KR100451916B1 - Apparatus for cooling electronic circuits with thin-plate type heat pipe having cooling fin - Google Patents

Abstract

The present invention relates to a cooling device for an electronic circuit, and in particular, to effectively spread the heat generated in the electronic circuit to a larger area and at the same time, by lowering the temperature of the electronic circuit by exchanging heat with the surroundings through an integrated cooling fin to maximize efficiency It is an object of the present invention to provide a cooling device having a thin plate heat pipe structure.

In order to achieve the above object, a thin plate heat pipe structure cooling apparatus according to the present invention is a metal plate formed of a lower plate and a predetermined three-dimensional pattern as a metal plate, and the lower plate is joined to a portion of the upper plate to provide a sealed space of a predetermined pattern. A thin metal housing made up of; And a liquid refrigerant provided in a sealed space inside the thin metal housing.

Description

Apparatus for cooling electronic circuits with thin-plate type heat pipe having cooling fin}

The present invention relates to a cooling device for an electronic circuit, and more particularly, to effectively diffuse the heat generated from the electronic circuit to a larger area and at the same time lower the temperature of the electronic circuit by exchanging heat with the surroundings through an integrated cooling fin. It relates to a cooling device of a thin plate heat pipe structure that can maximize the efficiency.

CPU, graphic chip, memory chip, hard disk, power supply, etc. installed inside various IT products generate a large amount of heat during operation. If the heat accumulates and the temperature exceeds 80 ℃ ~ 90 ℃, the product is damaged. Or stop working.

Recently, as the integration degree of semiconductor chips is improved, the width of internal lines becomes narrower, and the heat generation amount is increased, while the demand for light and light reduction of products is increasing. Therefore, a cooling device having excellent cooling performance and a small volume are essential.

In general, technologies related to cooling devices for electronic circuits include a fin and fan method, a thermoelectric method, a cooling water circulation method, a heat pipe method, and the like.

In the conventional fin and fan type cooling apparatus, a fin heat sink 21 is attached to a surface of a heat source 10 as shown in FIG. 1, and a cooling fan 30 is installed in the fin heat sink 21 to heat the heat source 10. It emits heat from the outside. However, there is a problem that the cooling efficiency is low compared to the noise, vibration and large volume, and in particular, because it relies only on the heat conduction through the metal heat sink 21, there is a problem that the heat resistance is large and can not quickly dissipate heat.

Conventional thermoelectric element cooling device using the Peltier effect has no noise and vibration, but requires a large driving power source, and there is a problem that an excessive heat dissipation device is required on the high heat side by the energy supplement law.

In addition, the cooling device of the cooling water circulation method takes a lot of installation space, there is a problem that can not be applied to a compact and highly integrated electronic device.

In order to solve the above problems, there is mentioned the invention of Unexamined Patent Publication No. 2003-0030509 or Unexamined Patent Publication No. 2003-0018478. The former has a constant space evaporation region 40 located inside the center with a thin-plate housing 22, as shown in Fig. 2A and Fig. 2B, which is a sectional view of AA ' of Fig. 2A, and dissipates the evaporated gaseous refrigerant. At the same time, the upper passage 50 for condensation and the lower passage 70 for transferring the condensed liquid refrigerant to the central evaporation region 40 by capillary action.

The latter, as shown in Figure 3, the refrigerant storage unit 102 for storing the liquid refrigerant inside the thin housing 100, the evaporation unit of the fine channel shape vaporizing the liquid refrigerant by the heat absorbed from the heat source ( 104), the condensation unit 108 of the fine channel shape for condensing the evaporated gaseous refrigerant, and the heat insulating portion 116 to transfer the condensed liquid refrigerant to the refrigerant storage unit 102 by capillary action It includes a liquid refrigerant moving unit 110 and the like.

However, as described above, the conventional thin plate heat pipe structure cooling apparatuses are formed in upper and lower multilayers and have a lead frame as compared to a thin plate type having a thickness of 1 mm or less, or a thin plate housing. It has a complex and diverse internal structure such as a plurality of microchannels and heat insulation, there is a problem that is difficult to manufacture and practical use.

Therefore, the present invention has been proposed to solve the above problems and does not necessarily require a cooling fan to eliminate noise and vibration, and may be manufactured by a simple process such as metal sheet plastic working and bonding of a predetermined pattern. It is an object of the present invention to provide a cooling device having a thin plate heat pipe structure.

That is, the evaporation part for absorbing heat from the heat generating source and the condensation part for dissipating and evaporating the evaporated coolant are formed by the structure itself having a uniform shape pattern of the plastically processed metal sheet, and the liquid refrigerant condensed in the condensation part is formed. The purpose is to provide a liquid refrigerant moving path and the like as a unitary of a thin plate to move back to the evaporator.

1 is a schematic diagram showing a conventional fin and fan type cooling apparatus.

Figure 2a is a top view showing a heat spreader for cooling conventional electronic equipment.

FIG. 2B is a cross-sectional view taken along the line AA ′ of FIG. 2A;

3 is a top view showing a conventional thin plate cooling device.

Figure 4 is a perspective view showing a part of the cooling device according to the present invention cut away.

Fig. 5A is a sectional view of the BB ′ section of Fig. 4;

Fig. 5B is a sectional view showing a section taken along line CC ' of Fig. 4;

Fig. 6 is a perspective view showing an embodiment in which a part of the cooling device according to the present invention has a region upside down.

