KR100553396B1 - Polyoxymethylene Resin Composition for Speaker Grille of Automobile - Google Patents
Polyoxymethylene Resin Composition for Speaker Grille of Automobile Download PDFInfo
- Publication number
- KR100553396B1 KR100553396B1 KR20020088059A KR20020088059A KR100553396B1 KR 100553396 B1 KR100553396 B1 KR 100553396B1 KR 20020088059 A KR20020088059 A KR 20020088059A KR 20020088059 A KR20020088059 A KR 20020088059A KR 100553396 B1 KR100553396 B1 KR 100553396B1
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- KR
- South Korea
- Prior art keywords
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- polyoxymethylene resin
- resin composition
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- Prior art date
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- 229920006324 polyoxymethylene Polymers 0.000 title claims abstract description 52
- -1 Polyoxymethylene Polymers 0.000 title claims abstract description 31
- 229930040373 Paraformaldehyde Natural products 0.000 title claims abstract description 20
- 239000011342 resin composition Substances 0.000 title claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 229920001400 block copolymer Polymers 0.000 claims abstract description 14
- 229920001515 polyalkylene glycol Polymers 0.000 claims abstract description 12
- 150000002148 esters Chemical class 0.000 claims abstract description 9
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 claims abstract description 8
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 62
- 239000011256 inorganic filler Substances 0.000 claims description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 7
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 20
- 239000000463 material Substances 0.000 abstract description 5
- 238000010276 construction Methods 0.000 abstract description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical group OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 19
- 238000000034 method Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 12
- 239000004611 light stabiliser Substances 0.000 description 12
- 239000000047 product Substances 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 10
- 238000000465 moulding Methods 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 125000005704 oxymethylene group Chemical group [H]C([H])([*:2])O[*:1] 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 3
- 150000007942 carboxylates Chemical group 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 235000019645 odor Nutrition 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- OWQPOVKKUWUEKE-UHFFFAOYSA-N 1,2,3-benzotriazine Chemical compound N1=NN=CC2=CC=CC=C21 OWQPOVKKUWUEKE-UHFFFAOYSA-N 0.000 description 2
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 2
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 2
- LEVFXWNQQSSNAC-UHFFFAOYSA-N 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexoxyphenol Chemical compound OC1=CC(OCCCCCC)=CC=C1C1=NC(C=2C=CC=CC=2)=NC(C=2C=CC=CC=2)=N1 LEVFXWNQQSSNAC-UHFFFAOYSA-N 0.000 description 2
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical group O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000004292 cyclic ethers Chemical class 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003623 enhancer Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- OKRSVCKJPLEHEY-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) acetate Chemical compound CC(=O)OC1CC(C)(C)NC(C)(C)C1 OKRSVCKJPLEHEY-UHFFFAOYSA-N 0.000 description 1
- YEYCMBWKTZNPDH-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) benzoate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC=C1 YEYCMBWKTZNPDH-UHFFFAOYSA-N 0.000 description 1
- JMUOXOJMXILBTE-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 JMUOXOJMXILBTE-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- XQMHLQCMMWBAPP-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-[2-(2,2,6,6-tetramethylpiperidin-4-yl)oxyethoxy]piperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OCCOC1CC(C)(C)NC(C)(C)C1 XQMHLQCMMWBAPP-UHFFFAOYSA-N 0.000 description 1
- IUKIOUVQRQCBOX-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-phenoxypiperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OC1=CC=CC=C1 IUKIOUVQRQCBOX-UHFFFAOYSA-N 0.000 description 1
- WDYYJEFALNLPOT-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-phenylmethoxypiperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OCC1=CC=CC=C1 WDYYJEFALNLPOT-UHFFFAOYSA-N 0.000 description 1
- MEAZPWBJLXTNOB-UHFFFAOYSA-N 2-(2-phenylbutan-2-yl)phenol Chemical compound C=1C=CC=C(O)C=1C(C)(CC)C1=CC=CC=C1 MEAZPWBJLXTNOB-UHFFFAOYSA-N 0.000 description 1
- USZUZIMVSOJMNA-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-2,4-dihydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-2,4-dihydroxy-5-methylphenyl)propanoate Chemical compound C(C)(C)(C)C=1C(=C(C=C(C1O)C)CCC(=O)OCCOCCOCCOC(CCC1=C(C(=C(C(=C1)C)O)C(C)(C)C)O)=O)O USZUZIMVSOJMNA-UHFFFAOYSA-N 0.000 description 1
- MFBRWKCKAGAJAJ-UHFFFAOYSA-N 2-[4-[[4-(2-hydroxyethoxy)phenyl]methyl]phenoxy]ethanol Chemical compound C1=CC(OCCO)=CC=C1CC1=CC=C(OCCO)C=C1 MFBRWKCKAGAJAJ-UHFFFAOYSA-N 0.000 description 1
- HPMGAACJOFKRPE-UHFFFAOYSA-N 4-(2,2,6,6-tetramethylpiperidin-4-yl)oxycarbonylbenzoic acid Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=C(C(O)=O)C=C1 HPMGAACJOFKRPE-UHFFFAOYSA-N 0.000 description 1
- QLUQHFODHZKSDT-UHFFFAOYSA-N 4-butoxycarbonylbenzoic acid Chemical group CCCCOC(=O)C1=CC=C(C(O)=O)C=C1 QLUQHFODHZKSDT-UHFFFAOYSA-N 0.000 description 1
- RWWGPCWSFFOXJN-UHFFFAOYSA-N 4-methoxy-2,2,6,6-tetramethylpiperidine Chemical compound COC1CC(C)(C)NC(C)(C)C1 RWWGPCWSFFOXJN-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 241000220259 Raphanus Species 0.000 description 1
- 235000006140 Raphanus sativus var sativus Nutrition 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000397 acetylating effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- SMISHRXKWQZCCQ-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-3-yl) decanedioate Chemical compound CC1(C)N(C)C(C)(C)CCC1OC(=O)CCCCCCCCC(=O)OC1C(C)(C)N(C)C(C)(C)CC1 SMISHRXKWQZCCQ-UHFFFAOYSA-N 0.000 description 1
- GMHDUYXGKJNFHH-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) oxalate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C(=O)OC1CC(C)(C)NC(C)(C)C1 GMHDUYXGKJNFHH-UHFFFAOYSA-N 0.000 description 1
- DGBLGWVHPYOSAI-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) propanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(=O)OC1CC(C)(C)NC(C)(C)C1 DGBLGWVHPYOSAI-UHFFFAOYSA-N 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical group B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003976 glyceryl group Chemical group [H]C([*])([H])C(O[H])([H])C(O[H])([H])[H] 0.000 description 1
- 229940075507 glyceryl monostearate Drugs 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000001788 mono and diglycerides of fatty acids Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 230000008786 sensory perception of smell Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- MVJKXJPDBTXECY-UHFFFAOYSA-N trifluoroborane;hydrate Chemical compound O.FB(F)F MVJKXJPDBTXECY-UHFFFAOYSA-N 0.000 description 1
- HAJIOQHUJLPSAL-UHFFFAOYSA-N tris(2,2,6,6-tetramethylpiperidin-4-yl) benzene-1,3,5-tricarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC(C(=O)OC2CC(C)(C)NC(C)(C)C2)=CC(C(=O)OC2CC(C)(C)NC(C)(C)C2)=C1 HAJIOQHUJLPSAL-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 폴리옥시메틸렌 수지에 솔비탄 페티엑시드 에스테르, 폴리알킬렌글리콜 또는 알킬렌폴리에테르-에스테르 블록 공중합체가 함유된 폴리옥시메틸렌 수지 조성물에 관한 것으로서, 본 조성물은 내후성과 저광성이 요구되는 분야의 성형제품과 고유동 특성이 요구되는 성형품, 예를 들면 스피커 그릴, 공조기 부품, 각종 크립 및 버튼류 등 자동차 내장재, 기계부품, 전기-전자부품, 컴퓨터 등의 사무기기, 또는 건설배관, 잡화 등의 소재로 매우 유용하다. The present invention relates to a polyoxymethylene resin composition in which a polyoxymethylene resin contains a sorbitan pethiex ester, a polyalkylene glycol or an alkylene polyether-ester block copolymer, and the composition is required to have weather resistance and low light resistance. Molded products in the field and molded products requiring high flow characteristics, for example, speaker grills, air conditioner parts, various creep and buttons, automobile interior materials, machinery parts, electrical and electronic parts, office equipment such as computers, construction piping, sundries Very useful as a back material.
