KR100535726B1 - Backup Apparatus of Work Environment Setting Data in Surface Mount Device - Google Patents
Backup Apparatus of Work Environment Setting Data in Surface Mount Device Download PDFInfo
- Publication number
- KR100535726B1 KR100535726B1 KR10-2001-0014713A KR20010014713A KR100535726B1 KR 100535726 B1 KR100535726 B1 KR 100535726B1 KR 20010014713 A KR20010014713 A KR 20010014713A KR 100535726 B1 KR100535726 B1 KR 100535726B1
- Authority
- KR
- South Korea
- Prior art keywords
- environment setting
- setting data
- work environment
- control device
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
본 발명은 표면실장장치의 작업환경설정데이터의 백업장치에 관한 것으로, 입력된 작업환경설정데이터에 따라 X-Y갠트리(10)에 설치된 헤드유니트(20)를 X-Y축 방향으로 이동을 제어하여 인쇄회로기판 이송장치(40) 및 부품공급장치(50)를 통해 각각 공급된 인쇄회로기판(PCB)에 부품(P)을 실장하는 것을 제어하고 부품(P)의 실장시 흡착 및 실장상태를 제1비젼장치(30) 및 제2비젼장치(60)를 통해 수신받아 흡착 및 실장오류를 판단하여 표시함과 아울러 설정된 작업환경설정데이터와 독출신호를 출력하는 제어장치(110)와, 제어장치(110)로부터 출력되는 작업환경설정데이터를 수신받아 순차적으로 저장하고 제어장치(110)로부터 독출신호가 수신되면 저장된 작업환경설정데이터를 제어장치(110)로 전송하는 백업부(120)로 구성하여, 작업환경설정으로 인해 발생될 수 있는 표면실장장치의 오동작 원인을 용이하게 찾을 수 있도록 함에 있다. The present invention relates to a backup device of the work environment setting data of the surface mount apparatus, and controls the movement of the head unit 20 installed in the XY gantry 10 in the XY axis direction according to the input work environment setting data. The first vision device controls the mounting of the component P on the printed circuit board PCB supplied through the transfer device 40 and the component supply device 50, and the adsorption and mounting state when the component P is mounted. The control device 110 and the control device 110 which receive the received through the second vision device 60 and determine and display the adsorption and mounting error, and output the set working environment setting data and the read signal. Receives the work environment setting data outputted from the storage device sequentially and receives a read signal from the control device 110 is configured as a backup unit 120 for transmitting the stored work environment setting data to the control device 110, work environment Caused by the settings It is to make it easy to find the cause of the malfunction of the surface mount device.
Description
본 발명은 표면실장장치의 작업환경설정데이터의 백업장치에 관한 것으로, 특히 표면실장장치를 이용하여 인쇄회로기판에 부품을 실장하기 전에 설정되는 표면실장장치의 작업환경설정데이터를 작업환경설정마다 순차적으로 저장하여 보관할 수 있는 표면실장장치의 작업환경설정데이터의 백업(backup)장치에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backup device of the work environment setting data of a surface mount apparatus, and in particular, the work environment setting data of a surface mount apparatus set before mounting components on a printed circuit board using the surface mount apparatus is sequentially set for each work environment setup. The present invention relates to a backup device for working environment setting data of a surface mount device that can be stored and stored.
표면실장장치는 부품을 고속 및 정밀하게 인쇄회로기판에 실장하기 위해 사용된다. 인쇄회로기판에 부품을 고속 및 정밀하게 실장하기 위한 표면실장장치를 첨부된 도면을 이용하여 설명하면 다음과 같다. Surface mount devices are used to mount components on printed circuit boards at high speed and precision. The surface mounting apparatus for mounting components on a printed circuit board at high speed and precision will be described with reference to the accompanying drawings.
도 1은 종래의 표면실장장치의 사시도이다. 도시된 바와 같이, 표면실장장치는 크게 X-Y 갠트리(10), 복수개의 헤드유니트(20), 제1비젼장치(30), 인쇄회로기판 이송장치(40), 부품공급장치(50), 제2비젼장치(60), 노즐교체장치(70) 및 제어장치(80)로 구성된다. 1 is a perspective view of a conventional surface mounting apparatus. As shown, the surface mounting apparatus is largely XY gantry 10, a plurality of head unit 20, the first vision device 30, the printed circuit board transfer device 40, the component supply device 50, the second It is composed of a vision device 60, a nozzle replacement device 70 and a control device 80.
