KR100570201B1 - Carrier Module for Semiconductor Device Test Handler - Google Patents

Abstract

According to the present invention, even when a lead or a ball is distributed in the entire area or the edge of the device, the semiconductor device is stably gripped and transferred, and the test socket is stably connected to the test socket.

To this end, the present invention, the carrier module body; An element seating portion formed on a bottom surface of the carrier module body; At least one pair of first latches opposed to both side portions of the element seating portion to hold and release both side portions of the semiconductor element seated on the element seating portion; At least one pair of second latches rotatably provided at both sides of the first latch to hold a bottom portion of the semiconductor device; A latch button moving upward and downward on an upper portion of the carrier module body to move the first latch; First and second elastic members for elastically supporting the first and second latches, respectively; A carrier module for a semiconductor device test handler, characterized in that it comprises a plurality of ribs extending from the end of the first latch between the balls of the semiconductor device to support the bottom edge of the semiconductor device. do.

Handler, Carrier Module, First Latch, Second Latch, BGA, Rib

Description

Carrier module for semiconductor device test handler

1 is a front view of a test tray in which a conventional carrier module is installed

Figure 2 is a perspective view showing the bottom of the conventional carrier module

Figure 3 is a perspective view showing the bottom of an embodiment of a carrier module according to the present invention

4 is an enlarged view showing in detail the structure of the first latch of the carrier module of FIG.

5A to 5C are cross-sectional views illustrating main parts of an operation example of the carrier module of FIG. 3.

Explanation of symbols on the main parts of the drawings

100: carrier module 110: carrier module body

111: guide pin 114: second compression spring

115: device mounting portion 120: heat sink

130: latch button 132: first compression spring

140: first latch 141: rib

142: first connecting pin 144: guide groove

150: second latch 152: second connecting pin

154: protrusion 101: semiconductor device

101a: ball

The present invention relates to a carrier module installed in a test tray in a handler for testing a semiconductor device. In particular, the ball socket is distributed to the edge of the bottom portion of the device or the micro-miniaturized BGA type semiconductor device is stably mounted to the test socket of the test site. The present invention relates to a carrier module for a semiconductor device test handler which can be easily connected to the same.

In general, memory ICs or non-memory semiconductor devices and module ICs having them properly configured on a substrate are shipped after various tests after production.

The handler is a device used to automatically test the semiconductor device and the module as described above. In such a handler, a tray containing the semiconductor device to be tested by the operator is loaded into the loading stacker of the handler, and then the semiconductor of the loading stacker is loaded. Reattach the devices to a separate test tray, send a test tray equipped with these semiconductor devices to a test site, and conduct a predetermined test by electrically connecting the lead or ball portion of the semiconductor devices to the connector of the test socket. Then, it is common to perform the test by separating the semiconductor elements of the test tray and classifying and mounting them on the customer tray of the unloading stacker according to the test result.

1 and 2 of the accompanying drawings show a test tray for transferring a semiconductor device between processes in a handler as described above, and a conventional carrier module mounted to the test tray, wherein the test tray 1 is made of a metallic material. The plurality of carrier modules 2 on which the semiconductor elements are mounted on the frame 11 are arranged at regular intervals.

The carrier module 2 includes a device seating part 22 on which the semiconductor device D is mounted on a rectangular body 21, and the semiconductor device D is disposed on both sides of the device seating part 22. A pair of latches 23 for holding are provided.

Here, the latch 23 is opened and closed while pivoting up and down about a hinge axis (not shown) installed inside the body 21, and the latch 23 is formed on the device seat 22. The ball Db at both edges thereof is held.

In the conventional carrier module 2 as described above, as shown in FIG. 2, the semiconductor device D is mounted with the ball-forming surface facing upward. The test tray 1 in which the semiconductor device D is mounted is thus mounted. Is transferred to the test site of the handler, an index unit installed at the test site pushes the carrier module 2 toward the test socket, and the ball Db of the semiconductor device D moves to the terminal pin of the socket (not shown). A test is performed by making a connection with the.

However, in the conventional carrier modules as described above, when the ball Db of the semiconductor device D is not formed, the latch 23 may sufficiently hold the semiconductor device D. As shown in the development trend, when the ball or lead is distributed over the entire area of the bottom edge of the semiconductor device or when the semiconductor device is microminiature, the carrier module is not sufficiently secured by the latch 23 for holding substantially. A problem arises in that the semiconductor element is stably mounted on the test socket and cannot be connected to the test socket.