Description
본 발명은 폴리옥시메틸렌 수지 조성물에 관한 것으로서, 더욱 상세하게는 빛에 노출이 되어 빛에 대한 색상 안전성과 무광성, 및 유동 특성이 우수하여 복잡하고 경로가 긴 사출물인 자동차용 스피커 그릴에 적용하기에 적합한 스피커 그릴용 폴리옥시메틸렌 수지 조성물에 관한 것이다.The present invention relates to a polyoxymethylene resin composition, and more particularly, it is exposed to light and has excellent color safety and matting, and flow characteristics for light, and is applied to an automobile speaker grill which is a complicated and long path injection product. It relates to a polyoxymethylene resin composition for a speaker grill suitable for.
일반적으로, 폴리옥시메틸렌 수지(이하 "POM 수지"이라 함)는 기계적 강도가 높고, 강성, 내크리프성, 내약품성, 접동성이 우수하다, 이러한 장점으로 인해 자동차 부품. 전기전자기기 부품, 공업 분야에서 대표적인 엔지니어링 수지로 널리 사용되어 왔다. Generally, polyoxymethylene resins (hereinafter referred to as "POM resins") have high mechanical strength and are excellent in rigidity, creep resistance, chemical resistance, and sliding properties. It has been widely used as a representative engineering resin in electric and electronic parts and industrial fields.
그러나 종래의 POM 수지로 성형한 제품을 그대로 장기간 옥외에서 사용할 경우 수지 자체의 내후성의 부족으로 인해 표면색상이 변하고 크랙(crack)이 발생하는 문제가 발생하고 있어 내후성의 개선이 요구된다. 특히 외장품으로 사용될 경우 색상의 변색은 물성의 저하보다도 더 치명적이다. 또한 눈에 쉽게 띄는 외장품의 경우 광택을 억제하여 고급스럽고 중후한 느낌을 주는 효과 및 햇빛의 반사광을 억제하여 육안의 자극을 방지하는 무광택성이 필요하다.However, when a product molded from the conventional POM resin is used outdoors for a long time as it is, there is a problem in that the surface color changes and cracks occur due to the lack of weather resistance of the resin itself, and thus it is required to improve weather resistance. Especially when used as exterior products, discoloration of colors is more fatal than deterioration of physical properties. In addition, in the case of the exterior products that stand out easily, the effect of giving a luxurious and profound feeling by suppressing the gloss and the matteness of preventing the stimulation of the naked eye by suppressing the reflected light of sunlight are necessary.
외장품의 경우 외관이 중요시되며, 외관 장식이 필요하고, 이에 따라 사출시 용융수지의 경로가 길게 된다. 이 경우 수지의 고유동 특성이 요구된다. 그러나 저점도의 수지를 사용할 경우에는 제품의 강도가 현저하게 저하되는 문제가 발생한다. 대표적인 경우가 자동차등에 사용되는 스피커 그릴이다. 저점도의 고유동 수지를 사용할 경우 충격강도가 부족하여 제품이 쉽게 파손되는 경향이 있다. 저점도의 수지가 아닌 중점도의 수지를 이용하여 유동 특성을 향상시키는 것이 필요하다.In the case of the exterior product, the appearance is important, and appearance decoration is required, and thus the path of the molten resin is long during injection. In this case, high flow characteristics of the resin are required. However, when a low viscosity resin is used, there is a problem that the strength of the product is significantly lowered. A typical case is speaker grills used in automobiles. If a low viscosity high flow resin is used, the impact strength is insufficient and the product tends to be easily damaged. It is necessary to improve the flow characteristics by using a resin of mid viscosity rather than a resin of low viscosity.
POM 수지 자체의 저광성을 부여하는 방법은 POM 수지에 아크릴계 다상 인터폴리머(Inter-polymer)를 POM 수지에 첨가하는 방법(일본 특개소 59-136343),-20℃이하의 유리전이 온도를 갖는 고무탄성 그래프트공중합물을 POM 수지에 배합하는 방법이 알려져 있고(일본 특공소 48-32830), 부타디엔기를 갖는 고무탄성 그래프트공중합체를 POM 수지에 첨가하는 방법(일본 특개소 61-120849)이 알려져 있다. 그러나, 상기의 방법들로 얻어진 조성물은 POM 수지의 기계적 물성, 특히 강도와 탄성율이 크게 떨어지고, 성형시 열안정성이 충분하지 않는 문제점이 있다. 그리고 탄산칼슘, 규산칼슘, 크레이, 또는 탈크 등의 무기충전제를 POM 수지와 배합하는 방법(일본 특개소 64-54053)이 공지되어 있다. 그러나 상기 공지된 방법에 사용되는 무기충전제는 그 입자크기가 5㎛이상인 것으로서, POM 수지의 분산성과 무광택성이 현저히 저하되는 문제점이 있다. The method of imparting low light property of the POM resin itself is a method of adding an acrylic polyphase interpolymer to the POM resin (Japanese Patent Laid-Open No. 59-136343), a rubber having a glass transition temperature of -20 ° C or lower. The method of mix | blending an elastic graft copolymer with a POM resin is known (Japanese Unexamined-Japanese-Patent No. 48-32830), and the method of adding the rubber-elastic graft copolymer which has butadiene group to a POM resin (Japanese Unexamined-Japanese-Patent No. 61-120849) is known. However, the composition obtained by the above method has a problem that the mechanical properties, in particular the strength and elastic modulus of the POM resin is greatly reduced, the thermal stability during molding is not sufficient. And a method of blending inorganic fillers such as calcium carbonate, calcium silicate, cray or talc with POM resin (Japanese Patent Laid-Open No. 64-54053) is known. However, the inorganic filler used in the known method is that the particle size is 5㎛ or more, there is a problem that the dispersibility and matte properties of the POM resin is significantly reduced.
POM 수지의 내후성을 향상하기 위해 내후 안정제를 첨가하는 방법은 많이 공 지되었다. 예를 들면, 아크릴계 수지를 POM 수지에 첨가하는 방법(일본 특개평 2-55756)과 카본을 POM수지에 첨가하는 방법(일본 특개소 61-285240)이 있다. 그러나 두 방법 모두 POM 수지의 표면외관과 색상이 나빠지는 문제점이 있고, 내열성이 떨어지는 문제점이 있다. In order to improve the weather resistance of the POM resin, a method of adding a weather stabilizer is well known. For example, there are a method of adding acrylic resin to POM resin (Japanese Patent Laid-Open No. 2-55756) and a method of adding carbon to POM resin (Japanese Patent Laid-Open No. 61-285240). However, both methods have a problem that the surface appearance and color of the POM resin is bad, and there is a problem of poor heat resistance.