X-Y 갠트리(10)는 베이스프레임(1)에서 화살표 Y와 같이 Y축방향으로 평행하게 복수개의 Y축갠트리(11)가 설치되며, 화살표 X와 같이 X축방향으로 향하도록 평행하게 복수개의 X축갠트리(12)가 설치된다. 복수개의 X축갠트리(12)는 Y축갠트리(11)에 의해 안내되어 Y축 방향으로 이동되도록 Y축갠트리(11) 상에 설치된다. X축갠트리(12)를 X-Y방향으로 이동시키기 위해 다수개의 영구자석(10a)과 전기자코일(10b)로 구성되는 선형전동기(10a,10b)가 적용되며 X축갠트리(12)의 Y축 이동영역을 감지하기 위해 Y축갠트리(11)에 리미트센서(13)가 적용된다. 여기서, Y축갠트리(11)와 X축갠트리(12)는 선형전동기(10a,10b) 외에 볼스크류(ball screw)나 타이밍벨트(도시 않음) 등이 적용될 수 있다. The XY gantry 10 is provided with a plurality of Y-axis gantry 11 in parallel in the Y-axis direction as shown by arrow Y in the base frame 1, a plurality of X-axis in parallel to face in the X-axis direction as shown by arrow X The gantry 12 is installed. The plurality of X-axis gantry 12 is guided by the Y-axis gantry 11 is installed on the Y-axis gantry 11 to move in the Y-axis direction. In order to move the X-axis gantry 12 in the XY direction, linear motors 10a and 10b composed of a plurality of permanent magnets 10a and the electric coil 10b are applied, and the Y-axis movement region of the X-axis gantry 12 is applied. In order to detect the limit sensor 13 is applied to the Y-axis gantry (11). Here, in addition to the linear motors 10a and 10b, the Y-axis gantry 11 and the X-axis gantry 12 may be applied with a ball screw or a timing belt (not shown).
Y축갠트리(11)에 안내되어 Y축방향으로 이동되는 복수개의 X축갠트리(12)에 각각 복수개의 헤드유니트(20)가 설치되고, 각각의 복수개의 헤드유니트(20)는 X-Y갠트리(10)에 의해 화살표 Y 및 X방향으로 이동하여 부품공급장치(50)로부터 공급되는 부품(P)을 집어 인쇄회로기판(PCB)에 실장한다. 부품(P)이 실장되는 인쇄회로기판(PCB)은 인쇄회로기판 이송장치(40)에 의해 이송되며, 인쇄회로기판 이송장치(40)는 인쇄회로기판(PCB)을 이송하고 이송 위치를 감지하기 위해 회전전동기(41) 및 위치감지센서(42)가 설치된다. A plurality of head units 20 are respectively installed in the plurality of X-axis gantry 12 guided to the Y-axis gantry 11 and moved in the Y-axis direction, and each of the plurality of head units 20 is an XY gantry 10. ), The component P supplied from the component supply device 50 is picked up and mounted on the printed circuit board PCB. The printed circuit board (PCB) on which the component (P) is mounted is transported by the printed circuit board transport device 40, and the printed circuit board transport device 40 transports the printed circuit board (PCB) and detects a transport position. In order to rotate the motor 41 and the position sensor 42 is installed.
회전전동기(41)와 위치감지센서(42)가 설치된 인쇄회로기판 이송장치(40)에 의해 인쇄회로기판(PCB)이 부품실장작업위치로 이송되면 복수개의 헤드유니트(20)는 노즐(21)을 화살표 Z방향과 같이 수직 운동을 하여 부품공급장치(50)로부터 공급되는 부품(P)을 집어 인쇄회로기판(PCB)에 실장하게 된다. 부품공급장치(50)로부터 공급되는 부품(P)을 노즐(21)이 정확하게 흡착하였는지 여부는 제1비젼장치(30)에서 감지하며, 정확하게 노즐(21)이 부품(P)을 흡착하면 인쇄회로기판(PCB)에 부품을 실장하게 된다. When the printed circuit board (PCB) is transferred to the component mounting work position by the printed circuit board transfer device 40 provided with the rotary motor 41 and the position sensor 42, the plurality of head units 20 are nozzles 21. In the vertical movement as shown by the arrow Z direction to pick up the component (P) supplied from the component supply device 50 is mounted on a printed circuit board (PCB). The first vision device 30 detects whether the nozzle 21 correctly adsorbs the component P supplied from the component supply device 50, and when the nozzle 21 adsorbs the component P accurately, the printed circuit The component is mounted on the substrate PCB.
