KR100431442B1 - Water proof thermister for automobile applications - Google Patents
Water proof thermister for automobile applications Download PDFInfo
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- KR100431442B1 KR100431442B1 KR10-2002-0002777A KR20020002777A KR100431442B1 KR 100431442 B1 KR100431442 B1 KR 100431442B1 KR 20020002777 A KR20020002777 A KR 20020002777A KR 100431442 B1 KR100431442 B1 KR 100431442B1
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- thermistor
- polyphenylene sulfide
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- molding
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title description 3
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 25
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 25
- 238000009792 diffusion process Methods 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 7
- 229910052736 halogen Inorganic materials 0.000 claims description 6
- 150000002367 halogens Chemical class 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000003063 flame retardant Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 229910002601 GaN Inorganic materials 0.000 claims description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- FQDSYGKTHDFFCM-UHFFFAOYSA-N beryllium sulfide Chemical compound S=[Be] FQDSYGKTHDFFCM-UHFFFAOYSA-N 0.000 claims description 2
- FFBGYFUYJVKRNV-UHFFFAOYSA-N boranylidynephosphane Chemical compound P#B FFBGYFUYJVKRNV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000001746 injection moulding Methods 0.000 abstract description 2
- 230000035945 sensitivity Effects 0.000 abstract description 2
- 230000035515 penetration Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 5
- -1 polybutylene terephthalate Polymers 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 229920006334 epoxy coating Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- YEACGXMAEGBJSM-UHFFFAOYSA-N 1,3,5-triphenyl-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(C=2C=CC=CC=2)C(=O)N(C=2C=CC=CC=2)C(=O)N1C1=CC=CC=C1 YEACGXMAEGBJSM-UHFFFAOYSA-N 0.000 description 1
- IHGSAQHSAGRWNI-UHFFFAOYSA-N 1-(4-bromophenyl)-2,2,2-trifluoroethanone Chemical compound FC(F)(F)C(=O)C1=CC=C(Br)C=C1 IHGSAQHSAGRWNI-UHFFFAOYSA-N 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- LCVKPRLPIZVVIX-UHFFFAOYSA-N carbonic acid;hydrobromide Chemical compound Br.OC(O)=O LCVKPRLPIZVVIX-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004230 steam cracking Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 온도의 변화에 따라 그 무부하 저항값이 변화하는 특성을 가진 써미스터에 관한 것으로, 써미스터 제조시 열확산계수가 0.3 x ㎡/s 이상인 열전도성 폴리페닐렌설파이드계 수지로 사출성형하여 공수를 줄이고 수분의 침투를 막으면서 온도민감성이 향상된 자동차 에어컨용 써미스터를 제공한다.The present invention relates to a thermistor having a characteristic that its no-load resistance value changes with temperature change, and the manufacturing process is reduced by injection molding with a thermally conductive polyphenylene sulfide resin having a thermal diffusion coefficient of 0.3 x ㎡ / s or more. It provides thermistors for automotive air conditioners with improved temperature sensitivity while preventing the penetration of moisture.
Description
본 발명은 온도의 변화에 따라 그 무부하 저항값이 변화하는 특성을 가진 써미스터에 관한 것으로, 특히 자동차 에어콘용 방수 써미스터에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermistor having the characteristic that its no-load resistance value changes with temperature change, and more particularly, to a waterproof thermistor for an automobile air conditioner.
써미스터(Thermally Sensitive Resister)는 "온도에 민감한 저항기"라는 뜻에서 써미스터(Thermister)라 불리우는 반도체 소자이다. 재질은 망간, 니켈, 코발트, 철, 구리 등의 금속 산화물의 소결체로 되어 있으며, NTC(Negative Temperature Coefficient Thermistor)라고 하는 온도 상승에 따라 저항치가 감소하는 특성을 이용해 온도를 감지하는 것이다.Thermally Sensitive Resister is a semiconductor device called a thermister in the sense of "temperature sensitive resistor." The material is made of a sintered body of metal oxides such as manganese, nickel, cobalt, iron, and copper, and senses the temperature by using a characteristic that the resistance decreases as the temperature rises, called a negative temperature coefficient thermistor (NTC).