적외선흡수제와 입체 장애 아민계 안정제 그리고 지방족 에스테르 등을 혼합하여 POM 수지에 첨가하는 방법(일본 특개소 61-47744, 특공평 4-65862, 특개평 5-48780)도 공지되어 있다. 그러나 상기 공지된 방법으로 제조한 POM 수지는 장기간의 옥외 사용시나 과격한 조건에서는 사용하기 어려운 문제점이 있다. A method of adding an infrared absorber, a hindered amine stabilizer, an aliphatic ester, and the like to a POM resin (Japanese Patent Laid-Open No. 61-47744, Japanese Patent Application Laid-Open No. 4-65862, Japanese Patent Application Laid-Open No. 5-48780) is also known. However, the POM resin prepared by the above known method is difficult to use in long-term outdoor use or in extreme conditions.
따라서, 본 발명은 상기한 선행기술의 제반 문제점을 감안하여 스피커 그릴에 적합한 폴리옥시메틸렌 수지 조성물을 제공하는 것을 기술적 과제로 한다.Accordingly, the present invention is to provide a polyoxymethylene resin composition suitable for a speaker grill in view of the above problems of the prior art as a technical problem.
상기한 과제를 해결하기 위한 본 발명자의 연구에서, POM 수지 조성물이 용융점도 30 ~ 60 g/10분, 보다 바람직하게 40∼50 g/10분, 표면 광택도 20% 이하, 잔류 포름알데히드의 농도가 20 ppm 이하인 경우 스피커 그릴의 소재로 적합하며, 이는 POM 수지에 특정 솔비탄 페티엑시드 에스테르, 트리아진계와 힌더드 페놀계 광안정제, 폴리옥시알킬렌 수지, 입자크기가 5㎛이하인 무기충전제 및 2가의 지방족 알코올을 첨가하여 제조할 수 있다는 사실을 알게 되어 본 발명을 완성하게 된 것이다.
In the present inventor's research for solving the above problems, the POM resin composition has a melt viscosity of 30 to 60 g / 10 minutes, more preferably 40 to 50 g / 10 minutes, surface glossiness of 20% or less, and the concentration of residual formaldehyde. Is less than 20 ppm, it is suitable as a material for speaker grills, which is specific to POM resins, such as sorbitan petiexide esters, triazine- and hindered phenol-based light stabilizers, polyoxyalkylene resins, inorganic fillers having a particle size of 5 μm or less; The present invention has been completed by knowing that it can be prepared by adding an aliphatic alcohol.
그러므로 본 발명에 의하면 폴리옥시메틸렌 수지 조성물에 있어서, (a)폴리옥시메틸렌 수지 100중량부, (b)솔비탄 페티엑시드 에스테르 0.01∼5 중량부, 및 (c)폴리알킬렌글리콜 또는 알킬렌폴리에테르-에스테르 블록 공중합체 0.1∼5.0 중량부, (d)입자크기가 5.0㎛이하인 무기 충전제 1.0~5.0중량부 및 (e)2가의 지방족 알코올 또는 융점 190℃미만의 저융점 폴리아미드 수지 0.01~5.0중량부를 함유하는 것을 특징으로 하는 자동차의 스피커 그릴용 폴리옥시메틸렌 수지 조성물이 제공된다. Therefore, according to the present invention, in the polyoxymethylene resin composition, (a) 100 parts by weight of polyoxymethylene resin, (b) 0.01-5 parts by weight of sorbitan pettiex ester, and (c) polyalkylene glycol or alkylene poly 0.1-5.0 parts by weight of ether-ester block copolymer, (d) 1.0-5.0 parts by weight of inorganic filler having a particle size of 5.0 μm or less, and (e) divalent aliphatic alcohol or low melting point polyamide resin having a melting point of less than 190 ° C. 0.01-5.0 There is provided a polyoxymethylene resin composition for a speaker grill of an automobile, comprising a weight part.
또한 본 발명에 의하면 용융지수 30 ~ 60 g/10분, 보다 바람직하게 40∼50 g/10분, 표면 광택도 20% 이하, 잔류 포름알데히드의 농도가 20 ppm 이하인 것을 특징으로 하는 자동차의 스피커 그릴용 폴리옥시메틸렌 수지 조성물이 제공된다. Further, according to the present invention, an automobile speaker grill, characterized in that the melt index is 30 to 60 g / 10 minutes, more preferably 40 to 50 g / 10 minutes, the surface glossiness is 20% or less, and the residual formaldehyde concentration is 20 ppm or less. A polyoxymethylene resin composition for is provided.
이하, 본 발명을 보다 상세하게 설명하기로 한다. Hereinafter, the present invention will be described in more detail.
본 조성물은 주성분으로 폴리옥시메틸렌 수지와, 필수성분으로 솔비탄 페티엑시드 에스테르 및 폴리알킬렌글리콜 또는 알킬렌폴리에테르-에스테르 블록 공중합체을 함유한다. The composition contains, as a main component, a polyoxymethylene resin and an essential component, a sorbitan petiexide ester and a polyalkylene glycol or an alkylene polyether-ester block copolymer.
본 조성물에 있어서, 주성분이 되는 POM 수지로는 옥시메틸렌 호모폴리머 또는 주쇄가 옥시메틸렌 단위로 되어있는 폴리머 주쇄중 적어도 1종의 탄소수 2∼8개를 가지는 옥시알킬렌단위를 함유하는 옥시메틸렌 코폴리머가 바람직하다. In the present composition, the main component of the POM resin is an oxymethylene homopolymer or an oxymethylene copolymer containing an oxyalkylene unit having at least one C 2 to 8 carbon atoms in a polymer main chain in which the main chain is an oxymethylene unit. Is preferred.
상기 옥시메틸렌 호모폴리머는 말단이 불안장한 히드록시기를 에스테르기 또는 에테르기로 치환하여 안정화시킨 옥시메틸렌 단독중합체가 바람직하다. 특별히 제한하기 위한 것은 아니지만 이러한 옥시메틸렌 호모폴리머는 무수포름알데히드를 유기아민, 유기 또는 무기화합물, 금속수산화물 및 염기성 중합촉매를 함유하는 유 기용매중에 첨가하여 중합하고, 중합체를 세척하고, 초산나트륨의 존재하에 가열하여 말단을 아세틸화시켜 제조할 수 있다. The oxymethylene homopolymer is preferably an oxymethylene homopolymer stabilized by substituting an unstable hydroxy group with an ester group or an ether group. Although not particularly limited, these oxymethylene homopolymers are polymerized by adding anhydrous formaldehyde in an organic solvent containing an organic amine, an organic or inorganic compound, a metal hydroxide and a basic polymerization catalyst, washing the polymer, and It can be prepared by acetylating the ends by heating in the presence.