인쇄회로기판(PCB)에 실장된 부품(P)의 오류는 헤드유니트(20)의 측면에 설치되어 헤드유니트(20)와 함께 이동되는 제2비젼장치(60)에 의해 감지하며, 부품(P)의 크기에 따라 노즐(21)을 교체하는 경우에는 노즐교체장치(70)가 사용된다. 노즐(21)을 교체하거나 부품(P)을 실장오류를 판단 및 헤드유니트(20)의 X-Y방향 이동을 제어하기 위해 제어장치(80)가 사용된다. The error of the component P mounted on the printed circuit board PCB is detected by the second vision device 60 installed on the side of the head unit 20 and moved together with the head unit 20. In the case of replacing the nozzle 21 according to the size of the nozzle replacement apparatus 70 is used. The controller 80 is used to replace the nozzle 21 or to determine the mounting error of the component P and to control the X-Y direction movement of the head unit 20.
제어장치(80)는 표면실장장치를 전반적으로 제어하며, 키보드(81)를 통해 입력된 작업환경데이터를 메인제어기(82)에서 수신받아 드라이브회로부(83)를 통해 X-Y갠트리(10), 헤드유니트(20), 제2비젼장치(60), 인쇄회로기판 이송장치(40) 및 부품공급장치(50)를 제어하여 부품(P)을 인쇄회로기판(PCB)에 실장하고, 그 결과를 A/D 변환기(84)를 통해 디지털로 변환된 감지신호를 수신받아 부품실장작업의 오류여부를 감지하며 그 결과를 표시부(85)를 통해 표시하여 작업을 진행하게 된다. The controller 80 controls the surface mounting apparatus as a whole, and receives the work environment data input through the keyboard 81 from the main controller 82, the XY gantry 10 and the head unit through the drive circuit unit 83. (20), the second vision device (60), the printed circuit board transfer device (40) and the component supply device (50) are controlled to mount the component (P) on the printed circuit board (PCB), and the result is A /. Receiving a digitally detected detection signal through the D converter 84 detects whether the component mounting operation is an error, and displays the result through the display unit 85 to proceed with the operation.
이와 같이 표면실장장치를 이용하여 인쇄회로기판에 부품을 실장하는 작업을 진행하는 경우에 부품의 종류나 인쇄회로기판의 종류에 따라 표면실장장치를 구동시키기 위한 작업환경설정을 변경하게 된다. 작업환경설정을 변경하는 경우에 사용자가 이전에 입력한 작업환경설정데이터는 사용자의 새로운 작업환경설정에 의해 지워져 삭제된다. 이와같이 작업환경설정으로 인해 표면실장장치에서 오동작이 발생되는 경우에 그 오동작 원인을 찾기 어려운 문제점이 있다. As described above, when the component is mounted on the printed circuit board using the surface mount apparatus, the work environment setting for driving the surface mount apparatus is changed according to the type of component or the type of the printed circuit board. When changing the work environment setting, the work environment setting data previously entered by the user is deleted and deleted by the user's new work environment setting. As such, when a malfunction occurs in the surface mount apparatus due to the work environment setting, there is a problem that it is difficult to find the cause of the malfunction.
본 발명의 목적은 표면실장장치에 설정된 작업환경설정데이터를 작업환경설정마다 순차적으로 저장하여 보관하여 작업환경설정으로 인해 표면실장장치가 오동작되는 경우에 오동작 발생 원인을 용이하게 찾을 수 있도록 한 표면실장장치의 작업환경설정데이터의 백업장치를 제공함에 있다.An object of the present invention is to store and store the work environment setting data set in the surface mounting apparatus for each work environment setting sequentially so that the surface mounting device can easily find the cause of the malfunction when the surface mounting device malfunctions due to the work environment setting The present invention provides a backup device for working environment setting data of a device.
