KR100644309B1 - 잉크젯 인쇄용 후막 잉크 조성물 및 방법 - Google Patents
잉크젯 인쇄용 후막 잉크 조성물 및 방법 Download PDFInfo
- Publication number
- KR100644309B1 KR100644309B1 KR1020050010381A KR20050010381A KR100644309B1 KR 100644309 B1 KR100644309 B1 KR 100644309B1 KR 1020050010381 A KR1020050010381 A KR 1020050010381A KR 20050010381 A KR20050010381 A KR 20050010381A KR 100644309 B1 KR100644309 B1 KR 100644309B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- composition
- inkjet printing
- ink
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0064—Digital printing on surfaces other than ordinary paper on plastics, horn, rubber, or other organic polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/007—Digital printing on surfaces other than ordinary paper on glass, ceramic, tiles, concrete, stones, etc.
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0081—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Ink Jet (AREA)
Abstract
Description
Claims (2)
- 도체, 레지스터, 커패시터 및 인덕터로 구성되는 군으로부터 선택되는 하나 이상의 전자 부품을 갖는 인쇄된 전자회로의 제조방법으로서,(a) 하나 이상의 층을 갖는 기재 상에,(1) 전기적 성질을 갖는, 원소, 화합물 및 이들의 혼합물로 구성되는 군으로부터 선택되는 하나 이상의 물질을 포함하는 기능성 물질 및(2) 폴리비닐피롤리돈을 포함하는 유기 중합체를(3) 유기 용매, 물 또는 이들의 혼합물로부터 선택되는 분산 비히클에 분산시켜 포함하며, 점도가 25 내지 35℃의 온도에서 5 mPa.s 내지 50 mPa.s인 잉크젯 인쇄용 조성물의 하나 이상의 패턴형성된 층을 잉크젯 인쇄함;(b) 상기 기재 및 (a)의 잉크 조성물을 연소함을 포함하는 인쇄된 전자회로의 제조방법.
- 제1항에 있어서, 기재가 복수개의 층들을 포함하고, 단계 (a) 및 (b)가 하기 단계들로 대체되는 방법:(i) 상기 기재의 복수개 층들에서 비아의 패턴형성된 배열을 형성하고;(ii) 단계 (b)의 기재 층(들)에서의 비아를 잉크젯 인쇄용 조성물로 충진하며, 그 후에(iii) 각각의 비아-충진된 기재 층들의 표면 상에 잉크 조성물의 하나 이상의 패턴형성된 전도성 층을 잉크젯 인쇄한 후, 단계 (b)를 하기 단계들로 대체함:(iv) 단계 (iii)의 인쇄된 기재 층들을 적층하여, 비연소 기재에 의해 분리된 복수개의 비연소 상호접속된 기능성 층들을 포함하는 복합체를 형성하며;(v) 단계 (iv)의 복합체 상에 잉크 조성물의 하나 이상의 패턴형성된 층을 잉크젯 인쇄하며, 그 후에 단계 (b)를 행함.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/775,849 | 2004-02-09 | ||
US10/775,849 US20050176246A1 (en) | 2004-02-09 | 2004-02-09 | Ink jet printable thick film ink compositions and processes |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060041699A KR20060041699A (ko) | 2006-05-12 |
KR100644309B1 true KR100644309B1 (ko) | 2006-11-14 |
Family
ID=34679424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050010381A Expired - Fee Related KR100644309B1 (ko) | 2004-02-09 | 2005-02-04 | 잉크젯 인쇄용 후막 잉크 조성물 및 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050176246A1 (ko) |
EP (1) | EP1562410A3 (ko) |
JP (1) | JP4563199B2 (ko) |
KR (1) | KR100644309B1 (ko) |
CN (1) | CN1660598B (ko) |
TW (1) | TWI363081B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101201418B1 (ko) | 2009-11-13 | 2012-11-14 | 한양대학교 에리카산학협력단 | 잉크젯 프린팅을 이용한 전자소자 제조방법 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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US6958522B2 (en) * | 2001-07-05 | 2005-10-25 | International Business Machines Corporation | Method to fabricate passive components using conductive polymer |
WO2006076607A1 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Ink-jet printing of passive electricalcomponents |
KR20080013300A (ko) * | 2006-08-08 | 2008-02-13 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
US8659158B2 (en) | 2006-08-16 | 2014-02-25 | Funai Electric Co., Ltd. | Thermally inkjettable acrylic dielectric ink formulation and process |
JP5187046B2 (ja) * | 2008-07-28 | 2013-04-24 | セイコーエプソン株式会社 | 液体吐出装置 |
US9578752B2 (en) * | 2009-02-05 | 2017-02-21 | Lg Chem, Ltd. | Method of forming conductive pattern and substrate having conductive pattern manufactured by the same method |
CN103081133A (zh) * | 2010-09-03 | 2013-05-01 | 宝洁公司 | 发光设备 |