Figure 7 is a perspective view showing an embodiment in which a through area is formed inside the cooling apparatus according to the present invention.

8 is a perspective view showing an embodiment in which a fastener is formed at a junction of a cooling apparatus according to the present invention.

Figure 9 is a perspective view showing an embodiment in which a three-dimensional pattern is formed on both sides of the cooling apparatus according to the present invention.

Fig. 10A is a sectional view taken along the line DD ' of Fig. 9;

Fig. 10B is a sectional view taken along line EE ' of Fig. 9;

Fig. 10C is a sectional view taken along line FF ' of Fig. 9;

Figure 11a is a detailed view showing part (a) of Figure 10b.

FIG. 11B is a detailed view of part (b) of FIG. 10C;

Figure 12 is a perspective view showing an embodiment in which a heat generating source attachment portion is formed on the lower plate of the cooling apparatus according to the present invention.

Figure 13 is a perspective view and a front view showing an embodiment formed of a flat upper plate and a thin upper plate of the cooling apparatus according to the present invention.

Fig. 14A is a sectional view showing a section taken along the line GG ' shown in Fig. 13A.

Fig. 14B is a sectional view showing the HH ' cross section shown in Fig. 13A.

Figure 15 is a perspective view, front view and cross-sectional view showing another embodiment formed of a flat lower plate and a thin upper plate of the cooling apparatus according to the present invention.

Figure 16 is a front view and a sectional view showing an embodiment having a closed heat dissipation part of the cooling device according to the present invention.

Figure 17 is a front view and a sectional view showing an embodiment having an air vent of the cooling apparatus according to the present invention.

Figure 18 is a front view and a sectional view showing an embodiment having a vent and an integrated heat dissipation fin of the cooling apparatus according to the present invention.

* Description of the main parts of the drawing

10: heating element 10 ' : heating element attachment portion

300, 400, 500, 600: sheet metal housing according to each embodiment

201,301,401,501,601: top plate 202,302,402,502,602: bottom plate

205: condensation unit 305: gaseous refrigerant moving path

405,505: hollow portion 207,307: liquid refrigerant flow path

308, 428: contact 318: linear groove

319,419: Hyangsaeng 320,420: Baesayeon

418: embossing 429: partial spherical groove

610: vent 611, 621: heat radiation fin

In order to achieve the object of the present invention, a thin plate heat pipe structure cooling apparatus according to the present invention has the following configuration.

The invention of claim 1 provides a cooling device of a thin plate heat pipe structure in which a refrigerant is filled in the vacuum sealed space of a thin metal housing providing a closed space. The thin metal housing is formed of a metal plate of a copper or copper series alloy having high thermal conductivity, and has a predetermined three-dimensional pattern formed on at least one of the two surfaces, and the two sides are joined to each other at the periphery thereof. .

At least one surface of the thin metal housing is mainly flat, and a heat source attachment portion is formed to be in close contact with the surface of the semiconductor chip packaging, which is a heat source. This is mainly because the object requiring cooling is a semiconductor chip component such as a CPU, and the shape of the heat source attachment portion may be changed depending on the shape of the heat source.

At least one surface of the thin metal housing is formed with a heat dissipation portion providing a hollow portion therein by a predetermined three-dimensional pattern raised outwardly. The predetermined three-dimensional pattern may be formed such that each bottom portion is in contact with the other surface of the housing, or may be formed such that a microgap that causes capillary phenomenon is maintained between the bottom portion and the other surface.

The three-dimensional pattern may be formed in a plurality of small projections each providing a closed hollow portion, may be formed in a long corrugated shape so that the refrigerant in the evaporated gas state can be distributed, the plurality of small projections are connected It may be formed as.

The heat transferred into the housing through the heat source attachment part is absorbed by the evaporative heat of the liquid refrigerant. The gaseous refrigerant evaporated to the hollow portion provided by the three-dimensional pattern raised from one side to the outside radiates heat to the outside through the outer surface thereof, and condenses into the liquid state again. By repeating this process, the temperature of the heat generating source can be maintained below a certain level.

The invention of claim 2 means that one surface of a metal plate forming a surface in contact with the refrigerant inside the housing is surface-treated by a predetermined method so as to have a small contact angle with the refrigerant. As the contact angle between the surface of the metal plate and the refrigerant is smaller, the refrigerant may be evenly wetted on the surface of the housing. Particularly, a portion of the housing contacting each other or a microgap portion needs to be sufficiently wetted with a liquid refrigerant, and in order to satisfy this demand, it is preferable to undergo a surface treatment for reducing the contact angle with the refrigerant.

Here, the predetermined surface treatment method includes a method of performing hair-line processing or sand blast processing on the surface of the metal plate forming the inner surface of the housing, and includes platinum (Pt) and titanium dioxide. There is a method of coating the surface using a material that reduces the contact angle with the refrigerant, such as (TiO ₂ ). This point is common also in the invention of Claims 5, 12, and 20.

The invention of claim 4 provides a thin plate heat pipe structure cooling device comprising a thin plate metal housing comprising a flat plate and a plate having a predetermined three-dimensional pattern.