본 발명의 표면실장장치의 작업환경설정데이터의 백업장치는 입력된 작업환경설정데이터에 따라 X-Y갠트리에 설치된 헤드유니트를 X-Y축 방향으로 이동을 제어하여 인쇄회로기판 이송장치 및 부품공급장치를 통해 각각 공급된 인쇄회로기판에 부품을 실장하는 것을 제어하고 부품의 실장시 흡착 및 실장오류 여부를 제1비젼장치 및 제2비젼장치를 통해 수신받아 흡착 및 실장오류를 판단하여 표시함과 아울러 설정된 작업환경설정데이터와 독출신호를 출력하는 제어장치와, 제어장치로부터 출력되는 작업환경설정데이터를 수신받아 순차적으로 저장하고 제어장치로부터 독출신호가 수신되면 저장된 작업환경설정데이터를 제어장치로 전송하는 백업부로 구비됨을 특징으로 한다.The backup device of the work environment setting data of the surface mount apparatus of the present invention controls the movement of the head unit installed in the XY gantry in the XY axis direction according to the input work environment setting data, respectively, through the printed circuit board transfer device and the component supply device. Controls the mounting of components on the supplied printed circuit board, receives adsorption and mounting errors during the mounting of components through the first vision device and the second vision device, determines and displays the adsorption and mounting errors, and sets the working environment. The control unit outputs the setting data and the read signal, and receives the work environment setting data outputted from the control device and stores them sequentially, and when the read signal is received from the control device, the backup unit transmits the stored work environment setting data to the control device. Characterized in that it is provided.
(실시예)(Example)
이하, 본 발명을 첨부된 도면을 이용하여 설명하면 다음과 같다.Hereinafter, the present invention will be described with reference to the accompanying drawings.
도 2는 본 발명에 의한 작업환경설정데이터의 백업장치가 구비된 표면실장장치의 사시도이고, 도 3은 도 2에 도시된 백업장치의 구성을 상세히 나타낸 블럭도이다. FIG. 2 is a perspective view of a surface mount apparatus equipped with a backup apparatus for working environment setting data according to the present invention, and FIG. 3 is a detailed block diagram illustrating the configuration of the backup apparatus illustrated in FIG.
도시된 바와 같이, 본 발명에 의한 작업환경설정데이터의 백업장치는 입력된 작업환경설정데이터에 따라 X-Y갠트리(10)에 설치된 헤드유니트(20)를 X-Y축 방향으로 이동을 제어하여 인쇄회로기판 이송장치(40) 및 부품공급장치(50)를 통해 각각 공급된 인쇄회로기판(PCB)에 부품(P)을 실장하는 것을 제어하고 부품(P)의 실장시 흡착 및 실장상태를 제1비젼장치(30) 및 제2비젼장치(60)를 통해 수신받아 흡착 및 실장오류를 판단하여 표시함과 아울러 설정된 작업환경설정데이터와 독출신호를 출력하는 제어장치(110)와, 제어장치(110)로부터 출력되는 작업환경설정데이터를 수신받아 순차적으로 저장하고 제어장치(110)로부터 독출신호가 수신되면 저장된 작업환경설정데이터를 제어장치(110)로 전송하는 백업부(120)로 구성된다. As shown, the backup device of the work environment setting data according to the present invention transfers the printed circuit board by controlling the movement of the head unit 20 installed in the XY gantry 10 in the XY axis direction according to the input work environment setting data. Controls the mounting of the component P on the printed circuit board PCB supplied through the device 40 and the component supply device 50, respectively, and displays the adsorption and mounting state when the component P is mounted. 30) and the control device 110 which receives the received through the second vision device 60 and determines and displays the adsorption and mounting error, and outputs the set working environment setting data and the read signal from the control device 110. Receiving and outputting the work environment setting data in sequence, and receives a read signal from the control device 110 is composed of a backup unit 120 for transmitting the stored work environment setting data to the control device (110).
본 발명의 구성 및 작용을 보다 상세히 설명하면 다음과 같다. Referring to the configuration and operation of the present invention in more detail as follows.
본 발명에 의한 표면실장장치는 X-Y 갠트리(10), 복수개의 헤드유니트(20), 제1비젼장치(30), 인쇄회로기판 이송장치(40), 부품공급장치(50), 제2비젼장치(60), 노즐교체장치(70), 제어장치(110) 및 백업부(120)로 구성된다. Surface mounting apparatus according to the present invention is the XY gantry 10, a plurality of head unit 20, the first vision device 30, the printed circuit board transfer device 40, the component supply device 50, the second vision device 60, the nozzle replacement device 70, the control device 110, and the backup unit 120.
