KR100479929B1 - Soundproofing board for construction and the method thereof - Google Patents
Soundproofing board for construction and the method thereof Download PDFInfo
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- KR100479929B1 KR100479929B1 KR10-2002-0018496A KR20020018496A KR100479929B1 KR 100479929 B1 KR100479929 B1 KR 100479929B1 KR 20020018496 A KR20020018496 A KR 20020018496A KR 100479929 B1 KR100479929 B1 KR 100479929B1
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- 238000010276 construction Methods 0.000 title description 6
- 238000000034 method Methods 0.000 title description 5
- 239000002699 waste material Substances 0.000 claims abstract description 49
- 229920000642 polymer Polymers 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims description 10
- 239000002861 polymer material Substances 0.000 abstract description 21
- -1 polyethylene vinyl acetate Polymers 0.000 abstract description 19
- 238000009413 insulation Methods 0.000 abstract description 11
- 239000004567 concrete Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000004698 Polyethylene Substances 0.000 abstract description 7
- 229920000573 polyethylene Polymers 0.000 abstract description 7
- 239000004743 Polypropylene Substances 0.000 abstract description 5
- 229920001155 polypropylene Polymers 0.000 abstract description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003054 catalyst Substances 0.000 abstract description 4
- 239000003063 flame retardant Substances 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000003912 environmental pollution Methods 0.000 abstract description 2
- 238000004064 recycling Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 49
- 239000002245 particle Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000005188 flotation Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011381 foam concrete Substances 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 239000003721 gunpowder Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/70—Scrap or recycled material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/10—Properties of the layers or laminate having particular acoustical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/72—Density
Landscapes
- Laminated Bodies (AREA)
- Building Environments (AREA)
Abstract
본 발명은 폐 고분자재 80-90중량%, 촉매 1-2중량%, 난연제 3-9중량%, 물 5-10중량%를 포함하는 건축방음보드에 있어서, 폐 고분자재는 폐 발포 폴리 에틸렌 비닐 아세테이트, 폐 발포 우레탄, 폐 발포 폴리에틸렌 및 폐 발포 폴리프로필렌으로 구성되는 군으로부터 선택된 적어도 1종 이상이고, 밀도가 다른 폐 고분자재를 사용하여 적어도 2개 이상의 층으로 구성한 것을 특징으로 하는 건축 방음보드 및 이의 제조 방법에 관한 것이다.The present invention is an architectural soundproof board comprising 80-90% by weight of waste polymer material, 1-2% by weight of catalyst, 3-9% by weight of flame retardant, 5-10% by weight of water, wherein the waste polymer is waste foamed polyethylene vinyl acetate. , At least one selected from the group consisting of waste foamed urethane, waste foamed polyethylene and waste foamed polypropylene, and the building soundproof board comprising at least two layers using waste polymer materials having different densities. It relates to a manufacturing method.
본 발명의 건축 방음보드는 폐기되는 자원을 재활용하여 사용하여 환경오염을 최소화 할 수 있도록 한 것이고, 이를 이용하여 아파트 등의 공동주택, 고층 빌딩 등과 같은 다층 건축물의 내부에서 발생되는 소음, 진동이 층과 층 사이에 형성되어 있는 콘크리트 슬라브층을 통하여 아래층에 전달되는 것을 차단 또는 감소시켜 입주자들이 안정되고 쾌적한 생활을 영유할 수 있도록 한 것이다.Building sound insulation board of the present invention is to minimize the environmental pollution by recycling the waste resources used, by using the noise and vibration generated in the interior of a multi-storey building, such as apartments, high-rise buildings, etc. Through the concrete slab layer formed between the floor and the floor to block or reduce the transmission so that the tenants can enjoy a stable and comfortable life.