Here, the thin metal housing has a plurality of cooling fins formed on the upper plate and protruding high to provide a hollow portion therein, and formed relatively low along a boundary line where the bottoms of the adjacent cooling fins meet to form a fine space between the upper plate and the lower plate. It includes a liquid refrigerant moving path to form a gap to cause a capillary phenomenon.

The liquid coolant moving path is a microgap in which a capillary phenomenon may occur depending on physical properties such as surface tension of the coolant. For example, when the coolant is water, the liquid coolant moving path is formed at about 0.05 mm to 0.2 mm. The liquid refrigerant condensed on the inner surface (hereinafter referred to as the condensation section) is transferred to the inner surface of the lower plate (hereinafter referred to as the evaporation section), particularly toward the heat generating source.

The heating source mounting portion may be formed on any surface of the upper plate and the lower plate, but is preferably formed on one side of the flat lower plate in order to reduce the thermal resistance from the heating source to the refrigerant and to efficiently operate a plurality of cooling fins.

The planar shape of the entire sheet metal housing may be freely formed so as to avoid structural limitations of the electronic circuit to which the cooling apparatus according to the present invention is applied.

In the cooling apparatus of Claim 4, the cooling device of the said Claim 4 WHEREIN: Cooling of the thin-plate heat pipe structure in which the contact part which the upper plate and the lower plate contact-points at the predetermined interval along the longitudinal direction is formed in the liquid refrigerant | coolant moving path of the said thin-plate metal housing. Provide the device.

The contact part supports the upper and lower plates so that the upper and lower plates are not in close contact by the vacuum pressure inside the thin metal housing, and does not block the liquid refrigerant path by making point contact. The contact portion may be point bonded in the upper and lower joining process of the housing.

According to a seventh aspect of the present invention, in the cooling device of claim 4, a cooling device having a thin plate heat pipe structure is formed so that the shape of the upper plate and the lower plate is reversed in a portion of the thin metal housing. The cooling device having such a structure allows the heating source attachment portions to be formed on both sides when a heating device is present in the electronic circuit formed of two layers, and a cooling device is provided therebetween.

The invention according to claim 8 provides a cooling device of a thin heat pipe structure in the cooling device according to claim 4, comprising a region that vertically penetrates a part within an entire area of the thin metal housing. It may be applied in a case where an element or the like protruding from the electronic circuit to be cooled is present to prevent close contact with the cooling device.

In the cooling device of Claim 4, the invention of Claim 9 provides the cooling device of the thin-plate heat pipe structure of which the upper end part of the said thin-plate metal housing upper part heat radiation part is flat. When heat is to be transferred to a solid such as an external heat sink through the heat dissipation part formed of the plurality of cooling fins, it is preferable to have a cooling fin having a flat upper surface and a relatively low height.

According to the invention of claim 10, in the cooling device of claim 4, the upper plate of the thin metal housing is formed of a thin metal plate, the lower plate provides a cooling device of a thin plate heat pipe structure formed by a relatively thick metal plate. . The upper plate may be applied to a thin plate as thin as possible to reduce the overall thickness and at the same time to reduce the thermal resistance, and the lower plate may be applied to a relatively thick metal plate to maintain the housing in a constant shape. have.

According to the invention of claim 11, the heat dissipation portion is formed continuously in the distant side near the heat generating source, the vaporized refrigerant movement path that can evaporate heat to move the refrigerant evaporated therein, and the refrigerant in the liquid state condensed after heat dissipation in the capillary phenomenon The present invention provides a cooling device having a thin plate heat pipe structure including a liquid refrigerant moving path to be transferred back toward the heat generating source.

The gas phase refrigerant path may be in the form of a plurality of protrusions are connected, may be in the form of a long corrugation, may be provided in a variety of other forms, it is sufficient that the vaporized refrigerant can move. The liquid phase refrigerant flow path is provided in the form of a narrow gap between both sides of the housing, and like the gaseous phase refrigerant flow path is connected to the near and far side from the heat source to distribute the refrigerant.

According to a thirteenth aspect of the present invention, there is provided the cooling device of the eleventh aspect, wherein the thin plate heat pipe structure is provided with a contact portion in which the upper plate and the lower plate are in point contact at a predetermined interval along a longitudinal direction of the liquid refrigerant moving path of the thin plate metal housing. Provide the device.

As described above, the contact part is supported by the vacuum pressure inside the thin metal housing so that the upper and lower plates do not come into close contact with each other, and the point contact does not block the liquid refrigerant flow path.

According to the invention of claim 14, in the cooling device of claim 11, one side of the thin metal housing is connected to the long side from the close to the heat generating source far away therefrom is formed a corrugated three-dimensional pattern having a plurality of reflection surface and fragrance surface It provides a cooling device of a thin plate heat pipe structure, the inner space between the discharge surface and the other surface raised to the outside as a gas phase refrigerant movement path, and the micro-gap between the fragrance surface and the other surface as a liquid refrigerant movement path.

The invention of claim 15, in the cooling device of claim 14, a plurality of linear grooves having the same depth as the fine gap in the direction perpendicular to the corrugated three-dimensional pattern on the other surface facing the one surface on which the corrugated three-dimensional pattern is formed It is formed, and provides a cooling device of a thin heat pipe structure, so that both sides are point-contacted to maintain the micro-gap of the remaining portion at the intersection of the plurality of linear grooves and the sloping surfaces of the plurality of corrugated three-dimensional patterns, respectively. .

