KR100453689B1 - Automatic ball size filtering device and method for ball bumping system for semiconductor package manufacturing - Google Patents

Abstract

The present invention relates to an automatic ball size filtering device of a ball bumping system for manufacturing a semiconductor package, and a method thereof, and to a ball bumping system that picks up and bumps a ball onto a substrate, which is a component of a ball grid array semiconductor package, in addition to the standard size ball. A ball storage unit for supplying a large amount of balls of various sizes by a predetermined amount to pick up and bump only the standard size balls by filtering and removing the oversize balls and the undersize balls; An oversized ball filtering unit for receiving the balls from the ball storage unit and filtering the oversized balls having a larger size than the standard size balls, and passing the remaining ones; An undersized ball filtering unit for receiving the balls from the oversized ball filtering unit and filtering the undersized balls having a smaller size than the standard size balls among them and passing the rest; Automatic ball size filtering device of the ball bumping system for semiconductor package manufacturing, characterized in that the ball is supplied from the under size ball filtering unit to maintain the flatness of the ball picker to pick up only the standard size ball ball system .

Description

Automatic Ball Size Filtering Device and Method for Ball Bumping System for Semiconductor Package Manufacturing

The present invention relates to an automatic ball size filtering device for a ball bumping system for manufacturing a semiconductor package, and a method thereof. More specifically, the present invention relates to bumping a conductive ball into a substrate that is a component of a ball grid array semiconductor package. The present invention relates to an automatic ball size filtering device for a ball bumping system for manufacturing a semiconductor package and to a method for filtering and bumping only a ball having a standard size in a ball bumping system.

In general, a ball bumping system for manufacturing a semiconductor package is a component of a ball grid array semiconductor package, for example, a dotting sticky flux on a ball land, for example, a ball land, and then a ball is picked there. A seating system. After the ball is bumped, the substrate is placed in a high temperature furnace, whereby the flux is volatilized and the ball is fused to the ball land there.

The ball bumping system includes an on-loader unit that sequentially provides a substrate on a rail, a flux dotting unit for dotting sticky flux on the substrate, a ball bumping unit for picking and bumping a ball with a picker where the flux is doped; It consists of an unloading unit for transferring the sub-bump bumped the ball to the furnace.

As shown in FIG. 1A, the ball bumping part 100 ′ includes a ball storage part 8 ′ in which a large amount of balls 2 ′ are stored, and a predetermined amount of balls from the ball storage part 8 ′. (2 ') is provided with a ball expansion portion (18') to make them flat state of a constant thickness, and is located on the top of the ball expansion portion (18 ') and a plurality of needles 22' is provided on the bottom It is comprised by the picker 20 'which picks up the ball 2'. Here, the needles 22 'of the picker 20' are all penetrated, and a through hole 20a 'is formed inside the picker 20' connected thereto, and the picker 20 'is not shown. It is connected to the vacuum means.

In the figure, reference numeral 8a 'is a connector for transferring the ball 2' from the ball storage portion 8 'to the ball expansion portion 18'.

The needle 22 'of the picker 20' is vacuumed while being positioned above the ball 2 'of the ball expansion portion 18', so that the ball 2 'is different at the end of each needle 22'. In this state, it moves to the upper portion of the flux 32 'doped on the substrate 30'. When the position of the needle 22 'picking up the flux 32' and the ball 2 'on the substrate 30' is exactly as described above, the picker 20 'and the needle 22' The vacuum is released. Then the flux 32 'is sticky and the balls 2' are bumped onto the flux 32 '.