종래의 써미스터는 에폭시 도포 또는 몰딩을 하여 사용하는 것이 일반적인데, 에폭시 도포공정 특성상 숙련된 작업자가 필요하며, 에폭시 도포 후 건조공정이 필요하여 제조시간이 오래 걸리며, 생산 로트(lot)에 따라서 에폭시의 주제, 경화제 배합비율이 일정치 않게 되므로 또 다른 품질 문제를 야기시킨다(한국공개실용신안공보 제97-59418). 또한 에폭시 건조 과정에서 전선피복의 가소제 성분을 휘발시키므로 전선 피복이 부러지는 불량이 발생할 수 있다. 특히, 자동차 에어콘용 방수 써미스터로 사용되기 위한 증기가압시험에서 에폭시가 깨지는 문제가 발생되기도 한다.Conventional thermistors are generally applied by epoxy coating or molding, which requires a skilled worker due to the characteristics of the epoxy coating process, requires a drying process after epoxy coating, and takes a long time to manufacture, depending on the production lot. Since the ratio of the main ingredient and the curing agent becomes inconsistent, it causes another quality problem (Korean Utility Model Publication No. 97-59418). In addition, since the plasticizer component of the wire coating is volatilized during the epoxy drying process, a failure in breaking the wire coating may occur. In particular, the steam cracking test for use as a waterproof thermistor for an automobile air conditioner may cause the epoxy to be broken.
본 발명은 상기 종래 기술의 문제점을 고려하여, 자동차 에어콘용 방수 써미스터로 사용되기 위한 증기가압실험 후에도 방수 및 전기적성질이 유지되고, 온도 감응시간이 우수한 자동차 에어콘용 방수 써미스터를 제공하는 것을 목적으로 한다.In view of the problems of the prior art, an object of the present invention is to provide a waterproof thermistor for an automotive air conditioner having excellent waterproofing and electrical properties and excellent temperature response time even after steam pressure test for use as a waterproof thermistor for an automobile air conditioner. .
도 1은 종래의 에폭시 수지의 몰딩부를 포함하는 방수 써미스터를 나타내는 개략도이다.1 is a schematic view showing a waterproof thermistor including a molding part of a conventional epoxy resin.
도 2은 본 발명의 폴리페닐렌설파이드계 열전도성 수지의 몰딩부를 포함하는 방수 써미스터를 나타내는 개략도이다.2 is a schematic view showing a waterproof thermistor including a molding part of the polyphenylene sulfide-based thermal conductive resin of the present invention.
본 발명은 상기 목적을 달성하기 위하여, 자동차 에어콘용 써미스터에 있어서,The present invention, in order to achieve the above object, in the thermistor for automobile air conditioner,
a) 폴리페닐렌설파이드 수지 10 내지 95 중량%; 및a) 10 to 95% by weight of polyphenylene sulfide resin; And
b) 세라믹 고체 90 내지 5 중량%b) 90 to 5% by weight of ceramic solids
를 함유하고, 열확산계수가 적어도 0.3 x 10-6㎡/s인 폴리페닐렌설파이드계 열전도성 수지의 몰딩부를A molded part of the polyphenylene sulfide-based thermal conductive resin containing a resin having a thermal diffusion coefficient of at least 0.3 × 10 −6 m 2 / s
를 포함하는 자동차 에어콘용 써미스터를 제공한다.It provides a thermistor for a car air conditioner comprising a.
이하에서 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail.
본 발명은 열전도도가 향상되어 열확산계수(α=k/ρCp, 여기에서 α는 열확산 계수이고, k는 열전도도(W/m-K)이고, ρ는 밀도이고, Cp는 열용량)가 0.3 x 10-6㎡/s 이상인 열전도성 폴리페닐렌 설파이드계 수지를 써미스터의 온도센서부에 몰딩함으로써 제조되는 써미스터가 증기가압실험 후에도 방수 및 전기적성질이 유지되고 온도감응시간이 우수하도록 한 것이다. 따라서 자동차 에어콘용 방수 써미스터로 바람직하다.In the present invention, the thermal conductivity is improved so that the thermal diffusion coefficient (α = k / ρCp, where α is the thermal diffusion coefficient, k is the thermal conductivity (W / mK), ρ is the density, and Cp is the heat capacity) of 0.3 x 10- . The thermistor manufactured by molding a thermally conductive polyphenylene sulfide-based resin of 6 m 2 / s or more into the temperature sensor part of the thermistor is designed to maintain waterproof and electrical properties and excellent temperature response time even after steam pressure test. Therefore, it is desirable as a waterproof thermistor for automobile air conditioners.
열확산계수가 낮은 소재의 경우 얇은 두께로 몰딩을 하면 빠른 온도 감응시간을 얻을 수 있지만, 두께를 얇게 하는데는 한계가 있으므로, 열확산계수가 0.3 x 10-6㎡/s 이상인 소재를 사용하는 것이 바람직하다.In the case of a material having a low thermal diffusion coefficient, molding at a thin thickness can give a quick temperature response time. However, since the thickness is limited, it is preferable to use a material having a thermal diffusion coefficient of 0.3 x 10 -6 m 2 / s or more. .