특별히 제한하기 위한 것은 아니지만 옥시메틸렌 코폴리머는 포름알데히드의 환상올리고머인 트리옥산과 공중합성분인 환상에테르중 적어도 1종을 사이크로헥산 또는 벤젠에 녹이고, 삼불화붕소, 삼불화붕소 수화물 및 삼불화붕소와 산소원자 또는 이붕소 원자를 갖는 유기화합물과의 배위화합물로부터 구성되는 군으로부터 선택되어지는 적어도 1종류 이상의 중합촉매의 존재하에서 괴상중합하고 불안정말단을 분해 제거하여 제조할 수 있다. 여기서, 상기 공중합체인 환상에테르성분은 중합촉매와 예비혼합한 후 셀프크리닝형 교반기에 도입하고, 그리고 중합체에서 촉매활성를 제거하기 위해 실활제를 첨가하고, 불안정한 말단기는 분해 제거하여 중합체를 얻는 것이 바람직하다. Although not particularly limited, the oxymethylene copolymer is obtained by dissolving at least one of cyclic ether copolymerized with trioxane, a formaldehyde cyclic oligomer, in cyclohexane or benzene, and boron trifluoride, boron trifluoride hydrate, and boron trifluoride. And bulk polymerization in the presence of at least one polymerization catalyst selected from the group consisting of a coordination compound with an organic compound having an oxygen atom or a diboron atom. Here, the cyclic ether component, which is the copolymer, is premixed with a polymerization catalyst and then introduced into a self-cleaning stirrer, and a deactivator is added to remove catalytic activity from the polymer, and unstable end groups are decomposed and removed to obtain a polymer. Do.
본 조성물에 있어서, 솔비탄 페티엑시드 에스테르는 시중구입가능하며, 그 한 예로서 미국 테그닉 프로닥트사 제품인 테크루베를 들 수 있다. 본 조성물중 솔비탄 페티엑시드 에스테르의 바람직한 함량은 POM 수지 100중량부에 대하여 0.1∼3 중량부, 보다 바람직하게 0.3∼2중량부이다. 만일 그 함량이 0.1 중량부 보다 적은 경우에는 용융수지의 유동특성의 향상을 기대하기 어렵고, 3중량부를 초과하는 경우에는 개선 효과의 증가가 미미할 뿐 아니라, 성형시 다량의 가스가 발생하여 성형이 어렵고, 제조 비용이 상승되어 경제성이 떨어지는 문제가 있다.In the present composition, the sorbitan petiexide ester is commercially available, and one example thereof is TECHLUBE, available from Tegnik Prodact Corporation of the United States. A preferable content of the sorbitan petiex ester in the present composition is 0.1 to 3 parts by weight, more preferably 0.3 to 2 parts by weight based on 100 parts by weight of the POM resin. If the content is less than 0.1 parts by weight, it is difficult to expect an improvement in the flow characteristics of the molten resin. If the content is more than 3 parts by weight, the improvement of the improvement effect is insignificant. However, there is a problem that the manufacturing cost is increased and economic efficiency is lowered.
본 조성물중 폴리알킬렌글리콜은 성형품 표면에 크랙이 발생하는 것을 방지하는 작용을 하는 것으로서, 본 조성물중 폴리알킬렌글리콜의 바람직한 함량은 POM 수지 100중량부에 대하여 0.1∼5중량부이다. 만일, 그 함량이 0.1중량부 보다 적은 경우에는 첨가 효과가 미미하며, 5중량부를 초과하는 경우에는 물성저하 및 성형시 유해가스 발생 등의 문제가 있다. 본 조성물에 사용하기에 바람직한 폴리알킬렌글리콜은 분자량이 5,000∼50,000인 폴리에틸렌글리콜이다. 폴리에틸렌글리콜의 분자량이 5000 미만인 경우에는 성형후 성형품 표면으로 이행되어 백화현상이 발생할 수 있고, 수분 흡습이 용이하여 수지의 수분 관리가 곤란하고 이로 인해 성형시 다량의 수지 분해가스 발생의 가능성이 높아서 적합하지 못하며, 50000을 초과하는 경우에는 수지의 유동 특성을 저하시키기고, 제조비용이 상승하여 경제적으로 바람직하지 못하다.In the present composition, the polyalkylene glycol serves to prevent cracks on the surface of the molded article, and the preferred content of the polyalkylene glycol in the present composition is 0.1 to 5 parts by weight based on 100 parts by weight of the POM resin. If the content is less than 0.1 parts by weight, the effect of addition is insignificant, and if it exceeds 5 parts by weight, there are problems such as deterioration of physical properties and generation of harmful gases during molding. Preferred polyalkylene glycols for use in the composition are polyethylene glycols having a molecular weight of 5,000 to 50,000. If the molecular weight of polyethylene glycol is less than 5000, it may transfer to the surface of the molded product after molding, which may cause whitening phenomenon, and moisture moisture absorption is easy, so that it is difficult to manage moisture of the resin, which is suitable because of the high possibility of generating a large amount of resin decomposition gas during molding. If it exceeds 50000, the flow characteristics of the resin are lowered, and the manufacturing cost is increased, which is economically undesirable.
또한, 상기 폴리알킬렌글리콜은 성형품 표면에 번쩍거림 현상을 초래함으로 사용에 주의를 요하며, 보다 고기능의 특성을 요구한다면 폴리알킬렌글리콜 대신으로 알킬렌폴리에테르-에스테르 블록 공중합체를 사용하는 것도 가능하다. 상기 알킬렌폴리에테르-에스테르 블록 공중합체는 부틸렌 테레프탈레이트 단위로 구성된 경질 세그먼트(hard segment)와 폴리(에틸렌 옥사이드)테레프탈레이트 단위로 구성된 연질세그먼트(soft segment)를 포함하는 블록 공중합체로서 경질세그먼트를 구성하는 디카복실산 성분은 테레프탈산 단독으로 이루어지나, 70몰%이상의 테레프탈산 단독으로 이루어지거나, 70몰%이상이 테레프탈산과 30몰%이하의 이소프탈산, 프탈산, 나프탈렌-2,6-디카복실산, 디페닐-4,4'-디카복실산 및 3-설폰이소프탈산으로 이루어진 군에서 선택된 1종 또는 2종 이상의 방향족 디카복실산, 옥살산, 숙신산, 아디프산, 아젤리산, 세박산, 도데칸산 및 이량체산으로 이루어진 군에서 선택된 1 종 또는 2종이상의 지환적 디카복실산을 포함한다. 이들 공중합 성분들 중에서 바람직하게 사용되는 것은 이소프탈산, 아디프산, 세박산 및 도데카산이다.In addition, the polyalkylene glycol requires attention to use as it causes a glare phenomenon on the surface of a molded article, and if an alkylene polyether-ester block copolymer is used instead of polyalkylene glycol, if a higher performance characteristic is required, It is possible. The alkylene polyether-ester block copolymer is a block copolymer including a hard segment composed of butylene terephthalate units and a soft segment composed of poly (ethylene oxide) terephthalate units. The dicarboxylic acid component constituting is composed of terephthalic acid alone, but 70 mol% or more of terephthalic acid alone, or more than 70 mol% of terephthalic acid and less than 30 mol% of isophthalic acid, phthalic acid, naphthalene-2,6-dicarboxylic acid, di 1 or 2 or more aromatic dicarboxylic acids, oxalic acid, succinic acid, adipic acid, azelic acid, sebacic acid, dodecanoic acid and dimer acid selected from the group consisting of phenyl-4,4'-dicarboxylic acid and 3-sulfonisophthalic acid It includes one or two or more alicyclic dicarboxylic acid selected from the group consisting of. Among these copolymerization components, preferably used are isophthalic acid, adipic acid, sebacic acid and dodecaic acid.