Description
본 발명은 건축방음보드 및 이의 제조방법에 관한 것으로, 더욱 상세하게는 폐 고분자재 80-90중량%, 촉매 1-2중량%, 난연제 3-9중량%, 물 5-10중량%를 포함하는 건축방음보드에 있어서, 폐 고분자재는 폐 발포 폴리 에틸렌 비닐 아세테이트, 폐 발포 우레탄, 폐 발포 폴리에틸렌 및 폐 발포 폴리프로필렌으로 구성되는 군으로부터 선택된 적어도 1종 이상이고, 밀도가 다른 폐 고분자재를 사용하여 적어도 2개 이상의 층으로 구성되는 건축방음보드를 제조하므로서 아파트 등의 공동주택, 고층 빌딩 등과 같은 다층 건축물의 내부에서 발생되는 소음, 진동이 층과 층사이에 형성되어 있는 콘크리트 슬라브층을 통하여 아래층에 전달되는 것을 차단 또는 감소시키기 위한 건축방음보드 및 그 제조방법에 관한 것이다.The present invention relates to a building soundproofing board and a method of manufacturing the same, and more particularly, containing 80-90% by weight of waste polymer material, 1-2% by weight of catalyst, 3-9% by weight of flame retardant, and 5-10% by weight of water. In the building soundproofing board, the waste polymer material is at least one selected from the group consisting of waste foamed polyethylene vinyl acetate, waste foamed urethane, waste foamed polyethylene and waste foamed polypropylene, and at least by using waste polymer materials having different densities. By manufacturing building soundproof boards composed of two or more floors, noise and vibrations generated inside multi-story buildings such as apartment houses and high-rise buildings are transmitted to the lower floors through concrete slab layers formed between floors. It relates to a building soundproofing board and a method of manufacturing the same for blocking or reducing the thing.
아파트와 같은 공동주택의 상층 바닥에는 사람의 보행, 물건의 낙하 등의 충격에 의하여 발생되는 충격음 및 진동은 바닥 슬라브를 통하여 하층 세대내로 방사되어 하층 세대의 거주자에게는 대단한 불쾌감을 주게 된다.The impact sound and vibration generated by the impact of human walking and falling of objects on the upper floor of an apartment such as an apartment are radiated into the lower generation through the floor slab, which causes great discomfort to the residents of the lower generation.
일반적으로 콘크리트 슬라브는 공기 전파음을 잘 차단하기 때문에 종은 차음재라 할 수 있으나, 콘크리트구조에 충격이나 진동을 직접 가하게 되면 고체 전파음으로 변하여 거의 감쇄되지 않고 인접한 다른 세대로 전달되어 방사되는 특성을 가지고 있다. 그리하여, 종래에는 일반적으로 다층 건축물의 바닥에 사용되어지는 건축방음보드의 재료는 다양한 소재의 고분자 재료를 발포시켜 차음과 흡음의 효과를 내도록 시공되어지고 있다.In general, concrete slabs block air propagation well, so species can be called sound insulation materials.However, if a concrete slab is directly impacted or vibrated, the concrete slab is converted into a solid propagation sound. Have. Thus, conventionally, the material of a building soundproofing board generally used on the floor of a multi-layered building has been constructed to foam the polymer material of various materials to effect sound insulation and sound absorption.
일반적인 다층 건축물의 시공방법은 일반적으로 상층과 하층을 격리시키는 콘크리트 슬라브 구조층을 최하단부면으로 하여 그 직상부에 건축방음보드를 수평으로 설치, 고정하고 그 직상부에 60내지 70%의 다공질 기포를 함유하는 기포콘크리트를 부어 단열과 차음의 효과를 내도록 고정 양생한다. 그 다음에 5일 내지 7일의 양생기간을 거쳐 작업자가 다공질의 기포 콘크리트층 상부를 걸을 수 있는 정도의 강도가 발생되도록 한 후 온돌 배관을 설치 시설하고 그 윗면에 온돌배관의 보호를 위한 모르타르를 부어 흙손질 마감한다.In general, the construction method of a multi-layered building generally uses a concrete slab structure layer that separates the upper and lower layers as the lowermost surface, and installs and fixes a soundproof board horizontally on the upper part, and forms 60-70% porous bubbles on the upper part. Foam concrete containing is poured and fixed and cured to give the effect of insulation and sound insulation. Then, after five to seven days of curing, the strength of the worker can walk on top of the porous foam concrete layer. Then, an ondol pipe is installed and the mortar for the protection of the ondol pipe is installed on the upper surface. Pour and finish the trowel.
