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KR100582448B1 - Plasma Display Panel Bulkhead Remover Composition - Google Patents

Plasma Display Panel Bulkhead Remover Composition Download PDF

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KR100582448B1
KR100582448B1 KR1020040062066A KR20040062066A KR100582448B1 KR 100582448 B1 KR100582448 B1 KR 100582448B1 KR 1020040062066 A KR1020040062066 A KR 1020040062066A KR 20040062066 A KR20040062066 A KR 20040062066A KR 100582448 B1 KR100582448 B1 KR 100582448B1
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weight
partition
display panel
plasma display
sodium gluconate
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KR20060013196A (en
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조성훈
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일동화학 주식회사
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H01J9/242Spacers between faceplate and backplate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20Constructional details
    • H01J11/34Vessels, containers or parts thereof, e.g. substrates
    • H01J11/36Spacers, barriers, ribs, partitions or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20Constructional details
    • H01J2211/34Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/36Spacers, barriers, ribs, partitions or the like
    • H01J2211/366Spacers, barriers, ribs, partitions or the like characterized by the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00Electron emission display panels, e.g. field emission display panels
    • H01J2329/86Vessels
    • H01J2329/8625Spacing members
    • H01J2329/864Spacing members characterised by the material

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Gas-Filled Discharge Tubes (AREA)

Abstract

본 발명은 플라스마 디스플레이 패널("PDP") 격벽 제거제 조성물에 관한 것으로 부틸디글리콜 5 내지 30 중량%; 에틸디글리콜 5 내지 40 중량%; 수산화칼륨 2 내지 8 중량%; 글루콘산소다 1 내지 10 중량%; 필요한 경우에 에틸렌글리콜 2 내지 6 중량%; 및 잔량의 물로 이루어지는 건조후 소성전의 PDP유전층 또는 격벽 제거제 조성물을 제공한다.The present invention relates to a plasma display panel ("PDP") partition remover composition, wherein the butyldiglycol is 5-30% by weight; 5 to 40 wt% ethyldiglycol; 2 to 8% by weight potassium hydroxide; Sodium gluconate 1 to 10% by weight; 2 to 6% by weight of ethylene glycol, if necessary; And it provides the PDP dielectric layer or partition removal agent composition before baking after drying consisting of a residual amount of water.

본 발명의 격벽 제거제 조성물은 제거효율이 좋고 Ag와 같은 금속으로 된 전극층에 손상을 주지 않고 PbO 뿐만아니라 비PbO 계열의 격벽재에도 높은 성능을 발휘하였다.The partition removing agent composition of the present invention has good removal efficiency and exhibits high performance not only for PbO but also for non-PbO-based partition walls without damaging an electrode layer made of a metal such as Ag.

플라스마 디스플레이 패널, 플라스마 디스플레이 패널, 유전층Plasma display panel, plasma display panel, dielectric layer

Description

플라스마 디스플레이 패널 격벽 제거제 조성물{composition to remove barrior rib in repairing plasma display panel}Plasma display panel bulkhead remover composition {composition to remove barrior rib in repairing plasma display panel}

본 발명은 플라스마 디스플레이 패널("PDP") 격벽 제거제 조성물에 관한 것이다. 특히 본 발명은 유전층 밑의 금속 전도층에 영향을 주지 않고 격벽을 제거하는데 사용하는 조성물에 관한 것이다.The present invention relates to a plasma display panel ("PDP") partition remover composition. In particular, the invention relates to compositions for use in removing barrier ribs without affecting the metal conductive layer underneath the dielectric layer.

