KR100624131B1 - Organic light emitting display device - Google Patents

Abstract

The present invention relates to a method for simplifying the encapsulation process of an organic light emitting display device and shortening the process time, comprising: a substrate; A first organic light emitting diode disposed on one surface of the substrate; A second organic light emitting display element located on the other side of the substrate; A first sealing substrate bonded to one surface of the substrate and sealing the first organic light emitting diode; A second encapsulation substrate bonded to the other surface of the substrate and sealing the second organic light emitting display element; Wherein the first and second encapsulation substrates penetrate the substrate and are bonded by a sealant through a through hole positioned in an edge portion of the substrate.

Organic light emitting display device, through hole, sealing board

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DISPLAY DEVICE}

1 is a plan view of an organic light emitting display device according to the present invention;

2 and 3 are cross-sectional views of an organic light emitting display device according to a first embodiment of the present invention.

4 and 5 are cross-sectional views of an organic light emitting display device according to a second embodiment of the present invention.

The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device that can shorten the process time by simplifying the encapsulation process of the organic light emitting display device.

In general, an organic light emitting display device has a structure in which an organic thin film layer is provided between an anode, which is a transparent electrode such as ITO, and a cathode using a metal having a low work function (Ca, Li, Al, etc.). When forward voltage is applied to the organic light emitting diode, holes and electrons are combined at the anode and the cathode to form excitons, and the excitons are recombined to emit light, thereby causing electroluminescence.

The organic light emitting device is structurally thin and lightweight, and the parts are simple and the manufacturing process is simple. Therefore, the organic light emitting device can reduce the production cost more than the conventional liquid crystal display.

A conventional organic light emitting display device includes a first organic light emitting diode including at least an organic light emitting layer formed on one surface of a substrate and a second organic light emitting diode including at least an organic light emitting layer formed on another surface of the substrate. A first sealing substrate bonded to one surface of the first organic electroluminescent device and sealed by the sealant, and a second sealing substrate bonded to the other surface of the substrate and sealed to the second organic electroluminescent device by the sealant. .

However, in the conventional organic light emitting display device, the sealant is applied twice when the first encapsulation substrate is encapsulated with the substrate and the second encapsulation substrate is encapsulated with the substrate, thereby complicating the process of the organic light emitting display apparatus. There is a problem that the process time is increased.

Accordingly, the present invention is to solve the above-mentioned disadvantages and problems of the prior art, by forming a through hole on the substrate of the organic light emitting display device to include a sealant on both sides through the through hole, The second sealing substrate can be bonded onto the substrate at one time.

In order to achieve the object as described above, the present invention is a substrate; A first organic light emitting diode disposed on one surface of the substrate; A second organic light emitting display element located on the other side of the substrate; A first sealing substrate bonded to one surface of the substrate and sealing the first organic light emitting diode; A second encapsulation substrate bonded to the other surface of the substrate and sealing the second organic light emitting display element; Wherein the first and second encapsulation substrates are bonded by a sealant, and the sealant adheres the first and second encapsulation substrates through through holes located at edge portions of the substrate. A light emitting display device is provided.

In addition, the present invention is a first substrate; A first organic light emitting diode disposed on the first substrate; A first sealing substrate bonded to the first substrate and sealing the first organic light emitting diode; A second substrate; A second organic light emitting diode disposed on the second substrate; A second sealing substrate bonded to the second substrate and sealing the second organic light emitting display element; Wherein the first substrate and the second substrate are bonded to one surface on which the first and second organic light emitting diodes are not formed, and the first and second encapsulation substrates are bonded by a sealant. The organic light emitting display device is characterized in that the first and second sealing substrate is bonded to each other through a through hole located in the edge portion of the first substrate and the second substrate.

Details of the above objects and technical configurations and the effects thereof according to the present invention will be more clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention. In addition, in the drawings, the length, thickness, etc. of layers and regions may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a plan view of a substrate of an organic light emitting display device according to the present invention.

Referring to FIG. 1, through holes 10a are formed in a substrate 10 formed of glass, stainless steel, or plastic. The area of the through holes 10a is 2 to 30% of the total area of the substrate. When the area of the through hole 10a is 2% or less of the entire area of the substrate 10, the sealing ability by the sealant is lowered. When the area of the through hole 10a is 30% or more, the substrate may be damaged by an external shock, and the substrate supporting ability There is a problem of deterioration.

Subsequently, the first organic light emitting diode 21 including the lower electrode 21a, the organic layer 21b, and the upper electrode 21c is formed.

The lower electrode 21a is made of ITO or IZO having a high work function, and may include a reflective film made of a metal having high reflectivity such as Al, Al-Nd, and Ag in the lower layer. In the case of the bottom emission, it does not include the reflective film, and may be formed of one of ITO and IZO, which are transparent conductive films.