상기 경질세그멘트를 구성하는 디올 성분은 주로 1,4-부타디올로 구성된다. 즉, 디올 성분은 1,4-부타디올 단독으로 이루어지거나, 50%몰 이상의 1,4-부타디올과 50몰%이하의 에틸렌글리콜, 디에틸렌 글리콜, 프로필렌 글리콜, 1,6-헥사디올, 1,10-데카디옥, 1,4-디하이드록시메틸 사이클로헥산, 비스(4-하이드록시에특시페닐)메탄 및 네오펜틸 글리콜로 이루어진 군에서 선택된 1종 또는 2종이상의 공중합 성분을 포함한다.The diol component constituting the hard segment is mainly composed of 1,4-butadiol. That is, the diol component consists of 1,4-butadiol alone or 50% or more of 1,4-butadiol and 50 mol% or less of ethylene glycol, diethylene glycol, propylene glycol, 1,6-hexadiol, 1 And one or two or more copolymer components selected from the group consisting of, 10-decadidio, 1,4-dihydroxymethyl cyclohexane, bis (4-hydroxyethoxyphenyl) methane and neopentyl glycol.
상기 연질 세그먼트를 구성하는 디카복실산 성분은 주로 테레프탈산으로 구성된다. 경질 세그먼트의 디카복실산 성분처럼 연질 세그먼트의 디카복실산 성분은 테레프탈산 단독으로 이루어지거나, 테레프탈산 70몰%이상과 공중합성분으로서 디카르복실산을 30몰%이하 포함한다. 공중합 성분으로서는 경질 세그먼트에 대하여 위에서 예시한 바와 같은 디카복실산을 언급 할 수 있다.The dicarboxylic acid component constituting the soft segment mainly consists of terephthalic acid. Like the dicarboxylic acid component of the hard segment, the dicarboxylic acid component of the soft segment is composed of terephthalic acid alone, or contains 70 mol% or more of terephthalic acid and 30 mol% or less of dicarboxylic acid as a copolymerization component. As the copolymerization component, mention may be made of dicarboxylic acids as exemplified above for the hard segments.
상기 연질 세그먼트인 폴리(에틸렌 옥사이드)테레프탈레이트 단위를 구성하는 폴리(에틸렌 옥사이드)글리콜로서는 수평균분자량이 800∼20,000인 폴리(에틸렌 옥사이드)글리콜을 사용한다. 수평균분자량이 5,000∼15,000인 폴리(에틸렌 옥사이드)글리콜이 바람직하며, POM 수지와의 상용성의 견지에서 수평균 분자량이 8,000∼10,000인 것을 사용하는 것이 더욱 좋다. 만일 수평균 분자량이 800보다 작으면 표면크랙방지 효과가 작고 수평균 분자량이 20,000보다 크면 경질 세그먼트의 부틸 테레프탈레이트 단위와의 상용성이 불량해서 균질한 폴리에테르-에스테르 블록 공 중합체를 제조할 수 없다.As the poly (ethylene oxide) glycol constituting the poly (ethylene oxide) terephthalate unit as the soft segment, poly (ethylene oxide) glycol having a number average molecular weight of 800 to 20,000 is used. Poly (ethylene oxide) glycols having a number average molecular weight of 5,000 to 15,000 are preferable, and those having a number average molecular weight of 8,000 to 10,000 are more preferable in view of compatibility with the POM resin. If the number average molecular weight is less than 800, the surface crack prevention effect is small, and if the number average molecular weight is greater than 20,000, compatibility with the butyl terephthalate unit of the hard segment is poor and a homogeneous polyether-ester block copolymer cannot be produced. .
폴리에테르-에스테르 블록 공중합체에 있어서, 주로 부틸렌 테레프탈레이트 단위로 구성된 경질 세그먼트와 주로 폴리(에틸렌 옥사이드) 테레프탈레이트 단위로 구성된 연질 세그먼트[폴리(에틸렌 옥사이드)카복실레이트 단위]간의 바람직한 조성비는, 폴리(에틸렌 옥사이드) 카복실레이트 단위의 함량이 40∼85중량%, 보다 바람직하게 70∼85중량% 비율이다. 폴리(에틸렌 옥사이드) 카복실레이트 단위의 함량이 85중량%보다 큰 경우에는 폴리에테르-에스테르 블록 공중합체가 중합되기 어렵고 조성물의 기계적 강도가 저하되는 문제가 있다.In the polyether-ester block copolymer, a preferred composition ratio between the hard segment mainly composed of butylene terephthalate units and the soft segment mainly composed of poly (ethylene oxide) terephthalate units is selected from poly (poly (ethylene oxide) carboxylate unit). The content of the (ethylene oxide) carboxylate units is 40 to 85% by weight, more preferably 70 to 85% by weight. When the content of the poly (ethylene oxide) carboxylate unit is greater than 85% by weight, the polyether-ester block copolymer is difficult to polymerize and the mechanical strength of the composition is lowered.
상기 폴리에테르-에스테르 블록 공중합체를 제조하는 방법은 특별히 중요하지 않으며, 폴리에테르-에스테르 블록 공중합체는 공지의 통상적인 방법으로 제조할 수 있다. 예를 들면, 폴리에테르-에스테르 블록 공중합체는 테레프탈산(또는 디메틸 테레프탈레이트)(a) 및 1,4-부탄디올(b) 폴리(에틸렌 옥사이드)글리콜(c)을 정류탑이 구비된 반응용기에 넣고 대기압 또는 상승된 압력하에 에스테르화 반응 또는 에스테르 교환 반응을 수행한 다음 대기압 또는 감압하에 중합시키는 방법에 따라 제조할 수 있다. 또한, 폴리에테르-에스테르 블록 공중합체는 테레프탈산(또는 디메틸 테레프탈레이트)(a) 및 1,4-부탄디올(b) 폴리(에틸렌 옥사이드)글리콜The method for producing the polyether-ester block copolymer is not particularly important, and the polyether-ester block copolymer can be produced by a known conventional method. For example, a polyether-ester block copolymer may contain terephthalic acid (or dimethyl terephthalate) (a) and 1,4-butanediol (b) poly (ethylene oxide) glycol (c) in a reaction vessel equipped with a rectification column. It can be prepared according to the method of carrying out the esterification reaction or the transesterification reaction under atmospheric pressure or elevated pressure and then polymerizing under atmospheric pressure or reduced pressure. In addition, the polyether-ester block copolymers include terephthalic acid (or dimethyl terephthalate) (a) and 1,4-butanediol (b) poly (ethylene oxide) glycol
(c)을 올리고머에 가한 다음 대기압 또는 감압하에 중합시키는 방법에 따라 제조할 수 있다.(c) may be added to the oligomer followed by polymerization under atmospheric or reduced pressure.
본 조성물에는 선택성분으로서 무기충전제와, 벤조트리아진계 및/또는 입체장애아민계 광안정제, 2가의 지방족 알코올를 함유시킬 수도 있다. The present composition may contain, as an optional component, an inorganic filler, a benzotriazine-based and / or hindered amine-based light stabilizer, and a divalent aliphatic alcohol.
