KR100394968B1 - 온돌용을 포함하는 바닥마감용 마루판재 - Google Patents
온돌용을 포함하는 바닥마감용 마루판재 Download PDFInfo
- Publication number
- KR100394968B1 KR100394968B1 KR10-2001-0048961A KR20010048961A KR100394968B1 KR 100394968 B1 KR100394968 B1 KR 100394968B1 KR 20010048961 A KR20010048961 A KR 20010048961A KR 100394968 B1 KR100394968 B1 KR 100394968B1
- Authority
- KR
- South Korea
- Prior art keywords
- ondol
- floorboard
- floorboards
- flooring
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/16—Flooring, e.g. parquet on flexible web, laid as flexible webs; Webs specially adapted for use as flooring; Parquet on flexible web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2201/00—Joining sheets or plates or panels
- E04F2201/02—Non-undercut connections, e.g. tongue and groove connections
- E04F2201/021—Non-undercut connections, e.g. tongue and groove connections with separate protrusions
- E04F2201/022—Non-undercut connections, e.g. tongue and groove connections with separate protrusions with tongue or grooves alternating longitudinally along the edge
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Floor Finish (AREA)
Abstract
Description
| 조성 | 베이스폴리머(중량%)1 | 점착부여제(중량%)2 | 가소제(중량%)3 | 노화방지제(1+2+3에대한 중량%) | 충진제(베이스폴리머에 대한중량%) | |
| SIS | SBS | |||||
| 예 1 | 15 | 20 | 55 | 10 | 0.5 | 10 |
| 예 2 | 20 | 20 | 50 | 10 | 0.5 | |
| 비교예1 | 40 | - | 50 | 10 | 0.8 | |
| SIS형태 : 트리블록, 용융지수 : 8∼14,브룩필드 점도(톨루엔 용액, 25℃) : 500∼1,600 cps공급처 : Exxon Mobil Chemical, Shell Chemical ChemistrySBS형태 : 트리블록, 용융지수 : 1∼23,브룩필드 점도(톨루엔 용액, 25℃) : 450∼9,000 cps공급처 : Exxon Mobil Chemical, Shell Chemical Chemistry점착부여제형태 : 지방족 탄화수소연화점(RB) : 98℃, Mn : 1,025, Mw : 1,895, DP : 1.85공급처 : Hercules Inc.가소제형태 : 파라핀 오일파라핀 탄소 (%) : 65, 나프사 탄소 (%) : 35발화점 : 〉266℃, 유동점(pour point) : -6℃공급처 : ESSO노화방지제제품명 : Irganox 1010공급처 : Ciba-Geigy충진제제품명 : Zeosil 155공급처 : Rhodia Kofran Co.Ltd. |
| 물성 | 예 1 | 예 2 | 비교예 1 |
| 용융점도 | 15,000 | 10,000 | 35,800 |
| Tg | -15℃ | -15℃ | -18℃ |
| 연화점 | 95℃ | 89℃ | 78℃ |
| 점착성 | 300 | 450 | 510 |
| 박리강도 | 1.1 | 1.4 | 1.8 |
Claims (5)
- 합판, 원목, 고밀도섬유판 또는 삭편판을 바탕판으로 하며, 이 바탕판의 상하부에 무늬목, 고압멜라민적층판 또는 저압멜라민적층판을 냉 또는 열프레싱 가공을 통해 일체구조로 제조되는 원판을 소정의 길이와 폭으로 제단하여 형성하는 단위원판을 사용하며, 길이방향의 일측단에 측삽입부와 다른 일측단에 선 시공된 인접 마루판재에 형성된 타 측삽입부와 결합되는 측수용부가 형성되고; 길이방향의 일끝단에 끝단삽입부와 다른 일끝단에 끝단수용부가 형성되며; 이면에 합성고무계 핫멜트 점착제가 도포되며, 이 점착제 위에 이형지를 부착하여 형성되는 바닥마감용 마루판재에 있어서,상기 끝단삽입부는 일끝단면 상부에서 길이방향으로 돌출되어 최단면은 소정의 단면여유각(γ)을 구비하도록 하며, 그 최단부 저면에 하향으로 돌출 형성되는 끝단하방돌기를 구비하며, 상기 끝단하방돌기의 내측에 상향으로 만입 형성되는 끝단상방홈을 구비하도록 이루어지고;상기 끝단삽입부의 반대편에 형성되어 한 쌍을 이루는 상기 끝단수용부는 다른 일끝단면 하부에서 길이방향으로 돌출 형성하며, 그 최단부 상면에 상향으로 돌출 형성되는 끝단상방돌기를 구비하며, 상기 끝단상방돌기의 내측에 하향으로 만입 형성되는 끝단하방홈을 구비하여 이루어지며;시공시 상기 측삽입부를 선 시공된 인접 마루판재에 형성된 상기 측수용부에 삽입함에 따라, 상기 끝단삽입부의 끝단하방돌기는 선 시공된 다른 인접 마루판재의 끝단수용부의 끝단하방홈에, 끝단상방홈에는 상기 끝단수용부의 끝단상방돌기가 각각 겹침되어 연동되는 것을 특징으로 하는 온돌용을 포함하는 바닥마감용 마루판재.