The plurality of linear grooves may be formed perpendicular to the corrugated three-dimensional pattern in addition to maintaining a microgap to reinforce the thin metal housing to be maintained in a constant shape.

The invention according to claim 16, The cooling device of claim 11, A plurality of heat dissipation fins provided with a vent hole penetrating through one side of the thin metal housing, the contact hole is fixed or integrally connected to the periphery of the vent hole, Provided is a cooling device having a thin plate heat pipe structure having a fan for supplying cooling air to a plurality of heat dissipation fins.

Here, a coolant flow path may be formed in the heat dissipation fins integrally connected to the metal housing to increase cooling efficiency. In addition, a heat dissipation block composed of a plurality of heat dissipation fins and fans may be installed in the vent hole to dissipate heat conducted from the periphery thereof.

19. The invention of claim 19 is a thin plate-shaped metal housing comprising the lower plate which is a flat and relatively thick metal plate, and the upper plate which is bonded to the lower plate and its periphery as a metal thin plate on which a predetermined three-dimensional pattern is formed to provide a sealed space of a predetermined pattern, and the thin plate type. Provided is a thin plate heat pipe structure cooling device including a liquid or gaseous refrigerant filled in an enclosed vacuum space inside a metal housing.

The point consisting of a relatively thick lower plate and a thin upper plate is common to the cooling device of claim 10, but is provided by a gaseous refrigerant moving path and a liquid refrigerant moving path like the cooling device of claim 11 by a three-dimensional pattern formed on the upper plate which is a metal thin plate. There is a difference. On the contrary, it is common in that the gaseous and liquid refrigerant moving paths are provided in comparison with the cooling device of claim 11, but are distinguished in that they are made of a relatively thick and flat lower plate and an upper plate on which a predetermined three-dimensional pattern is formed.

In this case, the relatively thick means a relatively thick plate compared to the thin plate, and does not necessarily mean a thick plate having an absolute thickness.

The invention of claims 21 to 22 has a configuration similar to the cooling device of claims 13 to 14, except that it consists of a relatively thick and flat bottom plate and a thin top plate.

The invention according to claim 23, wherein in the cooling device of claim 22, an embossing projecting inwardly from the sloping surface of the corrugated three-dimensional pattern of the upper plate is formed at predetermined intervals to contact the lower plate, which is a relatively thick flat plate, so that the inside of the housing The present invention provides a cooling device having a thin plate heat pipe structure in which a microgap of the remaining portion is maintained despite a vacuum pressure of.

The invention of claims 24 to 26 has a configuration similar to the cooling device of claims 16 to 18, except that it consists of a relatively thick and flat bottom plate and a thin top plate.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention;

4 is a perspective view showing a portion of the cooling apparatus according to the present invention cut away. The lower plate 202, which is a flat metal plate, and a metal plate having a predetermined three-dimensional pattern formed thereon, and the inner side of the thin plate-shaped metal housing made of a thin metal housing made of a thin plate-shaped metal housing composed of a top plate 201 that provides a sealed space 203 of a predetermined pattern. Provided is a cooling device having a thin plate heat pipe structure including a liquid refrigerant 203 provided in a space.

FIG. 5A is a cross-sectional view illustrating the BB ′ section of FIG. 4. A lower plate 202 having a heat generating source attachment portion in contact with the heat generating source 10 and a top plate 201 protruded thereon and having a plurality of cooling fins 220 having a hollow condensation portion 205 formed thereon. At this time, the shape of the cooling fin 220 may be variously formed up to the dome shape as well as the shape of the top surface polygonal plane as shown in the figure.

The upper plate 201 and the lower plate 202 have a joining portion 209 joined to each other around them to form a thin metal housing, and provide an enclosed space therein and a liquid refrigerant 203 filled in the enclosed space. do. At this time, the lower boundary line between the adjacent cooling fins 220 forms a micro gap with the lower plate 202 to form a liquid refrigerant path 207, and an upper side of the lower plate 202 except for the liquid refrigerant path 207. The space forms an evaporator 204 in which the liquid refrigerant absorbs heat and evaporates.

The upper plate 201 and the lower plate 202 may be thinner depending on the physical properties of the metal material and the permissible conditions such as plastic working technology and joining technology, but are preferably a metal thin plate having a thickness of 0.05 mm or more. Various refrigerants, such as alcohol or alkali aqueous solution, can be applied. In addition, the joint is preferably soldered or brazed, and welding is possible depending on the material of the metal foil.

In the case where the upper end 211 of the cooling fin 220 is in contact with another object and wants to release heat, the height of the cooling fin 220 is lowered so that the area of the upper surface is widened. The cooling fins 220 are preferably narrow and high to widen the surface area.

FIG. 5B is a cross-sectional view taken along the line CC ′ of FIG. 4. As described above, the boundary surface of the bottom where the adjacent cooling fins 220 meet forms a micro gap with the lower plate 202. The microgap forms the liquid coolant movement path 207 by maintaining a gap in which capillary phenomenon occurs, for example, about 0.05 mm to 0.3 mm, depending on the surface tension of the liquid refrigerant 203.

The liquid coolant movement path 207 is provided with contact portions 208 in which the upper plate 201 and the lower plate 202 are in point contact at predetermined intervals to prevent the upper and lower plates 1 and 2 from coming into close contact with each other. The movement of the refrigerant through the liquid refrigerant movement path 207 is not prevented.

