[go: up one dir, main page]

KR100609603B1 - Printed Circuit Board Inspection System with Integrated X-ray and Visual Inspection - Google Patents

Printed Circuit Board Inspection System with Integrated X-ray and Visual Inspection Download PDF

Info

Publication number
KR100609603B1
KR100609603B1 KR1020020027452A KR20020027452A KR100609603B1 KR 100609603 B1 KR100609603 B1 KR 100609603B1 KR 1020020027452 A KR1020020027452 A KR 1020020027452A KR 20020027452 A KR20020027452 A KR 20020027452A KR 100609603 B1 KR100609603 B1 KR 100609603B1
Authority
KR
South Korea
Prior art keywords
camera
ray
image
optical
under test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020020027452A
Other languages
Korean (ko)
Other versions
KR20030089293A (en
Inventor
홍성철
Original Assignee
주식회사 미르기술
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 미르기술 filed Critical 주식회사 미르기술
Priority to KR1020020027452A priority Critical patent/KR100609603B1/en
Publication of KR20030089293A publication Critical patent/KR20030089293A/en
Application granted granted Critical
Publication of KR100609603B1 publication Critical patent/KR100609603B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/40Imaging
    • G01N2223/413Imaging sensor array [CCD]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/60Specific applications or type of materials
    • G01N2223/611Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6113Specific applications or type of materials patterned objects; electronic devices printed circuit board [PCB]

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

본 발명은 피검사물체를 그 상부에 안착시킴과 아울러 소정의 위치로 이송시키는 이송장치와; 상기 이송장치의 하부에 설치되어 피검사물체에 소정의 파장을 갖는 광을 출사하는 광발생수단과; 상기 광발생수단의 맞은편 쪽에 설치되어 상기 피검사물체를 투과한 소정의 광을 가시광으로 변환 증폭시키는 광증폭수단과; 상기 피검사물체를 광학적으로 조명하여 화상을 생성하는 광학유닛과; 상기 광증폭수단을 통한 엑스레이이미지 또는 광학유닛에 의한 화상을 받아들여 정보를 획득하는 카메라를 포함한다.The present invention comprises a transfer device for seating the object to be inspected on top and to transfer to a predetermined position; Light generating means installed at a lower portion of the conveying device to emit light having a predetermined wavelength to the object under test; Optical amplification means provided on the opposite side of the light generating means to convert and amplify predetermined light transmitted through the object under test into visible light; An optical unit for optically illuminating the object under test to generate an image; And a camera that receives the x-ray image through the optical amplification means or the image by the optical unit to obtain information.

상술한 바와 같이 하나의 카메라를 이용하여 엑스레이영상 및 화상을 동시에 획득하도록 구현함에 따라 검사장치의 단순화를 꾀함과 아울러 제조 코스트 절감의 효과를 얻을 수 있다. As described above, by simultaneously acquiring the X-ray image and the image using one camera, the inspection apparatus may be simplified and the manufacturing cost may be reduced.

회로기판검사, 엑스레이, 카메라, 비주얼검사,Circuit board inspection, X-ray, camera, visual inspection,

Description

엑스레이 및 비주얼검사가 통합된 인쇄회로기판 검사장치{INTEGRATED X-RAY AND VISUAL INSPECTION SYSTEM}Printed circuit board inspection device with integrated X-ray and visual inspection {INTEGRATED X-RAY AND VISUAL INSPECTION SYSTEM}

도 1은 본 발명의 일 실시 예에 의한 엑스레이 및 비주얼검사가 통합된 검사시스템의 구성을 개략적으로 도시한 도면이다.1 is a diagram schematically illustrating a configuration of an inspection system incorporating X-rays and visual inspection according to an embodiment of the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

1 : 피검사물체 3 : 이송장치1: Test object 3: Transfer device

5 : 엑스레이소스 7 : 광증폭수단5: X-ray source 7: optical amplification means

9 : 광학유닛 9a : 조명기9: optical unit 9a: illuminator

9b : 렌즈 11 : 카메라9b: lens 11: camera

13 : 하프미러 15 : 반사미러13: half mirror 15: reflection mirror

본 발명은 엑스레이(X-RAY) 및 비주얼(VISUAL) 검사가 통합된 회로기판 검사장치에 관한 것으로서, 더욱 상세하게는 엑스레이 소스(X-RAY SOURCE)를 투과시켜 형성된 엑스레이이미지와, 광학적으로 투영된 화상을 하나의 카메라로 처리하도록 구현하여 장치의 단순화를 꾀하도록 하는 엑스레이 및 비주얼 검사가 통합된 회로기판 검사장치에 관한 것이다.The present invention relates to a circuit board inspection device incorporating X-ray and visual inspection, and more particularly, to an X-ray image formed by transmitting an X-ray source and optically projected. The present invention relates to a circuit board inspection apparatus incorporating X-ray and visual inspection, which implements an image to be processed by one camera to simplify the device.

