KR100545821B1 - 고결정성 금속분말, 그 제조방법, 상기 금속분말을 포함하는 도체페이스트 및 도체페이스트를 사용한 세라믹적층 전자부품 - Google Patents
고결정성 금속분말, 그 제조방법, 상기 금속분말을 포함하는 도체페이스트 및 도체페이스트를 사용한 세라믹적층 전자부품 Download PDFInfo
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- KR100545821B1 KR100545821B1 KR1020030063021A KR20030063021A KR100545821B1 KR 100545821 B1 KR100545821 B1 KR 100545821B1 KR 1020030063021 A KR1020030063021 A KR 1020030063021A KR 20030063021 A KR20030063021 A KR 20030063021A KR 100545821 B1 KR100545821 B1 KR 100545821B1
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- South Korea
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- powder
- raw material
- metal powder
- metal
- material powder
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- Expired - Lifetime
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- 239000000843 powder Substances 0.000 title claims abstract description 204
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 86
- 239000002184 metal Substances 0.000 title claims abstract description 81
- 239000004020 conductor Substances 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000919 ceramic Substances 0.000 title claims description 14
- 239000002245 particle Substances 0.000 claims abstract description 69
- 238000000034 method Methods 0.000 claims abstract description 37
- 238000006243 chemical reaction Methods 0.000 claims abstract description 30
- 239000012159 carrier gas Substances 0.000 claims abstract description 29
- 239000007789 gas Substances 0.000 claims abstract description 28
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims description 62
- 239000000956 alloy Substances 0.000 claims description 20
- 229910045601 alloy Inorganic materials 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 14
- 238000009826 distribution Methods 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 239000012071 phase Substances 0.000 description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 13
- 239000006185 dispersion Substances 0.000 description 13
- 239000013078 crystal Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 9
- 229910000510 noble metal Inorganic materials 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 238000005245 sintering Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 7
- -1 oxides Chemical class 0.000 description 7
- 238000000197 pyrolysis Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 230000002776 aggregation Effects 0.000 description 4
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 230000007847 structural defect Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000003746 solid phase reaction Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000005118 spray pyrolysis Methods 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004581 coalescence Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000036651 mood Effects 0.000 description 1
- 229940078487 nickel acetate tetrahydrate Drugs 0.000 description 1
- OINIXPNQKAZCRL-UHFFFAOYSA-L nickel(2+);diacetate;tetrahydrate Chemical compound O.O.O.O.[Ni+2].CC([O-])=O.CC([O-])=O OINIXPNQKAZCRL-UHFFFAOYSA-L 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Ceramic Capacitors (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
Claims (11)
- 열분해성 금속화합물 분말의 1종 이상으로 이루어지는 원료분말을, 캐리어가스와 함께, 캐리어가스의 단위시간당 유량을 V(L/min), 노즐의 개구부(開口部)의 단면적을 S(cm2)로 하였을 때, V/S > 600의 조건으로 노즐을 통해서 반응용기중에 분출시키고; 해당 원료분말을 10g/L 이하의 농도로 기상중에 분산시킨 상태에서, 해당 원료분말의 분해온도보다 높고, 또한 해당금속의 융점을 Tm(℃)으로 하였을 때 (Tm-200)℃ 이상인 온도로 가열함으로써 금속분말을 생성시키는 것을 포함하여 이루어지는 고결정성 금속분말의 제조방법.
- 제 1 항에 있어서, 원료분말을 노즐을 통해서 반응용기내에 분출시키기 전에, 분산기를 사용하여 캐리어가스중에 혼합, 분산시키는 것을 특징으로 하는 고결정성 금속분말의 제조방법.
- 제 1 항에 있어서, 원료분말의 입자도가 미리 조정된 것을 특징으로 하는 고결정성 금속분말의 제조방법.
- 제 1 항에 있어서, 원료분말이 2종 이상의 금속원소를 포함하는 금속화합물의 복합분말이고, 금속분말이 합금분말인 것을 특징으로 하는 고결정성 금속분말의 제조방법.
