KR100421880B1 - Method for Fabricating of Plasma Display Panel - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a plasma display panel suitable for simplifying the process and for enhancing the strength of barrier ribs, wherein the first paste layer is formed on a substrate on which electrode formation is completed, and the resin content of the powder is increased. Forming a second paste from a material having a lower resin content than the powder of the first paste layer, forming a photosensitive material covering the second paste layer, and patterning the photosensitive material to form the second paste in the direction of the electrode. Forming a photoresist pattern covering a cross section of a paste layer, sand blasting the photoresist pattern with a mask to form a partition wall with the second paste layer, and performing a baking process on the partition wall; It is characterized by forming.

Description

Method for manufacturing plasma display panel {Method for Fabricating of Plasma Display Panel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, to a method of manufacturing a plasma display panel that can simplify a process and eliminate a separation of a partition by forming a white back and a rib.

In general, a plasma display panel (hereinafter referred to as a PDP) is an element that displays characters or graphics by using light emitted from plasma generated during gas discharge. PDP is the most suitable for large-sized display among many flat panel display devices such as liquid crystal display (LCD), field emission display (FED), electro luminescence display (ELD), and vacuum fluorescent display (VFD). .

That is, the plasma display panel can be enlarged to 40 inches or more, and CRT level colorization is possible because the ultraviolet light generated by the discharge uses a photoluminescence mechanism that emits visible light by stimulating the fluorescent film. and has many unique advantages not found in other flat panel devices or the like having a magnetic wide viewing angle over ^160. as emissive display elements (self-emissive display). As a result, the next generation high-definition wall-mounted TV and a large-scale display device for multimedia in which the functions of the TV and the PC are combined are considered to be prominent.

PDP uses two glass substrates with a thickness of 3 mm to apply an appropriate electrode and phosphor on each substrate, and forms plasma in the space therebetween while maintaining the distance between the two substrates at about 0.1 mm to 0.2 mm. Since the method is adopted, the size of the flat plate can be increased.

In addition, in the PDP, the gas discharge has a strong nonlinearity in which discharge does not occur even when a voltage is applied between electrodes, and a large-sized panel has a memory function that is essential for driving a large display. Even in this case, a high quality image can be expressed without deteriorating the luminance.

The PDP is a direct current (DC type) in which the electrode for generating plasma is directly exposed to the plasma so that the conduction current flows directly through the electrode, and the electrode is covered with a dielectric so that the displacement current is not directly exposed. It is divided into alternating current type (AC type).

The front plate of AC type PDP is composed of a pair of parallel transparent electrodes, a bus electrode formed on the transparent electrode to increase conductivity, a dielectric layer, etc., and the back plate is formed of an address electrode, a dielectric layer, A barrier rib formed on the dielectric layer and a fluorescent layer formed between the barrier ribs. The front and back plates of such a structure are sealed and exhausted to form a PDP.

As the barrier rib forming method of the existing AC PDP, a screen printing method, a sandblast method, a lift off method, and the like are used. Among them, screen printing is mainly used, but printing is not effective in the high-definition eXtended Graphics Adapter (XGA) class. Therefore, most of the partitions are formed by sandblasting.

Hereinafter, a method of manufacturing a plasma display panel according to the related art will be described with reference to the accompanying drawings.

1A to 1G are cross-sectional views of a manufacturing process of a plasma display panel according to the prior art.

First, as shown in FIG. 1A, an address electrode (not shown) is formed on the substrate 11 by using a printing method, an additive method, a photosensitive paste, and the like on the address electrode and the substrate 11. A white-back paste film 12 is applied to the film.

Here, the white-back paste film 12 is formed using any one of a printing method and a coating method.

Subsequently, as illustrated in FIG. 1B, the white-back paste film 12 is dried and fired.

Subsequently, as shown in FIG. 1C, a rib paste film 13 is coated by printing or coating.

The partition paste layer 13 includes a powder component, a lower white-back paste layer 12, and a binder component for adhesion.

Subsequently, as shown in FIG. 1D, a dry film resist DFR covering the partition paste layer 13 is formed by a laminating method.

Thereafter, the dry film resist is patterned by an exposure and development process to form a dry film resist pattern 14 covering the partition paste layer 13 in the address electrode direction.

As shown in FIG. 1E, sand blasting is performed using the dry film resist pattern 14 as a mask to form a partition 13a formed of the remaining partition paste film 13, as shown in FIG. 1F. , Firing step is carried out.

After the partition 13a is formed, the remaining dry film resist pattern 14 as shown in FIG. 1G is peeled off by a wet process using a stripping solution, that is, an aqueous alkali solution such as NaOH, and the like before the firing process. Conduct.

In the peeling process of the dry film resist pattern 14, an adhesive component (Binder) for adhering between the partition paste film 13 and the white-back paste film 12 among the components of the partition paste film 13 is applied to the release liquid. The barrier ribs 13a are separated from the white-back paste film 12 by falling apart.

This problem is more serious in the high-definition XGA class than in the VGA (Video Graphics Array) class.

Subsequently, although not shown in the figure, a fluorescent layer is formed between the partitions 13a to complete the conventional plasma display panel.

However, the conventional method of manufacturing the plasma display panel as described above has the following problems.