근자에 와서 전자기기의 소형화, 경량화, 다 기능화 추세에 따라 인쇄회로기판 및 그 위에 탑재되는 전자부품의 집적도가 빠른 속도로 향상되고 있다. 즉, 인쇄회로기판은 점차 다층화되고, 인쇄회로기판에 형성되는 패턴 역시 조밀화되고 있다. 또한, 전자부품들 역시 집적도는 높아지고 크기는 소형화되고 있기 때문에 인쇄회로기판을 제조할 때나, 부품들을 인쇄회로기판 위에 실장할 때 세밀한 주의를 기울이지 않으면 불량이 발생할 가능성이 매우 커지고 있다. 따라서, 인쇄회로기판 제조 및 부품을 실장하고 납땜을 하는 과정에서 각각 단위의 공정 중 발생하는 불량을 제때에 정확히 검출하는 작업이 점차 중요시 요구되고 있다.In recent years, with the trend toward miniaturization, light weight, and multifunctionality of electronic devices, the integration of printed circuit boards and electronic components mounted thereon is rapidly increasing. That is, printed circuit boards are increasingly multilayered, and patterns formed on printed circuit boards are also becoming denser. In addition, electronic components are also increasingly integrated and miniaturized in size, and thus, failure to pay close attention when manufacturing printed circuit boards or mounting components on printed circuit boards is greatly increased. Therefore, in the process of manufacturing printed circuit boards and mounting parts and soldering, it is increasingly important to accurately detect timely defects occurring during each unit process.

이러한 부품의 실장상태를 검사하기 위한 검사장치는 부품의 특성에 좌우되는바 대표적인 것으로 피검사물체에 대한 정보를 획득하는 감지수단으로 엑스레이 이미지, 비디오카메라, 레이저 등에 의한다.An inspection apparatus for inspecting a mounting state of such a component depends on the characteristics of the component, and is a representative means for acquiring information on an object to be inspected by an X-ray image, a video camera, or a laser.

상기 엑스레이 이미지는 엑스레이소스로부터 조사되는 엑스레이 빔을 피검사물체를 향하여 방사하여 형성된 증폭광을 나타내는 것으로서, 피검사물체의 숨겨진 결함을 감지하기에 유용하다.The X-ray image represents amplified light formed by radiating an X-ray beam radiated from an X-ray source toward an object to be inspected, and is useful for detecting a hidden defect of the object to be inspected.

상기 비주얼 이미지는 피검사물체 비주얼 주파수 영역이 캡쳐 되어 형성되는 것으로서, 소납, 결품, 오삽, 부품의 위치 이탈 등 피검사물체의 외형적 결함을 감지하기에 유용하다.The visual image is formed by capturing a visual frequency region of an object, and is useful for detecting an external defect of an object to be inspected, such as soldering, defects, misplacement, and component deviation.

따라서, 최근에는 상기 두 개의 기능을 통합한 검사장치가 사용되어지고 있다.Therefore, recently, an inspection apparatus incorporating the two functions has been used.

그 구성은 크게 피검사물체에 대한 정보를 획득하는 검사시스템과, 획득된 정보를 입력받아 소정의 처리과정을 실시하여 그 불량여부를 판별하는 처리시스템으로 나뉘어진다. The configuration is largely divided into an inspection system for acquiring information on an object to be inspected, and a processing system that receives the acquired information and performs a predetermined process to determine whether there is a defect.