- 합금분말을 구성하는 2종 이상의 금속원소를 개개의 입자내에 일정한 조성비로 포함하는 원료분말을 제조하는 공정; 해당 원료분말을 포집하는 공정; 포집된 해당 원료분말을 캐리어가스로 분산시키는 공정; 해당 원료분말을 분산시킨 캐리어가스를, 캐리어가스의 단위시간당 유량을 V(L/min), 노즐의 개구부(開口部)의 단면적을 S(cm2)로 하였을 때, V/S > 600의 조건으로 노즐을 통해서 반응용기중에 분출시키는 공정; 및 해당 원료분말을 반응용기내에서 10g/L 이하의 농도로 기상중에 분산시킨 상태에서, 해당 원료분말의 분해온도보다 높고, 또한 생성되는 합금의 융점을 Tm(℃)으로 하였을 때 (Tm-200)℃ 이상인 온도로 가열함으로써 합금분말을 생성시키는 공정을 포함하여 이루어지는 고결정성 금속분말의 제조방법.
- 제 1 항에 기재된 방법으로 제조된 고결정성 금속분말로서, 레이저식의 입도분포계에 의한 중량기준의 입도분포 측정에서, 50%지름 D50에 대한 99.9%지름 D99.9의 비인 D99.9/D50가 3.0 이하인 것을 특징으로 하는 고결정성 금속분말.
- 제 5 항에 기재된 방법으로 제조된 고결정성 금속분말로서, 레이저식의 입도분포계에 의한 중량기준의 입도분포 측정에서, 50%지름 D50에 대한 99.9%지름 D99.9의 비인 D99.9/D50가 3.0 이하인 것을 특징으로 하는 고결정성 금속분말.
- 제 6 항에 기재된 고결정성 금속분말을 포함하는 도체페이스트.
- 제 7 항에 기재된 고결정성 금속분말을 포함하는 도체페이스트.
- 제 8 항에 기재된 도체페이스트를 사용하여 도체층을 형성한 것을 특징으로 하는 세라믹적층 전자부품.
- 제 9 항에 기재된 도체페이스트를 사용하여 도체층을 형성한 것을 특징으로 하는 세라믹적층 전자부품.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2002-00264750 | 2002-09-10 | ||
JP2002264750A JP3812523B2 (ja) | 2002-09-10 | 2002-09-10 | 金属粉末の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040023767A KR20040023767A (ko) | 2004-03-18 |
KR100545821B1 true KR100545821B1 (ko) | 2006-01-24 |
Family
ID=31884763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030063021A Expired - Lifetime KR100545821B1 (ko) | 2002-09-10 | 2003-09-09 | 고결정성 금속분말, 그 제조방법, 상기 금속분말을 포함하는 도체페이스트 및 도체페이스트를 사용한 세라믹적층 전자부품 |
Country Status (11)
Country | Link |
---|---|
US (1) | US7066980B2 (ko) |
EP (1) | EP1398101B1 (ko) |
JP (1) | JP3812523B2 (ko) |
KR (1) | KR100545821B1 (ko) |
CN (1) | CN100425377C (ko) |
AT (1) | ATE337123T1 (ko) |
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- 2003-09-05 AT AT03019654T patent/ATE337123T1/de active
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Also Published As
Publication number | Publication date |
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EP1398101B1 (en) | 2006-08-23 |
ATE337123T1 (de) | 2006-09-15 |
EP1398101A3 (en) | 2005-03-09 |
JP2004099992A (ja) | 2004-04-02 |
KR20040023767A (ko) | 2004-03-18 |
CN100425377C (zh) | 2008-10-15 |
CN1494966A (zh) | 2004-05-12 |
TW200404631A (en) | 2004-04-01 |
MY140451A (en) | 2009-12-31 |
CA2437781C (en) | 2007-12-04 |
US7066980B2 (en) | 2006-06-27 |
SG125920A1 (en) | 2006-10-30 |
CA2437781A1 (en) | 2004-03-10 |
TWI284576B (en) | 2007-08-01 |
US20040055418A1 (en) | 2004-03-25 |
EP1398101A2 (en) | 2004-03-17 |
DE60307753T2 (de) | 2007-09-13 |
DE60307753D1 (de) | 2006-10-05 |
JP3812523B2 (ja) | 2006-08-23 |
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