FR2968598B1 (fr) * | 2010-12-10 | 2013-01-04 | Commissariat Energie Atomique | Depot de materiaux thermoelectriques par impression |
US9785078B2 (en) | 2013-10-21 | 2017-10-10 | Hewlett-Packard Indigo B.V. | Electrostatic ink compositions |
US20160340534A1 (en) * | 2015-05-22 | 2016-11-24 | Board Of Regents, The University Of Texas System | Inks, piezoresistive sensors, and conductive materials on flexible substrates |
EP3625295A4 (en) * | 2017-05-15 | 2021-07-21 | Alpha Assembly Solutions Inc. | DIELECTRIC INK COMPOSITION |
CN109411113A (zh) * | 2017-08-18 | 2019-03-01 | 西安宏星电子浆料科技有限责任公司 | 凹槽自流平导体浆料及其使用方法 |
CN110240830B (zh) * | 2018-03-09 | 2022-10-18 | 国家纳米科学中心 | 基于液态金属颗粒的自烧结导电墨水、其制备方法及应用 |
US20200105453A1 (en) * | 2018-10-01 | 2020-04-02 | Texas Instruments Incorporated | Inkjet printed electronic components |
CN114283966B (zh) * | 2021-12-31 | 2024-11-15 | 西安宏星电子浆料科技股份有限公司 | 有机载体及其方法、导电银浆料及其方法和太阳能电池 |
CN115043690A (zh) * | 2022-05-09 | 2022-09-13 | 南京理工大学 | 一种基于喷墨直写的银点火桥制备方法 |
EP4353787A1 (en) * | 2022-10-12 | 2024-04-17 | NEOS S.r.l. | Ink composition curable by ultraviolet radiation |
DE102023206709A1 (de) | 2023-07-14 | 2025-01-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Elektrisch leitfähige Suspension und Verfahren zur Herstellung einer elektrische leitfähigen Suspension und Struktur |
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JP2002333719A (ja) * | 2001-05-08 | 2002-11-22 | Murata Mfg Co Ltd | パターン形成用支持体、ペースト組成物、及びそれを用いたパターン形成方法 |
JP3956087B2 (ja) * | 2001-06-06 | 2007-08-08 | 株式会社デンソー | プリント基板の製造方法 |
US20030108664A1 (en) * | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
DE10209835A1 (de) * | 2002-03-06 | 2003-10-16 | Bosch Gmbh Robert | Wasserlösliche Paste und deren Verwendung |
JP4042497B2 (ja) * | 2002-04-15 | 2008-02-06 | セイコーエプソン株式会社 | 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体 |
JP2003309337A (ja) * | 2002-04-16 | 2003-10-31 | Fujikura Ltd | プリント回路基板 |
US20040185388A1 (en) * | 2003-01-29 | 2004-09-23 | Hiroyuki Hirai | Printed circuit board, method for producing same, and ink therefor |
US7062848B2 (en) * | 2003-09-18 | 2006-06-20 | Hewlett-Packard Development Company, L.P. | Printable compositions having anisometric nanostructures for use in printed electronics |
US7683107B2 (en) * | 2004-02-09 | 2010-03-23 | E.I. Du Pont De Nemours And Company | Ink jet printable thick film compositions and processes |
US20050173680A1 (en) * | 2004-02-10 | 2005-08-11 | Haixin Yang | Ink jet printable thick film ink compositions and processes |
-
2004
- 2004-02-09 US US10/775,849 patent/US20050176246A1/en not_active Abandoned
-
2005
- 2005-01-07 EP EP05000234A patent/EP1562410A3/en not_active Withdrawn
- 2005-01-14 TW TW094101073A patent/TWI363081B/zh not_active IP Right Cessation
- 2005-01-27 JP JP2005020320A patent/JP4563199B2/ja not_active Expired - Fee Related
- 2005-02-03 CN CN2005100083170A patent/CN1660598B/zh not_active Expired - Fee Related
- 2005-02-04 KR KR1020050010381A patent/KR100644309B1/ko not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101201418B1 (ko) | 2009-11-13 | 2012-11-14 | 한양대학교 에리카산학협력단 | 잉크젯 프린팅을 이용한 전자소자 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP4563199B2 (ja) | 2010-10-13 |
EP1562410A2 (en) | 2005-08-10 |
TWI363081B (en) | 2012-05-01 |
CN1660598B (zh) | 2010-08-04 |
JP2005223324A (ja) | 2005-08-18 |
TW200535198A (en) | 2005-11-01 |
US20050176246A1 (en) | 2005-08-11 |
CN1660598A (zh) | 2005-08-31 |
EP1562410A3 (en) | 2008-04-09 |
KR20060041699A (ko) | 2006-05-12 |
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