플라스마 디스플레이 패널("PDP")은 크게 전면판(또는 상판)과 배면판(또는 하판)으로 구성된다. AC PDP를 예를 들면 전극은 전면판에 서스테인(x)전극과 스캔(y)극이 나란히 위치하고, 배면판에는 어드레스 전극을 전면판의 두 전극과 직각으로 교차하여 배치하고, 형광막은 반사형으로 채용하고 있다. 우선 배면판에 신호전극을 설치하고, 그 위에 유전층을 도포한다. 그리고 방전셀을 구분하고 전,배면판의 사이의 공간을 확보하기 위하여 일정 높이 격벽(barrier rib)을 설치한 다음 형광체를 격벽과 신호 전극을 덮고 있는 유전체위에 도포한다. 격벽을 따라서 도포된 빨강(r), 녹색(g), 파랑(b)에 해당하는 세 개의 골이 하나의 화소를 이룬다. 한편 전면판에는 방전유지를 위한 x전극과 y전극을 투과도를 고려하여 ITO(indium tin oxide)로 형성되고, 전극의 가장자리에는 ITO의 높은 저항을 보상 하기 위하여 Ag 혹은 Cr-Cu-Cr와 같은 버스전극을 형성한다. 자연스러운 용량성 형성을 통항 전류제한을 위하여 PbO 또는 비PbO 계열의 유전층을 도포하고, 그 표면에 Mgo와 같은 보호막을 증착 한다. 이 유전층 형성으로 인하여 AC PDP의 주요 특징 중의 하나인 메모리 특성이 나타난다.The plasma display panel ("PDP") is largely comprised of a front plate (or top plate) and a back plate (or bottom plate). For example, in the case of an AC PDP, the electrodes are arranged side by side with the sustain (x) electrode and the scan (y) pole, and on the back plate, the address electrodes are arranged at right angles to the two electrodes on the front plate, and the fluorescent film is reflective. I adopt it. First, a signal electrode is provided on the back plate, and a dielectric layer is applied thereon. In addition, a barrier rib is installed at a predetermined height to separate the discharge cells and to secure a space between the front and back plates, and then a phosphor is coated on the dielectric covering the partition and the signal electrode. Three valleys corresponding to red (r), green (g), and blue (b) applied along the partition wall form one pixel. Meanwhile, the front panel is formed of indium tin oxide (ITO) in consideration of the transmittance of the x electrode and the y electrode for maintaining the discharge, and at the edge of the electrode, a bus such as Ag or Cr-Cu-Cr is used to compensate for the high resistance of the ITO. Form an electrode. PbO or non-PbO-based dielectric layers are applied to limit current through natural capacitive formation, and a protective film such as Mgo is deposited on the surface. This dielectric layer formation results in memory characteristics, one of the main characteristics of AC PDP.

상기 AC PDP의 층 구조를 간단히 요약하면 전면판 배면판의 2매의 유리기관으로 구성이 되며 전면판에는 방전유지전극, 버스 전극, 유전층, 보호막이 올라가고, 배면판에는 어드레스 전극, 유전층, 격벽이 올라가게 된다. DC PDP의 층 구조는 전극과 유전층 대신에 절연층 등의 차이는 있으나 격벽과 형광체는 비슷하다. 이러한 전면판, 배면판을 조립, 봉착, 배기, 가스봉입을 함으로서 패널이 완성되게 된다.Briefly summarizing the layer structure of the AC PDP, it consists of two glass tubes of the front plate back plate, and the discharge sustaining electrode, the bus electrode, the dielectric layer, and the protective film rise on the front plate, and the address plate, the dielectric layer, and the partition wall on the back plate. Goes up. The layer structure of the DC PDP is similar to that of the insulating layer instead of the electrode and the dielectric layer, but the partition and the phosphor are similar. The panel is completed by assembling, sealing, exhausting, and gas sealing the front plate and the back plate.