또한, 건축 방음보드를 시공시 기포 콘크리트층과 온돌 배관층 및 보호 모르타르층에서 발생되는 진동과 소음이 건축물의 벽체 옹벽에 전달되는 것을 차단하기 위하여 벽체 차단용 보드를 설치한다.In addition, a wall blocking board is installed to block the transmission of vibration and noise generated in the bubble concrete layer, the ondol piping layer, and the protective mortar layer when the building soundproof board is installed on the wall retaining wall of the building.
종래의 건축 방음보드는 작업자의 작업용이성 때문에 가볍고 취급이 쉬운 폴리에틸렌계의 고분자재료를 주원료로 사용하여 발포시켜 생산 제작하였다. 때문에 기포 콘크리트층을 형성후 상부에 가구 등에 의한 부등 침하가 발생하는 경우도 있어왔으며, 진동과 소음의 차단과 흡수 효과가 미비한 단점들이 있었다.Conventional building soundproofing boards are manufactured by producing foams using polyethylene-based polymer materials as the main raw materials because of their ease of operation. Because of this, there have been cases of uneven settlement caused by furniture, etc. after forming the bubble concrete layer, and there are disadvantages in that vibration and noise are not blocked and absorbed.
또한, 건축 방음보드의 경량성 때문에 층간 슬라브층에 고정하기 위한 화약타격총을 이용 바닥에 충격을 발생시켜 고정핀을 이용 고정하는 방법을 사용하여 왔다.In addition, because of the light weight of the building soundproofing board has been using a method of generating a shock on the floor using a gunpowder shotgun for fixing to the interlayer slab layer to use a fixing pin.
바닥용 건축 방음보드는 상부층의 진동과 소음의 차단과 흡수를 위한 재료로 제작되어져야함과 동시에 적당한 강성을 지녀야만 하는 필요성이 있지만, 강성도 만족할 만한 수준이 아니었다. 또한, 재료를 새 소재만을 사용하였기 때문에 자원의 소모가 발생하였다.Floor building sound insulation boards must be made of materials to block and absorb vibrations and noises in the upper floors and at the same time have the necessary rigidity, but the stiffness was not satisfactory. In addition, the material was consumed because only the new material was used.
따라서, 본 발명의 목적은 상기와 같은 종래의 문제점을 해결하고 작업성 면에서 보다 편리하고 고정하기 쉬운 재료의 건축방음보드 제조하고, 다층건축물의 상층부에서 발생하는 소음과 진동이 하부층에 전달되어짐을 효과적으로 감쇄, 차단시키는 다층 건축물용 바닥 방음보드를 제공하는 데 있다.Therefore, the object of the present invention is to solve the conventional problems as described above and to manufacture a soundproof board of a material that is more convenient and easy to fix in terms of workability, and the noise and vibration generated in the upper layer of the multi-story building is transmitted to the lower layer. The present invention provides a floor soundproof board for a multi-layered building that effectively attenuates and blocks.
또한, 고갈되어져 가는 자원을 절감시키고자 폐기되는 자원중 재활용이 가능한 고분자의 재료를 분리하여 이를 사용하고, 특수한 첨가제를 첨가 성형한 방음보드를 제공하는 데 있다.In addition, to reduce the resources that are being depleted is to provide a soundproof board formed by separating and using the material of the polymer that can be recycled from the resources that are discarded, and added with a special additive.
종래의 방음보드는 통매트로 제조하여 사용하였으나, 본 발명에서는 이를 밀도가 다른 상부층과 하부층으로 제작하였다. 특히 상부층은 고밀도로 하고 하부층은 저밀도로 하여 차음효과를 높였다.Conventional soundproofing boards were manufactured and used as a whole mat, but in the present invention it was produced in the upper and lower layers having different densities. In particular, the upper layer is made dense and the lower layer is made dense, which enhances the sound insulation effect.
