KR100420983B1 - 웨이퍼 반송 로봇용 핸드 - Google Patents
웨이퍼 반송 로봇용 핸드 Download PDFInfo
- Publication number
- KR100420983B1 KR100420983B1 KR10-2001-0024347A KR20010024347A KR100420983B1 KR 100420983 B1 KR100420983 B1 KR 100420983B1 KR 20010024347 A KR20010024347 A KR 20010024347A KR 100420983 B1 KR100420983 B1 KR 100420983B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- hole
- hand
- air
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 68
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 2
- 238000001179 sorption measurement Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (4)
- 다축 관절 로봇의 종단에 설치되어 웨이퍼를 이송시킬 수 있도록 구성된 웨이퍼 반송 로봇용 핸드에 있어서,상기한 핸드의 종단에 부착되어 있을 뿐만 아니라 중앙부에 흡기공이 형성되고 그 외주변에 공급공이 형성된 플레이트와, 상기한 플레이트의 저면에 부착됨과 아울러 상기한 공급공으로 공급된 공기가 충진되도록 링형 챔버가 형성되고 다수의 배출공이 형성되어 웨이퍼에 근접되는 챔버 플레이트와, 상기한 공급공에 소정 압력의 공기를 공급하여 배출공으로 분출되도록 설치된 제1펌프와, 상기한 흡기공을 통해 상기한 배출공으로 분출된 공기를 흡입하도록 설치되어 상기한 공기 압력 차이로 웨이퍼를 이격/흡착하는 흡입력을 제공하는 흡입 수단을 포함하고,상기한 흡입 수단은 상기한 흡기공에 연결 설치됨과 아울러 상기한 공급 공기압과 상이한 흡입 압력을 발생시켜 웨이퍼를 이격된 상태로 흡입하는 제2펌프로 구성함을 특징으로 하는 웨이퍼 반송 로봇용 핸드.
- 제1항에 있어서,상기한 흡입 수단은 상기한 챔버 플레이트를 깔때기 형상으로 형성하여 유로를 길게 함과 아울러 챔버 내부에 형성하여 제1펌프를 통해 공급되는 공기의 유속을 빠르게 하도록 구성된 벤츄리와, 상기한 벤츄리를 통과하는 공기압에 의해 내측관 공동의 공기가 흡입되도록 형성된 흡입관과, 상기한 흡기공에 연결된 배출 호스로 구성함을 특징으로 하는 웨이퍼 반송 로봇용 핸드.
- 제1항 또는 제2항에 있어서,상기한 챔버 플레이트의 저면 단부에 형성되어 웨이퍼의 흡착 위치가 어긋나면 흡입력에 의해 웨이퍼가 미끄러지면서 정렬될 수 있도록 구성된 가이드 돌기를 포함함을 특징으로 하는 웨이퍼 반송 로봇용 핸드.
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0024347A KR100420983B1 (ko) | 2001-05-04 | 2001-05-04 | 웨이퍼 반송 로봇용 핸드 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0024347A KR100420983B1 (ko) | 2001-05-04 | 2001-05-04 | 웨이퍼 반송 로봇용 핸드 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020085078A KR20020085078A (ko) | 2002-11-16 |
KR100420983B1 true KR100420983B1 (ko) | 2004-03-02 |
Family
ID=27703719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0024347A Expired - Lifetime KR100420983B1 (ko) | 2001-05-04 | 2001-05-04 | 웨이퍼 반송 로봇용 핸드 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100420983B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170008506A (ko) | 2015-07-14 | 2017-01-24 | (주)서전기전 | 진공차단기용 양방향 개폐조작기 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58141536A (ja) * | 1982-02-17 | 1983-08-22 | Sanyo Electric Co Ltd | 半導体ウエハ−の吸着ヘツド |
KR970077458A (ko) * | 1996-05-22 | 1997-12-12 | 김주용 | 웨이퍼용 플로팅 척 및 그를 이용한 비 접촉식 척킹방법 |
KR20000018724U (ko) * | 1999-03-26 | 2000-10-25 | 황인길 | 웨이퍼 홀드 장치 |
KR20010018599A (ko) * | 1999-08-20 | 2001-03-05 | 김영환 | 반도체 노광장비의 웨이퍼 척 |
-
2001
- 2001-05-04 KR KR10-2001-0024347A patent/KR100420983B1/ko not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58141536A (ja) * | 1982-02-17 | 1983-08-22 | Sanyo Electric Co Ltd | 半導体ウエハ−の吸着ヘツド |
KR970077458A (ko) * | 1996-05-22 | 1997-12-12 | 김주용 | 웨이퍼용 플로팅 척 및 그를 이용한 비 접촉식 척킹방법 |
KR20000018724U (ko) * | 1999-03-26 | 2000-10-25 | 황인길 | 웨이퍼 홀드 장치 |
KR20010018599A (ko) * | 1999-08-20 | 2001-03-05 | 김영환 | 반도체 노광장비의 웨이퍼 척 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170008506A (ko) | 2015-07-14 | 2017-01-24 | (주)서전기전 | 진공차단기용 양방향 개폐조작기 |
Also Published As
Publication number | Publication date |
---|---|
KR20020085078A (ko) | 2002-11-16 |
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