바람직한 무기충전제는 입자크기가 5㎛이하인 탈크, 크레이, 마이카, 월라스트라이트, 아스베스토스, 글라스 비드 등으로 이루어진 군에서 선택된 1종 또는 2종이상이며, 특히 일부 또는 전체 무기충전제 표면에 아미노 실란 커플링제를 처리한 것을 사용하는 것이 바람직하다. 이들 무기 충전제 중에서 탈크와 크레이는 POM수지에 첨가할 경우 표면 무광성이 우수하므로 특히 바람직하다. 본 조성물중 무기 충전제의 바람직한 함량은 POM 수지 100중량부에 대하여 1∼5중량부, 보다 바람직하게 2∼4중량부이다. 만일 그 함량이 1중량부 보다 적으면 저광택성이 부족하며, 5중량부를 초과할 경우에는 기계적강도, 특히 충격강도가 저하되는 문제가 있다.Preferred inorganic fillers are one or two or more selected from the group consisting of talc, cray, mica, wallastrite, asbestos, glass beads, etc. having a particle size of 5 μm or less, and in particular, amino silane coupling agents on the surface of some or all of the inorganic fillers. It is preferable to use the thing treated. Of these inorganic fillers, talc and cray are particularly preferred since they are excellent in surface matting when added to POM resin. Preferable content of the inorganic filler in this composition is 1-5 weight part with respect to 100 weight part of POM resin, More preferably, it is 2-4 weight part. If the content is less than 1 part by weight, low glossiness is insufficient, and if it exceeds 5 parts by weight, there is a problem that the mechanical strength, particularly impact strength is lowered.
광안정제(E)로는 2-[2-히드록시-3,5-비스(α,α-디메틸벤질)페닐]벤조트리아질, 2-(3,5-디부틸-2-히드로시페닐)벤조트리아질, 2-(4,6-디페닐-1,3,5-트리아진-2-일)-5-[(헥실)옥시]-페놀, 2-(2-히드록시-벤조트리아졸-2-일)-4,6-비스 (1-에틸-1-페닐에틸)페놀과 같은 벤조트리아진계 광안정제; 4-아세톡시-2,2,6,6-테트라메틸피페리딘,4-스테아로일옥시-2,2,6,6-테트라메틸피페리딘, 4-아크릴로일옥시-2,2,As light stabilizer (E), 2- [2-hydroxy-3,5-bis (α, α-dimethylbenzyl) phenyl] benzotriazyl, 2- (3,5-dibutyl-2-hydrophenyl) benzo Triazyl, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[(hexyl) oxy] -phenol, 2- (2-hydroxy-benzotriazole- Benzotriazine-based light stabilizers such as 2-yl) -4,6-bis (1-ethyl-1-phenylethyl) phenol; 4-acetoxy-2,2,6,6-tetramethylpiperidine, 4-stearoyloxy-2,2,6,6-tetramethylpiperidine, 4-acryloyloxy-2,2 ,
6,6-테트라메틸피페리딘, 4-메톡시-2,2,6,6- 테트라메틸피페리딘, 4-벤조일옥시-2,2,6,6-테트라메틸피페리딘, 4-시클로헥시옥시- 2,2,6,6-티트라메틸피페리딘, 4-페녹시-2,2,6,6-테틀라메틸피페리딘,4-벤질옥시-2,2,6,6-테트라메틸피페리딘,4-(페6,6-tetramethylpiperidine, 4-methoxy-2,2,6,6-tetramethylpiperidine, 4-benzoyloxy-2,2,6,6-tetramethylpiperidine, 4- Cyclohexoxyoxy-2,2,6,6-titramethylpiperidine, 4-phenoxy-2,2,6,6-tetramethylpiperidine, 4-benzyloxy-2,2,6 , 6-tetramethylpiperidine, 4- (pe
닐카르바모이옥시)-2,2,6,6-테트라메틸피페리딘,비스(2,2,6,6-테트라메틸-4-피페리딜)옥살레이트,비스(2,2,6,6-테트라메틸-4-피페리딜)말로네이트,비스(2,2,6,6,-테트라메틸-4-피페리딜)아디페이트,비스(2,2,6,6-테트라메틸-4-피페리딜)세바케이트, 비스(1,2,2,6,6-펜타메틸-피페리딜)세바케이트,비스(2,2,6,6-테트라메틸-4-피페리딜)테레프탈레이트,1,2-비스(2,2,6,6-테트라메틸-4-피페리딜옥시)에탄, 비스(2,2,Nylcarbamooxy) -2,2,6,6-tetramethylpiperidine, bis (2,2,6,6-tetramethyl-4-piperidyl) oxalate, bis (2,2,6 , 6-tetramethyl-4-piperidyl) malonate, bis (2,2,6,6, -tetramethyl-4-piperidyl) adipate, bis (2,2,6,6-tetramethyl 4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-piperidyl) sebacate, bis (2,2,6,6-tetramethyl-4-piperidyl Terephthalate, 1,2-bis (2,2,6,6-tetramethyl-4-piperidyloxy) ethane, bis (2,2,
6,6-테트라메틸-4-피페리딜)헥사메틸렌-1,6-디카르바메이트, 비스(1-미틸- 2,2,6,6,6-tetramethyl-4-piperidyl) hexamethylene-1,6-dicarbamate, bis (1-mityl-2,2,6,
6-테트라메틸-4-피페리딜)아디페이트,트리스(2,2,6,6-테트라메틸-4-피페리딜)벤젠-1,3,5-트리카르복실레이트, 펜타에리트리틸-테트라키스[3-(3,5-디-t-부틸-4-히드록시페닐) 프로피오네이트], 트리에틸렌 글리콜-비스[3-(3-t-부틸-5-메틸-4-히드록시페닐) 프로피오네이트], 3,9-비스[1,1-디메틸-2-β-(3-t-부틸-4-부틸-4-히드록시- 5-메틸페닐)프로피오닐옥시 에틸]-2, 4, 8, 10-테트라옥사스피로 [5,5]운데칸-1, 3, 5-트리스(4-t-부틸-3-히드록시-2,6-디메틸벤질) 이소시아누르산, 폴리[(6-모르폴리노-S-트리아진-2,4-딜)[2,2,6,6-테트라메틸-4-피페리딜]이미노]-헥사메틸렌[(2,2,6,6-테트라메틸-4-피페리딜)이미노], 비스(2,2,6,6-테트라메틸-4-피페리딜)세바케이트와 같은 입체장애 아민계 광안정제가 바람직하다. 상기한 광안정제들은 단독으로 사용할 수도 있고 2종 이상 혼합하여 사용할 수도 있으나, 벤조트리아진계 광안정제와 입체장애 아민계 광안정제를 혼용하는 것이 바람직하다. 6-tetramethyl-4-piperidyl) adipate, tris (2,2,6,6-tetramethyl-4-piperidyl) benzene-1,3,5-tricarboxylate, pentaerythritol -Tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], triethylene glycol-bis [3- (3-t-butyl-5-methyl-4-hydroxy Hydroxyphenyl) propionate], 3,9-bis [1,1-dimethyl-2-β- (3-t-butyl-4-butyl-4-hydroxy-5methylphenyl) propionyloxy ethyl]- 2, 4, 8, 10-tetraoxaspiro [5,5] undecane-1, 3, 5-tris (4-t-butyl-3-hydroxy-2,6-dimethylbenzyl) isocyanuric acid, Poly [(6-morpholino-S-triazine-2,4-dil) [2,2,6,6-tetramethyl-4-piperidyl] imino] -hexamethylene [(2,2, 6,6-tetramethyl-4-piperidyl) imino] and bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate are preferably hindered amine light stabilizers. The above light stabilizers may be used alone or in combination of two or more, but it is preferable to use a benzotriazine light stabilizer and a hindered amine light stabilizer.