본 발명의 또 다른 목적은 본 발명의 건축용 방음보드를 생산하기 위한 제조방법을 제공하는 데 있다. Another object of the present invention to provide a manufacturing method for producing a sound insulation board for construction of the present invention.
본 발명을 좀 더 상세히 설명하면 다음과 같다.The present invention is described in more detail as follows.
본 발명에 따른 건축방음보드는 폐 고분자재 80-90중량%, 촉매 1-2중량%, 난연제 3-9중량%, 물 5-10중량%를 포함하는 건축방음보드에 있어서, 폐 고분자재는 폐 발포 폴리 에틸렌 비닐 아세테이트, 폐 발포 우레탄, 폐 발포 폴리에틸렌 및 폐 발포 폴리프로필렌으로 구성되는 군으로부터 선택된 적어도 1종 이상이고, 밀도가 다른 폐 고분자재를 사용하여 적어도 2개 이상의 층으로 구성한 것을 특징으로 한다.Building sound insulation board according to the present invention in the sound insulation board containing 80-90% by weight of the waste polymer material, 1-2% by weight of catalyst, 3-9% by weight of flame retardant, 5-10% by weight of water, waste polymer material is waste At least one selected from the group consisting of foamed polyethylene vinyl acetate, waste foamed urethane, waste foamed polyethylene, and waste foamed polypropylene, and characterized in that it is composed of at least two layers using waste polymer materials having different densities. .
폐 고분자재는 생활 및 산업용품을 생산하거나 생산하여 사용 후 폐기되는 폐에틸렌 비닐 아세테이트를 주성분으로 하고 발포 에틸렌 비닐 아세테이트, 고무와 발포 고무, 폴리우레탄 등의 폐 고분자재를 원료로 하되, 이를 성분별로 분리, 분쇄한 다음, 각 체별 단입도로 분류하고, 이를 이용하여 각기 다른 밀도의 판재를 형성하고 이를 일정한 두께를 가지는 판재로 2차 성형 가공하므로서 차음과 흡음의 특성을 갖도록 한 것이다.Waste polymer material is mainly composed of waste ethylene vinyl acetate, which is produced or produced and disposed of after being used for industrial and industrial products, and waste polymer material such as foamed ethylene vinyl acetate, rubber, foam rubber, polyurethane, etc. After crushing, the sieves are classified into single grains for each sieve, and by using them, plates having different densities are formed and secondary molded into plates having a constant thickness to have sound and sound absorption characteristics.
본 발명에서 사용되어지는 폐 고분자재는 폐 발포 폴리에틸렌 비닐 아세테이트, 폐 발포 우레탄, 폐 발포 폴리에틸렌 및 폐 발포 폴리프로필렌으로 구성되는 군으로부터 선택된 적어도 1종 이상이다.The waste polymer material to be used in the present invention is at least one selected from the group consisting of waste foamed polyethylene vinyl acetate, waste foamed urethane, waste foamed polyethylene and waste foamed polypropylene.
특히, 폴리에틸렌 비닐 아세테이트는 높은 온도 범위에서 탄성 및 반발력이 우수하며, 내환경 응력 균열(ESCR) 및 휨 균열저항(계속적인 굽힘 및 진동에 대한 저항)이 우수하고, 곰팡이에 대한 저항이 우수하며, 물리적 성질의 열화를 일으키지 않는 특성이 있다. 또한, 가소제를 사용할 필요가 없고 냄새가 없으며, 무취형, 무용매 결합제(solvent free binder)를 사용함으로써 시공 후 냄새가 없고, 산과 알칼리에 대한 저항성이 우수하며, 고무와 대부분의 비닐중합체보다 화학적으로 안정하고, 오존에 대한 저항이 고무나 폴리에틸렌보다 훨씬 우수한 특성을 가지고 있어 바람직하다.In particular, polyethylene vinyl acetate has excellent elasticity and repulsive force in the high temperature range, excellent environmental stress cracking (ESCR) and flexural cracking resistance (resistance to continuous bending and vibration), excellent mold resistance, There is a characteristic that does not cause deterioration of physical properties. In addition, there is no need to use plasticizers, no smell, no odor after construction by using odorless, solvent free binder, excellent resistance to acid and alkali, and chemically better than rubber and most vinyl polymers. It is preferable because it is stable and has a much better resistance to ozone than rubber or polyethylene.