First, since the white-back paste film and the barrier paste film are respectively formed, the printing and firing processes must be performed on each of the white-back paste film and the barrier paste film, which is a complicated process procedure.

Second, the adhesion component for adhering the white-back paste film to the partition wall is removed by the stripping solution used in the dry film resist pattern stripping process, thereby causing a defect that the partition wall is peeled off.

An object of the present invention is to provide a method of manufacturing a plasma display panel capable of simplifying a process procedure and preventing a barrier failure by forming an integrated body of a white-back paste film and a barrier paste film. There is this.

1A to 1G are cross-sectional views of a manufacturing process of a plasma display panel according to the related art.

2A to 2E are cross-sectional views of a manufacturing process of a plasma display panel according to an exemplary embodiment of the present invention.

Explanation of symbols for the main parts of drawings

21: back plate 22: reflecting film

23: partition material 24: photosensitive film

23a: bulkhead

In the method of manufacturing a plasma display panel according to the present invention for achieving the above object, in the method of forming a back plate of a plasma display panel, a first paste layer is formed on a substrate on which electrodes are formed, and a resin content of powder is increased. Forming a second paste from a material having a lower resin content than the powder of the first paste layer, forming a photosensitive material covering the second paste layer, and patterning the photosensitive material to form the second paste in the direction of the electrode. Forming a photoresist pattern covering a cross section of a paste layer, sand blasting the photoresist pattern with a mask to form a partition wall with the second paste layer, and performing a baking process on the partition wall; Preferably, the resin content of the first paste layer relative to the powder is second. It is characterized in that 2 to 10 times the resin content of the powder of the paste layer.

In general, the sand resistance of the barrier paste material increases in proportion to the rinse content in the paste. Typically, the partition paste has a sand blast speed difference of about 15% when the rinse content of the powder is about 0.5%.

The present invention focuses on these characteristics and the fact that the reflectance of the lower layer of the barrier layer does not differ significantly from the white-back paste layer. Thus, the present invention relates to a plasma display panel manufacturing method according to the present invention. When described in more detail with reference to as follows.

2A through 2E are cross-sectional views illustrating a manufacturing process of a plasma display panel according to an exemplary embodiment of the present invention.

First, as shown in FIG. 2A, an address electrode (not shown) is formed on the substrate 21 by using a printing method, an additive method, a photosensitive paste, and the like, and then on the address electrode and the substrate 21. The first paste layer 22 is formed on the second paste layer 22, and the second paste layer 23 is formed of a material having a resin content lower than that of the first paste layer 22.

Here, the first paste layer 22 is formed by using a material having a resin content (Rinse) to the powder 2 to 10 times higher than the resin content of the powder of the second paste film 23, the second paste film to be carried out later In the sand blast process for 23, the first paste film 22 can have sand resistance.

As a method of forming the first and second paste layers 22 and 23, both a printing method and a coating method may be used, but a coating method is more effective than a printing method.

Subsequently, drying and firing processes are performed on the first and second paste films 22 and 23.

Subsequently, as shown in FIG. 2B, a dry film resist DFR covering the second paste layer 23 is formed by a laminating method.

Thereafter, the dry film resist is patterned by an exposure and development process to form a dry film resist pattern 24 covering the second paste layer 23 in the address electrode direction.

As shown in FIG. 2C, a sand blast is performed using the dry film resist pattern 14 as a mask to form a partition wall 23a formed of the remaining second paste layer 23, as shown in FIG. 2D. do.

Here, since the first paste layer 22 has a resin content higher than that of the powder and has a large sand resistance, only the second paste layer 23 is sanded during the sandblasting process, thereby partitioning the barrier rib 23a. ) Is formed.

In addition, as described above, since the reflectance of the lower portion of the partition 23a, that is, the first paste layer 22 is similar to that of the white-back paste layer, the first paste layer 22 serves as a white back.

As shown in FIG. 2E, the dry film resist pattern 24 remaining after the partition 23a is formed is peeled off by a wet process using a stripping solution, that is, an aqueous alkali solution such as NaOH.

Subsequently, the partition wall 23a is fired and a fluorescent layer is formed between the partition walls 23a, although not shown in the drawing, to complete the plasma display panel according to the present invention.

The manufacturing method of the plasma display panel of the present invention as described above has the following effects.

First, the process can be simplified since the white-back coating process, the drying and the baking process are not required.

Second, the white bag and the partition may be integrally formed to prevent a defect in which the partition is peeled off.

Third, since the white bag and the partition are integrated to strengthen the partition substructure, the strength of the partition is increased.

Claims (3)

In the method of forming the back plate of the plasma display panel, Forming a first paste layer on the substrate on which the electrode formation is completed, and forming a second paste made of a material having a resin content of powder lower than that of the powder of the first paste layer; Forming a photosensitive material covering the second paste layer; Patterning the photosensitive material to form a photosensitive material pattern covering an end surface of the second paste layer in the electrode direction; Sand blasting the photoresist pattern with a mask to form a partition wall with the second paste layer; And performing a calcination process for the partition wall. delete The method of claim 1, wherein the resin content of the first paste layer is 2 to 10 times the resin content of the powder of the second paste layer.