The organic layer 21b may include at least an organic light emitting layer and may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

The upper electrode 21c is formed of Mg, Ag, Al, Ca, and an alloy thereof having a low work function. In the case of the bottom emission, it may be formed of a reflective electrode made of one selected from the group consisting of Mo, MoW, Cr, AlNd and Al alloy.

2 is a cross-sectional view of an organic light emitting display device according to a first embodiment of the present invention.

The through holes 10a are formed in the substrate 10 made of glass, stainless steel, plastic, or the like. The area of the through holes 10a is 2 to 30% of the total area of the substrate 10. When the area of the through holes 10a is 2% or less of the entire area of the substrate 10, the sealing ability by the sealant 40 is lowered. When the area of the through holes 10a is 30% or more, the substrate may be damaged by external impact. There is a problem that the substrate holding capacity is lowered.

Subsequently, a first organic light emitting display element 21 including the first lower electrode 21a, the first organic layer 21b, and the first upper electrode 21c is formed on one surface of the substrate 10. A second organic light emitting display device 22 including the second lower electrode 22a, the second organic layer 22b, and the second upper electrode 22c is formed on the other surface of the substrate 10.

The first and second lower electrodes 21a and 22a may be formed of ITO or IZO having a high work function, and may include a reflective film formed of a metal having high reflectivity such as Al, Al-Nd, and Ag in the lower layer. have. In the case of the bottom emission, it does not include the reflective film, and may be formed of one of ITO and IZO, which are transparent conductive films.

The first and second organic film layers 21b and 22b may include at least an organic light emitting layer, and may further include any one or more layers of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

The first and second upper electrodes 21c and 22c are formed of Mg, Ag, Al, Ca, and alloys thereof having a low work function. In the case of the bottom emission, it may be formed of a reflective electrode made of one selected from the group consisting of Mo, MoW, Cr, AlNd and Al alloy.

Next, a first sealing substrate 31 is formed to seal the first organic light emitting diode 21 formed on one surface of the substrate 10. The first encapsulation substrate 31 is bonded to the substrate 10 by the sealant 40. The sealant 40 may be a transparent sealant. Furthermore, the sealant 40 may be a UV curing agent containing epoxy or a thermosetting agent containing epoxy, and may include a spacer such as polymer beads or silica particles.

Subsequently, the sealant 40 is formed on only one surface of the substrate 10 and then formed on the other surface of the substrate 10 through the through holes 10a. The second encapsulation substrate 32 seals the second organic light emitting diode 22 formed on the other surface of the substrate 10 and is sealed by the sealant 40 formed through the through holes 10a. The substrate 10 is bonded to the substrate 10.

The first encapsulation substrate 31 and the second encapsulation substrate 32 may be formed of glass, stainless steel, plastic, or the like.

FIG. 3 is a cross-sectional view of the organic light emitting display device according to the first embodiment of the present invention in a direction different from that of FIG.

Through-holes 10a are formed on the substrate 10. After forming the sealant 40 on one surface of the substrate 10, the first encapsulation substrate 31 is bonded. The sealant 40 is formed on the other surface of the substrate 10 through the through holes 10a. The second encapsulation substrate 32 is bonded to the other surface of the substrate 10 by the sealant 40 formed through the through holes 10a.

The other descriptions are the same as in FIG. 2, and thus descriptions thereof will be omitted.

In the organic light emitting display device according to the structure of the substrate described above, the sealant 40 used to attach the substrate 10 and the first encapsulation substrate 31 is formed through the through holes 10a. It is used to attach the substrate 10 and the second sealing substrate 32. As such, the sealant 40 is injected into one surface of the substrate 10 and coated on both surfaces of the substrate 10 through the through holes 10a to simplify the process of manufacturing the organic light emitting display device. The advantage is that the process time can be shortened.

In addition, since the region where the first encapsulation substrate 31 and the second encapsulation substrate 32 are bonded only to the sealant 40 is formed, the encapsulation effect of the organic light emitting display device is enhanced, and the organic light emitting display device More effective protection from the outside air.

4 is a cross-sectional view of an organic light emitting display device according to a second embodiment of the present invention.

Referring to FIG. 4, through holes 10a are formed in the first substrate 11 made of glass, stainless steel, plastic, or the like. The area of the through holes 10a is 2 to 30% of the total area of the first substrate 11. When the area of the through holes 10a is 2% or less of the total area of the first substrate 11, the sealing ability by the sealant 40 is lowered. When the area of the through holes 10a is 30% or more, the substrate may be damaged by external impact. In addition, there is a problem that the substrate holding capacity is lowered.

Subsequently, a first organic light emitting diode 21 including the first lower electrode 21a, the first organic layer 21b, and the first upper electrode 21c is formed on one surface of the first substrate 11. .

In addition, the through holes 10a are formed in the second substrate 12 made of glass, stainless steel, plastic, or the like. The area of the through holes 10a is 2 to 30% of the total area of the second substrate 12. If the area of the through holes 10a is less than or equal to 2% of the total area of the second substrate 12, the sealing ability of the sealant is reduced. There is a problem that the support capacity is lowered.