본 발명에서 폐 고분자재를 90 중량%를 초과하여 사용하면 경화시키기가 어려운 문제점이 있으며, 80중량% 미만으로 사용하면 차음 및 흡음의 효과가 떨어지는 문제점이 있다. In the present invention, when the waste polymer material is used in excess of 90% by weight, there is a problem that it is difficult to harden. When the waste polymer is used in an amount of less than 80% by weight, the effects of sound insulation and sound absorption are poor.
이하, 본 발명을 첨부한 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, described in detail with reference to the accompanying drawings of the present invention.
도 1은 본 발명에 따른 건축방음보드를 보인 것으로서, 고밀도의 상부층과 저밀도의 하부층으로 구성됨을 보인 단면도이다.1 is a cross-sectional view showing a building soundproof board according to the present invention, consisting of a high density of the upper layer and a low density of the lower layer.
본 발명에 따른 건축 방음보드는 도 1에 도시한 바와같이, 밀도가 다른 폐 고분자재를 사용하여 적어도 2개 이상의 층으로 구성되며 전체적으로 0.2-0.4g/㎤의 밀도를 갖고 두께는 10-20mm로 압축 성형한 것으로, 단입도가 아닌 이중입도를 가진 통매트로서 밀도가 0.6-1.0g/㎤인 고밀도의 상부층(20)과 밀도가 0.1-0.2g/㎤인 저밀도의 하부층(30)으로 구성되어 있다.Architectural soundproof board according to the present invention is composed of at least two layers using waste polymer materials of different densities, as shown in Figure 1, has a total density of 0.2-0.4g / cm3 and a thickness of 10-20mm Compression-molded, non-single, double-grain tubular, consisting of a high density top layer 20 having a density of 0.6-1.0 g / cm 3 and a low density bottom layer 30 having a density of 0.1-0.2 g / cm 3. have.
예를 들어, 0.6-1.0g/cm3의 고밀도의 상부층(20)은 직경 1mm이하의 칩(chip)과 분말을 사용하여 제조하며, 1mm-3mm 정도의 두께로 성형한다. 0.1-0.2g/㎤의 저밀도의 하부층(30)은 직경 2-6mm의 칩(chip)을 사용하여 제조하며, 8-16mm 정도의 두께로 성형한다.For example, the high-density upper layer 20 of 0.6-1.0 g / cm 3 is manufactured using chips and powder having a diameter of 1 mm or less, and molded to a thickness of about 1 mm-3 mm. The lower layer 30 having a low density of 0.1-0.2 g / cm 3 is manufactured by using a chip having a diameter of 2-6 mm, and molded to a thickness of about 8-16 mm.
이때, 저밀도의 하부층(30)은 도 2에서와 같이, 선택적으로 직경 2-4mm의 구멍(31)을 일정간격으로 펀칭하여 제조할 수도 있다.In this case, as shown in FIG. 2, the lower layer 30 having a low density may be manufactured by punching holes 31 having a diameter of 2-4 mm at regular intervals.