X-Y 갠트리(10)는 Y축갠트리(11)와 X축갠트리(12)가 베이스프레임(1)에서 화살표 Y 및 X와 같은 방향으로 각각 설치되어 X축갠트리(12)가 Y축갠트리(11)에 의해 안내되어 Y축 방향으로 이동된다. X축갠트리(12)와 헤드유니트(20)를 X-Y방향으로 이동시키기 위해 다수개의 영구자석(10a)과 전기자코일(10b)로 구성되는 선형전동기(10a,10b)가 적용되며 X축갠트리(12)의 Y축 이동영역을 감지하기 위해 Y축갠트리(11)에 리미트센서(13)가 적용된다. 여기서, Y축갠트리(11)와 X축갠트리(12)는 선형전동기(10a,10b) 외에 볼스크류(ball screw)나 타이밍벨트(도시 않음) 등이 적용될 수 있다. In the XY gantry 10, the Y-axis gantry 11 and the X-axis gantry 12 are installed in the same direction as the arrows Y and X in the base frame 1, so that the X-axis gantry 12 is the Y-axis gantry 11. Guided and moved in the Y-axis direction. In order to move the X-axis gantry 12 and the head unit 20 in the XY direction, linear motors 10a and 10b consisting of a plurality of permanent magnets 10a and electric coils 10b are applied and the X-axis gantry 12 The limit sensor 13 is applied to the Y-axis gantry 11 to detect the Y-axis moving area of the. Here, in addition to the linear motors 10a and 10b, the Y-axis gantry 11 and the X-axis gantry 12 may be applied with a ball screw or a timing belt (not shown).
Y축갠트리(11)에 안내되어 Y축방향으로 이동되는 복수개의 X축갠트리(12)에 각각 복수개의 헤드유니트(20)가 설치되고, 각각의 복수개의 헤드유니트(20)는 X-Y갠트리(10)에 의해 화살표 Y 및 X방향으로 이동하여 부품공급장치(50)로부터 공급되는 부품(P)을 집어 인쇄회로기판(PCB)에 실장한다. 부품(P)이 실장되는 인쇄회로기판(PCB)은 인쇄회로기판 이송장치(40)에 의해 이송되며, 인쇄회로기판 이송장치(40)는 인쇄회로기판(PCB)을 이송하고 이송 위치를 감지하기 위해 회전전동기(41) 및 위치감지센서(42)가 설치된다. A plurality of head units 20 are respectively installed in the plurality of X-axis gantry 12 guided to the Y-axis gantry 11 and moved in the Y-axis direction, and each of the plurality of head units 20 is an XY gantry 10. ), The component P supplied from the component supply device 50 is picked up and mounted on the printed circuit board PCB. The printed circuit board (PCB) on which the component (P) is mounted is transported by the printed circuit board transport device 40, and the printed circuit board transport device 40 transports the printed circuit board (PCB) and detects a transport position. In order to rotate the motor 41 and the position sensor 42 is installed.
회전전동기(41)와 위치감지센서(42)가 설치된 인쇄회로기판 이송장치(40)에 의해 인쇄회로기판(PCB)이 부품실장작업위치로 이송되면 복수개의 헤드유니트(20)는 노즐(21)을 화살표 Z방향과 같이 수직 운동을 하여 부품공급장치(50)로부터 공급되는 부품(P)을 집어 인쇄회로기판(PCB)에 실장하게 된다. 부품공급장치(50)로부터 공급되는 부품(P)을 노즐(21)이 정확하게 흡착하였는지 여부는 제1비젼장치(30)에서 감지하며, 정확하게 노즐(21)이 부품(P)을 흡착하면 인쇄회로기판(PCB)에 부품을 실장하게 된다. When the printed circuit board (PCB) is transferred to the component mounting work position by the printed circuit board transfer device 40 provided with the rotary motor 41 and the position sensor 42, the plurality of head units 20 are nozzles 21. In the vertical movement as shown by the arrow Z direction to pick up the component (P) supplied from the component supply device 50 is mounted on a printed circuit board (PCB). The first vision device 30 detects whether the nozzle 21 correctly adsorbs the component P supplied from the component supply device 50, and when the nozzle 21 adsorbs the component P accurately, the printed circuit The component is mounted on the substrate PCB.
인쇄회로기판(PCB)에 실장된 부품(P)의 오류는 헤드유니트(20)의 측면에 설치되어 헤드유니트(20)와 함께 이동되는 제2비젼장치(60)에 의해 감지하며, 부품(P)의 크기에 따라 노즐(21)을 교체하는 경우에는 노즐교체장치(70)가 사용된다. 노즐(21)을 교체하거나 부품(P)을 실장오류를 판단 및 헤드유니트(20)의 X-Y방향 이동을 제어하기 위해 제어장치(110)가 사용된다. The error of the component P mounted on the printed circuit board PCB is detected by the second vision device 60 installed on the side of the head unit 20 and moved together with the head unit 20. In the case of replacing the nozzle 21 according to the size of the nozzle replacement apparatus 70 is used. The controller 110 is used to replace the nozzle 21 or to determine the mounting error of the component P and to control the X-Y direction movement of the head unit 20.
