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KR100587389B1 - Stacked Semiconductor Packages - Google Patents

Stacked Semiconductor Packages Download PDF

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Publication number
KR100587389B1
KR100587389B1 KR1020000081123A KR20000081123A KR100587389B1 KR 100587389 B1 KR100587389 B1 KR 100587389B1 KR 1020000081123 A KR1020000081123 A KR 1020000081123A KR 20000081123 A KR20000081123 A KR 20000081123A KR 100587389 B1 KR100587389 B1 KR 100587389B1
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South Korea
Prior art keywords
package
ball land
substrate
ball
stacked
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KR1020000081123A
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Korean (ko)
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KR20020051661A (en
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양준영
박성수
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앰코 테크놀로지 코리아 주식회사
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Priority to KR1020000081123A priority Critical patent/KR100587389B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/10—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H01L2225/1011—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 적층형 반도체 패키기에 관한 것으로서, 패키지의 전체 두께를 경박하게 하고, 적층되는 패키지 간의 신호선을 짧게 하기 위한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stacked semiconductor package, in which the overall thickness of the package is light and the signal lines between the stacked packages are shortened.

이를 위해 본 발명은 기판(130)의 상면에는 칩(110)이 몰딩되고, 상기 기판(130)의 하면에는 볼랜드(133) 주위에 솔더 레지스트(135)가 도포되는 상부 패키지(100)와; 기판(230)의 하면에는 칩(210)이 몰딩됨과 함께 솔더볼(240)이 구비되고, 상기 기판(230)의 상면에는 볼랜드(233) 주위에 솔더 레지스트(235)가 도포되는 하부패키지(200)와; 상기 상부 패키지의 볼랜드(133)와 상기 하부 패키지의 볼랜드(233) 사이에 연결메탈(300)이 구비되어 상기 상부 패키지(100)와 상기 하부 패키지(200)를 연결하는 적층형 반도체 패키지가 제공된다.To this end, the present invention is a chip (110) is molded on the upper surface of the substrate 130, the lower package of the upper package 100, the solder resist 135 is applied around the land 133; The lower surface of the substrate 230 is a chip 210 is molded and a solder ball 240 is provided, the upper surface of the substrate 230, the lower package 200 is coated with a solder resist 235 around the ball land 233 Wow; A connection metal 300 is provided between the ball land 133 of the upper package and the ball land 233 of the lower package to provide a stacked semiconductor package connecting the upper package 100 and the lower package 200.

적층, 반도체 패키지 Laminated, Semiconductor Packages

Description

적층형 반도체 패키지{stack-type semiconductor package}Stacked semiconductor package

도 1 은 종래 적층형 패키지의 일 예를 나타내는 측단면도1 is a side cross-sectional view showing an example of a conventional stacked package

도 2 는 본 발명의 제1실시예에 따른 적층형 패키지의 측단면도2 is a side cross-sectional view of a stacked package according to a first embodiment of the present invention;

도 3 는 본 발명의 제2실시예에 따른 적층형 패키지의 결합부 확대 측단면도Figure 3 is an enlarged side cross-sectional view of the coupling portion of the stacked package according to the second embodiment of the present invention

도면의 주요부분에 대한 부호설명Explanation of Signs of Major Parts of Drawings

100,200. 반도체 패키지 120,220. 몰드100,200. Semiconductor Package 120,220. Mold

130,230. 기판 133,233. 볼랜드 130,230. Substrate 133,233. Borland

135,235. 솔더 레지스트 240. 솔더볼 135,235. Solder Resist 240. Solder Balls

300. 연결메탈300. Connecting Metal

본 발명은 적층형 반도체 패키지에 관한 것으로서, 보다 상세하게는 볼랜드 상에 기판 위로 돌출하는 연결메탈을 형성하여 패키지를 적층함으로써 패키지의 전체 두께 및 신호선을 단축하기 위한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stacked semiconductor package, and more particularly, to shorten the overall thickness and signal line of a package by forming a connection metal projecting onto a substrate and stacking the package.

현재, 반도체 패키지는 급진전되는 기술의 발달과 더불어 경박단소화되어 가고 있으며, 이러한 요구에 부응하여 새로운 형태의 다양한 반도체 패키지가 계속해 서 개발되고 있다.At present, semiconductor packages are becoming lighter and shorter with the rapid development of technology, and in response to these demands, new types of semiconductor packages have been continuously developed.

