KR100644334B1 - Method of cutting glass plates and the apparatus therefor - Google Patents

Abstract

The present invention is to solve the problem that the division speed is slow in the method of dividing the glass substrate by irradiating a laser spot on the scribe line.

When irradiating a laser to the scribe line formed on the surface of the glass substrate by the movement of the glass cutter wheel

A plurality of pairs of beam spots are irradiated on both sides of the scribe line, and the beam spots are moved in synchronization with or following the movement of the preceding glass cutter.

Description

Glass substrate dividing method and apparatus {METHOD OF CUTTING GLASS PLATES AND THE APPARATUS THEREFOR}             

1 is a view showing a conventional glass splitting method by laser irradiation;

2 is a view showing the generation of stress on the glass surface by laser irradiation;

3 is a view showing a state in which the divided section;

4 is a view showing an embodiment of the glass dividing apparatus of the present invention;

5 is a configuration diagram of an optical apparatus in the apparatus of FIG. 4;

6 shows the position and size of the beam spot irradiated in the apparatus of FIG. 4;

7 is a view of a beam spot having a shape different from that in FIG. 6;

FIG. 8 shows a beam spot having a different shape from that shown in FIG. 6;

9 is a view showing a deformation of the optical apparatus shown in FIG. 5;

10 is a view showing a modification of the beam spot in the apparatus of FIG. 9;

11 is a front view showing a second embodiment of the present invention;                 

12 is a configuration diagram of an optical apparatus in the apparatus of FIG.

FIG. 13 is a configuration diagram of an optical mechanism including two refrigerant nozzles in the apparatus of FIG.

Explanation of symbols on the main parts of the drawings

1: pedestal 11: rotating mechanism

12: Table 13, 13 ': glass substrate

14 laser oscillation unit 15 barrel portion

16: support unit (支持 UNIT)

17: CUTTER WHEEL CHIP

18: chip holder 19: refrigerant nozzle (冷 媒 NOZZLE)

20, 21: CCD camera 22, 23: monitor

35 BEAM SPLITTER 38, 42 BEAM SPOT

50, 51: glass divider

The present invention relates to a method and apparatus for dividing a glass substrate by irradiating a laser after scribing by a glass cutter wheel.                         

As shown in FIG. 1, by moving the glass cutter wheel 102 on the glass substrate 101 to form a scribe line 103, and irradiating the beam spot 104 with a laser directly on the scribe line 103. There is a processing method for dividing the glass substrate 101.

In this processing method, there were the following problems.

1. While the typical scribing speed of the glass cutter wheel 102 is 300 mm / sec (the scribing conditions at this time are as described below), the splitting speed of the glass substrate by laser irradiation, that is, the moving speed of the beam spot is 30 mm. The glass pore speed is significantly slowed down because it is limited to / sec or less.

2. Also, the quality of the divided glass substrate cross section is poor.

FIG. 2 shows the generated stress in the glass substrate seen in the direction opposite to the advancing direction of the laser spot at the line a-a 'in FIG. When the glass substrate 101 is viewed in a plan view, the glass substrate 101 is divided into two with the scribe line 103 as the boundary. Vertical cracks are generated in the thickness direction of the glass on the glass surface immediately below the scribe line 103. When the beam spot is irradiated and the glass on the scribe line is heated to a temperature below the glass melting point, the heated area tries to expand. As the glass does not melt, the vertical crack just below the scribe line is closed as a reaction force. The compressive stress that is going to be produced. Then, after the spot passes, the stress of trying to advance the vertical crack occurs as the glass returns to room temperature. In this way, it is thought that the speed of advancing the vertical crack as a whole is slowed down because the stress to be developed after the compression stress to close the vertical crack occurs due to the movement of the spot.

3 shows a section in which the glass substrate 101 is divided. A tendon shape (mark 106) is formed over one surface of the cross section. This mark 106 is a shape in which the traveling direction of cracks, which locally occur respectively, appears as a shape. Thus, it is recognized in the glass industry that the mark 106 is not good as a divided surface.

The present invention has been made to solve the above problems and to provide a glass splitting method and apparatus which can improve the processing speed and improve the quality of the cross section.

The present invention relates to a method of forming a scribe line on a surface of a glass substrate by moving a glass cutter wheel, and dividing the glass substrate by irradiating a laser to the scribe line.

Irradiating the laser with a plurality of pairs of beam spots on both sides of the scribe line, and synchronously or following the movement of the preceding glass cutter.