제어장치(110)는 전술한 바와 같이 표면실장치를 구동시켜 인쇄회로기판(PCB)에 부품(P)을 실장하기 위해 인쇄회로기판(PCB)의 종류, 부품(P)의 종류 내지는 작업조건에 따라 작업환경설정데이터를 수신받게 된다. 작업환경설정데이터는 키보드(111)를 통해 사용자가 입력하며, 키보드(111)를 통해 입력된 작업환경설정데이터는 메인제어기(112)에 저장된다. 제어장치(110)의 메인제어기(112)는 작업환경설정데이터가 수신되면 설정된 작업환경에 따라 드라이브회로부(113)를 통해 표면실장장치를 전반적으로 제어하여 구동하게 된다. As described above, the controller 110 drives the surface seal device to mount the component P on the printed circuit board PCB according to the type of the printed circuit board PCB, the type of the component P, or the working conditions. Receive work environment setting data. The work environment setting data is input by the user through the keyboard 111, and the work environment setting data input through the keyboard 111 is stored in the main controller 112. When the work environment setting data is received, the main controller 112 of the control device 110 controls and drives the surface mounting apparatus as a whole through the drive circuit unit 113 according to the set work environment.
제어장치(110)의 메인제어기(112)는 드라이브회로부(113)를 통해 X-Y갠트리(10)에 설치된 헤드유니트(20)를 X-Y축 방향으로 이동을 제어하여 선형전동기(10a,10b)를 제어하고, 인쇄회로기판 이송장치(40) 및 부품공급장치(50)를 통해 각각 공급된 인쇄회로기판(PCB)에 부품(P)을 실장하기 위해 회전전동기(41)를 제어하고 부품(P)의 실장시 흡착 및 실장상태를 제1비젼장치(30) 및 제2비젼장치(60)를 통해 수신받아 흡착 및 실장오류를 판단하여 표시부(115)를 통해 현재 작업상태나 오류 등을 표시하게 된다. 메인제어기(112)는 또한, 제1비젼장치(30), 제2비젼장치(60), 리미트센서(13) 및 위치감지센서(42)로부터 감지되는 감지신호를 A/D변환부(114)에서 디지털신호로 변환시켜 수신받아 전반적으로 부품실장작업 상태를 감지하게 된다. The main controller 112 of the control unit 110 controls the linear motors 10a and 10b by controlling the movement of the head unit 20 installed in the XY gantry 10 in the XY axis direction through the drive circuit unit 113. In order to mount the component P on the printed circuit board PCB supplied through the printed circuit board transfer device 40 and the component supply device 50, the rotary motor 41 is controlled and the component P is mounted. When the adsorption and mounting conditions are received through the first vision device 30 and the second vision device 60, the adsorption and mounting errors are determined, and the display unit 115 displays a current working state or an error. The main controller 112 also outputs a detection signal detected from the first vision device 30, the second vision device 60, the limit sensor 13, and the position sensor 42 to the A / D converter 114. It converts the digital signal into a digital signal and receives the overall mounting status.
부품실장작업 상태를 전반적으로 제어하는 제어장치(120)는 부품실장작업 전에 저장된 작업환경설정데이터를 출력하거나 작업환경설정데이터가 필요한 경우에 사용자의 선택이 있으면 독출신호를 발생하여 출력하게 된다. 제어장치(110)의 메인제어기(112)로부터 출력되는 작업환경설정데이터와 독출신호를 백업부(120)에서 전송받는다. 백업부(120)는 메인제어기(112)로부터 작업환경설정데이터가 전송되면 전송된 작업환경설정데이터를 순차적으로 저장하고 메인제어기(112)로부터 독출신호가 수신되면 저장된 작업환경설정데이터를 제어장치(110)의 메인제어기(112)로 전송한다.The control device 120 for controlling the overall state of the component mounting operation outputs the work environment setting data stored before the component mounting operation or if a user's selection is required when the work environment setting data is required, it generates and outputs a read signal. The backup environment 120 receives the work environment setting data and the read signal output from the main controller 112 of the control device 110. The backup unit 120 sequentially stores the transmitted work environment setting data when the work environment setting data is transmitted from the main controller 112, and stores the stored work environment setting data when the read signal is received from the main controller 112. 110 to the main controller 112.