또한, 최근에는 다양한 기능을 위해 고용량의 반도체 패키지가 요구되고 있으나, 단일 칩만으로는 이와 같이 다기능을 수행 할 수 있는 반도체 패키지를 실현하는 데에는 한계가 있다.In addition, in recent years, a high-capacity semiconductor package is required for various functions, but there is a limit in realizing a semiconductor package capable of performing such a multifunction with only a single chip.

이에 따라, 패키지 내부에 칩을 적층하거나, 혹은 패키지를 적층하는 다양한 형태의 반도체 패키지들이 제안되고 있다.Accordingly, various types of semiconductor packages have been proposed in which chips are stacked or packages are stacked in the package.

그러나, 이러한 적층형 반도체 패키지는 칩 혹은 패키지를 적층함에 따라, 각 반도체 패키지마다 단점 또는 구조적 한계를 갖고 있다.However, such a stacked semiconductor package has disadvantages or structural limitations for each semiconductor package as the chips or packages are stacked.

도 1 은 이와 같은 종래 적층형 반도체 패키지의 일 예를 나타내는 측단면도로써, 도시한 바와 같이 상부 패키지(10)와 하부 패키지(20)는 각 기판(13),(23)의 하면 중앙에 칩(미도시)이 몰드(12),(22)에 의해 보호된다.FIG. 1 is a side cross-sectional view illustrating an example of such a conventional stacked semiconductor package. As shown in the drawing, the upper package 10 and the lower package 20 have a chip (not shown) in the center of the lower surface of each of the substrates 13 and 23. Is protected by the molds 12, 22.

그리고, 상기 상부 패키지의 기판(13) 하면과 상기 하부 패키지의 기판(23) 상면 사이에 솔더볼(14)이 구비되어 상기 상부 패키지(10)와 상기 하부 패키지(20)가 연결되고, 상기 하부 패키지의 기판(23) 하면에는 솔더볼(24)을 구비되어 외부장치에 실장하도록 되어 있다.In addition, a solder ball 14 is provided between the lower surface of the substrate 13 of the upper package and the upper surface of the substrate 23 of the lower package to connect the upper package 10 and the lower package 20 to the lower package. The lower surface of the substrate 23 is provided with a solder ball 24 to be mounted on an external device.

그런데, 상기한 적층형 패키지에서는 전술한 바와 같이 상부 패키지(10)와 하부 패키지(20)를 연결하기 위해 솔더볼(14)을 사용함에 따라, 전체 적층형 패키지의 두께가 상기 솔더볼(14)에 의해 증가하게 된다.However, in the stacked package, as described above, as the solder ball 14 is used to connect the upper package 10 and the lower package 20, the thickness of the entire stacked package is increased by the solder ball 14. do.

뿐만아니라, 상부 패키지(10)의 신호를 하부 패키지(20)로 전달하는 신호선의 길이 역시 상기 솔더볼(14) 만큼 길어짐에 따라 패키지의 전기적 신뢰성에도 좋 지 않다.In addition, as the length of the signal line that transmits the signal of the upper package 10 to the lower package 20 is also as long as the solder ball 14, the electrical reliability of the package is not good.

본 발명은 이와 같은 종래의 문제점을 해결하기 위해 안출한 것으로서, 패키지의 전체 두께를 경박하게 하고, 적층되는 패키지 간의 신호선을 짧게 하는 새로운 형태의 적층형 반도체 패키지를 제공하기 위한 것이다.SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and is to provide a new type of stacked semiconductor package that reduces the overall thickness of the package and shortens the signal lines between the stacked packages.

상기한 목적을 달성하기 위한 본 발명의 형태에 따르면, 기판의 상면에는 칩이 몰딩되고, 상기 기판의 하면에는 볼랜드 주위에 솔더 레지스트가 도포되는 상부 패키지와; 기판의 하면에는 칩이 몰딩됨과 함께 솔더볼이 구비되고, 상기 기판의 상면에는 볼랜드 주위에 솔더 레지스트가 도포되는 하부패키지와; 상기 상부 패키지의 볼랜드와 상기 하부 패키지의 볼랜드 사이에 연결메탈이 구비되어 상기 상부 패키지와 상기 하부 패키지를 연결하는 적층형 반도체 패키지가 제공된다.According to an aspect of the present invention for achieving the above object, a top package of the chip is molded on the upper surface of the substrate, a solder resist is applied around the borland on the lower surface of the substrate; A lower package having a solder ball formed on the lower surface of the substrate and a solder ball provided on the upper surface of the substrate; A connection metal is provided between the borland of the upper package and the borland of the lower package to provide a stacked semiconductor package connecting the upper package and the lower package.