일반 폴리페닐렌 설파이드 수지로 몰딩을 한 경우에 방수성능은 유지되지만 열확산계수가 0.1 x 10-6㎡/s 이하이면 온도감응성이 떨어진다. 또한 폴리비닐클로라이드나 폴리카보네이트와 같이 결정이 작거나 없는 수지로 몰딩을 한 경우에는 방수성능을 유지할 수 없다. 폴리부틸렌테레프탈레이트로 몰딩한 경우는 방수성능이 있지만, 증기가압실험 후에 소재가 분해되어 방수성능이 떨어진다.In case of molding with a general polyphenylene sulfide resin, waterproof performance is maintained, but temperature sensitivity is inferior when the thermal diffusion coefficient is 0.1 x 10 -6 m 2 / s or less. In addition, when molding with a resin having small or no crystals such as polyvinyl chloride or polycarbonate, the waterproof performance cannot be maintained. In the case of molding with polybutylene terephthalate, there is a waterproof performance, but after the vapor pressure test, the material is decomposed and the waterproof performance is deteriorated.
따라서 결정형 열가소성 수지(semi-crystalline thermoplastics)로, 내열성이 있으며, 결정을 가지고 있으며, 또한 열전도도가 우수한 열전도성 폴리페닐렌설파이드계 수지로 온도센서부를 몰딩할 경우에 방수성능이 있으며, 열감응성이 좋은자동차용 방수 써미스터를 제조할 수 있다. 도 1은 본 발명의 써미스터를 나타내었다.Therefore, it is a semi-crystalline thermoplastics, which has heat resistance, has crystals, and is thermally conductive polyphenylene sulfide-based resin with excellent thermal conductivity. Good waterproof waterproof thermistors can be manufactured. 1 shows a thermistor of the present invention.
본 발명은 이를 위하여, 상기 폴리페닐렌설파이드계 열전도성 수지는The present invention for this purpose, the polyphenylene sulfide-based thermal conductive resin
a) 폴리페닐렌설파이드 수지 10 내지 95 중량%, 및 b) 세라믹 고체 90 내지 5 중량%를 배럴온도 250 내지 340 ℃의 이축압출기에서 압출 혼합하는 단계를 포함하는 방법으로 제조되는 것이 바람직하다.It is preferably prepared by a process comprising the steps of a) 10 to 95% by weight of polyphenylene sulfide resin, and b) 90 to 5% by weight of a ceramic solid in a twin screw extruder at a barrel temperature of 250 to 340 ° C.
특히 상기 b)의 세라믹 고체는 상온에서의 열전도도가 적어도 300 W/mㆍK인 실리콘카바이드, 보론 나이트라이드, 다이아몬드, 베릴륨옥사이드, 보론 포스파이드, 알루미늄 나이트라이드, 베릴륨 설파이드, 보론 아제나이드, 실리콘, 갈륨나이트라이드, 알루미늄 포스파이드, 갈륨 포스파이드로 이루어지는 군으로부터 1 종 이상 선택되는 것이 바람직하다.In particular, the ceramic solid of b) has silicon carbide, boron nitride, diamond, beryllium oxide, boron phosphide, aluminum nitride, beryllium sulfide, boron azenide, silicon having a thermal conductivity of at least 300 W / m · K at room temperature. It is preferable to select at least 1 type from the group which consists of gallium nitride, aluminum phosphide, and gallium phosphide.
또한 상기 폴리페닐렌설파이드계 열전도성 수지는In addition, the polyphenylene sulfide-based thermal conductive resin
c) ⅰ) 플레이크(flake), ⅱ) 유리섬유 또는 카본섬유, 및 ⅲ) 할로겐 또는 비할로겐계 난연제로 이루어진 군으로부터 1 종 이상 선택되는 충전재 5 내지 15 중량%를 추가로 포함할 수도 있다.c) 5 to 15% by weight of a filler selected from the group consisting of iii) flakes, ii) glass fibers or carbon fibers, and iii) halogen or non-halogen-based flame retardants.