It is characterized by.

Cooling the scribe line on the rear side of the beam spot with a coolant or cooling the rear of the beam spot with a coolant further improves the processing speed and processing quality.

(Example)

4 is a front view of the glass dividing apparatus 50 showing the first embodiment of the present invention. The pedestal 1 is moved in the Y direction perpendicular to the ground of the drawing along the rails 4 and 5 of two rows by axially rotating the ball screw 2 in the direction perpendicular to the ground of the drawing with the motor 3. do. The upper surface of the pedestal 1 is provided with a second pedestal 9 which is axially rotated by the guide 6 and the motor 7 in the left and right (X) directions. The ball screw 8 is engaged with the ball nut 10 installed in the second pedestal 9 so that when the motor 7 rotates, the second pedestal 9 moves in the X direction along the guide 6. A table 12 is provided on the second pedestal 9 with the rotating mechanism 11 interposed therebetween, and the glass substrate 13 is sucked and fixed on the table 12.

14 denotes a laser oscillation unit, in which a beam of laser light is directed from the barrel portion 15 to the support unit 16. The support unit 16 is provided so that the chip holder 18 for supporting the cutter wheel chip 17 to rotate can be raised and lowered on the lower right end of the barrel center of the barrel 15.

5 shows the optical mechanism in the barrel 15 and the support unit 16. As shown in FIG. The horizontal beam 31 oscillated by the laser oscillator 14 is guided downward by the mirror 32 located in the barrel 15 and then beams of predetermined aperture by the beam expander 33. It is shaped by. The beam is guided into the support unit 16 in a horizontal direction by the mirror 34.

The beam guided to the support unit 16 is divided into a beam 31a that goes straight by the beam splitter 35 and a beam 31b that is turned 90 degrees in the horizontal direction. The beam 31b is turned downward by the mirror 36 and an elliptic beam spot 38 is formed on the glass substrate 13 by the circumferential lens 37 provided in the middle of the optical path. do.

On the other hand, the beam 31a is rotated by 90 degrees in the horizontal direction by the mirror 39, and is turned downward by the mirror 40, and on the glass substrate 13 by the circumferential lens 41 provided in the middle of the optical path. An elliptic beam spot 42 is formed in the. These beam spots 38 and 42 are located behind the cutter wheel chip 17 (downstream in the moving direction of the glass substrate 13) and on both sides of the scribe line L by the cutter wheel chip 17. Each one.

Returning to Fig. 4, the alignment marks photographed by the CCD cameras 20 and 21 photographing the alignment marks imprinted on the glass substrate 13 are recognized by the image recognition device. The position shift of the glass substrate 13 mounted on the table 12 is understood. 22 and 23 are monitors for displaying captured images by the CCD cameras 20 and 21.

6 is a plan view showing the size and positional relationship of the beam spot 38 and the beam spot 42. The size of each beam spot is

Shortening a: 0.5 to 10 mm

Long axis b: 10 to 50 mm

Distance between both beam spots c1: 0.5 to 20 mm

The range of is preferable. The distance between the cutter wheel chip 17 and the beam spot may be appropriately adjusted according to the environment.

As a scribe condition,

Glass Substrate Thickness: 0.7t

Angle of cutter: 125 °

Cutter Weight: 1.4Kgf

When the beam spot is moved in accordance with the scribe speed, the upper limit of the moving speed is 300 mm / sec, and the temperature of the glass surface by the irradiation of the beam is lower than the melting point of the glass. Since the beam spots are irradiated with symmetrical intervals in this manner, stresses for advancing the vertical cracks act equally on the vertical cracks just below the scribe line. Since the glass is divided at the moment, the splitting speed is higher than that of the split processing method shown in FIG. 1, and the mark is not generated as shown in FIG.

In Fig. 6, the beam spots 38 and 42 have their long axes parallel to the scribe direction, but the beam lenses 38 and 42 are shown in Fig. 7 by changing their 90 ° directions with respect to the optical axis. Similarly, beam spots 38a and 42a having a short axis parallel to the scribing direction are obtained, and in this case, the distance c2 between both beamsoot is 10.5 to 80 mm.

If a conventional condenser lens is used instead of the cylindrical lens, circular beam spots 38b and 42b as shown in Fig. 8 are obtained, in which case the beam diameter d is 2 to 25 mm, The distance c3 between beam spots is 2.5-45.5 mm.

