KR100568032B1 - 포토레지스트 코팅불량 감지방법 및 그 검출장치 - Google Patents
포토레지스트 코팅불량 감지방법 및 그 검출장치 Download PDFInfo
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- KR100568032B1 KR100568032B1 KR1020030040944A KR20030040944A KR100568032B1 KR 100568032 B1 KR100568032 B1 KR 100568032B1 KR 1020030040944 A KR1020030040944 A KR 1020030040944A KR 20030040944 A KR20030040944 A KR 20030040944A KR 100568032 B1 KR100568032 B1 KR 100568032B1
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- Prior art keywords
- wafer
- air
- coating
- photoresist
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- 239000011248 coating agent Substances 0.000 title claims abstract description 57
- 238000000576 coating method Methods 0.000 title claims abstract description 57
- 230000007547 defect Effects 0.000 title claims abstract description 33
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 33
- 238000001514 detection method Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000007664 blowing Methods 0.000 claims abstract description 5
- 230000002265 prevention Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 66
- 238000007689 inspection Methods 0.000 abstract description 4
- 238000005070 sampling Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Materials For Photolithography (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (8)
- 노광장비에서 포토레지스트의 코팅불량을 감지하는 방법에 있어서,포토레지스트가 코팅과 소프트 베이킹된 웨이퍼를 오리엔테이션 플랫 체크 블럭으로 로딩하여 상기 웨이퍼를 회전하며, 노치의 위치를 검출하는 단계;상기 웨이퍼의 회전동안 상기 웨이퍼 상부에 설치된 다수의 에어노즐을 통해 상기 웨이퍼로 공기를 분출하는 단계;상기 다수의 에어노즐을 통해 상기 웨이퍼로 분출되는 공기 분출량을 검출하고 변화량을 증폭하는 단계; 및상기 검출되는 공기 분출량에 변화가 생기면 상기 포토레지스트 코팅이 불량인 것으로 판단하여 코팅 불량 신호를 발생하는 단계를 포함하는 포토레지스트 코팅불량 감지방법.
- 제 1 항에 있어서,상기 다수의 에어노즐을 상기 웨이퍼의 외측에서 중심에 이르는 직선상에 설치하여 공기를 분출하는 포토레지스트 코팅불량 감지방법.
- 제 1 항에 있어서,상기 다수의 에어노즐을 상기 웨이퍼로부터 3-8mm 이격되도록 하여 공기를 분출하는 포토레지스트 코팅불량 감지방법.
- 웨이퍼를 회전하며 센서에 의해 상기 웨이퍼의 노치를 검출하는 오리엔테이션 플랫 체크 블럭을 포함하는 노광방지를 이용하여 포토레지스트의 코팅불량을 검출하는 장치에 있어서,상기 오리엔테이션 플랫 체크 블럭의 웨이퍼가 놓이는 위치 상부에 설치되어 상기 웨이퍼로 공기를 분출하는 다수의 에어노즐;상기 에어노즐을 통해 분출되는 공기 분출량을 검출하고 변화량을 증폭하는 에어게이지;상기 에어게이지의 신호에 따라 상기 포토레지스트의 코팅 불량을 판단하여 코팅 불량 신호를 발생하는 컨트롤러; 및상기 컨트롤러의 코팅 불량 신호에 따라 사용자가 알 수 있도록 표시하여 주는 표시부를 포함하는 포토레지스트 코팅불량 검출장치.
- 제 4 항에 있어서,상기 다수의 에어노즐은 상기 웨이퍼의 외측에서 중심에 이르는 직선상에 설치된 포토레지스트 코팅불량 검출장치.
- 제 5 항에 있어서,상기 다수의 에어노즐은 상기 웨이퍼로부터 3~8mm 이격된 위치에 설치된 포토레지스트 코팅불량 검출장치.
- 제 4 항에 있어서,상기 다수의 에어노즐은 각각 직경이 3mm인 포토레지스트 코팅불량 검출장치.
- 제 4 항에 있어서,상기 다수의 에어노즐은 상기 웨이퍼의 반경을 따라 2행 9열로 형성된 포토레지스트 코팅불량 검출장치.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030040944A KR100568032B1 (ko) | 2003-06-24 | 2003-06-24 | 포토레지스트 코팅불량 감지방법 및 그 검출장치 |
US10/875,967 US7638096B2 (en) | 2003-06-24 | 2004-06-24 | Photoresist coating failure sensing methods and detection devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030040944A KR100568032B1 (ko) | 2003-06-24 | 2003-06-24 | 포토레지스트 코팅불량 감지방법 및 그 검출장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050000450A KR20050000450A (ko) | 2005-01-05 |
KR100568032B1 true KR100568032B1 (ko) | 2006-04-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020030040944A Expired - Fee Related KR100568032B1 (ko) | 2003-06-24 | 2003-06-24 | 포토레지스트 코팅불량 감지방법 및 그 검출장치 |
Country Status (2)
Country | Link |
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US (1) | US7638096B2 (ko) |
KR (1) | KR100568032B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105097581B (zh) * | 2014-05-08 | 2018-11-16 | 中芯国际集成电路制造(上海)有限公司 | 喷嘴位置的检测方法及检测晶圆 |
JP6612172B2 (ja) * | 2016-04-25 | 2019-11-27 | Towa株式会社 | 樹脂成形装置、樹脂成形方法、樹脂成形品の製造方法及び製品の製造方法 |
JP6869842B2 (ja) * | 2017-07-24 | 2021-05-12 | 株式会社荏原製作所 | 基板処理装置、および基板に形成された切り欠きを検出する方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729966A (en) * | 1972-02-02 | 1973-05-01 | Ibm | Apparatus for contouring the surface of thin elements |
US4654310A (en) * | 1984-01-10 | 1987-03-31 | Ly Uy Vu | Instrumentless quantitative analysis system |
US4607525A (en) * | 1984-10-09 | 1986-08-26 | General Signal Corporation | Height measuring system |
JPH0499838U (ko) * | 1991-02-08 | 1992-08-28 | ||
JP3516195B2 (ja) | 1996-05-28 | 2004-04-05 | 東京エレクトロン株式会社 | 塗布膜形成方法及びその装置 |
KR100326432B1 (ko) | 2000-05-29 | 2002-02-28 | 윤종용 | 웨이퍼 스테이지용 에어 샤워 |
US6492127B2 (en) * | 2001-01-23 | 2002-12-10 | Varian, Inc. | Lateral flow testing device with on-board chemical reactant |
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2003
- 2003-06-24 KR KR1020030040944A patent/KR100568032B1/ko not_active Expired - Fee Related
-
2004
- 2004-06-24 US US10/875,967 patent/US7638096B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7638096B2 (en) | 2009-12-29 |
KR20050000450A (ko) | 2005-01-05 |
US20040266012A1 (en) | 2004-12-30 |
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