이 때, 상기 연결메탈은 상기 상부 패키지의 볼랜드와 상기 하부 패키지의 볼랜드에 각각 형성할 수 있으며, 상기 상부 패키지의 볼랜드에만 또는 상기 하부 패키지의 볼랜드에만 형성할 수도 있다.In this case, the connection metal may be formed on the borland of the upper package and the borland of the lower package, respectively, or may be formed only on the borland of the upper package or only on the borland of the lower package.

이하, 본 발명의 바람직한 실시예를 첨부한 도 2 내지 도 3 을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, with reference to Figures 2 to 3 attached to a preferred embodiment of the present invention will be described in detail.

도 2 는 본 발명의 제1실시예에 따른 적층형 패키지의 측단면도로써, 도시한 바와 같이 본 발명의 제1실시예의 적층형 패키지는 상부 패키지(100)와 하부 패키지(200)가, 상기 상부 패키지(100) 및 상기 하부 패키지(200) 사이에 구비되는 연 결메탈(300)에 의해 연결되어 이루어진다.2 is a side cross-sectional view of the stacked package according to the first embodiment of the present invention. As shown in the stacked package of the first embodiment of the present invention, the upper package 100 and the lower package 200 may include the upper package ( It is made by the connection metal 300 provided between the 100 and the lower package 200.

이 때, 상기 하부 패키지(200)는 기판(230)의 하면 중앙에 칩(미도시)이 장착되어 몰드(220)에 의해 보호되고, 상기 몰드(220) 주위에는 외부장치에 실장하기 위한 솔더볼(240)이 구비된다.At this time, the lower package 200 is a chip (not shown) in the center of the lower surface of the substrate 230 is protected by the mold 220, the solder ball around the mold 220 for mounting to an external device ( 240 is provided.

그리고, 상기 하부 패키지의 기판(230) 상면에는 상기 칩과 메탈라인(미도시)에 의해 연결되는 볼랜드(233)가 형성된다.In addition, a ball land 233 connected to the chip and the metal line (not shown) is formed on an upper surface of the substrate 230 of the lower package.

또한, 상기 볼랜드(233) 주위에는 상기 볼랜드(233)보다 높게 솔더 레지스트(235)가 도포되는데, 이 때 상기 솔더 레지스트(233)는 그 일부가 상기 볼랜드(233)의 가장자리 영역을 덮는 SMD(Solder Mask Defined; 이하, "SMD"라고 한다) 타입으로 형성된다.In addition, a solder resist 235 is applied around the ball land 233 to be higher than the ball land 233, wherein a part of the solder resist 233 covers an edge region of the ball land 233. Mask Defined (hereinafter referred to as " SMD ") type.

그리고, 상기 볼랜드(233) 위에는 금(Au) 또는 니켈(Ni)등에 의한 연결메탈(300)이 주위의 솔더 레지스트(235)보다 높게 플레이팅되어 돌출 형성된다.In addition, the connection land 300 made of gold (Au) or nickel (Ni) is plated higher than the surrounding solder resist 235 on the ball land 233 to protrude.

한편, 상기 상부 패키지(100)는 기판(130)의 상면 중앙에 칩(미도시)이 장착되어 몰드(120)에 의해 보호되고, 상기 상부 패키지(100)의 하면에는 상기 칩과 메탈라인(미도시)에 의해 연결되는 볼랜드(133)가 형성되며, 상기 볼랜드(133) 주위에는 상기 볼랜드(133)보다 높게 SMD 타입으로 솔더 레지스트(135)가 도포된다.On the other hand, the upper package 100 is a chip (not shown) in the center of the upper surface of the substrate 130 is protected by the mold 120, the lower surface of the upper package 100, the chip and the metal line (not shown) The ball lands 133 connected to each other are formed, and around the ball lands 133, a solder resist 135 is applied in a SMD type higher than the ball lands 133.