However, the conventional ball bumping device having such a configuration and action has a number of balls (m '), oversized ball (4'), undersized ball (6 ') on the substrates 30' due to several problems as follows. Etc., the reliability of the ball grid array semiconductor package is weakened. That is, the balls 2 'are all made slightly different in size while having a constant standard deviation. This phenomenon did not cause such a big problem in the conventional ball grid array semiconductor package (ball size; 1.27 to 1.0 mm), but the current film ball grid array semiconductor package (ball size; 0.5 to 0.45 mm), micro ball grid array semiconductor package ( Ball size: 0.5 to 0.35 mm) provides many problems in the manufacture of semiconductor packages due to the size variation of the balls. That is, as shown in FIG. 1B, the state of the ball picked up by the needle 22 'of the picker 20' is that the flatness of the ball located in the ball expansion portion 18 'is poor or its size is standard. It may be in the form of a missing ball (m '), an oversized ball (4'), an undersized ball (6 '), or the like caused by a larger or smaller size. In such a state, the ball grid array semiconductor package in which the balls are bumped and fused to the substrate 30 'is generally disposed of due to problems such as inoperability or inability to be mounted on the main board. Among these phenomena, MissingBall is emerging seriously as the manufacturing industry is developed into a micro ball grid array semiconductor package.

Therefore, the first object of the present invention is the automatic ball size filtering of the ball bumping system for manufacturing a semiconductor package, which can provide only the ball of a standard size in the ball bumping system for bumping the ball in the substraight as a component of the ball grid array semiconductor package To provide a device.

It is a second object of the present invention to provide a method for filtering only balls of standard size in a ball bumping system.

According to an aspect of the present invention for achieving the above object and the ball storage unit for supplying a large amount of balls by a predetermined amount; An oversized ball filtering unit for receiving the balls from the ball storage unit and filtering the oversized balls having a larger size than the standard size balls, and passing the remaining ones; An undersized ball filtering unit for receiving the balls from the oversized ball filtering unit and filtering the undersized balls having a smaller size than the standard size balls among them and passing the rest; It is characterized in that it comprises a ball expansion unit for receiving the ball from the undersize ball filtering unit to maintain the flatness of the ball so that the picker can pick up only the standard size ball.

In addition, according to another aspect of the present invention for achieving the above object ball supply step of supplying a predetermined amount of balls; An oversized ball filtering step of filtering the oversized balls and passing the remaining balls out of the supplied balls; An undersize ball filtering step of filtering the undersize ball from the passed ball and passing the remaining standard size ball; Characterized in that the ball leveling step of flattening the passed standard size ball.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art can easily implement the present invention.

Figure 2 is a state diagram showing one embodiment of the automatic ball size filtering device 100 of the ball bumping system according to the present invention.

As shown, in the configuration of the present invention, the ball storage unit 8 is positioned at the top of the ball storage unit 8 so as to supply a predetermined amount of balls, and a predetermined amount of the ball storage unit 8 from the bottom of the ball storage unit 8. The oversized ball filtering part 10 is formed to filter the oversized ball 4 having a larger size than the standard size ball 2 and to pass the rest, and the oversized ball filtering part ( At the bottom of the 20), the undersized ball filtering part receives the ball from the oversize ball filtering part 10 so as to filter the undersize ball 6 having a smaller size than the standard size ball 2, and pass the rest. (12) is formed, the side of the undersized ball filtering unit 12 receives only the standard size ball (2) from the undersized ball filtering unit 12 to maintain the flatness of the ball constant picker Needle (22) of (20) is standard The ball expansion part 18 is located so that only the ear balls 2 can be picked up.

Here, the oversized ball filtering unit 10 and the undersized ball filtering unit 12 are further provided with vibrating units 24a and 24b for applying horizontal vibration to facilitate filtering of the balls. The expansion part 18 is further provided with the vibration part 24c which vibrates horizontally in order to maintain the flatness of the standard size ball 2 supplied uniformly.

At the bottom of the oversize ball filtering unit 10 and the undersize ball filtering unit 12, a reject ball storage unit 16 further collects the filtered oversize ball 4 and the undersize ball 6 separately. A buffer 14 is provided between the undersized ball filtering unit 12 and the reject ball storage unit 16 to temporarily filter the undersized ball 6.

The oversized ball filtering part 10 has a plurality of through holes 10a formed in the bottom so that only the ball below the standard size ball 2 can pass therethrough, and the undersized ball filtering part 12 has a standard size at the bottom. A plurality of through holes 12a are formed to allow the undersized ball 6 less than the ball 2 to pass therethrough, and the bottoms of the oversized ball filtering part 10 and the undersized ball filtering part 12 are respectively formed. It is inclined at a predetermined angle so that filtering can be easily performed.