The operation of the cooling apparatus according to the present invention will be described with reference to FIGS. 5A and 5B as follows. The heat generated from the heat generating source 10 is transferred to the evaporator 204 on the inner surface of the lower plate 202, and the liquid refrigerant absorbing heat is evaporated in the evaporator 204. The gaseous refrigerant that has risen through the hollow part 206 releases heat through the cooling fins 220 from the condensation part 205 of the upper part and condenses into liquid again. The condensed liquid refrigerant is transferred along the liquid refrigerant movement path 207 by the capillary phenomenon and is supplied to the evaporator 204 to repeat this process. As a result, the process of continuously absorbing heat from the heat generating source 10 to diffuse heat through the condensation unit 205 and release the heat to the outside.

Fig. 6 is a perspective view showing an embodiment in which some structures of the cooling apparatus according to the present invention have regions formed upside down. The upper plate may be flat and include a region 212 in which the cooling fins are formed on the lower plate, in addition to the region 213 in which the cooling fins are formed on the upper plate, in an inner region of the junction 209 of the thin metal housing. Therefore, not only the bottom surface but also the top surface of the present cooling device may be provided with a heat generating source attachment portion.

7 is a perspective view showing an embodiment in which a through region is formed inside the cooling apparatus according to the present invention. A region 214 penetrated up and down may be provided in an inner region of the junction 209 of the thin metal housing. A junction 209 is also formed around the perforated region 214. Therefore, even if there is a protrusion in the middle of the electronic circuit to be cooled can be installed without being disturbed.

8 is a perspective view showing an embodiment in which a fastener is formed at a junction of a cooling apparatus according to the present invention. The junction part 209 of the thin metal housing may be provided with a fastener 215 penetrating it. The fastener 215 facilitates the coupling with the electronic circuit to be cooled and maintains close contact with the heat generating source to maintain smooth heat transfer.

9 is a perspective view showing an embodiment in which a three-dimensional pattern is formed on both sides of the cooling apparatus according to the present invention. (a) shows the upper surface, and (b) shows the lower surface. As the three-dimensional pattern, a three-dimensional pattern of various shapes may be applied as long as it can provide a liquid refrigerant moving path formed by a minute gap between the gaseous refrigerant moving path that is raised outwardly and both surfaces. As an example, the thin metal housing 300 according to the present exemplary embodiment may have a top plate 301 in which a corrugated three-dimensional pattern having a convex reflection surface 320 and a concave fragrance surface is formed, and a direction perpendicular to the corrugated three-dimensional pattern of the upper plate. The lower plate 302 is formed with a concave linear groove 318. A flat heating source attachment portion 10 ′ is formed on one side of the upper plate 301, which may be formed on the lower plate.

The exhaust surface 320 of the corrugated three-dimensional pattern is raised outward to provide a hollow portion therein to form a gaseous refrigerant moving path so that vaporized refrigerant can be freely distributed therein, and the fragrance surface has a micro gap between the lower plate 302. By forming the liquid refrigerant movement path to the liquid refrigerant mainly condensed at a position far from the heat source to be transferred back to the heat source by the capillary phenomenon.

At this time, the lower plate 302 is formed with a linear groove 318 of the same depth as the fine gap in the direction perpendicular to the corrugated three-dimensional pattern. The inner side of the linear groove 318 is in point contact at a plurality of points intersecting the fragrance surface of the upper plate 301 to prevent the upper plate and the lower plate is in close contact by the vacuum pressure therein, and also the linear groove 318 is By forming in the direction perpendicular to the corrugated three-dimensional pattern it is possible to prevent deformation of the thin metal housing itself.

When the thin metal housing is made by forming and joining the metal plate, a refrigerant sufficiently wetted inside is introduced through the inlet and outlet 330 according to a general heat pipe manufacturing process, connected to a vacuum pump, and vacuumed and then sealed.

FIG. 10A is a cross-sectional view taken along line DD ′ of FIG. 9. The thin metal housing is composed of an upper plate 301 having a corrugated solid pattern and a lower plate 302 having a linear groove 318 formed therein. In particular, the housing according to the present embodiment is a flat heating element attachment portion (10 ' ) is formed on the upper plate, the corrugated three-dimensional pattern is formed on the opposite side. This may vary depending on the environment in which the cooling device is to be installed, and the planar contour of the housing itself may also vary. As described above, the penetrating portion may be formed inside as shown in the embodiment of FIG. 7.

The linear groove 318 of the lower plate 302 is formed by the depth of the microgap to form a plurality of contact portions 308 which are in point contact with the inside of the scented surface 319 of the corrugated three-dimensional pattern, the role of which is described above As shown.

FIG. 10B is a cross-sectional view taken along line EE ′ of FIG. 9. The inside of the discharge surface 320 serves as a gaseous phase refrigerant moving path 305 through which the vaporized refrigerant can move as a hollow portion, and also the discharge surface 320 as a condensation part for radiating and condensing the refrigerant in the gas state. Releases heat through and returns to the liquid state.

A microgap g is formed between the fragrance surface 319 and the lower plate 302 to serve as a liquid refrigerant moving path 307 for transferring a liquid refrigerant in a capillary phenomenon.