본 조성물중 광안정제의 바람직한 첨가량은 POM 수지 100중량부에 대하여 0.01∼5중량부, 보다 바람직하게 0.05∼3중량부이다. 만일, 그 함량이 0.01중량부보다 적을 경우에는 얻은 조성물의 광안정성이 떨어지고, 5중량부보다 많을 경우에는 POM 수지의 표면에 백분상으로 석출되는 문제가 발생된다.The addition amount of the light stabilizer in the present composition is preferably 0.01 to 5 parts by weight, more preferably 0.05 to 3 parts by weight based on 100 parts by weight of the POM resin. If the content is less than 0.01 part by weight, the light stability of the obtained composition is inferior, and when more than 5 parts by weight, a problem occurs that precipitates in the form of powder on the surface of the POM resin.
2가의 지방족 알코올은 POM 수지의 열노화에 의해 발생하는 포름알데히드와 반응하여 이로부터 유발되는 2차 분해를 방지해 줄 뿐만 아니라 가공시 발생하는 포름알데히드를 반응으로 제거하여 성형품내의 포름알데히드의 함량을 낮춰줌으로 이로 유발되는 냄새를 줄일 목적으로 사용된다. 상기한 2가 지방산 알코올의 예로는 글리세릴 모노 스테아레이트 또는 펜타에리스톨 페티엑시드 에스테르와 같은 2가의 지방산 알코올이 있다. 또한 2가의 지방산 알코올 대신에 융점 190℃ 미만의 저융점의 폴리아미드 코폴리머를 사용할 수도 있다. The dihydric aliphatic alcohol reacts with formaldehyde generated by thermal aging of the POM resin to prevent secondary decomposition caused from it, and also removes formaldehyde produced during the reaction by reacting to reduce the content of formaldehyde in the molded article. It is used to reduce the odor caused by lowering. Examples of the dihydric fatty acid alcohols mentioned above include dihydric fatty acid alcohols such as glyceryl mono stearate or pentaerythritol fetiside ester. It is also possible to use low melting point polyamide copolymers having a melting point of less than 190 ° C. instead of divalent fatty alcohols.
본 조성물중 2가 지방족 알코올의 바람직한 함량은 POM 수지 100중량부에 대하여 0.01∼5.0중량부이다. 만일, 그 함량이 0.01중량부 보다 적은 경우에는 첨가 효과가 비비하고, 5중량부를 초과할 경우에는 물성저하가 심하며 가스가 발생하는 등 그 특성상 문제가 될 뿐 만 아니라 경제적인 면에서도 바람직하지 못하다.The preferable content of the dihydric aliphatic alcohol in this composition is 0.01-5.0 weight part with respect to 100 weight part of POM resin. If the content is less than 0.01 parts by weight, the addition effect is inferior, and if it exceeds 5 parts by weight, the physical properties are severely deteriorated and gas is generated.
또한 본 조성물에는 본 발명의 목적을 해치지 않는 범위에서 당 분야에 잘 알려진 통상의 첨가제를 배합할 수 있음은 물론이다. In addition, the present composition may be blended with conventional additives well known in the art within a range that does not impair the object of the present invention.
이상 설명한 본 발명의 조성물은 수지의 용융지수는 30 ~ 60 g/10분, 특히 40∼50 g/10분 수준으로 스피커 그릴을 제조하는데 큰 문제가 없고, 본 수지로 성형한 성형품의 표면 광택도는 바람직하게 20% 이하이다. 최근에 자동차의 내부 부품이 정교함에 따라 대부분의 내부부품의 감촉을 개선하기 위해 새틴-엠보스형(satin-embossed) 가공 또는 가죽 그레인(leather grain)을 얻도록 엠보스된다. 그러므로 엠보스된 표면은 POM 수지 표면을 완화시킴으로써 현저하게 광택이 더 저하 할 수 있다. 또한 최근 여러 자동차 회사에서 내장재로 채택하기 위해서는 성형품중 잔류 포름알데히드가 냄새등을 유발하므로 이의 평가를 실시하고 있다. 냄새와 관련한 평가는 통상 여러 사람이 후각을 이용한 평가를 실시하는 데 본 발명에서는 이러한 방법이 아닌 잔류 포름알데히드량을 적게 함으로 냄새를 없앨 수 있다는데 착안하여 잔류 포름알데히드량을 평가하였다. 성형품 및 성형 과정에서 포름알데히드의 냄새를 느끼지 않기 위해서는 여러 평가 결과 20 ppm 이하가 되어야 함을 알 수 있었고, 이로 성형품중 잔류 포름알데히드의 농도가 20 ppm 이하의 수지 조성물을 제조할 수 있었다.The composition of the present invention described above has no major problem in producing a speaker grill at a melt index of 30 to 60 g / 10 minutes, particularly 40 to 50 g / 10 minutes, and the surface glossiness of molded articles molded from the resin. Is preferably 20% or less. Recently, as the internal parts of automobiles are refined, they are embossed to obtain satin-embossed processing or leather grain to improve the feel of most internal parts. Therefore, the embossed surface can remarkably lower the gloss by alleviating the surface of the POM resin. In addition, recently, various automobile companies have been evaluating the residual formaldehyde in the molded product because it causes odors. The evaluation related to the odor is usually performed by many people using the sense of smell. In the present invention, the amount of residual formaldehyde was evaluated by focusing on the fact that the amount of residual formaldehyde can be eliminated by reducing the amount of residual formaldehyde. In order to avoid the smell of formaldehyde in the molded article and the molding process, it was found that the evaluation result should be 20 ppm or less, thereby producing a resin composition having a concentration of 20 ppm or less in the molded article.
이상 설명한 바와 같은 본 발명의 특징 및 기타의 장점은 후술되는 실시예로부터 보다 명백하게 될 것이다. 단, 본 발명이 하기 실시예에 한정되는 것은 아니다.Features and other advantages of the present invention as described above will become more apparent from the following examples. However, the present invention is not limited to the following examples.
본 발명에 의해 제조된 POM 수지 조성물의 평가 방법은 다음과 같다.The evaluation method of the POM resin composition manufactured by this invention is as follows.
* 성형: 60톤의 사출능력이 있는 사출 성형기를 사용하여, 실린더 온도가 190℃, 금형 온도가 80℃, 성형사이클을 20초로 설정하고, ASTM 덤벨시험편 및 80×80×3㎜두께의 사각판을 사출 성형하였다.* Molding: Using an injection molding machine with an injection capacity of 60 tons, the cylinder temperature is set to 190 ° C, the mold temperature is 80 ° C, the molding cycle is set to 20 seconds, ASTM dumbbell test piece and a square plate of 80 × 80 × 3 mm thickness. Was injection molded.
* 내후시험: 웨더-오-메터(Wheater-O-meter)에 위 방법으로 사출 성형한 ASTM 시험편을 넣고, 89℃, 무우(無雨) 조건에서 1000시간 처리 후 색상을 측정하였고, 크랙 발생 유무를 24시간 간격으로 육안 관찰하였다. * Weathering test: ASTM test specimen injection-molded in the above method in a weather-O-meter, and after 1000 hours treatment at 89 ℃, radish conditions, the color was measured, there was no crack Was visually observed at 24 hour intervals.