한편, 도 3은 본 발명에 따른 건축방음보드의 일 실시예를 보인 것으로서, 저밀도의 중간층과 고밀도의 상,하부층으로 구성됨을 보인 단면도로서, 본 발명의 방음보드(10)에서 상부층(20a)은 0.6-1.0g/㎤의 고밀도로 직경이 1mm이하의 칩(chip) 또는 분말을 사용하여 제조하고, 그 두께가 1-3mm이며, 가운데층(30')은 0.1-0.2g/㎤의 저밀도로 직경이 2-6mm인 칩(chip)을 사용하여 제조하고, 그 두께가 8-16mm이며, 하부층(20b)은 0.6-1.0g/㎤의 고밀도로 직경이 1mm이하의 칩(chip) 또는 분말을 사용하여 제조하고, 그 두께가 1-3mm으로 성형할 수도 있다.On the other hand, Figure 3 is a cross-sectional view showing an embodiment of the building soundproofing board according to the present invention, consisting of a low density intermediate layer and a high-density upper, lower layer, the upper layer (20a) in the soundproofing board 10 of the present invention It is manufactured using chips or powder having a diameter of 1 mm or less at a high density of 0.6-1.0 g / cm 3, and has a thickness of 1-3 mm, and the middle layer 30 'has a low density of 0.1-0.2 g / cm 3. Manufactured using chips having a diameter of 2-6 mm, and having a thickness of 8-16 mm, the lower layer 20b has a density of 0.6-1.0 g / cm 3 and a chip or powder having a diameter of 1 mm or less. It can manufacture using, and shape the thickness to 1-3mm.
이때, 저밀도의 가운데층(30')은 도 4에서와 같이, 선택적으로 직경 2-4mm의 구멍(31)을 일정간격으로 펀칭하여 제조할 수도 있다.At this time, the low-density middle layer 30 'may be manufactured by punching holes 31, 2-4 mm in diameter at a predetermined interval, as shown in FIG.
본 발명의 건축 방음보드는 폐 고분자재를 성분별로 분리하는 단계; 분리된 폐 고분자재를 1-10mm로 분쇄하는 단계; 분쇄된 폐 고분자재를 각 체별 단입도로 분류하는 단계; 각각의 층에 적합한 밀도와 입도를 갖는 폐 고분자재 80-90중량%, 촉매 1-2중량%, 난연제 3-9중량%, 물 5-10중량%를 혼합하는 단계; 및 상기 혼합물을 가압 가온 경화시켜 각가의 층을 제조하는 단계; 제조된 각각의 층을 가온 가압 접착시키는 단계로 구성되는 것을 특징으로 하는 방법에 의하여 제조된다.Architectural sound insulation board of the present invention comprises the steps of separating the waste polymer material by component; Grinding the separated waste polymer material into 1-10 mm; Classifying the pulverized waste polymer material into single particles for each body; Mixing 80-90 wt% of waste polymer material, 1-2 wt% of catalyst, 3-9 wt% of flame retardant, and 5-10 wt% of water having a suitable density and particle size for each layer; And pressure warming the mixture to prepare each layer. It is produced by a method comprising the step of hot pressing bonding each layer prepared.
이때, 폐 고분자재를 용도에 따라 분말 및 칩(chip)으로 분쇄하여 사용한다. At this time, the waste polymer material is used by grinding into powder and chips according to the application.
상기와 같이 제조된 방음보드는 용도에 따라 다양한 설게 및 적용이 가능하며, 설계자의 요구에 따른 다양하고 자동화된 전용 커팅(cutting) 설비 사용으로 균일한 두께의 제품 공급이 가능하다. 습식 및 건식 가공이 가능하고 부양공법에 의한 차음 및 진동 방지층 형성, 규격화 및 경량성으로 전문 기술없이 누구나 쉽게 시공할 수 있으며 폐기물을 사용함으로써 저렴한 시공비로 탁월한 성능을 갖으며 내 하중성이 우수하다.The soundproof board manufactured as described above can be variously designed and applied according to the use, and it is possible to supply a product having a uniform thickness by using various and automated dedicated cutting equipment according to the designer's request. Wet and dry processing is possible, and the soundproof and vibration prevention layer formed by the flotation method, standardization and light weight make it easy for anyone to build without special skills. By using waste, it has excellent performance with low construction cost and excellent load resistance.
본 발명의 건축 방음보드는 고밀도의 상부층과 저밀도의 하부층을 다음의 경우와 같이 조합하여 제조된다. 이때 상부층과 하부층에 사용되는 폐 고분자재는 동일소재를 사용한다.The architectural soundproof board of the present invention is manufactured by combining a high density upper layer and a low density lower layer as follows. At this time, the waste polymer used in the upper layer and the lower layer uses the same material.