PDP의 유전체 또는 격벽 형성공정에서 각각 유전물질 또는 격벽재료 페이스트를 도포한 후 저온에서 건조하게 되고 격벽의 경우는 격벽을 형성하기 위하여 일반적으로 샌드블라스팅에 의하여 밭고랑처럼 길다란 골을 만든다. 건조된 유전층이나 격벽에 이상이 없으면 소성공정을 진행하여 유리 상태로 만든다. 그러나 이러한 소성 전에 유전층이 불량이라든지 격벽의 경우 골의 형태가 무너진다든지 아니면 평활도에 문제가 생기게 되면 소성하여도 불량품이 되게 되고 전극이 형성된 고가의 유리판을 폐기하여야 하고 이러한 폐기물량은 PDP제조의 원가에 상당한 부담이 된다. In the dielectric or bulkhead forming process of PDP, the dielectric material or bulkhead paste is applied and dried at low temperature. In the case of the bulkhead, the ribs are generally formed as long as furrows by sandblasting to form the bulkhead. If there is no abnormality in the dried dielectric layer or partition wall, the firing process is carried out to a glass state. However, if the dielectric layer is bad before the firing, or if the bulkhead is broken in the form of a partition, or if there is a problem in the smoothness, it will be a defective product even if it is fired, and the expensive glass plate on which the electrode is formed should be discarded. This is a significant burden.

격벽재가 유효하게 제거될 수 있다면 격벽재가 제거된 패널은 격벽 형성 공정에 다시 투입될 수 있다. 종래에는 단일 성분의 용제로 불량 격벽재나 유전층을 제거하여 불량 PDP 유리판을 재생하고자 하는 시도를 하였다. 그러나 단일 유기 용제에 의한 격벽재나 유전층의 제거방법은 시간이 많이 걸리고 전극층을 부식하는 문제가 있었다.If the partition material can be effectively removed, the panel from which the partition material has been removed can be put back into the partition formation process. Conventionally, attempts have been made to regenerate defective PDP glass plates by removing defective partition walls or dielectric layers with a single component solvent. However, the method of removing the partition wall material or the dielectric layer by a single organic solvent takes a long time and has a problem of corrosion of the electrode layer.

이러한 격벽제거제는 침투성이 좋아 제거효율이 좋아야 하고 Ag와 같은 금속으로 된 전극층에 손상을 주지 않아야 한다. 또한 유전층도 손쉽게 제거할 수 있어야 한다.Such barrier remover should have good permeability and good removal efficiency and should not damage the electrode layer made of metal such as Ag. It should also be easy to remove the dielectric layer.

본 발명은 침투성이 좋아 제거효율이 좋고 Ag와 같은 금속으로 된 전극층에 손상을 주지 않는 소성전의 불량 유전층 또는 격벽재를 제거하는데 사용될 수 있는조성물을 제공하기 위한 것이다. 또한 본 발명은 PbO 뿐만아니라 비PbO 계열의 격벽재에도 높은 성능을 발휘하는 격벽 제거제 조성물을 제공하기 위한 것이다. 본 발명자는 다양한 용제를 시험한 결과 단일 용제로는 바람직한 결과를 얻을 수 없었다. 본 발명자는 대략 부틸디글리콜;에틸디글리콜;글루콘산소다의 비율이 대략 3:3:1인 제거제가 가장 우수하다는 것을 발견하고 본 발명을 완성하였다.The present invention is to provide a composition that can be used to remove the defective dielectric layer or partition wall material before firing having good permeability and good removal efficiency and not damaging an electrode layer made of a metal such as Ag. In addition, the present invention is to provide a barrier removal composition exhibiting high performance not only for PbO but also for non-PbO-based barrier materials. The present inventors tested various solvents and could not obtain the desired result with a single solvent. The inventors have found that the removal agent having a ratio of approximately butyl diglycol; ethyl diglycol; sodium gluconate approximately 3: 3: 1 is the best and has completed the present invention.