그리고, 상기 볼랜드(133) 위에는 전술한 하부 패키지(200)와 동일하게 금 또는 니켈등에 의한 연결메탈(300)이 솔더 레지스트(135)보다 높게 플레이팅되어 돌출 형성된다.In addition, on the ball land 133, the connection metal 300 made of gold or nickel is plated higher than the solder resist 135 in the same manner as the lower package 200.

즉, 본 발명은 상기한 바와 같이 각 패키지(100),(200)의 볼랜드(133),(233)에 플레이팅되어 돌출 형성되는 각 연결메탈(300)이 접촉 연결됨으로써 상부 패키지(100)와 하부 패키지(200)가 적층되는 것이다.That is, according to the present invention, the connection metals 300 which are formed by being projected by being plated and protruding from the ball lands 133 and 233 of the respective packages 100 and 200 are contacted and connected to the upper package 100. The lower package 200 is stacked.

한편, 상기 연결메탈(300)은 기판(100),(200) 제조시에, SMD 타입으로 볼랜드(133),(233)의 가장자리를 솔더 레지스트(135),(235)로 도포한 후, 상기 볼랜드(133),(233) 위에 금 또는 니켈등을 플레이팅함으로써 형성할 수 있다.On the other hand, the connection metal 300 is a SMD type at the time of manufacturing the substrate 100, 200, after applying the edges of the ball land 133, 233 with the solder resist 135, 235, It can be formed by plating gold or nickel on the borland 133, 233.

그리고, 이상에서 설명한 실시예에서는 SMD 타입의 볼랜드를 기준으로 설명하였으나, 본 발명은 이에 한정되는 것은 아니며 솔더 레지스트가 볼랜드의 가장자리로부터 일정간격 이격되어 도포되는 NSMD(Non Solder Mask Defined) 타입에도 적용될 수 있고, 이는 후술하는 실시예에서도 동일하게 적용된다.In addition, although the embodiments described above are described based on SMD-type borland, the present invention is not limited thereto, and the present invention may also be applied to a non-solder mask defined (NSMD) type in which a solder resist is applied at a predetermined distance from the edge of the borland. The same applies to the embodiments described later.

상기한 바와 같이 본 발명은 상부 패키지(100)에 형성되는 연결메탈(300)과 하부 패키지(200)에 형성되는 연결메탈(300)이 페이스트(paste)에 의해 직접 연결됨으로써, 패키지 전체의 두께를 줄임과 함께 신호선을 짧게 단축할 수 있게 된다.As described above, in the present invention, the connection metal 300 formed on the upper package 100 and the connection metal 300 formed on the lower package 200 are directly connected by a paste, thereby reducing the thickness of the entire package. In addition to shortening, it is possible to shorten the signal line.

도 3 는 본 발명의 제2실시예에 따른 적층형 패키지의 결합부 확대 측단면도로써, 도시한 바와 같이 본 실시예에 따른 적층형 패키지의 전체적인 구성은 전술한 본 발명의 제1실시예와 동일하고, 특히 본 실시예에서는 연결메탈(300)을 상부 패키지의 볼랜드(133)에만 형성하고 하부 패키지의 볼랜드(233)에는 형성하지 않은 것이다.3 is an enlarged side cross-sectional view of a coupling portion of a stacked package according to a second embodiment of the present invention. As shown in FIG. 3, the overall configuration of the stacked package according to the present embodiment is the same as that of the first embodiment of the present invention. In particular, in the present embodiment, the connection metal 300 is formed only on the ball land 133 of the upper package, but not on the ball land 233 of the lower package.

따라서, 상부 패키지(100)에 형성되는 연결메탈(300)은 솔더 레지스트(135) 위로 돌출한 상태가 되는 한편, 하부 패키지(200)의 볼랜드(233)는 솔더 레지스트(235) 내부에 위치하는 형태가 된다.Accordingly, the connection metal 300 formed in the upper package 100 is protruded over the solder resist 135, while the ball land 233 of the lower package 200 is positioned inside the solder resist 235. Becomes

결국, 본 실시예에서는 상기 상부 패키지에 형성되는 연결메탈(300)이 상기 하부 패키지의 솔더 레지스트(235)에 끼워지는 상태로 하부 패키지의 볼랜드(233)와 접촉 연결되는 것이다As a result, in the present embodiment, the connection metal 300 formed on the upper package is in contact with the ball land 233 of the lower package while being fitted to the solder resist 235 of the lower package.