폐 고분자재로 발포 폴리에틸렌 비닐 아세테이트 사용시When using foamed polyethylene vinyl acetate as waste polymer
a1 : 1mm이하의 칩과 분말a1: chips and powder less than 1mm
a2 : 2-4mm의 단입도 칩a2: 2-4mm single grain chip
a3 : 6-8mm의 단입도 칩a3: 6-8mm single grain chip
a4 : 2-4mm의 혼합입도 칩a4: 2-4mm mixed particle size chip
a5 : 6-8mm의 혼합입도 칩a5: 6-8mm mixed particle chip
폐 고분자재로 발포 폴리우레탄 사용시When using foamed polyurethane as waste polymer
b1 : 1mm이하의 칩과 분말b1: chip and powder less than 1mm
b2 : 2-4mm의 단입도 칩b2: 2-4mm single grain chip
b3 : 6-8mm의 단입도 칩b3: 6-8mm single grain chip
b4 : 2-4mm의 혼합입도 칩b4: 2-4mm mixed particle size chip
b5 : 6-8mm의 혼합입도 칩b5: 6-8mm mixed particle size chip
폐 고분자재로 발포 폴리에틸렌 사용시When using foamed polyethylene as waste polymer
c1 : 1mm이하의 칩과 분말c1: chip and powder less than 1mm
c2 : 2-4mm의 단입도 칩c2: 2-4mm single grain chip
c3 : 6-8mm의 단입도 칩c3: 6-8mm single grain chip
c4 : 2-4mm의 혼합입도 칩c4: 2-4mm mixed particle size chip
c5 : 6-8mm의 혼합입도 칩c5: mixed particle size of 6-8mm
폐 고분자재로 발포 폴리프로필렌 사용시When using expanded polypropylene as waste polymer
d1 : 1mm이하의 칩과 분말d1: chip and powder less than 1mm
d2 : 2-4mm의 단입도 칩d2: 2-4mm single grain chip
d3 : 6-8mm의 단입도 칩d3: 6-8mm single grain chip
d4 : 2-4mm의 혼합입도 칩d4: 2-4mm mixed particle size chip
d5 : 6-8mm의 혼합입도 칩d5: mixed particle size of 6-8mm
즉, 폐 고분자재로 폐 발포 폴리에틸렌 비닐 아세테이트를 사용시 고밀도의 상부층은 1mm이하의 칩과 분말을 사용하고, 저밀도의 하부층은 6-8mm의 칩을 사용하여 건축 방음보드를 제조할 수 있다.That is, when using waste foamed polyethylene vinyl acetate as the waste polymer material, a high-density upper layer may use chips and powders of 1 mm or less, and a low-density lower layer may use 6-8 mm chips to manufacture architectural soundproof boards.
상술한 바와 같이 본 발명에서는 폐기되는 자원을 재활용하여 사용하여 환경오염을 최소화 할 수 있도록 한 것이고, 용도에 따라 다양한 설게 및 적용이 가능하며, 설계자의 요구에 따른 다양하고 자동화된 전용 커팅(cutting) 설비 사용으로 균일한 두께의 제품 공급이 가능하다. 습식 및 건식 가공이 가능하고 부양공법에 의한 차음 및 진동 방지층 형성, 규격화 및 경량성으로 전문기술없이 누구나 쉽게 시공할수 있으며 폐기물을 사용함으로써 저렴한 시공비로 탁월한 성능을 갖으며 내 하중성이 우수하다.As described above, in the present invention, it is possible to minimize the environmental pollution by recycling and using the discarded resources, and various design and application are possible according to the use, and various automatic dedicated cutting according to the designer's request. It is possible to supply products with uniform thickness by using equipment. Wet and dry processing is possible, and the soundproof and vibration prevention layer formed by the flotation method can be easily installed by anyone without special skills due to the standardization and light weight, and by using waste, it has excellent performance with low construction cost and excellent load resistance.
