mechanism 370 serves to elevate the nozzle spindle 240, and the nozzle elevating mechanism 270 provided in the head module 201 according to the preferred embodiment of the present invention, and its structure and function. Since this is the same, a detailed description thereof will be omitted.

On the other hand, the housing elevating mechanism 380 is provided with a elevating control member 281, in conjunction with the nozzle elevating mechanism 370 can raise and lower the rotating housing 230. In this case, the elevating control member 281 is coupled to the nozzle spindle 240 is movable with the nozzle spindle.

The housing lifting mechanism 380 has the same structure and function as the housing lifting mechanism 280 provided in the head module 201 according to the preferred embodiment of the present invention, and thus a detailed description thereof will be omitted.

As such, the housing elevating mechanism 380 interlocks with the nozzle elevating mechanism 370 and simultaneously lowers the rotary housing 230 through its own load by using components provided in the nozzle elevating mechanism 370. As a result, the components constituting the head module 301 are reduced so that the weight of the head module 301 is reduced, and the lifting and lowering operation is simplified. As a result, the head module can be modularized and mounted to be detachable to the horizontal moving mechanism.

In addition, the head module 301 provided in the component mounter 100 according to the embodiment of the present invention may be disposed in an internal space of the housing rotating mechanism 350 and the nozzles for rotating the rotary housing 230. It may further include an air supply mechanism 390 for introducing the air of the positive pressure and negative pressure. This is also provided in the component module head module 201 according to an embodiment of the present invention, the structure and function of the housing rotating mechanism 250 and the air supply mechanism 290, shown in Figure 3 is the same, so the detailed description Is omitted.

As described above, the structure of the air supply mechanism 390 is simple, and the connection portion 298 connecting the air supply portion 291 and the internal space of the nozzle 242 does not cause twisting so that the positive and negative pressure are efficiently controlled. Is possible. At the same time, by operating the air supply mechanism 390 using the housing rotating mechanism 350 that rotates the rotating housing 230, the total weight and size of the head module is reduced, and thus the head module 301 Modularization is possible.

Therefore, the head module 301 having such a structure can be detachably mounted to the horizontal moving mechanism 103, and a module mounting mechanism for mounting the head module and the horizontal moving mechanism can also be used in various ways.

An example of the module mounting mechanism will be described with reference to FIGS. 16 and 17. The module mounting unit 130 is provided with a toggle clamping device 140, and the body 310 is attached to the toggle clamping device 140. By the clamping may be mounted to the module mounting portion 130. The toggle clamping device 140 is excellent in mounting force even with a small force, and also easy to mount and detach.

The toggle clamping device 140 may include a clamping driver 141, a toggle mechanism 143, and an arm 147. The clamping driving unit 141 is mounted on the module mounting unit 130 and linearly displaces the rod member 142 installed therein. In this case, the clamping driving unit 141 is coupled to the upper side of the module mounting unit 130, thereby displacing the rod member 142 in the front, rear direction, which is a direction substantially perpendicular to the upper side of the body 310.

The rod member 142 is connected to the toggle mechanism 143. The toggle mechanism 143 converts a linear motion of the rod member 142 into a rotational motion, and is connected to the rod member 142 to the rotary link member 145 and the link member 145 which move forward and backward. Linked support lever 144 and the fixed link member 146 is disposed on one side of the support is not the rotation link member 145 of the support lever 144.

The arm portion 147 is connected to the support lever 144 of the toggle mechanism portion 143. The arm part 147 is rotated at a predetermined angle under the driving action of the clamping driving part 141, and a fixing pin 148 for fixing the body 310 is formed at one end thereof.

Therefore, in order to mount the head module 301 on the module mounting unit 140, the clamping driving unit 141 is first operated to displace the rod member 142 forward. When the rod member 142 is displaced forward, the fixed link member 146 of the toggle mechanism 143 is fixed, and the rotary rod member 145 is advanced. Accordingly, the support lever 144 is rotated. Therefore, the arm part 147 rotates at right angles as the support lever 144 rotates. Therefore, the fixing pin 148 formed at one end of the arm part 147 is fixed by pressing the front surface of the body 310.

In this case, at the position where the fixing pin 148 of the body 310 is accommodated, it is preferable that the fixing pin guide part 318 is formed to guide the fixing pin 148 to be seated. The fixing pin guide portion 318 may be formed to accommodate the fixing pin 148, and may also have a structure that is elastically biased toward the module mounting portion 130, thereby the fixing pin guide portion 318 The fixing pin 148 seated at the front side is securely fixed unless a certain force is operated forward.