상기 검사시스템은 검사대상인 피검사물체를 고정시키는 보드홀더와 상기 보드홀더를 소정의 위치로 이송시키는 컨베이어 어셈블리와, 상기 피검사물체를 향하여 x-ray를 출사하는 엑스레이소스와, 피검사물체를 투과한 엑스레이이미지를 획득하는 엑스레이카메라와, 상기 피검사물체에 광을 조사하여 그 반사광에 의한 광학적 이미지를 획득하는 광학카메라로 구성된다.The inspection system includes a board holder for fixing an object to be inspected, a conveyor assembly for transporting the board holder to a predetermined position, an X-ray source for emitting x-ray toward the object to be inspected, and a test object to penetrate the object. An x-ray camera for acquiring an x-ray image, and an optical camera for irradiating light onto the object under test to obtain an optical image by the reflected light.

그러나, 종래에는 상술한 바와 같이 엑스레이카메라와 광학카메라를 각각 별개로 설치하여 사용함에 따라 검사시스템이 복잡할 뿐만 아니라 제조코스트가 증가하게 된다는 문제점이 있다.However, conventionally, as described above, as the X-ray camera and the optical camera are separately installed and used, there is a problem that the inspection system is complicated and the manufacturing cost increases.

따라서, 본 발명은 상술한 문제점을 해결하기 위하여 안출 된 것으로서, 본 발명의 목적은 엑스레이이미지 및 화상에 대한 정보를 하나의 카메라를 이용하여 받아들이도록 함에 따라 검사시스템의 단순화를 꾀함과 아울러 제조코스트를 절감시키는 엑스레이 및 비주얼검사가 통합된 회로기판 검사장치를 제공하는 데 있다.Accordingly, the present invention has been made to solve the above-described problems, the object of the present invention is to simplify the inspection system as well as to simplify the inspection system by receiving the information on the x-ray image and the image using a single camera. The present invention provides a circuit board inspection device incorporating X-ray and visual inspection which are reduced.

상술한 목적을 달성하기 위하여 본 발명은 피검사물체를 그 상부에 안착시킴과 아울러 소정의 위치로 이송시키는 이송장치; 상기 이송장치의 하부에 설치되어 피검사물체에 엑스선을 출사하는 광발생수단; 상기 광발생수단의 맞은편 쪽에 설치되어 상기 피검사물체를 투과한 엑스선을 가시광으로 변환 증폭시키는 광증폭수단; 상기 피검사물체를 광학적으로 조명하여 화상을 생성하는 광학유닛; 상기 광증폭수단을 통해 증폭된 엑스레이이미지 및 광학유닛에 의한 화상을 받아들여 정보를 획득하는 하나의 카메라를 포함한다.In order to achieve the above object, the present invention comprises a transfer device for seating the object to be inspected on the upper portion and transported to a predetermined position; Light generating means installed at a lower portion of the transfer device to emit X-rays to an object under test; Optical amplification means installed on the opposite side of the light generating means to convert and amplify X-rays transmitted through the object under test into visible light; An optical unit for optically illuminating the object under test to generate an image; And a camera that receives the X-ray image amplified by the optical amplification means and the image by the optical unit to obtain information.

상기 광증폭수단 및 상기 광발생수단은 상기 카메라의 하부에 수직으로 배치되며; 상기 광학유닛은 상기 광증폭수단의 측면에 나란하게 배치되며; 상기 광발생수단 및 카메라 사이의 광축상에는 하프미러가 소정의 각도로 마련되고; 상기 광학유닛의 출사광축상에는 상기 하프미러가 배치된 수평방향으로 동일선상을 이루는 위치에 반사미러가 마련된다.The optical amplifying means and the light generating means are disposed perpendicular to the lower portion of the camera; The optical unit is disposed side by side of the optical amplifying means; A half mirror is provided at a predetermined angle on an optical axis between the light generating means and the camera; The reflection mirror is provided on the exiting optical axis of the optical unit at the same line in the horizontal direction in which the half mirror is arranged.

상기 광발생수단은 엑스레이빔을 출사시키는 엑스레이소스로 하며, 상기 카메라는 CCD카메라로 한다.The light generating means is an X-ray source for emitting an X-ray beam, and the camera is a CCD camera.

이하, 첨부된 도면 도 1을 참조로 하여 본 발명의 일 실시 예에 의한 구성 및 작용에 대해서 설명한다.Hereinafter, with reference to the accompanying drawings Figure 1 will be described the configuration and operation according to an embodiment of the present invention.