본 발명에 의하여 부틸디글리콜 5 내지 30 중량%; 에틸디글리콜 5 내지 40 중량%; 수산화칼륨 2 내지 8 중량%; 글루콘산소다 1 내지 10 중량%; 필요한 경우에 에틸렌글리콜 2 내지 6 중량%; 및 잔량의 물로 이루어지는 격벽 제거제 조성물이 제공된다. 상기식에서 바람직하게는 부틸디글리콜 7 내지 25 중량%; 에틸디글리콜 7 내지 30 중량%; 수산화칼륨 3 내지 6 중량%; 글루콘산소다 1 내지 7 중량%; 에틸렌글리콜 3 내지5 중량%이다.5 to 30% by weight of butyldiglycol according to the present invention; 5 to 40 wt% ethyldiglycol; 2 to 8% by weight potassium hydroxide; Sodium gluconate 1 to 10% by weight; 2 to 6% by weight of ethylene glycol, if necessary; And a barrier removal composition comprising a residual amount of water. Preferably 7 to 25% by weight of butyldiglycol; 7-30 wt% ethyldiglycol; 3 to 6 weight percent of potassium hydroxide; Sodium gluconate 1 to 7 wt%; Ethylene glycol 3 to 5% by weight.

격벽재와 유전층 재료는 금속산화물로된 프리트 글라스의 분말, 보다 상세하게는 PbO, B2O3, SiO2, ZnO, SnO2 계 비정질 글라스 혼합물로 구성을 하고 있으며, 결합강도와 열팽창계수를 조절하기 위해 Al2O3, TiO2, PbTiO3 등을 첨가할 수 있다. 격벽재와 유전층 재료는 특별히 한정되는 것이 아니며 적절히 선정하여 사용할 수 있다. The barrier material and the dielectric layer material are composed of metal oxide frit glass powder, more specifically PbO, B2O3, SiO2, ZnO, SnO2 based amorphous glass mixture, and Al2O3, TiO2 to control the bonding strength and thermal expansion coefficient. , PbTiO3 and the like can be added. The partition material and the dielectric layer material are not particularly limited and may be appropriately selected and used.

격벽재나 유전체 재료는 상기의 프리트 글라스에 아크릴레이트 계열의 바인더와 용제를 섞어 페이스트 상으로 제조한다. 유리 기판에 상기 페이스트를 도포한 뒤 건조하면 용제는 날아 가고 바인더에 의하여 형태가 고정된다. 격벽제거제는 프릿분말을 잡고 있는 바인더를 짧은 시간에 녹여 낼 수 있도록 침투력이 좋은 용제가 필요하다. The partition material or the dielectric material is prepared in a paste form by mixing an acrylate-based binder and a solvent with the frit glass. After the paste is applied to a glass substrate and dried, the solvent is blown off and the shape is fixed by a binder. The bulkhead remover needs a good penetrating solvent to melt the binder holding the frit powder in a short time.

KOH는 바람직하게는 3 내지 6 중량% 사용하여 Ag와 같은 금속전극이 부식되는 것을 방지한다.KOH is preferably used 3 to 6% by weight to prevent corrosion of metal electrodes such as Ag.

격벽재 제거제 조성물은 PDP제조공정에 다음 4가지 물질을 제거하게 되는데The bulkhead remover composition removes the following four substances in the PDP manufacturing process:

1). 격벽이 형성된 구조(샌드블러스팅이 완료된 격벽)One). Bulkhead Structure (Sandblasting Completed Bulkhead)

2). 도포된 상태의 격벽(샌드블러스팅이 안된, 즉 골이 없는 격벽층)2). Bulkheads in uncoated state (non-sandblasted, ie rib-free bulkhead layers)

3).유전체층3) .Dielectric layer

4).상기의 PbO격벽 뿐만아니라 non-Pb 격벽(ZnO격벽)제거가능 4) .Removable non-Pb bulkheads (ZnO bulkheads) as well as the above PbO bulkheads.

제거 효율은(상온상태에서) 1)번의 경우 8초~15초 정도에 제거 2)번의 경우 2분, 3)번은 50초 정도 4)번은 5분내 정도의 제거 시간을 충족해야 한다. The removal efficiency (at room temperature) should be within 8 seconds to 15 seconds for 1), 2 minutes for 2), 50 seconds for 3) and 4 minutes for 5).