On the contrary, in order to detach the head module 301 from the module mounting unit 130, the clamping driving unit 141 operates to displace the rod member 142 to the rear. As a result, the fixing pin 148 holding the front surface of the body 310 rotates in a direction opposite to the rotation direction at the time of fixing, so that the fixing pin 148 may be simply separated.

In addition, as shown in FIG. 7 and FIG. 17, in order to mount the body 310 at the correct position of the module mounting unit 130, the module mounting unit ( At least one guide member 212 is formed to guide the mounting member 130, and a guide member insertion groove into which the guide member 212 is inserted into a surface corresponding to the guide member 212 of the module mounting unit 130 ( 132 is preferably formed.

Meanwhile, the head module 301 provided in the component mounter 100 of the present invention may include a nozzle rotating mechanism 360. The nozzle rotating mechanism rotates the nozzle driven gear 268 according to the driving of the nozzle rotating driver 262, thereby rotating the nozzle spindle 240 coupled with the nozzle driven gear 268. Since the structure and function of the nozzle rotating mechanism 260 shown in FIG. 9 are the same, detailed description thereof will be omitted.

According to the present invention having the above structure has the following effects.

First, the components of the head module are reduced by elevating the rotary housing by a section using a mechanism for elevating the nozzle. This makes the lifting structure simple and reduces the manufacturing cost by reducing the total weight of the head module.

Second, by rotating the nozzle spindle and rotating at the same time, it is possible to mount the electronic component accurately and simply according to the position deviation of the printed circuit board, and in particular, a plurality of electronic components can be mounted at the same time. Here, the structure for rotating the rotating housing and the mechanism for rotating the nozzle spindle are simple, and a small number of components are used to reduce the total weight and increase the high speed.

Third, as a mechanical means, by elevating the nozzle spindle and the rotating housing and rotating the rotary housing and the nozzle spindle, the accuracy of the elevating and rotating degree is increased.

 Fourth, the air supply mechanism for injecting positive and negative pressure air into the nozzle inner space for suction and mounting of electronic components is simple, and the twisting of the air supply mechanism does not occur due to the rotation of the rotary housing. The structure is simplified.

Fifth, the head module can be modularized by such an effect, so that one component mounter may include a head module according to the type of each electronic component, thereby manufacturing a separate component mounter according to the type of electronic component. There is no need.

Sixth, the structure in which the head module is mounted on the horizontal moving mechanism is simple, but the mounting and detaching force is excellent. Therefore, the head module can be easily mounted and removed.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (19)