* 색조: 훼이드-오-메터(Fade-O-meter) 처리 후 표면색상을 미놀타사의 칼라측정기(Chroma Meter CR-200)를 사용하여 ΔE값으로 표시하였다.* Hue: The surface color after Fade-O-meter treatment was expressed as ΔE value using Minolta's Chroma Meter CR-200.
ΔE = (ΔL2+Δa2+Δb2)1/2 ΔE = (ΔL2 + Δa2 + Δb2) 1/2
(ΔL:밝기 변화폭, Δa:적색 변화폭, Δb:황색 변화폭) (ΔL: change in brightness, Δa: change in red, Δb: change in yellow)
* 표면외관의 광택도 시험: JIS K7105의 광택도 측정방법에 따라서 위 방법으로 사출성형한 80×80×3㎜두께의 사각시험판을 디지탈 광학계로 45°-45°반사에서 광택도를 측정하였다.* Glossiness test of surface appearance: According to the method of measuring glossiness of JIS K7105, glossiness was measured at 45 ° -45 ° reflection with a 80 × 80 × 3 mm thick rectangular test plate injected by the above method with a digital optical system.
* 용융지수: 제조된 수지를 85℃에서 4시간 건조 후 ASTM측정법에 의거하여 평가함* Melt index: The prepared resin was dried at 85 ° C. for 4 hours and evaluated according to ASTM measurement.
* FA 함량: 성형시편내의 잔존하는 포름알데히드(FA)량으로서 성형품을 밀폐 용기에서 140℃오븐에 30분간 방치 후 가스크로마토그래피로 포름알데히드량을 정량함.* FA content: As the amount of formaldehyde (FA) remaining in the molded specimens, the molded product is left in a closed container for 30 minutes in a 140 ℃ oven and the amount of formaldehyde is quantified by gas chromatography.
* 크랙발생 : 1000시간동안 표면크랙발생여부를 관찰. 1000시간의 평가 시간 내에서는 표면 크랙 발생하지 않은 경우 "◎"로 표시.* Crack occurrence: Observe surface crack occurrence for 1000 hours. "◎" is displayed when no surface crack occurs within the evaluation time of 1000 hours.
[실시예 및 비교예][Examples and Comparative Examples]
저점도 POM수지(용융지수 27 g/10분인 Kocetal K700을 사용함: 주식회사KTP 제품)를 80℃에서 진공으로 4시간 건조한후 광안정제, 크랙방지제로서 폴리알킬렌글리콜, 유동성증진제로서 소르비탄 페티엑시드 에스테르, 포름알데하이드와 반응물로서 2가의 지방산 알코올과 블랜딩 한 후 트윈스크류 압출기의 1차 투입구로 투입하고, 무기 충전제를 2차 투입구로 투입한다. 트윈 스크류 압출기를 이용해 190℃의 온도에서 충분히 용융 혼련한다. 이것을 다이를 통하여 스파게티로 토출 한 후 냉각하여 펠렛타이저(Pelletizer)를 이용해 절단하여 칩 상태로 만든다. 이와 같이 하여 얻은 수지 조성물을 잘 건조한 후 190℃에서 각종 물성 측정용 시편을 사출성형하고 기계적물성 및 내후성을 평가하였다. 상기와 같이 제조한 실시예 및 비교예의 폴리옥시메틸렌 수지 조성물의 조성(POM수지 100중량부 기준)은 표 1에 제시되고, 평가 결과는 표 2에 제시된다.After drying the low-viscosity POM resin (using Kocetal K700 with a melt index of 27 g / 10 min: KTP Co., Ltd.) at 80 ° C. for 4 hours under vacuum, polyalkylene glycol as a light stabilizer, crack inhibitor, and sorbitan petiexide ester as a fluid enhancer After blending with dihydric fatty acid alcohol as formaldehyde and reactant, it is added to the first inlet of the twin screw extruder, and the inorganic filler is added to the second inlet. Fully melt kneaded at a temperature of 190 ° C. using a twin screw extruder. This is discharged to the spaghetti through the die, cooled, cut with a pelletizer and cut into chips. After drying the resin composition thus obtained well, various physical properties test specimens were injection molded at 190 ° C., and mechanical properties and weather resistance were evaluated. The compositions (based on 100 parts by weight of POM resin) of the polyoxymethylene resin compositions of Examples and Comparative Examples prepared as described above are shown in Table 1, and the evaluation results are shown in Table 2.
* 광안정제* Light stabilizer
E-1 : 2-(4,6-디페닐-1,3,5-트리아진-2-일)-5-[(헥실)옥시]-페놀 E-1: 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[(hexyl) oxy] -phenol
E-2 : 비스(2,2,6,6-테트라메틸-4-피페리딜)세바케이트 E-2: bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate
* 무기충전제* Inorganic filler
D-1 : 평균입자크기가 4 마이크로인 탈크 D-1: Talc with an average particle size of 4 microns
D-2 : 평균입자크기가 4 마이크로인 크레이 D-2: Cray with an average particle size of 4 microns
* 포름알데히드 반응물* Formaldehyde reactant
F-1 : 글리세릴 모노 지방산 에스테르 (식 1) F-1: Glyceryl Mono Fatty Acid Ester (Formula 1)
F-2 : 펜타에리스톨 지방산 에스테르 (식 2) F-2: pentaerythritol fatty acid ester (formula 2)
* 크랙 방지제는 분자량이 10,000인 폴리 알킬렌 글리콜을 사용함.* Anti-crack agents use polyalkylene glycols with a molecular weight of 10,000.
이상 상술한 바와 같이, 본 발명에 의해 얻어진 POM수지 조성물은 내후성과 저광성이 요구되는 분야의 성형제품과 고유동 특성이 요구되는 성형품, 예를 들면 스피커 그릴, 공조기 부품 등 자동차 내장재, 기계부품, 전기-전자부품, 컴퓨터 등의 사무기기, 또는 건설배관, 잡화 등의 소재로 매우 유용하다. As described above, the POM resin composition obtained by the present invention is a molded product in a field where weatherability and low light resistance are required and a molded product requiring high flow characteristics, for example, an automobile interior material such as a speaker grill, an air conditioner part, a mechanical part, It is very useful as a material for office equipment such as electric-electronic parts, computers, or construction piping, miscellaneous goods.
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KR20020088059A KR100553396B1 (en) | 2002-12-31 | 2002-12-31 | Polyoxymethylene Resin Composition for Speaker Grille of Automobile |
AU2003289582A AU2003289582A1 (en) | 2002-12-31 | 2003-12-30 | Polyoxymethylene resin composition for speaker grille |
PCT/KR2003/002913 WO2004058885A1 (en) | 2002-12-31 | 2003-12-30 | Polyoxymethylene resin composition for speaker grille |
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JP3024802B2 (en) * | 1991-02-04 | 2000-03-27 | ポリプラスチックス株式会社 | Polyacetal resin coloring composition |
JPH1160893A (en) * | 1997-08-21 | 1999-03-05 | Polyplastics Co | Polyoxymethylene composition |
WO1999043751A1 (en) * | 1998-02-24 | 1999-09-02 | Asahi Kasei Kogyo Kabushiki Kaisya | Polyoxymethylene resin composition |
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