이하 실시예에 의하여 본 발명을 상세히 설명한다. Hereinafter, the present invention will be described in detail with reference to Examples.

시편제조Specimen Manufacturing

산화납 60 중량%+산화붕소 20중량%+산화규소 20중량%로 된 무기입자혼합물과 아크릴레이트 바인더와 가소제로된 유전체 페이스트 전사지를 이용하여 Ag 전극층이 형성된 유리판 시편(3cm*2cm)에 250nm의 두께로 피복하고 건조시켜(150℃) B형의 시편을 다수 제조한다.250 nm on a glass plate specimen (3 cm * 2 cm) in which an Ag electrode layer was formed using a dielectric paste transfer paper made of an inorganic particle mixture of 60 wt% lead oxide + 20 wt% boron oxide + 20 wt% silicon oxide and an acrylate binder and a plasticizer. A large number of specimens of type B are prepared by coating with a thickness and drying (150 ° C.).

상기 B형 시편 일부를 400℃온도로 소성하고 산화납-산화붕소-산화규소-알루미나 계열의 무기입자와 바인더와 가소제로된 격벽재 전사지를 이용하여 500nm의 두께로 격벽재로 피복한 후에 건조시키고(150℃) C형의 시편을 제조한다. 상기 C형의 시편의 일부를 1mm 홈이 형성된 알루미늄 포일로 마스킹 한 후에 샌드 블라스팅으로 격벽이 형성된 A형의 시편을 만든다.The B-type specimen was calcined at 400 ° C. and coated with a partition wall material having a thickness of 500 nm using a partition paper transfer paper made of lead oxide, boron oxide, silicon oxide, alumina-based inorganic particles, a binder, and a plasticizer, followed by drying. (150 ° C.) A specimen of type C was prepared. A portion of the C-type specimen is masked with an aluminum foil having a 1 mm groove and then sand-blasted to make an A-type specimen having a partition wall.

상기 C형의 시편의 제조와는 산화아연+산화규소+산화붕소로된 무기입자를 사용하는 것을 제외하고 동일한 방법으로 D형의 시편을 제조한다.D-type specimens are prepared in the same manner as the preparation of the C-type specimens, except that inorganic particles of zinc oxide + silicon oxide + boron oxide are used.

제거제의 적용Application of remover

보드 상에 시편이 수직이 되도록 고정시키고 약액을 소형 분무기로 분무하여 유전층과 격벽재가 흘러 내리는 시간을 측정하였다. The specimen was fixed vertically on the board and the chemical liquid was sprayed with a small atomizer to measure the time for the dielectric layer and the partition wall to flow down.

비교예Comparative example 1~15 1-15

메탄올으로 상기 준비된 A, B, C와 D형의 시편에 분무하고 제거시간을 측정 하였다. 동일한 방법으로 여러가지 단일 용매로 제거시간을 측정하고 그 결과를 표1에 정리하였다.Methanol was sprayed on the prepared A, B, C and D specimens and the removal time was measured. In the same way, the removal time was measured with various single solvents and the results are summarized in Table 1.