물론, 상기 연결메탈(300)은 상부 패키지의 볼랜드(133)에만 플레이팅됨에 따라, 상부 패키지의 솔더 레지스트(135)로부터 돌출되는 상기 연결메탈(300)의 높이는 하부 패키지의 솔더 레지스트(235)로부터 들어간 볼랜드(233)의 깊이보다는 높게 형성되어야 상부 패키지(100)와 하부 패키지(200)를 연결할 수 있다.Of course, since the connection metal 300 is plated only on the ball land 133 of the upper package, the height of the connection metal 300 protruding from the solder resist 135 of the upper package is increased from the solder resist 235 of the lower package. The upper package 100 and the lower package 200 may be connected to be formed higher than the depth of the borland 233.

한편, 상기한 본 발명의 제2실시예에서는 상기 연결메탈(300)이 상부 패키지의 볼랜드(133)에 형성된 것을 기준으로 설명하였으나, 본 발명은 연결메탈(300)을 하부 패키지의 볼랜드(233)에만 형성하고 상부 패키지의 볼랜드(133)에는 형성하지 않을 수 있음은 분명하다.Meanwhile, in the second embodiment of the present invention, the connection metal 300 has been described on the basis of the ball land 133 formed in the upper package, but the present invention uses the connection metal 300 as the ball land 233 of the lower package. It is apparent that only formed and not formed in the ball land 133 of the upper package.

상기한 바와 같이 본 발명은 각 패키지의 볼랜드에 연결메탈을 돌출되도록 플레이팅하여 직접 연결함으로써, 패키지의 전체 높이를 줄일 수 있으며, 또한 적층된 패키지 간의 신호선을 짧게 단축할 수 있다.

As described above, the present invention can reduce the overall height of the package and shorten the signal lines between the stacked packages by directly connecting the plated metal to protrude from the borland of each package.

Claims (3)

기판의 상면에는 칩이 몰딩되고 상기 기판의 하면에는 볼랜드가 형성되며, 상기 볼랜드 주위에는 상기 볼랜드보다 높으면서 그 일부가 상기 볼랜드의 가장자리 영역을 덮도록 솔더 레지트스가 도포되는 상부 패키지와;A top package on which a chip is molded on a top surface of the substrate and a ball land is formed on a bottom surface of the substrate, and a solder register is coated around the ball land so that a portion thereof is higher than the ball land and covers a portion of the edge of the ball land; 기판의 하면에는 칩이 몰딩됨과 함께 솔더볼이 구비되고, 상기 기판의 상면에는 볼랜드가 형성되며, 상기 볼랜드 볼랜드 주위에 상기 볼랜드보다 높으면서 그 일부가 상기 볼랜드의 가장자리 영역을 덮도록 솔더 레지스트가 도포되는 하부패키지와;On the lower surface of the substrate, a chip is molded and solder balls are provided. A lower surface is formed on the upper surface of the substrate, and a lower portion on which the solder resist is applied so as to cover an edge area of the borland while a portion thereof is higher than the borland around the borland. With package; 상기 상부 패키지의 볼랜드와 상기 하부 패키지의 볼랜드 사이에 연결메탈이 구비된 적층형 반도체 패키지에 있어서,In the stacked semiconductor package provided with a connection metal between the ball land of the upper package and the ball land of the lower package, 상기 상기 연결메탈은 상기 상부 패키지의 볼랜드에 형성되어 상기 하부 패키지의 볼랜드에 연결되거나, 또는 상기 하부 패키지의 볼랜드에 형성되어 상기 상부 패키지의 볼랜드에 연결되는 적층형 반도체 패키지.And the connection metal is formed in the ball land of the upper package and connected to the ball land of the lower package, or formed in the ball land of the lower package and connected to the ball land of the upper package. 삭제delete 삭제delete
KR1020000081123A 2000-12-23 2000-12-23 Stacked Semiconductor Packages KR100587389B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6022761A (en) * 1996-05-28 2000-02-08 Motorola, Inc. Method for coupling substrates and structure
US6138348A (en) * 1989-12-18 2000-10-31 Polymer Flip Chip Corporation Method of forming electrically conductive polymer interconnects on electrical substrates

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6138348A (en) * 1989-12-18 2000-10-31 Polymer Flip Chip Corporation Method of forming electrically conductive polymer interconnects on electrical substrates
US6022761A (en) * 1996-05-28 2000-02-08 Motorola, Inc. Method for coupling substrates and structure

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