특히 상기 ⅲ)의 할로겐 또는 비할로겐계 난연제는 브롬계 카보네이트 올리고머, Sb2O3, 인계 및 적인계 난연제, 멜라민시아누레이트, 멜라민, 트리페닐 아이소시아누레이트, 멜라민 포스페이트, 멜라민 파이로포스페이트, 암모늄 폴리소스페이트, 알킬 아민 포스페이트, 멜라민 수지 및 징크보레이트로 이루어진 군으로부터1 종 이상 선택되는 것이 바람직하다.In particular, the halogen or non-halogen flame retardant of iii) bromine carbonate oligomer, Sb 2 O 3 , phosphorus and phosphate flame retardant, melamine cyanurate, melamine, triphenyl isocyanurate, melamine phosphate, melamine pyrophosphate, It is preferable to select at least one member from the group consisting of ammonium polyphosphate, alkyl amine phosphate, melamine resin and zinc borate.
따라서 본 발명은 써미스터 제조시 열확산계수가 0.3 x 10-6㎡/s 이상인 열전도성 폴리페닐렌설파이드계 수지로 사출성형하여 공수를 줄이고 수분의 침투를 막으면서 온도민감성이 향상된 자동차 에어컨용 온도센서를 제공할 수 있다.Therefore, the present invention is an injection molding of thermally conductive polyphenylene sulfide-based resin having a thermal diffusion coefficient of 0.3 x 10 -6 m 2 / s or more when manufacturing the thermistor. Can provide.
이하의 실시예 및 비교예를 통하여 본 발명을 더욱 상세하게 설명한다. 단, 실시예는 본 발명을 예시하기 위한 것이지 이들만으로 한정하는 것이 아니다.The present invention will be described in more detail with reference to the following examples and comparative examples. However, an Example is for illustrating this invention and is not limited only to these.
[실시예]EXAMPLE
자동차 에어콘용 써미스터는 하기 1)∼6)의 시험을 통과해야 한다.Thermistors for automotive air conditioners must pass the tests of 1) to 6) below.
1) 열시정수1) Thermal time constant
온도센서를 최초의 온도 12 ℃ 수조에 1 시간 이상 방치 후에 최종온도 2 ℃의 수조에 담그고 온도가 5.68 ℃에 해당하는 저항값이 될 때까지의 시간 측정.After leaving the temperature sensor in the water bath at 12 ℃ for the first time for more than 1 hour, immerse it in the water bath at the final temperature of 2 ℃ and measure the time until the temperature reaches the resistance value corresponding to 5.68 ℃.
2) 증기가압실험2) Steam pressure test
121 ℃, 2기압, 100 % 상대습도의 조건에서 96 시간 방치 후에 전기적 특성에 만족해야하는 테스트이다.This test is required to satisfy the electrical characteristics after 96 hours at 121 ℃, 2 atm, 100% relative humidity.
3) 내온실험3) Temperature test
전압 DC 13.5 V, 온도 40 ℃, 상대습도 90∼95 %의 조건에서 48 시간 방치 후 전기적 특성에 만족해야한다.The electrical characteristics should be satisfied after 48 hours in the condition of voltage DC 13.5 V, temperature 40 ℃, relative humidity 90-95%.
4) 가열 싸이클(Heat Cycle) 실험4) Heat Cycle Test
전압 DC 13.5 V, 온도 -80 ℃(2 시간), 80 ℃(2 시간)을 1 사이클로하여 20사이클 반복 후 전기적 특성에 만족해야 한다.The electrical characteristics shall be satisfied after 20 cycles of repetition with a voltage of DC 13.5 V, temperature of -80 ° C (2 hours) and 80 ° C (2 hours) as one cycle.
5) 고온방치실험5) High temperature leaving experiment
온도 80 ℃에서 96 시간 방치 후에 전기적 특성을 만족해야한다.After 96 hours at 80 ℃ temperature, the electrical characteristics should be satisfied.
6) 저온 방치 실험6) Low temperature leaving experiment
온도 -30 ℃에서 72 시간 방치후에 전기적 특성을 만족해야한다.The electrical characteristics should be satisfied after 72 hours at the temperature of -30 ℃.
실시예 1Example 1
열확산계수가 0.5 x 10-6㎡/s인 폴리페닐렌설파이드계 수지(엘지화학 제조 열전도성 수지 PPS, 폴리페닐렌설파이드 40 중량% 및 실리콘카바이드 고체 60 중량%)로 도 2와 같이 몰딩하여 써미스터를 제조하였다. 이 제품은 상기 테스트 2)~6)을 통과하였으며 몰딩의 두께가 1 mm에서 열시정수가 5 초 이하로 자동차용 방수 써미스터로 사용하기에 적합하였다.Thermistor was molded as shown in Figure 2 with a polyphenylene sulfide-based resin (thermal conductivity resin PPS made by LG Chemical, 40% by weight of polyphenylenesulfide and 60% by weight of silicon carbide solid) having a thermal diffusion coefficient of 0.5 x 10 -6 m 2 / s. Was prepared. This product passed the test 2) ~ 6), and the molding had a thickness of 1 mm and a thermal time constant of 5 seconds or less, which was suitable for use as a waterproof thermistor for automobiles.