3 is a flowchart illustrating an automatic ball size filtering method of a ball bumping system according to the present invention. The configuration is as follows.

1. In the ball supply step (S1), the standard size ball (12), the oversize ball (4) and the undersize ball (6) are all supplied to the next stage.

2. In the oversize ball filtering step S2, the oversize ball 4 is filtered and the remaining standard size ball 2 and the undersize ball 6 are passed to the next stage.

3. Under sized ball filtering step (S3) of the passed ball under size ball 6 is filtered and passes only the remaining standard size ball (2) to the next stage.

4. As the ball leveling step (S4) is applied to the passed standard size ball (2) in the horizontal direction to make a flat state and then the needle 22 of the picker 20 to be easily picked up.

Here, the oversize ball 4 and the undersize ball 6 filtered in the oversize ball filtering step S2 and the undersize ball filtering step S3 are separately collected and recycled or disposed of (S5). In addition, the oversize ball filtering step (S2), the undersize ball filtering step (S3) is also applied to the vibration in the horizontal direction so that its operation is performed smoothly.

As described above, although the present invention has been described with reference to the above embodiments, the embodiments are not limited thereto and various modifications may be made by those skilled in the art without departing from the scope and spirit of the present invention.

Therefore, according to the automatic ball size filtering device and method of the ball bumping system for manufacturing a semiconductor package according to the present invention, by filtering only the standard size ball in the ball bumping system for bumping the ball on the substrate, a component of the ball grid array semiconductor package By providing the ball expansion unit and maintaining the flatness of the ball in the ball expansion unit, there is an effect that the picker picks up the ball, do not pick up Missing ball, oversize ball and undersize ball.

FIG. 1A illustrates a state in which a ball is picked up from a ball storage unit of a conventional ball bumping system and bumped on a substrate. FIG. 1B illustrates a state in which a missing ball, an oversize ball, an undersize ball, and a standard size ball are picked up. It is.

Figure 2 is a state diagram showing one embodiment of the automatic ball size filtering device of the ball bumping system according to the present invention.

3 is a flowchart illustrating an automatic ball size filtering method of a ball bumping system according to the present invention.

-Explanation of symbols for the main parts of the drawings-

100; Automatic ball size filtering device according to the present invention

2 ; Standard Size Ball 4; Over Size Ball

6; Under Size Ball 8; Ball storage

10; Oversized ball filtering unit 12; Under size ball filtering part

14; Buffer 16; Reject Ball Storage

16a; Reject ball 18; Ball Expansion Division

20; Picker 22; Needle

24; Vibration part

Claims (4)

Ball storage unit for supplying a predetermined amount of a large amount of balls of various sizes; An oversized ball filtering unit for receiving the balls from the ball storage unit and filtering the oversized balls having a larger size than the standard size balls in the double ball; An undersize ball filtering unit for receiving the ball from the oversize ball filtering unit and filtering the undersize ball having a smaller size than the standard size ball among the balls; A first vibration part installed in the oversize ball filtering part and the undersize ball filtering part to apply vibration to facilitate filtering of the ball; And, Automatic ball size of the ball-bumping system for semiconductor package manufacturing, characterized in that it comprises a ball expansion unit for receiving the ball from the under size ball filtering unit to maintain the flatness of the ball so that the picker can pick up only the standard size ball Filtering device. The apparatus of claim 1, wherein the ball expansion unit further includes a second vibration unit for vibrating horizontally to maintain a flatness of the supplied ball. . The ball bumping system of claim 1, wherein a reject ball storage unit is further installed in the oversize ball filtering unit and the undersize ball filtering unit to separately collect the filtered oversize ball and the undersize ball. Automatic ball size filtering device. A ball supply step of supplying a predetermined amount of balls; An oversized ball filtering step of filtering the oversized ball from the supplied balls and passing the remaining balls; An undersize ball filtering step of filtering the undersize ball from the passed ball and passing the remaining standard size ball; Automatic ball size filtering method of the ball bumping system for semiconductor package manufacturing, characterized in that the ball leveling step to flatten the passed standard size ball.

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