Accordingly, the present invention has been made to solve the above problems, and even if the ball of a very small or thin BGA type semiconductor device is distributed in the entire area or the edge of the device, the semiconductor device is stably gripped and transported. In addition, an object of the present invention is to provide a carrier module for a semiconductor device test handler which can be stably connected to a test socket to perform a test.

The present invention for achieving the above object, the carrier module body; An element seating portion formed on a bottom surface of the carrier module body; At least one pair of first latches provided on both sides of the device seating part so as to be open and closed to hold and release both sides of the semiconductor device seated on the device seating part; At least one pair of second latches rotatably installed on both sides of the first latch, holding a bottom portion of the semiconductor element seated in the element seating portion, and interlocking together to release the semiconductor element during the release operation of the first latch; Wow; A latch button installed on the upper portion of the carrier module body so as to be movable up and down, coupled with one end of the first latch, and moving up and down and moving the first latch; A first elastic member and a second elastic member elastically supporting the first latch and the second latch, respectively; A carrier module for a semiconductor device test handler, characterized in that it comprises a plurality of ribs extending from the end of the first latch between the balls of the semiconductor device to support the bottom edge of the semiconductor device. do.

According to the present invention as described above, when the carrier module holds the semiconductor element, the first latch and the second latch simultaneously hold the semiconductor element, and when the semiconductor device is connected to the test socket to perform the test, the first latch The test can be smoothly performed by turning only the second latch outward while releasing the semiconductor device while holding both side portions of the semiconductor device. When the semiconductor device needs to be separated or accommodated from the carrier module, the first latch and the second latch At the same time, the semiconductor element can enter and exit the carrier module.

Hereinafter, exemplary embodiments of a carrier module for a semiconductor device test handler according to the present invention will be described in detail with reference to the accompanying drawings.

3 to 5c illustrate an embodiment of a carrier module for a semiconductor device test handler according to the present invention. The carrier module 100 includes a carrier module body 110 and a lower surface of the carrier module body 110. A first latch formed in the center and installed on both sides of the device seating portion 115 and the device seating portion 115 facing each other to hold both side portions and the bottom portion of the semiconductor element 101; 140 and the second latch 150, the latch button 130 is installed to be moved up and down on the carrier module body 110 to operate the first latch 140.

The first latch 140 is rotatably coupled to the latch button 130 by a first connecting pin 142, the second latch 150 is a carrier module body (2) by the second connecting pin 152 110 is pivotally coupled.

In addition, a pair of the second latch 150 is installed, and the first latch 140 is disposed on both sides of the second latch 150 with two pairs of the second latch 150 interposed therebetween.

The device seating part 115 may be replaced by being separated from the carrier module body 110 according to the shape and size of the semiconductor device 101.

In addition, a heat sink 120 is installed at the center of the carrier module body 110 to suppress a temperature rise of the semiconductor device, and a through hole vertically penetrated from the top to the bottom in the center of the heat sink 120. 122) is formed.

The latch button 130 is elastically supported with respect to the carrier module body 110 by the first compression spring 132 while being inserted into the holes 116 formed on both sides of the heat sink 120. .

The latch movable pieces 147 protrude from both sides of the first latch 140 so as to contact the inner surface of the second latch 150. In addition, the first latch 140 has a long slot-shaped guide groove 144 is inclined in the middle portion, the guide pin 112 is fixed to the carrier module body 110 inside the guide groove 144 is located do.

Therefore, when the latch button 130 descends due to an external force applied to the latch button 130, the guide groove 144 is guided by the guide pin 112, so the first latch 140 descends diagonally outward. When the external force applied to the latch button 130 is removed, the latch button 130 is raised by the elastic force of the first compression spring 132, and thus the guide groove of the first latch 140. 144 is guided by the guide pin 112, the first latch 140 is lifted up and down in the diagonal direction.

In addition, the first latch 140 is formed at the distal end thereof with a plurality of ribs 141 extending between the balls 101a of the semiconductor element 101. The ribs 141 are formed by the first latch 140. It is possible to simultaneously hold not only the sides of the semiconductor device but also the edges of the bottom, thereby providing a very stable supporting force even when a very thin BGA semiconductor device is connected to the test socket.

Of course, the rib 141 should be thinner than the thickness of the ball 101a so that the balls 101a of the semiconductor device 101 can be securely connected to the test socket. In addition, the groove portion between the ribs 141 preferably has an arc shape corresponding to the shape of the ball 101a.