본 발명에서 제조된 건축 방음보드를 이용하여 아파트 등의 공동주태, 고층 빌딩 등과 같은 다층 건축물의 내부에서 발생되는 소음, 진동이 층과 층사이에 형성되어 있는 콘크리트 슬라브층을 통하여 아래층에 전달되는 것을 차단 또는 감소시켜 입주자들이 안정되고 쾌적한 생활을 영유할 수 있도록 한 것이다.The noise and vibration generated in the interior of a multi-storey building such as an apartment building, a high-rise building, etc. using the building soundproofing board manufactured in the present invention is transmitted to the lower floor through the concrete slab layer formed between the floors. By blocking or reducing, tenants can enjoy a stable and pleasant life.
도 1은 본 발명에 따른 건축방음보드를 보인 것으로서, 고밀도의 상부층과 저밀도의 하부층으로 구성됨을 보인 단면도.1 is a cross-sectional view showing a building soundproof board according to the present invention, consisting of a high density of the upper layer and a low density of the lower layer.
도 2는 도 1의 방음보드에서 저밀도의 하부층에 구멍이 형성된 것을 보인 단면도.Figure 2 is a cross-sectional view showing a hole formed in the lower layer of the low density in the soundproofing board of Figure 1;
도 3은 본 발명에 따른 건축방음보드의 일 실시예를 보인 것으로서, 저밀도의 중간층과 고밀도의 상,하부층으로 구성됨을 보인 단면도.Figure 3 is a cross-sectional view showing an embodiment of the building soundproofing board according to the present invention, consisting of a low density intermediate layer and a high density, upper and lower layers.
도 4는 도 3의 방음보드에서 저밀도의 중간층에 구멍이 형성된 것을 보인 단면도.4 is a cross-sectional view showing a hole formed in the middle layer of the low density in the soundproof board of FIG.
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
10 ; 건축방음보드 20 ; 상부층10; Architectural Soundproofing Boards 20; Upper layer
30 ; 하부층 31 ; 구멍30; Lower layer 31; hole
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0533470A (en) * | 1991-08-02 | 1993-02-09 | Mitsuboshi Belting Ltd | Acoustic insulating floor member |
| KR950014990U (en) * | 1993-11-20 | 1995-06-17 | 통일공업 주식회사 | Structure of sound absorbing plate for absorbing noise and vibration |
| JPH07195598A (en) * | 1993-12-28 | 1995-08-01 | Sekisui Plastics Co Ltd | Thermoplastic resin molding and method for producing the same |
| JPH0960144A (en) * | 1995-08-22 | 1997-03-04 | Ig Tech Res Inc | Composite recycle board |
| KR970020414A (en) * | 1995-10-31 | 1997-05-28 | 경주현 | Composite sandwich structure with foam layers of different densities |
| KR19980023060U (en) * | 1996-10-30 | 1998-07-25 | 성재갑 | Sound absorption panel |
| KR200209711Y1 (en) * | 2000-07-25 | 2001-01-15 | 김화순 | Panel structure using waste articles |
-
2002
- 2002-04-04 KR KR10-2002-0018496A patent/KR100479929B1/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0533470A (en) * | 1991-08-02 | 1993-02-09 | Mitsuboshi Belting Ltd | Acoustic insulating floor member |
| KR950014990U (en) * | 1993-11-20 | 1995-06-17 | 통일공업 주식회사 | Structure of sound absorbing plate for absorbing noise and vibration |
| JPH07195598A (en) * | 1993-12-28 | 1995-08-01 | Sekisui Plastics Co Ltd | Thermoplastic resin molding and method for producing the same |
| JPH0960144A (en) * | 1995-08-22 | 1997-03-04 | Ig Tech Res Inc | Composite recycle board |
| KR970020414A (en) * | 1995-10-31 | 1997-05-28 | 경주현 | Composite sandwich structure with foam layers of different densities |
| KR19980023060U (en) * | 1996-10-30 | 1998-07-25 | 성재갑 | Sound absorption panel |
| KR200209711Y1 (en) * | 2000-07-25 | 2001-01-15 | 김화순 | Panel structure using waste articles |
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| Publication number | Publication date |
|---|---|
| KR20030079453A (en) | 2003-10-10 |
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