A head module provided in a component mounter which absorbs electronic components from a component supply unit, moves them to a horizontal moving mechanism, and mounts them on a printed circuit board. body; A rotating housing supported to be rotatable and descendable on the body and having a plurality of spindle receiving holes formed on the same circumference from a central portion thereof; A plurality of nozzle spindles accommodated in each of the spindle accommodating holes, and coupled to nozzles for sucking and mounting the electronic component under the spindle; A nozzle elevating mechanism having a clutch shaft for lowering the nozzle spindle by pressing the nozzle spindle upper surface while the nozzle elevating drive unit and the nozzle elevating drive unit are driven down; And For a component mounter having a housing elevating mechanism having an elevating control member for elevating the rotary housing while lowering the rotary housing by its own load while interlocking with the nozzle elevating mechanism. Head module. The method of claim 1, The nozzle lifting drive unit is a motor coupled to the body, And the clutch shaft is coupled to the nozzle lifting drive unit by a mechanical mechanism. The method of claim 1, The spacing between the nozzle spindles that are disposed opposite the center of the rotating housing is an integer multiple of the spacing between the centers of the neighboring component supply parts, And the nozzle elevating mechanisms are arranged to simultaneously press the nozzle spindles facing each other at least about the center of the rotating housing. The method of claim 1, The elevating control member is moved up and down with the nozzle spindle, The housing elevating mechanism is mounted on the rotary housing to be moved up and down together with the rotary housing, and includes at least one hook having a guide hole extending in the center so that the elevating control member is inserted and spans the upper side. , The stopper is supported by the elevating control member when the elevating control member stops at a predetermined height and is prevented from being lowered. When the elevating control member is lowered, the hanger is interlocked with the elevating control member by its own load. Head module for component mounter, characterized in that. The method of claim 4, wherein The body has a head module for a component mounter, characterized in that it comprises at least one linear guide portion arranged to guide the lifting movement of the housing lifting mechanism. The method of claim 1, The body, the head module for a component mounter, characterized in that the rotary housing is provided with a lowering stopper to prevent the lowering of the predetermined section or more. The method of claim 1, A housing rotation drive unit mounted to the body; A drive rotating shaft extending from the housing rotation driving unit and rotating by driving of the housing rotation driving unit; A housing drive gear mounted along an outer circumference of the drive rotation shaft; And And a housing rotating mechanism mounted to the rotating housing and having a housing driven gear connected to and interlocked with the housing driving gear. The method of claim 7, wherein The body has at least one linear guide portion arranged to guide the lifting movement of the housing lifting mechanism, And the housing drive gear is elevated along the linear guide part to move in coordination with the rotary housing. The method according to claim 1 or 7, A plurality of supply valves for supplying positive pressure and negative pressure air; A fixing part mounted to the body in a hollow shape and having a plurality of first supply lines connected to each of the air supply valves and having different heights; A plurality of air-sealed flow portions disposed in the fixed portion and in the same number of supply holes as the nozzles, and connected to the respective first supply lines and sealed along outer circumferential surfaces of different heights; A rotating part having a plurality of second supply lines connecting between the air sealed flow part and a corresponding supply hole, and rotating at the same speed as the rotating housing; And And a connection pipe connecting the respective supply holes to the internal space of the nozzle, and further comprising an air supply mechanism for introducing positive and negative pressure air into the internal space of the respective nozzles. Head module. The method of claim 9, The rotating unit is a head module for a component mounter, characterized in that the rotation by the drive of the housing rotation drive unit. The method of claim 9, Between the fixing part and the rotating part, the outer sealing member which is formed in contact with each of the spindle air flow path and the corresponding fixing part inner side to seal the spindle air flow path is arranged in a ring shape Head module for the component mounter of the mounter. The method according to claim 1 or 7, And a nozzle rotating mechanism for rotating the nozzle spindle. The method of claim 12, The nozzle rotating mechanism is: A nozzle rotating driver mounted to the body; A nozzle drive gear connected to the nozzle rotating drive unit and disposed in a central portion of the rotary housing; And And a plurality of nozzle driven gears engaged with the nozzle drive gears and coupled along the nozzle spindle outer periphery, respectively. The method of claim 1, And the body is mounted to the horizontal moving mechanism so as to be detachable. A component mounter having at least one head module for absorbing an electronic component from a component supply unit for supplying components to be mounted on a printed circuit board, and a horizontal moving mechanism for horizontally moving the head module. The head module includes: a body; A rotating housing rotatably supported by the body and having a plurality of spindle receiving holes formed on the same circumference from a central portion thereof; A plurality of nozzle spindles accommodated in each of the spindle receiving holes; A nozzle elevating mechanism for lowering the nozzle spindle; And a housing elevating mechanism including an elevating control member which is interlocked with the nozzle elevating mechanism to lower the rotary housing by its own load and contacts the elevating rotary housing while interlocking with the nozzle elevating mechanism. And said horizontal moving mechanism comprises a module mounting portion to which said head module is detachably mounted. The method of claim 15, The module mounting unit is provided with a toggle clamping device, the body mounting component, characterized in that the clamping mounted on the module mounting. The method of claim 15, On the surface in contact with the module mounting portion of the body, a guide pin for guiding to be mounted to the module mounting portion is formed, And a guide insertion hole is formed on a surface corresponding to the guide pin of the module mounting part. The method of claim 15, The nozzle elevating mechanism is: Nozzle lift drive unit; And And a clutch shaft coupled to the nozzle elevating drive unit and a mechanical mechanism to lower the nozzle spindle by pressing the nozzle spindle upward while descending along the nozzle elevating drive unit. The method of claim 15, The elevating control member is coupled to the nozzle spindle, The housing elevating mechanism is mounted on the rotary housing to be moved up and down together with the rotary housing, and includes at least one hook having a guide hole extending in the center so that the elevating control member is inserted and spans the upper side. , The stopper is supported by the elevating control member when the elevating control member stops at a predetermined height and is prevented from being lowered. When the elevating control member is lowered, the hanger is interlocked with the elevating control member by its own load. Component mounting machine, characterized in that.

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