상기 도면에 도시된 바와 같이 피검사물체(1)를 상면에 안착시켜 소정의 방향으로 이송시키는 이송장치(3)와, 상기 이송장치(3)의 하측에 설치되어 상기 피검사물체(1)에 소정의 파장을 갖는 광을 출사하는 광발생수단(5)과, 상기 광발생수단(5)의 맞은편 쪽에 설치되어 상기 피검사물체(1)를 투과한 소정의 광을 가시광으로 변환 증폭시키는 광증폭수단(7)과, 상기 피검사물체(1)를 광학적으로 조명하여 화상을 생성하는 광학유닛(9)과, 상기 광증폭수단(7)을 통해 증폭된 엑스레이이미지 또는 광학유닛(9)에 의한 화상을 받아들여 영상을 획득하는 카메라(11)를 포함한다.As shown in the figure, a transfer device 3 for seating the test object 1 on the upper surface and transporting the object 1 in a predetermined direction, and installed on the lower side of the transport device 3 to the test object 1. Light generating means (5) for emitting light having a predetermined wavelength, and light provided on the opposite side of the light generating means (5) for converting and amplifying the predetermined light transmitted through the object (1) to visible light An amplification means 7, an optical unit 9 for optically illuminating the object 1 to generate an image, and an X-ray image or optical unit 9 amplified by the optical amplification means 7. Camera 11 for receiving an image and acquiring an image.

상기 광발생수단(5)은 엑스레이빔(x-ray beam)을 출사하는 엑스레이소스(x-ray source)가 바람직하며, 상기 카메라(11)는 상기 CCD(Charged Couple Device)카메라로 함이 바람직하다.The light generating means 5 is preferably an x-ray source for emitting an x-ray beam, and the camera 11 is preferably a CCD (Charged Couple Device) camera. .

상기 광발생수단(5)은 상기 카메라(11)의 하측에 수직으로 배치됨과 아울러 상기 광학유닛(9)은 상기 광발생수단(5)과 나란하게 배치되고, 상기 광발생수단(5) 및 상기 카메라(11) 사이의 광로 상에는 하프미러(13)가 소정의 각도로 경사지게 설치된다.The light generating means 5 is disposed perpendicularly to the lower side of the camera 11, and the optical unit 9 is arranged in parallel with the light generating means 5, and the light generating means 5 and the The half mirror 13 is installed to be inclined at a predetermined angle on the optical path between the cameras 11.

또한, 상기 광학유닛(9)의 출사광축상에는 상기 하프미러(13)가 배치된 위치와 동일선상에서 상기 하프미러(13)의 기울어진 각도와 동일한 각도를 유지하는 반사미러(15)가 설치된다.In addition, a reflection mirror 15 is installed on the exiting optical axis of the optical unit 9 to maintain the same angle as the inclination angle of the half mirror 13 on the same line as the position where the half mirror 13 is disposed.

상기 광학유닛(9)은 광을 피검사물체(1)에 조사하는 조명기(9a)와, 상기 피검사물체(9a)에 조사되어 반사되는 반사광의 포커스를 조정하는 렌즈(9b)로 구성된다.The optical unit 9 includes an illuminator 9a for irradiating light to the object 1 and a lens 9b for adjusting the focus of the reflected light that is irradiated and reflected on the object 9a.

상술한 바와 같이 하나의 카메라를 이용하여 엑스레이이미지 및 화상 정보를 동시에 획득하도록 구현함에 따라 검사장치의 단순화를 꾀함과 아울러 제조 코스트 절감의 효과를 얻을 수 있다.As described above, by simultaneously acquiring the X-ray image and the image information using one camera, the inspection apparatus may be simplified and the manufacturing cost may be reduced.

이와 같이, 본 발명의 상세한 설명에서는 구체적인 실시 예에 관해 설명하였 으나, 본 발명의 범주에서 벗어나지 않는 한도 내에서 여러 가지 변형이 가능함은 물론이다. 그러므로, 본 발명의 범위는 설명된 실시 예에 국한되어 정해져서는 안되며 후술하는 특허청구범위 뿐만 아니라 이 특허청구범위와 균등한 것들에 의해 정해져야 한다.As described above, in the detailed description of the present invention, specific embodiments have been described. However, various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.

Claims (4)

피검사물체를 그 상부에 안착시킴과 아울러 소정의 위치로 이송시키는 이송장치;A transporting device for seating the object under test and transporting it to a predetermined position; 상기 이송장치의 하부에 설치되어 피검사물체에 엑스선을 출사하는 광발생수단; Light generating means installed at a lower portion of the transfer device to emit X-rays to an object under test; 상기 광발생수단의 맞은편 쪽에 설치되어 상기 피검사물체를 투과한 엑스선을 가시광으로 변환 증폭시키는 광증폭수단;Optical amplification means installed on the opposite side of the light generating means to convert and amplify X-rays transmitted through the object under test into visible light; 상기 피검사물체를 광학적으로 조명하여 화상을 생성하는 광학유닛;An optical unit for optically illuminating the object under test to generate an image; 상기 광증폭수단을 통해 증폭된 엑스레이이미지 및 광학유닛에 의한 화상을 받아들여 정보를 획득하는 하나의 카메라를 포함하는 것을 특징으로 하는 엑스레이 및 비주얼검사가 통합된 회로기판 검사장치.And a camera for acquiring the information by receiving the X-ray image amplified by the optical amplification means and the image by the optical unit. 제 1항에 있어서,The method of claim 1, 상기 광증폭수단 및 상기 광발생수단은 상기 카메라의 하부에 수직으로 배치되며;The optical amplifying means and the light generating means are disposed perpendicular to the lower portion of the camera; 상기 광학유닛은 상기 광증폭수단의 측면에 나란하게 배치되며;The optical unit is disposed side by side of the optical amplifying means; 상기 광발생수단 및 카메라 사이의 광축상에는 하프미러가 소정의 각도로 마련되고;A half mirror is provided at a predetermined angle on an optical axis between the light generating means and the camera; 상기 광학유닛의 출사광축상에는 상기 하프미러가 배치된 수평방향으로 동일 선상을 이루는 위치에 반사미러가 마련된 것을 특징으로 하는 엑스레이 및 비주얼검사가 통합된 회로기판 검사장치.And a reflection mirror provided at a position in the horizontal direction in which the half mirror is arranged on the output optical axis of the optical unit. 삭제delete 제 1항에 있어서,The method of claim 1, 상기 카메라는 CCD카메라인 것을 특징으로 하는 엑스레이 및 비주얼검사가 통합된 회로기판 검사장치.The camera is an integrated circuit board inspection apparatus, x-ray and visual inspection, characterized in that the CCD camera.
KR1020020027452A 2002-05-17 2002-05-17 Printed Circuit Board Inspection System with Integrated X-ray and Visual Inspection Expired - Lifetime KR100609603B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020020027452A KR100609603B1 (en) 2002-05-17 2002-05-17 Printed Circuit Board Inspection System with Integrated X-ray and Visual Inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020020027452A KR100609603B1 (en) 2002-05-17 2002-05-17 Printed Circuit Board Inspection System with Integrated X-ray and Visual Inspection

Publications (2)

Publication Number Publication Date
KR20030089293A KR20030089293A (en) 2003-11-21
KR100609603B1 true KR100609603B1 (en) 2006-08-04

Family

ID=32383330

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020027452A Expired - Lifetime KR100609603B1 (en) 2002-05-17 2002-05-17 Printed Circuit Board Inspection System with Integrated X-ray and Visual Inspection

Country Status (1)

Country Link
KR (1) KR100609603B1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100863680B1 (en) 2007-02-26 2008-10-15 금호타이어 주식회사 Multi-directional X-ray CT Tire Checker
KR101657982B1 (en) 2014-09-15 2016-09-30 (주)자비스 Apparatus for Investigating LED Package with X-ray
KR102000941B1 (en) 2017-10-26 2019-07-17 (주)자비스 An X-Ray Investigating Apparatus with Nano Scale Resolution and a Method for Correcting an Error of the Same
KR102116889B1 (en) * 2018-10-30 2020-05-29 (주)자비스 A Transmission X-Ray Microscope with an Enhanced Guiding Property

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010007394A (en) * 1999-06-15 2001-01-26 조셉 제이. 스위니 Apparatus and method for reviewing defects on an object
KR20010088425A (en) * 2000-03-07 2001-09-26 도오야마 시게오 X-ray spectroscopic analyzer having sample surface observation mechanism
KR100344587B1 (en) * 1998-09-30 2003-03-26 삼성전자 주식회사 Fault Inspection System

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100344587B1 (en) * 1998-09-30 2003-03-26 삼성전자 주식회사 Fault Inspection System
KR20010007394A (en) * 1999-06-15 2001-01-26 조셉 제이. 스위니 Apparatus and method for reviewing defects on an object
KR20010088425A (en) * 2000-03-07 2001-09-26 도오야마 시게오 X-ray spectroscopic analyzer having sample surface observation mechanism

Also Published As

Publication number Publication date
KR20030089293A (en) 2003-11-21

Similar Documents

Publication Publication Date Title
KR100793182B1 (en) Device and method for detecting defects in semiconductor substrate using line sensor camera
US6937754B1 (en) Inspection equipment
KR101175595B1 (en) Apparatus and method for noncontact inspection for components
CN105101657B (en) Off-axis illumination assembly and method
US7369644B2 (en) Printed circuit board inspection system combining X-ray inspection and visual inspection
JPH0656920B2 (en) Board assembly method, board inspection method and device
CN101308099A (en) Optical inspection device
US4672209A (en) Component alignment method
CN100520380C (en) Inspecting apparatus, image pickup apparatus, and inspecting method
WO1997032180A1 (en) Device comprising diffuse foreground illumination for detecting an electronic component, and component-mounting machine provided with such a detection device
KR100609603B1 (en) Printed Circuit Board Inspection System with Integrated X-ray and Visual Inspection
KR101471984B1 (en) Carrying Apparatus for Inspection Object Having Light Emitting Module Possible Dimming
JP2001155160A (en) Appearance inspection equipment for electronic components
US20080044059A1 (en) Alignment of printed circuit board targets
JP2021018232A (en) Inspection device of wiring pattern part formed on ceramic green sheet, method for inspecting wiring pattern part, and method for manufacturing ceramic wiring board
JPH10246617A (en) Method and apparatus for judgment of flatness
JP2519363B2 (en) Wiring pattern defect inspection method on printed circuit board
KR100576392B1 (en) Vision inspection device
KR0137950Y1 (en) Apparatus for checking the mounting state of the part that is mounted on printed board
JP7616953B2 (en) Photographing device and photographing method
KR100577421B1 (en) Inspection device
JP2885443B2 (en) Flat package integrated circuit lead inspection device
JP2007127486A (en) PC board through hole wall surface defect inspection system
KR20240026427A (en) Image capturing apparatus, substrate inspection apparatus, image capturing method, and substrate inspection method
JP2002507330A (en) Method and apparatus for measuring height position of target edge of component element

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20020517

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20040630

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20050315

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20040630

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 20050412

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20050315

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Decision date: 20060529

Appeal identifier: 2005101002197

Request date: 20050412

PB0901 Examination by re-examination before a trial

Comment text: Amendment to Specification, etc.

Patent event date: 20050412

Patent event code: PB09011R02I

Comment text: Request for Trial against Decision on Refusal

Patent event date: 20050412

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20040922

Patent event code: PB09011R02I

E801 Decision on dismissal of amendment
PE0801 Dismissal of amendment

Patent event code: PE08012E01D

Comment text: Decision on Dismissal of Amendment

Patent event date: 20050609

Patent event code: PE08011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20050412

Patent event code: PE08011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20040922

B601 Maintenance of original decision after re-examination before a trial
PB0601 Maintenance of original decision after re-examination before a trial
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20050412

Effective date: 20060529

PJ1301 Trial decision

Patent event code: PJ13011S01D

Patent event date: 20060529

Comment text: Trial Decision on Objection to Decision on Refusal

Appeal kind category: Appeal against decision to decline refusal

Request date: 20050412

Decision date: 20060529

Appeal identifier: 2005101002197

PS0901 Examination by remand of revocation
S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

Patent event date: 20060621

Patent event code: PS07012S01D

Comment text: Decision to Grant Registration

Patent event date: 20060612

Patent event code: PS07011S01I

Comment text: Notice of Trial Decision (Remand of Revocation)

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20060731

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20060801

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20090729

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20101031

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20110729

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20120516

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20130426

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20130426

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20140714

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20140714

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20150724

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20150724

Start annual number: 10

End annual number: 10

FPAY Annual fee payment

Payment date: 20170717

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20170717

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20180716

Year of fee payment: 13

PR1001 Payment of annual fee

Payment date: 20180716

Start annual number: 13

End annual number: 13

FPAY Annual fee payment

Payment date: 20190624

Year of fee payment: 14

PR1001 Payment of annual fee

Payment date: 20190624

Start annual number: 14

End annual number: 14

PC1801 Expiration of term

Termination date: 20221117

Termination category: Expiration of duration