FIG. 10C is a cross-sectional view taken along line FF ′ of FIG. 9. The linear grooves 318 formed at predetermined intervals on the lower plate 302 are in point contact with the fragrance face of the corrugated three-dimensional pattern to form a plurality of contacts.

FIG. 11A is a detailed view of portion (a) of FIG. 10B. A coolant is present in a liquid or gaseous state inside the thin metal housing including the upper plate 301 and the lower plate 302, and a thin film is formed on an inner surface of the housing.

As described above, by treating the inner surface of the housing with a surface treatment such as hairline processing or sandblasting, it is possible to better form the refrigerant film as described above. The refrigerant absorbs heat from the housing, vaporizes, and moves to a relatively low temperature through the gaseous coolant movement path 305 inside the discharge surface 320, and then, again, through the housing, in particular, has a large heat dissipation area. The heat is discharged and condensed through the side of the discharge surface 320 and flows along the liquid refrigerant path 307.

FIG. 11B is a detailed view showing part (b) of FIG. 10C. As shown in the drawing, the microgap g is formed between the scented surface of the upper plate three-dimensional pattern and the lower plate, and the microgap g has an appropriate gap in which capillary phenomenon may occur depending on the type of refrigerant. It can be readily seen that it has a constant relationship with the surface tension of the liquid refrigerant.

In the liquid refrigerant movement path 307 including the fine gap g, the point contact portions 308 at predetermined intervals are formed by the linear grooves 318, and the role thereof is as described above.

12 is a perspective view showing an embodiment in which a heat generating source attachment portion is formed on a lower plate of the cooling apparatus according to the present invention. (a) shows the upper surface, and (b) shows the lower surface. Unlike the embodiment shown in FIG. 9, when the heating source attachment portion 10 ′ is formed on the substantially flat lower plate 302, the three-dimensional pattern of the upper plate 301 may be continuously formed.

Figure 13 is a perspective view and a front view showing an embodiment formed of a flat lower plate and a thin upper plate of the cooling apparatus according to the present invention. (a) shows an upper surface, (b) shows a lower surface, and (c) is a front view which shows the upper surface of said (a). The thin metal housing 400 according to the present exemplary embodiment is formed by bonding a lower plate 402, which is a relatively thick metal plate, and a circumferential portion of an upper plate 401 having a three-dimensional pattern formed on a thin thin plate.

The heat generating unit attachment portion in contact with the heat generating source may be formed on one side of the upper plate, but is preferably formed on the flat lower plate. By making the lower plate 402 a relatively thick and flat metal plate, heat generated from a heat source can be spread evenly on the lower plate 402, and the housing 400 is bent in spite of the corrugated three-dimensional pattern of the upper plate 401. It can prevent deformation such as losing.

On the other hand, by using a thin thin plate as the upper plate 401, it is easy to mold various three-dimensional patterns, and is advantageous for rapid heat dissipation. The three-dimensional pattern of various shapes may be applied to the three-dimensional pattern of the upper plate as long as it can provide a liquid refrigerant moving path formed by a minute gap between the gaseous refrigerant moving path that is raised outward and the lower plate.

In the housing 400 according to the present embodiment, the upper plate 401 is formed with a corrugated three-dimensional pattern, and the inner surface thereof is in point contact with the lower plate by forming embossing at predetermined intervals toward the inside of the scented surface.

FIG. 14A is a cross-sectional view illustrating the GG ′ cross section shown in FIG. 13A. As shown in the figure, it consists of a thin upper plate 401 and a relatively thick and flat lower plate 402, and provides a gas phase refrigerant path and a liquid phase refrigerant path as in the embodiment shown in FIG. .

FIG. 14B is a cross-sectional view showing the HH ' cross section shown in FIG. 13A. An embossing 418 is formed on the scented surface of the corrugated three-dimensional pattern, and the inner surface thereof is in point contact with the lower plate 402.

Figure 15 is a perspective view, front view and sectional view showing another embodiment formed of a flat lower plate and a thin upper plate of the cooling apparatus according to the present invention. (a) is a perspective view which shows the upper surface, (b) is a front view which shows the upper surface, (c) is a top view which shows the II ' cross section shown to said (a).

The lower plate 402 is a relatively thick and flat metal plate as in the embodiment of FIG. For example, when the thickness of the upper plate 401 is 0.05mm, the lower plate 402 may have a thickness of about 0.1mm. Of course, both the upper plate and the lower plate should have a rigidity (rigidity) to maintain a constant shape with respect to the vacuum pressure and the limit thickness may vary depending on the metal material.

The top plate of the housing according to the present embodiment has a partial spherical groove 429 in a plane raised by a predetermined height. The groove 429 has the lowest point in point contact with the lower plate 402 to support the upper plate, and to maintain the liquid refrigerant in a state where the liquid refrigerant is wetted near the contact point 428. The gaseous refrigerant can move through the hollow portion 405 provided by the raised plane, that is, the gaseous refrigerant moving path, and when the amount of the liquid refrigerant condensed near the one contact point 428 407 increases, You can also move.

16 is a front view and a sectional view showing an embodiment including a closed heat dissipation unit of the cooling apparatus according to the present invention. (a) is the front view which shows the upper surface, (b) is sectional drawing which shows the JJ ' cross section shown to said (a). The thin metal housing 500 according to the present exemplary embodiment provides a hollow part 505, that is, a heat dissipation part, respectively closed by a three-dimensional pattern 520 partially raised outward on the upper plate or the lower plate.