비교예 1Comparative Example 1
폴리페닐렌설파이드계 수지 대신에 열확산계수가 0.5 x 10-6㎡/s인 폴리부틸렌테레프탈레이트계 수지(엘지화학 제조 열전도성 수지, 폴리부틸렌테레프탈레이트 40 중량% 및 실리콘카바이드 고체 60 중량%)로 변경한 것을 제외하고는 상기 실시예 1과 동일하게 써미스터를 제조하였다. 이 제품은 상기 테스트 3)~6)을 통과하였으며 몰딩의 두께가 1 mm에서 열시정수가 5 초이지만 2)의 증기가압실험을 통과하지 못하였다.Polybutylene terephthalate resin having a thermal diffusion coefficient of 0.5 x 10 -6 m 2 / s instead of polyphenylene sulfide resin (40% by weight of thermal conductivity resin manufactured by LG Chemical, 40% by weight of polybutylene terephthalate and 60% by weight of silicon carbide solid) Thermistor was manufactured in the same manner as in Example 1 except for changing to). This product passed the test 3) ~ 6) and the thermal time constant was 5 seconds at the thickness of the molding of 1 mm but did not pass the steam pressure test of 2).
비교예 2Comparative Example 2
폴리페닐렌설파이드계 수지 대신에 열확산계수가 0.2 x 10-6㎡/s 인 폴리비닐클로라이드, 폴리페닐렌설파이드, 폴리카보네이트, 및 폴리프로필렌의 열가소성 수지로 각각 몰딩한 것을 제외하고는 상기 실시예 1과 동일하게 써미스터를 제조하였다. 이 제품들은 몰딩의 두께가 1 mm에서 열시정수가 14 초 이상으로 온도센서로서의 성능이 떨어졌다.Example 1, except that instead of polyphenylene sulfide-based resin molded with a thermoplastic resin of polyvinyl chloride, polyphenylene sulfide, polycarbonate, and polypropylene having a thermal diffusion coefficient of 0.2 x 10 -6 m 2 / s Thermistors were prepared in the same manner as in the following. These products have a poor performance as a temperature sensor with a molding thickness of 1 mm and a thermal time constant of more than 14 seconds.
비교예 3Comparative Example 3
폴리페닐렌설파이드계 수지로 몰딩하는 대신에 에폭시수지로 도포하는 것을 제외하고는 상기 실시예 1과 동일하게 써미스터를 제조하였다. 이 제품은 도포두께가 0.5 mm 이하인 경우에 열시정수가 5 초로 실시예 1과 동일하였으나, 증기 가압실험을 통과하지 못하였다.Thermistors were manufactured in the same manner as in Example 1, except that the resin was coated with an epoxy resin instead of the polyphenylene sulfide-based resin. This product had a thermal time constant of 5 seconds when the coating thickness was 0.5 mm or less, the same as in Example 1, but did not pass the steam pressurization test.
비교예 4Comparative Example 4
폴리페닐렌설파이드계 수지 대신에 에폭시수지로 몰딩하는 것을 제외하고는 상기 실시예 1과 동일하게 써미스터를 제조하였다. 이 제품은 두께가 1 mm 이상인 경우에 열시정수가 14 초 이상으로 온도센서로서의 성능이 떨어졌다.Thermistors were manufactured in the same manner as in Example 1, except that the polyphenylene sulfide-based resin was molded with an epoxy resin. This product has a thermal time constant of more than 14 seconds when the thickness is more than 1 mm, which degrades its performance as a temperature sensor.
본 발명에 따르는 써미스터는 열전도성 폴리페닐렌설파이드로 몰딩하여 방수성능 및 온도감응시간이 우수하여 방수가 요구되는 자동차 에어콘용 방수 써미스터로 사용될 수 있으며, 사출성형을 적용할 수가 있어서 제조공정이 간단하고 여러가지 모양으로 몰딩할 수가 있다.The thermistor according to the present invention can be used as a waterproof thermistor for automotive air conditioners that require waterproofing by molding with thermally conductive polyphenylene sulfide and having excellent waterproof performance and temperature response time. It can be molded in various shapes.
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KR101011929B1 (en) * | 2006-11-29 | 2011-01-31 | 주식회사 엘지화학 | Automotive Waterproof Thermistors |
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