메인제어기(112)로 순차적으로 저장된 작업환경설정데이터를 전송하는 백업부(120)는 보조제어기(121)와, 저장부(122)로 구성된다. 보조제어기(121)는 제어장치(110)의 메인제어기(112)로부터 출력되는 작업환경설정데이터와 독출신호를 각각 전송받아 작업환경설정데이터의 전송시 전송된 작업환경설정데이터를 출력하고 독출신호가 수신되면 제어장치(110)로 저장된 작업환결정데이터의 출력을 제어한다. 보조제어기(121)로부터 출력되는 작업환결설정데이터는 저장부(112)에서 순차적으로 수신받아 저장하고 저장부(112)에 저장된 작업환경설정데이터는 보조제어기(121)의 제어에 의해 제어장치(110)로 재전송되어 표시부(115)에 표시하여 작업환경설정으로 인한 표면실장장치의 오동작 원인을 용이하게 찾을 수 있게 된다. The backup unit 120 which sequentially transmits the work environment setting data stored to the main controller 112 includes an auxiliary controller 121 and a storage unit 122. The auxiliary controller 121 receives the work environment setting data and the read signal output from the main controller 112 of the control device 110, respectively, and outputs the work environment setting data transmitted when the work environment setting data is transmitted and reads out. When a call is received, the control device 110 controls the output of the work conversion decision data. The work setting data output from the auxiliary controller 121 is sequentially received and stored in the storage unit 112, and the work environment setting data stored in the storage unit 112 is controlled by the auxiliary controller 121. By re-transmitting) is displayed on the display unit 115 it is possible to easily find the cause of the malfunction of the surface mount device due to the work environment setting.
이상과 같이 표면실장장치에 설정된 작업환경설정데이터를 작업환경설정마다 순차적으로 백업부를 이용하여 저장하여 보관함으로써 표면실장장치에서 오동작이 발생되는 경우에 작업환경설정으로 인해 발생될 수 있는 표면실장장치의 오동작 원인을 용이하게 찾을 수 있게 된다. As described above, by storing and storing the work environment setting data set in the surface mounting apparatus using the backup unit in sequence for each work environment setting, the surface mounting apparatus may be generated due to the work environment setting when a malfunction occurs in the surface mounting apparatus. It is easy to find the cause of the malfunction.
이상에서 설명한 바와 같이 본 발명은 표면실장장치에 설정된 작업환경설정데이터를 작업환경설정마다 순차적으로 백업부를 이용하여 저장하여 보관함으로써 표면실장장치에서 오동작이 발생되는 경우에 작업환경설정으로 인해 발생될 수 있는 표면실장장치의 오동작 원인을 용이하게 찾을 수 있는 효과를 제공한다. As described above, the present invention may be generated due to the work environment setting when a malfunction occurs in the surface mount apparatus by storing and storing the work environment setting data set in the surface mount apparatus sequentially using the backup unit for each work environment setting. It provides an effect that can easily find the cause of the malfunction of the surface-mounting device.
도 1은 종래의 표면실장장치의 사시도, 1 is a perspective view of a conventional surface mounting apparatus,
도 2는 본 발명에 의한 작업환경설정데이터의 백업장치가 구비된 표면실장장치의 사시도,2 is a perspective view of a surface mounting apparatus equipped with a backup apparatus for working environment setting data according to the present invention;
도 3은 도 2에 도시된 백업장치의 구성을 상세히 나타낸 블럭도이다. <도면의 주요 부분에 대한 부호 설명>3 is a block diagram showing in detail the configuration of the backup apparatus shown in FIG. <Description of the symbols for the main parts of the drawings>
10: X-Y갠트리 20: 헤드유니트 10: X-Y Gantry 20: Head Unit
30: 제1비젼장치 40: 인쇄회로기판 이송장치 30: first vision device 40: printed circuit board transfer device
50: 부품공급장치 60: 제2비젼장치 50: parts supply device 60: second vision device
70: 노즐교체장치 110: 제어장치 70: nozzle replacement device 110: controller
120: 백업부120: backup unit
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0014713A KR100535726B1 (en) | 2001-03-21 | 2001-03-21 | Backup Apparatus of Work Environment Setting Data in Surface Mount Device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0014713A KR100535726B1 (en) | 2001-03-21 | 2001-03-21 | Backup Apparatus of Work Environment Setting Data in Surface Mount Device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020074753A KR20020074753A (en) | 2002-10-04 |
| KR100535726B1 true KR100535726B1 (en) | 2005-12-09 |
Family
ID=27698196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2001-0014713A Expired - Fee Related KR100535726B1 (en) | 2001-03-21 | 2001-03-21 | Backup Apparatus of Work Environment Setting Data in Surface Mount Device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100535726B1 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980074880A (en) * | 1997-03-27 | 1998-11-05 | 배순훈 | Auto Assignment of Parts in Parts Feeder of Parts Inserter |
-
2001
- 2001-03-21 KR KR10-2001-0014713A patent/KR100535726B1/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980074880A (en) * | 1997-03-27 | 1998-11-05 | 배순훈 | Auto Assignment of Parts in Parts Feeder of Parts Inserter |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020074753A (en) | 2002-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101411256B (en) | Mounting head and electronic component mounting equipment | |
