KR100596391B1 - 강유전체/상유전체 다층 박막 및 그 제조 방법과 그를이용한 초고주파 가변 소자 - Google Patents
강유전체/상유전체 다층 박막 및 그 제조 방법과 그를이용한 초고주파 가변 소자 Download PDFInfo
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- KR100596391B1 KR100596391B1 KR1020040101087A KR20040101087A KR100596391B1 KR 100596391 B1 KR100596391 B1 KR 100596391B1 KR 1020040101087 A KR1020040101087 A KR 1020040101087A KR 20040101087 A KR20040101087 A KR 20040101087A KR 100596391 B1 KR100596391 B1 KR 100596391B1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
- H01G7/06—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31691—Inorganic layers composed of oxides or glassy oxides or oxide based glass with perovskite structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
- H01P1/181—Phase-shifters using ferroelectric devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
- H10D1/684—Capacitors having no potential barriers having dielectrics comprising perovskite structures the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
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- Condensed Matter Physics & Semiconductors (AREA)
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- Semiconductor Integrated Circuits (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
Description
Claims (11)
- 제1 격자 상수를 가지는 물질로 이루어지는 기판상에 형성되어 있고 상기 제1 격자 상수보다 작은 제2 격자 상수를 가지는 물질로 이루어진 에피택셜 강유전체 (ferroelectrics) (BaxSr1-x)TiO3 박막과,상기 기판과 상기 에피택셜 강유전체 (BaxSr1-x)TiO3 박막과의 사이에 개재되어 있고, 상기 제1 격자 상수보다 작고 상기 제2 격자 상수보다 큰 제3 격자 상수를 가지는 물질로 이루어지는 페로브스카이트 (perovskite) ABO3형 상유전체(paraelectrics) 종자층을 포함하는 것을 특징으로 하는 강유전체/상유전체 다층 박막.
- 제1항에 있어서,상기 상유전체 종자층은 SrZrO3, BaZrO3, Ba(Zrx, Ti1-x)O 3 (x > 0.2), Ba(Hfx, Ti1-x)O3 (x > 0.24) 및 Ba(Snx, Ti1-x)O3 (x > 0.15)로 이루어지는 군에서 선택되는 물질로 구성되는 것을 특징으로 하는 강유전체/상유전체 다층 박막.
- 제1항에 있어서,상기 (BaxSr1-x)TiO3 박막은 0 ≤ x ≤ 1의 조성을 가지는 것을 특징으로 하는 강유전체/상유전체 다층 박막.
- 기판상에 페로브스카이트 ABO3형 상유전체 종자층을 형성하는 단계와,상기 상유전체 종자층 위에 강유전체 (BaxSr1-x)TiO3 박막을 에피택셜 성장시키는 단계를 포함하는 것을 특징으로 하는 강유전체/상유전체 다층 박막의 제조 방법.
- 제4항에 있어서,상기 상유전체 종자층은 펄스 레이저 어블레이션 (pulsed laser ablation), RF 마그네트론 스퍼터링, 화학기상증착, 및 원자층 증착 방법 중에서 선택되는 하나의 방법에 의하여 에피택셜 성장된 박막인 것을 특징으로 하는 강유전체/상유전체 다층 박막의 제조 방법.
- 제4항에 있어서,상기 (BaxSr1-x)TiO3 박막은 펄스 레이저 어블레이션, RF 마그네트론 스퍼터링, 화학기상증착, 및 원자층 증착 방법 중에서 선택되는 하나의 방법에 의하여 에피택셜 성장된 박막인 것을 특징으로 하는 강유전체/상유전체 다층 박막의 제조 방법.
- 제1 격자 상수를 가지는 기판과,상기 기판상에 형성되어 있고 상기 제1 격자 상수보다 작은 제2 격자 상수를 가지는 물질로 이루어진 에피택셜 강유전체 (ferroelectrics) (BaxSr1-x)TiO3 박막과, 상기 기판과 상기 에피택셜 강유전체 (BaxSr1-x)TiO3 박막과의 사이에 개재되어 있고, 상기 제1 격자 상수보다 작고 상기 제2 격자 상수보다 큰 제3 격자 상수를 가지는 물질로 이루어지는 페로브스카이트 (perovskite) ABO3형 상유전체(paraelectrics) 종자층으로 구성되는 강유전체/상유전체 다층 박막과,상기 강유전체 (BaxSr1-x)TiO3 박막 상에 형성된 적어도 하나의 전극을 포함하는 것을 특징으로 하는 초고주파 가변 소자.
- 제7항에 있어서,상기 기판은 MgO 기판인 것을 특징으로 하는 초고주파 가변 소자.
- 제7항에 있어서,상기 전극은 주파수 가변 소자 또는 위상 가변 소자의 전극을 구성하는 것을 특징으로 하는 초고주파 가변 소자.
- 제7항에 있어서,상기 전극은 Au, Ag, Al, Cu, Cr 및 Ti로 이루어지는 군에서 선택되는 단일층 금속막 또는 다층 금속막으로 이루어지는 것을 특징으로 하는 초고주파 가변 소자.
- 제7항에 있어서,상기 초고주파 소자는 전압조절 가변 축전기, 가변 공진기, 가변 필터, 위상변위기, 전압제어 발진기, 듀플렉서 및 가변 분배기로 이루어지는 군에서 선택되는 하나의 소자를 구성하는 것을 특징으로 하는 초고주파 가변 소자.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020040101087A KR100596391B1 (ko) | 2004-12-03 | 2004-12-03 | 강유전체/상유전체 다층 박막 및 그 제조 방법과 그를이용한 초고주파 가변 소자 |
US11/180,744 US7274058B2 (en) | 2004-12-03 | 2005-07-12 | Ferroelectric/paraelectric multilayer thin film, method of forming the same, and high frequency variable device using the same |
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KR1020040101087A KR100596391B1 (ko) | 2004-12-03 | 2004-12-03 | 강유전체/상유전체 다층 박막 및 그 제조 방법과 그를이용한 초고주파 가변 소자 |
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KR20060062299A KR20060062299A (ko) | 2006-06-12 |
KR100596391B1 true KR100596391B1 (ko) | 2006-07-04 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018182267A1 (ko) * | 2017-03-27 | 2018-10-04 | 울산과학기술원 | 초격자 구조를 가지는 유전체 소재, 전자 소자 및 전자 소자의 제조 방법 |
WO2021095974A1 (ko) * | 2019-11-15 | 2021-05-20 | 광주과학기술원 | 유전박막, 이를 포함하는 멤커패시터, 이를 포함하는 셀 어레이, 및 그 제조 방법 |
US11264448B2 (en) | 2019-11-12 | 2022-03-01 | Unist (Ulsan National Institute Of Science And Technology) | Dielectric thin film and memcapacitor including the same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7579621B2 (en) * | 2004-09-17 | 2009-08-25 | Massachusetts Institute Of Technology | Integrated BST microwave tunable devices using buffer layer transfer method |
KR101018291B1 (ko) * | 2009-03-18 | 2011-03-04 | 한국과학기술연구원 | 강유전체 박막 및 산화물이 첨가된 강유전체 박막을 포함하는 적층 구조체 및 그 제조 방법 |
FR3051979B1 (fr) * | 2016-05-25 | 2018-05-18 | Soitec | Procede de guerison de defauts dans une couche obtenue par implantation puis detachement d'un substrat |
CN113948879B (zh) * | 2021-09-30 | 2023-08-08 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 模块化相控阵天线装置 |
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KR20040047174A (ko) * | 2002-11-29 | 2004-06-05 | 한국전자통신연구원 | 강유전체/상유전체 바륨-스트론듐-티타늄 산화물 박막을구비하는 초고주파 가변소자 |
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KR100355380B1 (ko) | 2000-01-31 | 2002-10-11 | 삼성전자 주식회사 | 완충층을 이용한 마이크로웨이브 특성 개선 비.에스.티.오튜너블 캐패시터 및 이를 부착한 튜너블 소자 |
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Patent Citations (4)
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JPH08162684A (ja) * | 1994-12-06 | 1996-06-21 | Hitachi Ltd | 酸化物素子およびその製造方法 |
JP2002329787A (ja) | 2001-04-27 | 2002-11-15 | Kyocera Corp | 可変容量コンデンサおよび製造方法 |
KR20040047174A (ko) * | 2002-11-29 | 2004-06-05 | 한국전자통신연구원 | 강유전체/상유전체 바륨-스트론듐-티타늄 산화물 박막을구비하는 초고주파 가변소자 |
KR20050057714A (ko) * | 2003-12-10 | 2005-06-16 | 한국전자통신연구원 | 초고주파 가변 소자용 강유전체 에피택셜 박막 및 이를이용한 초고주파 가변 소자 |
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WO2018182267A1 (ko) * | 2017-03-27 | 2018-10-04 | 울산과학기술원 | 초격자 구조를 가지는 유전체 소재, 전자 소자 및 전자 소자의 제조 방법 |
US11264448B2 (en) | 2019-11-12 | 2022-03-01 | Unist (Ulsan National Institute Of Science And Technology) | Dielectric thin film and memcapacitor including the same |
WO2021095974A1 (ko) * | 2019-11-15 | 2021-05-20 | 광주과학기술원 | 유전박막, 이를 포함하는 멤커패시터, 이를 포함하는 셀 어레이, 및 그 제조 방법 |
KR20210059428A (ko) * | 2019-11-15 | 2021-05-25 | 광주과학기술원 | 유전박막, 이를 포함하는 멤커패시터, 이를 포함하는 셀 어레이, 및 그 제조 방법 |
KR102259923B1 (ko) * | 2019-11-15 | 2021-06-02 | 광주과학기술원 | 유전박막, 이를 포함하는 멤커패시터, 이를 포함하는 셀 어레이, 및 그 제조 방법 |
US11158701B2 (en) | 2019-11-15 | 2021-10-26 | Gwangju Institute Of Science And Technology | Dielectric thin film, memcapacitor including the same, cell array including the same, and manufacturing method thereof |
US11935915B2 (en) | 2019-11-15 | 2024-03-19 | Gwangji Institute of Science and Technology | Dielectric thin film, memcapacitor including the same, cell array including the same, and manufacturing method thereof |
Also Published As
Publication number | Publication date |
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KR20060062299A (ko) | 2006-06-12 |
US20060118843A1 (en) | 2006-06-08 |
US7274058B2 (en) | 2007-09-25 |
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