Fig. 9 shows an optical mechanism for forming two pairs of beam spots on the scribe line L border. The beam splitters 36 'and 40' are beam splitters, and the beams reflected downwards pass through the circumferential lenses 37 and 41 as in the case of FIG. 5, and the beam spots 38 and 42 are formed. The beams passing through the beam splitters 36 'and 40' are reflected downward from the separately installed mirrors 36a and 40a and pass through circumferential lenses (not shown) to form beam spots 38 'and 42', respectively.

If a condenser lens is used instead of the cylindrical lenses 37 and 41, two pairs of beam spots are obtained as shown in FIG.

The glass dividing apparatus 51 shown in FIG. 11 includes a coolant nozzle 19 for ejecting water injection, He gas, N ₂ gas or CO ₂ as a coolant in the support unit 16, as shown in FIG. As described above, the coolant nozzle 19 is set so that the coolant is ejected to the spot Q on the scribe line L downstream of the beam spots 38 and 42.

In the glass division of Fig. 12, the beam spot can be moved in accordance with the scribing speed up to 400 mm / sec under the above scribing conditions. This is thought to be due to the effect of increasing the stress to advance the vertical crack just below the scribe line by cooling on the scribe line.

Fig. 13 shows a dividing apparatus having coolant nozzles 19a and 19b for ejecting a coolant into spots Q1 and Q2 on the downstream side of beam spot 38 and beam spot 42, respectively.

In the dividing apparatus shown in FIG. 13, as shown by 13 ', it is effective in dividing the board | substrate in which the stress at the time of sticking a board | substrate like a board | substrate with two pieces of glass is latent. This is because by varying the cooling conditions, it is necessary to deliberately disproportionately stress the vertical crack directly below the scribe line.

As described above, in the present invention, when irradiating a laser to a scribe line formed on the surface of a glass substrate by a glass cutter wheel, a plurality of pairs of beam spots are irradiated on both sides of the scribe line and the glass spot is preceded by the glass cutter. By moving in synchronization with, or following the movement of, the glass substrate can be divided by moving the beam spot at a normal scribe speed, and the quality of the divided cross section is also good.

Claims (6)

A method of forming a scribe line on a surface of a glass substrate by moving a glass cutter wheel, and dividing the glass substrate by irradiating a laser to the scribe line, Irradiate the laser with a plurality of pairs of beam spots on both sides of the scribe line, and move the laser in synchronization with or following the movement of the preceding glass cutter. Glass division method characterized in that. A method of forming a scribe line on a surface of a glass substrate by moving a glass cutter wheel, and dividing the glass substrate by irradiating a laser to the scribe line, The laser is irradiated with a plurality of pairs of beam spots on both sides of the scribe line, and moved in synchronization with or following the movement of the preceding glass cutter, and moved behind the beam spot. Cooling the scribe line on the side with a refrigerant Glass division method characterized in that. A method of forming a scribe line on a surface of a glass substrate by moving a glass cutter wheel, and dividing the glass substrate by irradiating a laser to the scribe line, The laser is irradiated with a plurality of pairs of beam spots on both sides of the scribe line, and moved in synchronization with or following the movement of the preceding glass cutter, and moved behind the beam spot. Cooling the side with refrigerant Glass division method characterized in that. A glass substrate dividing apparatus comprising a table on which a glass substrate is placed, a table moving mechanism for moving the table, and a glass cutter wheel and laser irradiation means along a moving direction of the table, The laser irradiation means forms a plurality of pairs of beam spots on both sides of the scribe line formed on the surface of the glass substrate by the glass cutter wheel. Glass division method characterized in that. A glass substrate dividing apparatus comprising a table on which a glass substrate is placed, a table moving mechanism for moving the table, and a glass cutter wheel and laser irradiation means along a moving direction of the table, The laser irradiation means forms a plurality of pairs of beam spots on both sides of the scribe line formed on the surface of the glass substrate by the glass cutter wheel, and coolant ejection means for cooling the scribe line on the rear side of these beam spots. With hand) Glass division method characterized in that. A glass substrate dividing apparatus comprising a table on which a glass substrate is placed, a table moving mechanism for moving the table, and a glass cutter wheel and laser irradiation means along a moving direction of the table, The laser irradiation means forms a plurality of pairs of beam spots on both sides of the scribe line formed on the surface of the glass substrate by the glass cutter wheel, and includes refrigerant ejection means for cooling the rear of these beam spots. Glass division method characterized in that.

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