표1Table 1

약액명 Drug name 처리 결과 제거 시간(sec)Processing result removal time (sec) TYPE ATYPE A TYPE B (유전체)TYPE B (dielectric) TYPE C (Pb격벽)TYPE C (Pb bulkhead) TYPE D (Zn격벽)TYPE D (Zn bulkhead) 비교예1Comparative Example 1 METHANOLMETHANOL 1515 113113 554554 698698 비교예2Comparative Example 2 ETHANOLETHANOL 1212 125125 598598 745745 비교예3Comparative Example 3 ETHYLENE GLYCOL MONOBUTYL ETHERETHYLENE GLYCOL MONOBUTYL ETHER 4545 200200 541541 698698 비교예4Comparative Example 4 TETRA HYDRO FURANTETRA HYDRO FURAN 1212 225225 314314 387387 비교예5Comparative Example 5 DIACETONA ALCOHOLDIACETONA ALCOHOL 2323 212212 361361 446446 비교예6Comparative Example 6 DMSODMSO 3030 312312 334334 412412 비교예7Comparative Example 7 NMPNMP 2525 320320 323323 398398 비교예8Comparative Example 8 AMMONIUM ACETATEAMMONIUM ACETATE 1818 225225 365365 462462 비교예9Comparative Example 9 1,1,2,2 TETRA CHLORO ETHANE1,1,2,2 TETRA CHLORO ETHANE 2121 207207 335335 435435 비교예10Comparative Example 10 N-OCTHYL ACETATEN-OCTHYL ACETATE 4545 262262 451451 512512 비교예11Comparative Example 11 MONO CHLORO BENZENMONO CHLORO BENZEN 3030 225225 321321 421421 비교예12Comparative Example 12 O-CHLOROBENZENO-CHLOROBENZEN 2525 362362 387387 324324 비교예13Comparative Example 13 BDGBDG 4545 260260 641641 812812 비교예14Comparative Example 14 EDGEDG 2424 187187 637637 786786 비교예15Comparative Example 15 KOHKOH 4040 367367 473473 584584

실시예Example 1~19 1-19

부틸디글리콜("BDG")20중량%+에틸디글리콜("EDG")20중량%+수나화칼륨5중량%와 잔량의 물로된 약액으로 상기 준비된 A, B, C와 D형의 시편에 분무하고 제거시간을 측정하였다. 동일한 방법으로 여러가지 복합용매로 제거시간을 측정하고 그 결과를 표2에 정리하였다.20% by weight of butyldiglycol ("BDG") + 20% by weight of ethyl diglycol ("EDG") + 5% by weight of potassium hydride and the remaining amount of water in the prepared A, B, C and D specimens Spray and remove time was measured. In the same way, the removal time was measured with various complex solvents and the results are summarized in Table 2.

표2Table 2

약액명 Drug name 처리 결과 제거 시간(sec)Processing result removal time (sec) TYPE ATYPE A TYPE B (유전체)TYPE B (dielectric) TYPE C (Pb격벽)TYPE C (Pb bulkhead) TYPE D (Zn격벽)TYPE D (Zn bulkhead) 실시예1Example 1 BDG(20%)+EDG(20%)+KOH(5%)BDG (20%) + EDG (20%) + KOH (5%) 1313 7272 208208 257257 22 BDG(20%)+EDG(20%)+KOH(5%)+글루콘산소다(1%)BDG (20%) + EDG (20%) + KOH (5%) + Sodium Gluconate (1%) 1111 6363 160160 198198 33 BDG(20%)+EDG(20%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (20%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 1111 5252 135135 167167 44 BDG(5%)+EDG(5%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (5%) + EDG (5%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 3030 7272 289289 278278 55 BDG(10%)+EDG(10%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (10%) + EDG (10%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 1818 6767 178178 215215 66 BDG(20%)+EDG(20%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (20%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 1111 5252 135135 167167 77 BDG(30%)+EDG(30%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (30%) + EDG (30%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 1717 5959 166166 197197 88 BDG(20%)+EDG(5%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (5%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 3434 7171 195195 268268 99 BDG(20%)+EDG(10%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (10%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 2121 6868 176176 226226 1010 BDG(20%)+EDG(20%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (20%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 1111 5252 135135 167167 1111 BDG(20%)+EDG(30%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (30%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 1919 5555 152152 196196 1212 BDG(20%)+EDG(20%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (20%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 1111 5252 135135 167167 1313 BDG(20%)+EDG(20%)+KOH(10%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (20%) + KOH (10%) + Sodium Gluconate (1%) + EG (4%) 1010 5252 146146 159159 1414 BDG(20%)+EDG(20%)+KOH(15%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (20%) + KOH (15%) + Sodium Gluconate (1%) + EG (4%) 1515 5656 178178 175175 1515 BDG(20%)+EDG(20%)+KOH(20%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (20%) + KOH (20%) + Sodium Gluconate (1%) + EG (4%) 1717 5555 182182 194194 1616 BDG(20%)+EDG(20%)+KOH(5%)+글루콘산소다(1%)+EG(4%)BDG (20%) + EDG (20%) + KOH (5%) + Sodium Gluconate (1%) + EG (4%) 1111 5252 135135 167167 1717 BDG(20%)+EDG(20%)+KOH(5%)+글루콘산소다(5%)+EG(4%)BDG (20%) + EDG (20%) + KOH (5%) + Sodium Gluconate (5%) + EG (4%) 1111 5252 134134 167167 1818 BDG(20%)+EDG(20%)+KOH(5%)+글루콘산소다(7%)+EG(4%)BDG (20%) + EDG (20%) + KOH (5%) + Sodium Gluconate (7%) + EG (4%) 1212 5252 135135 167167 1919 BDG(20%)+EDG(20%)+KOH(5%)+글루콘산소다(10%)+EG(4%)BDG (20%) + EDG (20%) + KOH (5%) + Sodium Gluconate (10%) + EG (4%) 1111 5252 134134 168168