The continuously raised three-dimensional pattern 520 forms a gaseous refrigerant moving path therein, and a liquid refrigerant is formed at both edges 507 to form a liquid refrigerant moving path. The cooling process through vaporization and condensation is as described above.

Fig. 17 is a front view and a sectional view showing an embodiment having an air vent of the cooling apparatus according to the present invention. (a) is a front view, (b) is sectional drawing which shows the KK ' cross section shown to said (a).

As can be applied to all of the cooling device described in the above embodiments, forming a vent hole 610 to pass through a portion on one side of the thin metal housing 600, provided across the vent hole 610 and both sides A stage is connected to the metal housing and has a plurality of heat dissipation fins 611 for dissipating the received heat.

The heat dissipation fins 611 may be integrally formed by bonding and modifying a part of the housing 600, or may be provided in close contact with each other so that heat can be transferred to the housing. In addition, it may be provided in the form of a cooling block having a separate heat sink and fan. Both sides of the circumference of the vent hole 610 should be joined, and a joining hole 612 ′ to which a fan may be attached may be provided at the joining part.

18 is a front view and a cross-sectional view showing an embodiment including an air vent and an integrated heat dissipation fin of the cooling apparatus according to the present invention. (a) is a perspective view, (b) is sectional drawing which shows the ventilation hole of said (a).

The heat dissipation fin 621 formed across the vent hole 610 may be integrally formed in the housing, and a distribution passage 622 may be formed therein to exchange heat through the housing and the refrigerant. In addition, the fan 612 may be coupled to smoothly supply cool air to the vent hole 610.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common knowledge in the field of the present invention that various substitutions and modifications and changes are possible without departing from the technical spirit of the present invention. It will be evident to those who have.

Therefore, the thin plate heat pipe structure cooling apparatus according to the present invention maximizes the cooling efficiency by uniformly spreading the heat generated from the heat source of the electronic circuit to a large area and radiating heat in a large area through an integrated cooling fin. It works.

By forming a capillary for the transfer of the liquid refrigerant by the micro-gap formed in the grid between the integrated cooling fins has a simple structure that does not require a separate component or additional manufacturing process, due to this simple structure various forms It may be provided in a shape suitable for an electronic circuit or an electronic device. In addition, since the total thickness may be manufactured in an ultra-thin plate having a thickness of 0.3 mm or less, there is an effect to be applied to electronic devices having a gentle curved shape.

In addition, even when the heating source is present on both the bottom and the upper surface, or when there is a protrusion on the electronic circuit to be cooled, the sheet metal housing can be freely formed in various forms, thereby being applicable to various restricted areas.

Claims (26)

A thin metal housing having both sides formed of a metal plate, and having a predetermined three-dimensional pattern formed on at least one side thereof, the both sides being joined to each other at a circumference thereof to provide a closed space; And A liquid or gaseous refrigerant filled in the sealed vacuum space inside the thin metal housing, The thin metal housing, A heat source attachment portion formed on at least one surface and in contact with the heat source; And It provided with a heat dissipation part which provides a hollow part in the inside by the three-dimensional pattern protruded outward from at least one surface of the said joined both sides, Cooling device with thin heat pipe structure. The method of claim 1, The metal plate is surface-treated so that the surface in contact with the coolant has a small contact angle with respect to the coolant, Cooling device with thin heat pipe structure. delete A thin metal housing having an upper and lower surfaces formed of a metal plate, a flat lower plate, and a top plate formed with a predetermined three-dimensional pattern, the upper plate being bonded to the lower plate and the periphery thereof to provide a sealed space of a predetermined pattern; And Refrigerant in a liquid or gas state filled in the sealed space inside the thin metal housing, The thin metal housing, A heat source attachment portion formed on at least one surface and in contact with the heat source; A heat dissipation part formed of a plurality of cooling fins protruding outward from the upper plate to provide a hollow part therein; And And a liquid coolant movement path formed by a microgap between an interface where the bottoms of adjacent cooling fins of the upper plate meet and the lower plate to cause capillary action. Cooling device with thin heat pipe structure. The method of claim 4, wherein The metal plate is surface-treated so that the surface in contact with the coolant has a small contact angle with respect to the coolant, Cooling device with thin heat pipe structure. The method of claim 5, The liquid refrigerant movement path is formed in contact with the two sides in point contact at a predetermined interval along the longitudinal direction to maintain the microgap of the remaining portion, Cooling device with thin heat pipe structure. The method of claim 4, wherein The thin metal housing includes a region in which the structure of the upper plate and the lower plate is formed upside down. Cooling device with thin heat pipe structure. The method of claim 4, wherein The thin metal housing includes a region penetrating up and down a part within its entire region. Cooling device with thin heat pipe structure. The method of claim 4, wherein The heat dissipation portion of the thin metal housing, the upper end thereof is formed flat, Cooling device with thin heat pipe structure. The method of claim 4, wherein The top plate is a metal thin plate, The lower plate is a relatively thick metal plate compared to the upper plate, Cooling device with thin heat pipe structure. A thin plate-shaped metal housing having both sides formed of a metal plate, and having a predetermined three-dimensional pattern formed on at least one side thereof, the both sides being joined to each other at a circumference thereof to provide a predetermined sealed space; And A liquid or gaseous refrigerant filled in the sealed vacuum space inside the thin metal housing, The thin metal housing, A heat source attachment portion formed on at least one surface and in contact with the heat source; At least one surface of the two surfaces is continuously raised to the outside to form a wide space between the two surfaces, and a vapor phase refrigerant path for allowing vaporized refrigerant to move away from and radiate heat closer to the heat generating source; And It is formed with a narrow gap between the two sides is provided with a liquid refrigerant moving path for condensing the refrigerant in the liquid state of the condensed liquid state after the heat dissipation by the capillary phenomenon, Cooling device with thin heat pipe structure. The method of claim 11, The metal plate is surface-treated so that the surface in contact with the coolant has a small contact angle with respect to the coolant, Cooling device with thin heat pipe structure. The method of claim 11, The liquid refrigerant movement path is formed in contact with the two-sided contact point at predetermined intervals along the longitudinal direction to maintain the microgap of the remaining portion, Cooling device with thin heat pipe structure. The method of claim 11, The gaseous refrigerant moving path is formed in a corrugated three-dimensional pattern having a plurality of discharge surfaces and fragrance surfaces connected to one surface of the thin metal housing long from the side close to the heat generating source and away from it. The liquid refrigerant movement path is formed of a fine gap formed between the scented surface of the corrugated three-dimensional pattern and the other surface of the thin metal housing, Cooling device with thin heat pipe structure. The method of claim 14, The other surface of the thin metal housing is formed with a plurality of linear grooves having the same depth as the microgap in a direction perpendicular to the corrugated three-dimensional pattern, Where both sides of the plurality of linear grooves and the sloping surface of the plurality of corrugated three-dimensional pattern cross each other in point contact so that the microgap of the remaining portion is maintained, Cooling device with thin heat pipe structure. The method of claim 11, A vent formed to penetrate a portion of the thin metal housing; A plurality of heat dissipation fins provided across the vent hole and connected to both sides of the metal housing to dissipate the received heat; And Further comprising a fan for supplying air to the plurality of heat dissipation fins, Cooling device with thin heat pipe structure. The method of claim 16, The plurality of heat dissipation fins are connected to both sides of the metal housing integrally and a flow path is formed therein to allow the refrigerant to flow. Cooling device with thin heat pipe structure. The method of claim 11, A vent formed to penetrate a portion of the thin metal housing; And Further comprising a heat dissipation block connected to the periphery of the vent hole, the heat dissipation block having a plurality of heat dissipation fins receiving heat from the thin metal housing by heat conduction and a fan for supplying air to the heat dissipation fins, Cooling device with thin heat pipe structure. A thin plate-shaped metal housing comprising a lower plate which is a flat and relatively thick metal plate, and a metal plate having a predetermined three-dimensional pattern, the upper plate being bonded to the lower plate and its periphery to provide a sealed space of a predetermined pattern; And A liquid or gaseous refrigerant filled in the sealed vacuum space inside the thin metal housing, The thin metal housing, A heat source attachment portion formed on at least one surface and in contact with the heat source; A gaseous refrigerant movement path formed by a three-dimensional pattern continuously raised outwardly from the upper plate, and having a wide distance from the lower plate so that the vaporized refrigerant can move away from and radiate heat away from the heat source; And It is formed by a three-dimensional pattern of the upper plate, is formed in a fine gap with a narrow gap between the lower plate and having a liquid refrigerant moving path for condensing the refrigerant in the liquid state condensed after heat dissipation by the capillary phenomenon, Cooling device with thin heat pipe structure. The method of claim 19, The metal plate is surface-treated so that the surface in contact with the coolant has a small contact angle with respect to the coolant, Cooling device with thin heat pipe structure. The method of claim 19, The liquid refrigerant movement path is formed in contact with the two sides in point contact at a predetermined interval along the longitudinal direction to maintain the microgap of the remaining portion, Cooling device with thin heat pipe structure. The method of claim 19, The gaseous refrigerant moving path is formed by a corrugated three-dimensional pattern formed on the upper plate and long connected from the side close to the heat generating source to the far side and having a plurality of reflection surfaces and fragrance surfaces, The liquid refrigerant movement path is formed as a fine gap between the fragrance surface of the corrugated three-dimensional pattern and the lower plate, Cooling device with thin heat pipe structure. The method of claim 22, Embossing is formed on the inclined surface of the corrugated three-dimensional pattern inward at a predetermined interval, the embossing is in contact with the lower plate to maintain the micro-gap of the remaining portion, Cooling device with thin heat pipe structure. The method of claim 19, A vent formed to penetrate a portion of the thin metal housing; A plurality of heat dissipation fins provided across the vent hole and connected to both sides of the metal housing to dissipate the received heat; And Further comprising a fan for supplying air to the plurality of heat dissipation fins, Cooling device with thin heat pipe structure. The method of claim 24, The plurality of heat dissipation fins are connected to both sides of the metal housing integrally and a flow path is formed therein to allow the refrigerant to flow. Cooling device with thin heat pipe structure. The method of claim 19, A vent formed to penetrate a portion of the thin metal housing; And Further comprising a heat dissipation block connected to the periphery of the vent hole, the heat dissipation block having a plurality of heat dissipation fins receiving heat from the thin metal housing by heat conduction and a fan for supplying air to the heat dissipation fins, Cooling device with thin heat pipe structure.