Subsequently, a second organic light emitting diode 22 including the second lower electrode 22a, the second organic layer 22b, and the second upper electrode 22c is formed on one surface of the second substrate 12.

The first and second lower electrodes 21a and 22a may be formed of ITO or IZO having a high work function, and may include a reflective film formed of a metal having high reflectivity such as Al, Al-Nd, and Ag in the lower layer. have. In the case of the bottom emission, it does not include the reflective film, and may be formed of one of ITO and IZO, which are transparent conductive films.

The first and second organic film layers 21b and 22b may include at least an organic light emitting layer, and may further include any one or more layers of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

The first and second upper electrodes 21c and 22c are formed of Mg, Ag, Al, Ca, and alloys thereof having a low work function. In the case of the bottom emission, it may be formed of a reflective electrode made of one selected from the group consisting of Mo, MoW, Cr, AlNd and Al alloy.

Subsequently, the first substrate 11 and the second substrate 12 are bonded to one surface on which the first organic light emitting diode 21 and the second organic light emitting diode 22 are not formed.

The through holes 10a pass through the first and second substrates 11 and 12, and the positions of the through holes 10a formed on the first and second substrates 11 and 12 should coincide with each other. do.

A first sealing substrate 31 is formed to seal the first organic light emitting diode 21 formed on one surface of the first substrate 11. The first encapsulation substrate 31 is bonded to the first substrate 11 by the sealant 40. The sealant 40 is formed on only one surface of the first substrate 11 and then formed on one surface of the second substrate 12 through the through holes 10a. The second encapsulation substrate 32 seals the second organic light emitting diode 22 formed on one surface of the second substrate 12 and is formed on the sealant 40 formed through the through holes 10a. Thereby bonding to the second substrate 12.

The first and second sealing substrates 31 and 32 may be formed of glass, stainless steel, plastic, or the like.

The sealant 40 may be a transparent sealant. Furthermore, the sealant 40 may be a UV curing agent containing epoxy or a thermosetting agent containing epoxy, and may include a spacer such as polymer beads or silica particles.

FIG. 5 is a cross-sectional view of the organic light emitting display device according to the second exemplary embodiment of the present invention in a direction different from that of FIG.

Through-holes 10a are formed on the first substrate 11 and the second substrate 12. After forming the sealant 40 on one surface of the first substrate 11, the first sealing substrate 31 is bonded to the first sealing substrate 31. The adhesive 40 is formed on one surface of the second substrate 12 through the through holes 10a. The second encapsulation substrate 32 is bonded to the second substrate 12 by the sealant 40 formed through the through holes 10a.

Since other descriptions are the same as in FIG. 4, descriptions are omitted to avoid duplication.

In the organic light emitting display device of the present invention, the sealant 40 used to attach the first substrate 11 and the first encapsulation substrate 31 has a through hole 10a. It is used to attach the second substrate 12 and the second sealing substrate 32 through. As described above, the sealant 40 is formed on one surface of the first substrate 11 and formed on one surface of the second substrate 12 through the through holes 10a to thereby process the organic light emitting display device. Simplify and shorten the manufacturing process time.

In addition, since the region where the first encapsulation substrate 31 and the second encapsulation substrate 32 are bonded only to the sealant 40 is formed, the encapsulation capability of the organic light emitting display device is improved, and thus the organic light emitting display device More effective protection from the outside air.

Although the present invention has been shown and described with reference to the preferred embodiments as described above, it is not limited to the above embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

Therefore, the organic light emitting display device of the present invention simplifies the encapsulation process, has an advantage of shortening the process time, and improves the encapsulation capability.

Claims (4)

Board; A first organic light emitting diode disposed on one surface of the substrate; A second organic light emitting display element located on the other side of the substrate; A first sealing substrate bonded to one surface of the substrate and sealing the first organic light emitting diode; A second encapsulation substrate bonded to the other surface of the substrate and sealing the second organic light emitting display element; Including, And the first and second encapsulation substrates are bonded by a sealant, and the sealant attaches the first and second encapsulation substrates through a through hole located at an edge of the substrate. The method of claim 1, The area of the sum of the through holes is 2 to 30% of the area of the substrate. A first substrate; A first organic light emitting diode disposed on the first substrate; A first rod substrate bonded to the first substrate and sealing the first organic light emitting diode; A second substrate; A second organic light emitting diode disposed on the second substrate; A second sealing substrate bonded to the second substrate and sealing the second organic light emitting display element; Including, The first substrate and the second substrate are bonded to one surface on which the first and second organic light emitting diodes are not formed. The first and second encapsulation substrates are bonded by a sealant, and the sealant adheres the first and second encapsulation substrates through through holes located in edge portions of the first and second substrates. An organic light emitting display device. The method of claim 3, wherein The area of the sum of the through holes formed on the first and second substrates is 2 to 30% of the area of each substrate.

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