시험결과 부틸디글리콜 10 내지 20 중량%; 에틸디글리콜 10 내지 30 중량%; 수산화칼륨 5내지 10 중량%; 글루콘산소다 1 내지 10 중량%; 에틸렌글리콜 3 내지5 중량%과 잔량의 물을 사용한 경우가 가장 양호하였다. 알카리를 사용하지 않은 비교예1~15경우에는 금속 전극층의 부식이 관찰되었다.Test results of 10 to 20% by weight of butyldiglycol; 10-30 wt% ethyldiglycol; 5 to 10 weight percent potassium hydroxide; Sodium gluconate 1 to 10% by weight; It was best when 3 to 5% by weight of ethylene glycol and the remaining amount of water were used. In Comparative Examples 1 to 15 where no alkali was used, corrosion of the metal electrode layer was observed.

본 발명의 격벽 제거제 조성물은 제거효율이 좋고 Ag와 같은 금속으로 된 전극층에 손상을 주지 않고 PbO 뿐만아니라 비PbO 계열의 격벽재에도 높은 성능을 발휘하였다.The partition removing agent composition of the present invention has good removal efficiency and exhibits high performance not only for PbO but also for non-PbO-based partition walls without damaging an electrode layer made of a metal such as Ag.

Claims (2)

부틸디글리콜 5 내지 30 중량%; 에틸디글리콜 5 내지 40 중량%; 수산화칼륨 2 내지 8 중량%; 글루콘산소다 1 내지 10 중량%; 필요한 경우에 에틸렌글리콜 2 내지 6 중량%; 및 잔량의 물로 이루어지는 건조후 소성전의 PDP유전층 또는 격벽 제거제 조성물.5 to 30 wt% butyldiglycol; 5 to 40 wt% ethyldiglycol; 2 to 8% by weight potassium hydroxide; Sodium gluconate 1 to 10% by weight; 2 to 6% by weight of ethylene glycol, if necessary; And a PDP dielectric layer or barrier rib removal composition before firing after drying, which comprises residual water. 제1항에 있어서, 부틸디글리콜 7 내지 25 중량%; 에틸디글리콜 7 내지 30 중량%; 수산화칼륨 3 내지 6 중량%; 글루콘산소다 1 내지 7 중량%; 에틸렌글리콜 3 내지5 중량%인 PDP유전층 또는 격벽 제거제 조성물.The method of claim 1, wherein the butyl diglycol 7 to 25% by weight; 7-30 wt% ethyldiglycol; 3 to 6 weight percent of potassium hydroxide; Sodium gluconate 1 to 7 wt%; Ethylene glycol 3 to 5% by weight PDP dielectric layer or barrier rib removal composition.
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