On the other hand, the second latch 150 has a locking groove 156 is formed in the outer upper end, one end of the second compression spring 114 is coupled to the locking groove 156 is burnt against the carrier module body 110 Sexually Supported In addition, a protruding jaw 158 extending toward the bottom of the semiconductor device 101 is formed inside the lower end of the second latch 150, and a protrusion 154 protruding downwardly outside the lower end of the second latch 150. ) Is formed, and when the protrusion 154 is pressed, the second latch 150 pivots about the second connection pin 152.

The carrier module configured as described above operates as follows.

First, as shown in FIG. 5A, when the semiconductor element 101 to be tested by a predetermined element transfer device (not shown) is conveyed under the carrier module 100 of the test tray 1 (see FIG. 1), The pusher member 170 descends from the carrier module 100 and presses the latch button 130.

When the pusher member 170 presses the latch button 130 and descends, the first latch 140 is guided by the guide pin 112 and descends diagonally outward as described above. At the same time, since the latch movable piece 147 pushes the inner surface of the second latch 150 while the first latch 140 is opened, the second latch 150 is swung outward.

As such, when the first latch 140 and the second latch 150 are opened, a lower pusher member (not shown) installed below the carrier module 100 pushes up the semiconductor element 101 so that the element seating portion ( 115).

When the semiconductor device 101 is seated on the device seating portion 115, the pusher member 170 is raised and the latch button 130 is lifted by the elastic force of the first compression spring 132. As the first latch 140 rises in the diagonally inward direction, the first latch 140 may be held to hold both side portions of the semiconductor device 101 as illustrated in FIG. 5B.

At the same time, as the first latch 140 is raised, the second latch 150 is also turned inward by the elastic force of the second compression spring 114 so that the protruding jaws 158 are formed on both sides of the semiconductor device 101. Holding the bottom portion.

As described above, when the test tray 1 (see FIG. 1) is moved to the test socket 160 position of the test site while the semiconductor device 101 is held in the carrier module 100, the press unit (not shown) The carrier module body 110 is pushed toward the test socket 160.

On both sides of the test socket 160, the latch pusher 162 corresponding to the protrusion 154 of the second latch 150 is formed to protrude upward, and the carrier module 100 is connected to the test socket 160. As shown in FIG. 5C, as the protrusion 154 of the second latch 150 contacts the latch pusher 162, the second latch 150 swings outward to open. The holding state of the semiconductor device by the latch 150 is released, and only the first latch 140 holds both side portions of the semiconductor device 101 so that the ball 101a of the semiconductor device 101 and the test socket 160 are held. The contact portion 164 is connected.

At this time, since the ribs 141 are formed at the front end thereof, the first latch 140 stably holds the edges of both side portions and the bottom portion of the semiconductor device.

When the test is completed, the test tray is moved to a position where the semiconductor device is unloaded, and as described with reference to FIG. 5A, the pusher member 170 is lowered again at the unloading position, so that the semiconductor device 101 is formed as a carrier module ( 100).

On the other hand, as described above, when the semiconductor device 101 is connected to the test socket 160 and the electrical performance test is performed, heat generated in the semiconductor device 101 is quickly discharged to the outside through the heat sink 120. There is no need for a separate device or time for heat dissipation, thus reducing test time and costs.

The vacuum pressure may be sensed through the through hole 122 formed in the center of the heat sink 120 to determine whether the carrier module 100 is holding the semiconductor device 101.

 As described above, according to the present invention, the ball is distributed over the edge of the device, and especially when testing a very thin BGA type semiconductor device, the carrier module stably supports the semiconductor device and connects it to the test socket. It is possible to improve the test reliability.

Claims (2)

A carrier module body; An element seating portion formed on a bottom surface of the carrier module body; At least one pair of first latches provided on both sides of the device seating part so as to be open and closed to hold and release both sides of the semiconductor device seated on the device seating part; At least one pair of second latches rotatably installed on both sides of the first latch, holding a bottom portion of the semiconductor element seated in the element seating portion, and interlocking together to release the semiconductor element during the release operation of the first latch; Wow; A latch button installed on the upper portion of the carrier module body so as to be movable up and down, coupled with one end of the first latch, and moving up and down and moving the first latch; A first elastic member and a second elastic member elastically supporting the first latch and the second latch, respectively; And a plurality of ribs extending from the end of the first latch between the balls of the semiconductor element and supporting the bottom edge of the semiconductor element. The carrier module for a semiconductor device test handler as claimed in claim 1, wherein an interval between each rib is formed in an arc shape corresponding to a ball of the semiconductor device.

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