| EP2059111B1 (en) | Mounting apparatus | |
| US5336935A (en) | Electronic parts mounting apparatus | |
| US6943521B2 (en) | Motor drive, motor drive control method, and component attaching device | |
| US6466841B2 (en) | Apparatus and method for determining a reference position for an industrial robot | |
| US6788989B2 (en) | Electric-circuit board assembling line, electric-circuit board producing method and electric-circuit board assembling line controlling program | |
| KR100535726B1 (en) | Backup Apparatus of Work Environment Setting Data in Surface Mount Device | |
| KR100445530B1 (en) | Semiconductor Device | |
| JP2004319662A (en) | Electronic part mounting apparatus and its assembly, or peripheral device | |
| KR100402178B1 (en) | Tilt Correcting System of Gantry for Surface Mounting Device | |
| JP2010003728A (en) | Surface mounting device | |
| KR100402177B1 (en) | Tilt Correcting System of Gantry for Surface Mounting Device | |
| KR20000038348A (en) | Chucking device for modular devices with gap adjustment | |
| JP4498896B2 (en) | Surface mount machine | |
| KR100402179B1 (en) | Tilt Correcting System of Dual Gantries | |
| KR20020081738A (en) | Separation Operating System of Head Unit and Vision Camera forSurface Mount Device | |
| KR100322964B1 (en) | Parts Supplying System of Surface Mounting Device | |
| JP4537233B2 (en) | Image recognition apparatus and surface mounter | |
| JP4805084B2 (en) | Imaging control apparatus and surface mounter | |
| JP2005243668A (en) | Component mounting method and apparatus | |
| KR100307252B1 (en) | Automatic Nozzle Offset Controlling Apparatus of Surface Mount System | |
| JP6103846B2 (en) | Sensor monitoring device | |
| KR200262970Y1 (en) | Mounting Head of Surface Mounting Device | |
| KR100406058B1 (en) | Pickup Center Sensing Method of a Tape Feeder | |
| KR0174964B1 (en) | How to change the designated suction nozzle in chip mounter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20010321 |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20021213 Patent event code: PE09021S01D |
|
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20030830 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20021213 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
Patent event date: 20030929 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20030830 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20050720 Appeal identifier: 2003101003857 Request date: 20030929 |
|
| AMND | Amendment | ||
| PB0901 | Examination by re-examination before a trial |
Comment text: Amendment to Specification, etc. Patent event date: 20031027 Patent event code: PB09011R02I Comment text: Request for Trial against Decision on Refusal Patent event date: 20030929 Patent event code: PB09011R01I Comment text: Amendment to Specification, etc. Patent event date: 20030212 Patent event code: PB09011R02I |
|
| B601 | Maintenance of original decision after re-examination before a trial | ||
| PB0601 | Maintenance of original decision after re-examination before a trial |
Comment text: Report of Result of Re-examination before a Trial Patent event code: PB06011S01D Patent event date: 20031204 |
|
| J301 | Trial decision |
Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20030929 Effective date: 20050720 |
|
| PJ1301 | Trial decision |
Patent event code: PJ13011S01D Patent event date: 20050721 Comment text: Trial Decision on Objection to Decision on Refusal Appeal kind category: Appeal against decision to decline refusal Request date: 20030929 Decision date: 20050720 Appeal identifier: 2003101003857 |
|
| PS0901 | Examination by remand of revocation | ||
| S901 | Examination by remand of revocation | ||
| GRNO | Decision to grant (after opposition) | ||
| PS0701 | Decision of registration after remand of revocation |
Patent event date: 20050909 Patent event code: PS07012S01D Comment text: Decision to Grant Registration Patent event date: 20050809 Patent event code: PS07011S01I Comment text: Notice of Trial Decision (Remand of Revocation) |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20051205 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20051206 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
Payment date: 20081204 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20081204 Start annual number: 4 End annual number: 4 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |