KR100446842B1 - 반도체웨이퍼의수납용기,수납구조및수납.인출방법 - Google Patents
반도체웨이퍼의수납용기,수납구조및수납.인출방법 Download PDFInfo
- Publication number
- KR100446842B1 KR100446842B1 KR1019970702784A KR19970702784A KR100446842B1 KR 100446842 B1 KR100446842 B1 KR 100446842B1 KR 1019970702784 A KR1019970702784 A KR 1019970702784A KR 19970702784 A KR19970702784 A KR 19970702784A KR 100446842 B1 KR100446842 B1 KR 100446842B1
- Authority
- KR
- South Korea
- Prior art keywords
- spacer sheet
- wafer
- semiconductor wafer
- container
- container body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 title claims abstract description 219
- 238000003860 storage Methods 0.000 title claims abstract description 91
- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 125000006850 spacer group Chemical group 0.000 claims abstract description 101
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 30
- 239000000835 fiber Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920000128 polypyrrole Polymers 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 abstract description 12
- 230000003068 static effect Effects 0.000 abstract description 12
- -1 polyethylene Polymers 0.000 description 10
- 239000004698 Polyethylene Substances 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- 239000006260 foam Substances 0.000 description 6
- 238000004049 embossing Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920006327 polystyrene foam Polymers 0.000 description 2
- 239000011496 polyurethane foam Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Packaging For Recording Disks (AREA)
Abstract
Description
Claims (15)
- 반도체 웨이퍼가 스페이서 시트를 사이에 두고 다수매 포개어져 수납되는 통부를 갖고, 표면 저항치 106Ω/□ 이하의 도전성 플라스틱으로 이루어지는 용기본체와, 상기 용기본체에 덮여지는 덮개로 이루어지며,상기 통부는 반도체 웨이퍼의 수납 및/또는 인출을 위한 픽업아암이 들어가는 적어도 하나의 슬릿을 가지며,상기 용기본체는 평면도에서 보아 사각형상을 이루는 기초부에, 상기 통부가 세워져 설치되어 이루어지고,상기 덮개는 평면도에서 보아 상기 용기본체의 기초부의 평면도에서 본 형상과 거의 동일한 사각형상을 이루며,상기 덮개와 상기 용기본체는 상대적인 회전에 의해, 양자의 평면도에서 본 형상이 일치하도록 결합하는 것을 특징으로 하는 반도체 웨이퍼의 수납용기.
- 제 1 항에 기재된 용기 본체 내에 반도체 웨이퍼가 스페이서 시트를 사이에 두고 다수매 포개어져 수납된 것을 특징으로 하는 반도체 웨이퍼의 수납구조.
- 제 2 항에 있어서, 말단부 쿠션재가 상기 다수매 포개어져 수납된 반도체 웨이퍼의 상하 말단부에 배치된 것을 특징으로 하는 반도체 웨이퍼의 수납구조.
- 제 2 항에 있어서, 상기 스페이서 시트의 표면저항이 106Ω/□ 이하인 것을 특징으로 하는 반도체 웨이퍼의 수납구조.
- 제 4 항에 있어서, 상기 스페이서 시트가 폴리피롤을 복합화한 섬유를 사용한 전도성의 합성지인 것을 특징으로 하는 반도체 웨이퍼의 수납구조.
- 제 4 항에 있어서, 상기 스페이서 시트가 적어도 한쪽의 면에, 복수의 오목 형상부 및/또는 볼록형상부를 가지는 것을 특징으로 하는 반도체 웨이퍼의 수납구조.
- 제 4 항에 있어서, 상기 스페이서 시트가 주위에서 내측으로 잘라넣어진 커트라인을 가지는 것을 특징으로 하는 반도체 웨이퍼의 수납구조.
- 제 6 항에 있어서, 상기 스페이서 시트가 주위에서 내측으로 잘라넣어진 커트라인을 가지는 것을 특징으로 하는 반도체 웨이퍼의 수납구조.
- 하나의 픽업아암을 사용하여, 적어도 하나의 슬릿을 구비한 통부를 가지는 용기본체의 상기 통부내에, 반도체 웨이퍼, 스페이서 시트를 수납하고, 혹은 상기통부내에서 이들을 인출하는 반도체 웨이퍼의 수납·인출 방법에 있어서,상기 픽업아암은 상기 적어도 하나의 슬릿에 들어가고, 상기 반도체 웨이퍼와 상기 스페이서 시트를, 교대로, 상기 통부내에 수납하고, 또는 상기 통부내에서 인출하는 것을 특징으로 하는 반도체 웨이퍼의 수납·인출 방법.
- 2개의 픽업아암을 사용하고, 적어도 하나의 슬릿을 구비한 통부를 가지는 용기본체의 상기 통부내에, 반도체 웨이퍼, 스페이서 시트를 수납하고, 혹은 상기 통부내에서 이들을 인출하는 반도체 웨이퍼의 수납·인출 방법에 있어서,상기 픽업아암중 한쪽은 상기 슬릿에 들어가고, 상기 픽업아암중 다른쪽은 상기 한쪽의 픽업아암이 들어가는 슬릿과, 동일한 슬릿 또는 다른 슬릿에 들어가고. 상기 반도체 웨이퍼와 상기 스페이서 시트를, 교대로, 상기 통부내에 수납하고, 또는 상기 통부내에서 인출하는 것을 특징으로 하는 반도체 웨이퍼의 수납·인출 방법.
- 제 1 항에 있어서, 상기 스페이서 시트의 표면저항이 106Ω/□ 이하인 것을 특징으로 하는 반도체 웨이퍼의 수납용기.
- 제 1 항에 있어서, 상기 스페이서 시트가 폴리피롤을 복합화한 섬유를 사용한 전도성의 합성지인 것을 특징으로 하는 반도체 웨이퍼의 수납용기.
- 제 1 항에 있어서, 상기 스페이서 시트가 적어도 한쪽의 면에, 복수의 오목 형상부 및/또는 볼록형상부를 가지는 것을 특징으로 하는 반도체 웨이퍼의 수납용기.
- 제 5 항에 있어서, 상기 스페이서 시트가 적어도 한쪽의 면에, 복수의 오목 형상부 및/또는 볼록형상부를 가지는 것을 특징으로 하는 반도체 웨이퍼의 수납구조.
- 제 5 항에 있어서, 상기 스페이서 시트가 주위에서 내측으로 잘라넣어진 커트라인을 가지는 것을 특징으로 하는 반도체 웨이퍼의 수납구조.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24527795 | 1995-08-30 | ||
JP95-245277 | 1995-08-30 | ||
JP96-204261 | 1996-07-15 | ||
JP20426196A JPH09129719A (ja) | 1995-08-30 | 1996-07-15 | 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970707579A KR970707579A (ko) | 1997-12-01 |
KR100446842B1 true KR100446842B1 (ko) | 2004-12-04 |
Family
ID=26514373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970702784A Expired - Lifetime KR100446842B1 (ko) | 1995-08-30 | 1996-08-30 | 반도체웨이퍼의수납용기,수납구조및수납.인출방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6533123B1 (ko) |
EP (1) | EP0789393B1 (ko) |
JP (1) | JPH09129719A (ko) |
KR (1) | KR100446842B1 (ko) |
AT (1) | ATE392009T1 (ko) |
DE (1) | DE69637489T2 (ko) |
WO (1) | WO1997008746A1 (ko) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2785257B1 (fr) * | 1998-10-28 | 2001-01-19 | St Microelectronics Sa | Caisse pour plaquettes semiconductrices |
US6193090B1 (en) | 1999-04-06 | 2001-02-27 | 3M Innovative Properties Company | Reusable container |
US6662950B1 (en) | 1999-10-25 | 2003-12-16 | Brian R. Cleaver | Wafer shipping and storage container |
US6848579B2 (en) * | 1999-10-25 | 2005-02-01 | Brian Cleaver | Shock absorbing apparatus and method |
JP4330761B2 (ja) | 2000-04-17 | 2009-09-16 | 信越ポリマー株式会社 | ウェーハ輸送容器のサポート具 |
FR2819794B1 (fr) * | 2001-01-22 | 2003-09-05 | Excel Services Emballages Sa | Boite a fermeture controlee pour le conditionnement de plaquettes distinees a la fabrication de circuits integres |
JP2002324835A (ja) * | 2001-04-26 | 2002-11-08 | Fuji Electric Co Ltd | 薄板搬送治具 |
US20030056471A1 (en) * | 2001-07-12 | 2003-03-27 | Linker Frank V. | Wafer jar loader method, system and apparatus |
US7059475B2 (en) * | 2001-10-04 | 2006-06-13 | Entegris, Inc. | System for cushioning wafer in wafer carrier |
JP3751246B2 (ja) | 2001-11-13 | 2006-03-01 | 大日本スクリーン製造株式会社 | 薄膜形成装置および搬送方法 |
US7425362B2 (en) | 2002-09-06 | 2008-09-16 | E.Pak International, Inc. | Plastic packaging cushion |
CN1942304A (zh) * | 2002-10-09 | 2007-04-04 | 诚实公司 | 用于设备处理系统的高温高强度可着色材料 |
US6886696B2 (en) * | 2003-01-15 | 2005-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer container with removable sidewalls |
US6926150B2 (en) * | 2003-02-05 | 2005-08-09 | Texas Instruments Incorporated | Protective interleaf for stacked wafer shipping |
JPWO2004089784A1 (ja) * | 2003-04-10 | 2006-07-06 | アキレス株式会社 | ウエハ保護シート |
KR20070024453A (ko) * | 2003-09-11 | 2007-03-02 | 니폰 제온 가부시키가이샤 | 스페이서 시트, 스페이서 시트를 이용하여 제조한 제품 및판형상물의 수송방법 |
US20050072121A1 (en) * | 2003-10-06 | 2005-04-07 | Texas Instruments Incorporated | Method and system for shipping semiconductor wafers |
US20050098473A1 (en) * | 2003-11-10 | 2005-05-12 | 3M Innovative Properties Company | Container for containing semiconductor wafers |
US20060000747A1 (en) * | 2004-06-30 | 2006-01-05 | 3M Innovative Properties Company | Shipping container for integrated circuit wafers |
US6933033B1 (en) * | 2004-07-13 | 2005-08-23 | Illinois Tool Works Inc. | Scribed interleaf separator wafer packaging |
US20060105498A1 (en) * | 2004-08-13 | 2006-05-18 | Cheng-Chung Huang | Wafer stack separator |
US7299927B2 (en) * | 2005-02-07 | 2007-11-27 | Peak Plastic & Metal Products (International) Limited | Stackable wafer container with raised handle and ribs |
WO2009048456A1 (en) * | 2007-10-12 | 2009-04-16 | Peak Plastic & Metal Products (International) Limited | Wafer container with staggered wall structure |
JP4838818B2 (ja) * | 2008-01-18 | 2011-12-14 | ミライアル株式会社 | クッションシート付ウエハ収納容器 |
US8556079B2 (en) * | 2009-08-26 | 2013-10-15 | Texchem Advanced Products Incorporated Sdn Bhd | Wafer container with adjustable inside diameter |
US8813964B2 (en) * | 2009-08-26 | 2014-08-26 | Texchem Advanced Products Incorporated Sdn. Bhd. | Wafer container with recessed latch |
US8109390B2 (en) * | 2009-08-26 | 2012-02-07 | Texchem Advanced Products Incorporated Sdn Bhd | Wafer container with overlapping wall structure |
WO2012029217A1 (ja) * | 2010-08-30 | 2012-03-08 | シャープ株式会社 | 包装セット |
WO2012058676A2 (en) * | 2010-10-29 | 2012-05-03 | Entegris, Inc. | Substrate shipper |
CN106364794B (zh) | 2010-11-30 | 2019-11-19 | 康宁股份有限公司 | 包装多个玻璃板的方法及玻璃板的包装 |
JP5976307B2 (ja) * | 2011-12-06 | 2016-08-23 | アキレス株式会社 | ウェーハ保護クッション材の製造方法 |
US9543175B2 (en) | 2013-09-25 | 2017-01-10 | International Business Machines Corporation | Package assembly for thin wafer shipping and method of use |
JP6391324B2 (ja) * | 2014-06-30 | 2018-09-19 | アキレス株式会社 | ウエハ保護フィルム |
JP6514603B2 (ja) * | 2015-08-07 | 2019-05-15 | アキレス株式会社 | 基板収納容器 |
JP6545601B2 (ja) | 2015-10-23 | 2019-07-17 | アキレス株式会社 | セパレータ |
MY192574A (en) | 2017-02-06 | 2022-08-29 | Achilles Corp | Substrate housing container |
US10870207B2 (en) * | 2017-12-14 | 2020-12-22 | Stmicroelectronics (Malta) Ltd | Barrel cap attach trays |
CN109524359B (zh) * | 2018-11-13 | 2020-06-19 | 常州信息职业技术学院 | 一种翻转夹持式芯片封装机构 |
JP3240633U (ja) * | 2020-02-10 | 2023-01-25 | プレイリー プラスティック ハードウェア カンパニー リミテッド | 回転により仕切り空間を変更可能な保存容器 |
EP4092721A1 (en) | 2021-05-21 | 2022-11-23 | STMicroelectronics S.r.l. | Containment and transportation tray for electronic components having small dimensions and low weight |
KR102595526B1 (ko) * | 2021-09-07 | 2023-10-30 | 주식회사 삼에스코리아 | 웨이퍼 이송 박스 |
CN115818216A (zh) * | 2021-09-16 | 2023-03-21 | 柯尼卡美能达株式会社 | 部件供给装置 |
WO2024216456A1 (en) * | 2023-04-17 | 2024-10-24 | Viavi Solutions Suzhou Co., Ltd. | Cover for a wafer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669328A (ja) * | 1992-08-15 | 1994-03-11 | Achilles Corp | 半導体ウェーハ収納容器 |
JPH06204315A (ja) * | 1992-12-25 | 1994-07-22 | Mitsubishi Materials Corp | 半導体ウェーハおよびその保管方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1427772A1 (de) * | 1965-11-23 | 1968-12-12 | Telefunken Patent | Verfahren zum Zerlegen einer Halbleiterscheibe in einzelne Halbleiterplaettchen |
US3392824A (en) * | 1966-04-27 | 1968-07-16 | Stanley F. Flynn | Packaging and cushioning device |
US4203127A (en) * | 1977-07-18 | 1980-05-13 | Motorola, Inc. | Package and method of packaging semiconductor wafers |
IT209910Z2 (it) * | 1987-02-06 | 1988-11-04 | Sgs Microelettronica Spa | Contenitore porta-wafer o fretta di slicio, utilizzato perl'immagazzinamento e/o spedizione sotto vuoto degli stessi. |
US4787508A (en) * | 1987-10-06 | 1988-11-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit wafer container |
US5270901A (en) * | 1991-11-08 | 1993-12-14 | Presstek, Incorporated | Charge-dissipating packaging system |
US5366079A (en) * | 1993-08-19 | 1994-11-22 | Taiwan Semiconductor Manufacturing Company | Integrated circuit wafer and retainer element combination |
US5553711A (en) * | 1995-07-03 | 1996-09-10 | Taiwan Semiconductor Manufacturing Company | Storage container for integrated circuit semiconductor wafers |
US5759006A (en) * | 1995-07-27 | 1998-06-02 | Nitto Denko Corporation | Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith |
US5551571A (en) * | 1995-09-18 | 1996-09-03 | Vanguard International Semiconductor Corp. | Semiconductor wafer container |
-
1996
- 1996-07-15 JP JP20426196A patent/JPH09129719A/ja active Pending
- 1996-08-30 WO PCT/JP1996/002441 patent/WO1997008746A1/ja active IP Right Grant
- 1996-08-30 AT AT96928707T patent/ATE392009T1/de not_active IP Right Cessation
- 1996-08-30 KR KR1019970702784A patent/KR100446842B1/ko not_active Expired - Lifetime
- 1996-08-30 EP EP96928707A patent/EP0789393B1/en not_active Expired - Lifetime
- 1996-08-30 DE DE69637489T patent/DE69637489T2/de not_active Expired - Lifetime
-
1997
- 1997-04-30 US US08/846,256 patent/US6533123B1/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669328A (ja) * | 1992-08-15 | 1994-03-11 | Achilles Corp | 半導体ウェーハ収納容器 |
JPH06204315A (ja) * | 1992-12-25 | 1994-07-22 | Mitsubishi Materials Corp | 半導体ウェーハおよびその保管方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH09129719A (ja) | 1997-05-16 |
US6533123B1 (en) | 2003-03-18 |
DE69637489T2 (de) | 2009-06-04 |
WO1997008746A1 (fr) | 1997-03-06 |
ATE392009T1 (de) | 2008-04-15 |
EP0789393B1 (en) | 2008-04-09 |
EP0789393A4 (en) | 2006-07-19 |
EP0789393A1 (en) | 1997-08-13 |
KR970707579A (ko) | 1997-12-01 |
DE69637489D1 (de) | 2008-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100446842B1 (ko) | 반도체웨이퍼의수납용기,수납구조및수납.인출방법 | |
US5553711A (en) | Storage container for integrated circuit semiconductor wafers | |
KR100432975B1 (ko) | 반도체웨이퍼의수납·인출장치및이것에이용되는반도체웨이퍼의운반용기 | |
US5706951A (en) | Packing structure for container for semiconductor wafer and packing method for container | |
US5366079A (en) | Integrated circuit wafer and retainer element combination | |
JP2910684B2 (ja) | ウエハー容器 | |
CN103314433A (zh) | 制造、运输及储存过程中保护ic晶圆的包装系统 | |
JP5329093B2 (ja) | ボード運搬ユニット | |
US20020144927A1 (en) | IC wafer cushioned separators | |
US20050098473A1 (en) | Container for containing semiconductor wafers | |
JP4329536B2 (ja) | 半導体ウェハーの収納具 | |
US6168026B1 (en) | Component carrier having high strength pocket | |
US6848579B2 (en) | Shock absorbing apparatus and method | |
WO2004019387A1 (en) | Substrate processing system | |
US5551571A (en) | Semiconductor wafer container | |
WO1996002328A1 (en) | Conveyor cassette for wafers | |
KR102111868B1 (ko) | 세퍼레이터 | |
JP7061857B2 (ja) | リングスペーサー | |
JPH05218185A (ja) | ウェハキャリアボックス | |
JP2004311779A (ja) | 半導体ウェーハ収納容器及び半導体ウェーハの搬送方法 | |
TW382614B (en) | Storage structure of semiconductor wafer | |
CN211088229U (zh) | 多片水平放置晶圆盒及隔离环 | |
JP7032086B2 (ja) | 板状物搬送容器 | |
US6044976A (en) | Horizontal storage and transport container | |
JP4547712B2 (ja) | 半導体ウェハ包装部材 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 19970428 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20010604 Comment text: Request for Examination of Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20030922 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20040622 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20040824 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20040825 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20070709 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20080624 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20090811 Start annual number: 6 End annual number: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20100603 Start annual number: 7 End annual number: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20110621 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20120614 Start annual number: 9 End annual number: 9 |
|
FPAY | Annual fee payment |
Payment date: 20130529 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20130529 Start annual number: 10 End annual number: 10 |
|
FPAY | Annual fee payment |
Payment date: 20140625 Year of fee payment: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20140625 Start annual number: 11 End annual number: 11 |
|
FPAY | Annual fee payment |
Payment date: 20150611 Year of fee payment: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20150611 Start annual number: 12 End annual number: 12 |
|
PC1801 | Expiration of term |