- 삭제
- 삭제
- 삭제
- 제 1항에 있어서,상기 핫멜트 점착제는 디블록(diblock:분자내 이중결합) 함량이 1% 이하인트리블록(triblock)이며, 용융지수가 8∼14, 브룩필드(Brookfield)점도 (톨루엔 용액, 25℃)가 500∼1,600인 스티렌-이소프렌-스티렌(styrene-isoprene-styrene) 10∼25 중량%,디블록(diblock) 함량이 1% 이하인 트리블록(triblock)이며, 용융지수가 1∼23, 브룩필드(Brookfield) 점도(톨루엔 용액, 25℃)가 450∼9,000인 스티렌-부타디엔-스티렌(styrene-butadiene-styrene) 15∼25 중량%,점착부여제 50∼60 중량%를 포함하는 것을 특징으로 하는 온돌용을 포함하는 바닥마감용 마루판재.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0048961A KR100394968B1 (ko) | 2001-08-14 | 2001-08-14 | 온돌용을 포함하는 바닥마감용 마루판재 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0048961A KR100394968B1 (ko) | 2001-08-14 | 2001-08-14 | 온돌용을 포함하는 바닥마감용 마루판재 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20030014963A KR20030014963A (ko) | 2003-02-20 |
| KR100394968B1 true KR100394968B1 (ko) | 2003-08-19 |
Family
ID=27719150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2001-0048961A Expired - Fee Related KR100394968B1 (ko) | 2001-08-14 | 2001-08-14 | 온돌용을 포함하는 바닥마감용 마루판재 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100394968B1 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040009282A (ko) * | 2002-07-23 | 2004-01-31 | (주)현대시트 | 점착 처리된 스티커 타입 바닥재 타일 |
| KR100704644B1 (ko) * | 2005-08-17 | 2007-04-06 | 재단법인서울대학교산학협력재단 | 피착재 부착 표면재 접착용 핫멜트 점착제 |
| KR102092124B1 (ko) * | 2019-12-09 | 2020-03-24 | 이종현 | 바닥재 덧판의 제조방법 및 이에 의해 제조된 바닥재 덧판 |
| KR102315506B1 (ko) * | 2020-04-21 | 2021-10-20 | 정길호 | 설치가 용이한 diy 방열판 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990018139U (ko) * | 1997-11-07 | 1999-06-05 | 조유환 | 건축용 목질판재 |
| JPH11510869A (ja) * | 1996-06-11 | 1999-09-21 | ユニリン ベヒール ビー.ヴィ. | 硬質床板からなる床仕上げ材、および該床板の製造方法 |
| KR20000048365A (ko) * | 1998-12-23 | 2000-07-25 | 쉬한 존 엠. | 다목적 핫멜트 접착제 |
| KR20010110454A (ko) * | 1999-12-27 | 2001-12-13 | 추후제출 | 성형 플러그인 단면을 갖춘 패널 |
-
2001
- 2001-08-14 KR KR10-2001-0048961A patent/KR100394968B1/ko not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11510869A (ja) * | 1996-06-11 | 1999-09-21 | ユニリン ベヒール ビー.ヴィ. | 硬質床板からなる床仕上げ材、および該床板の製造方法 |
| KR19990018139U (ko) * | 1997-11-07 | 1999-06-05 | 조유환 | 건축용 목질판재 |
| KR20000048365A (ko) * | 1998-12-23 | 2000-07-25 | 쉬한 존 엠. | 다목적 핫멜트 접착제 |
| KR20010110454A (ko) * | 1999-12-27 | 2001-12-13 | 추후제출 | 성형 플러그인 단면을 갖춘 패널 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030014963A (ko) | 2003-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11225800B2 (en) | Floor panel for forming a floor covering | |
| HU229529B1 (en) | Floor panels with sealing means | |
| CN115279981B (zh) | 用于构建地板或墙壁覆盖物的面板 | |
| US20080199676A1 (en) | Panel, in Particular for Floor Covering | |
| CN103958577B (zh) | 具有斜角的嵌板 | |
| WO2008133377A1 (en) | Floor board with reinforced surfaces | |
| SK287667B6 (sk) | Usporiadanie na spájanie plošných konštrukčných častí | |
| KR100394968B1 (ko) | 온돌용을 포함하는 바닥마감용 마루판재 | |
| CN107642172B (zh) | 自粘防水卷材 | |
| CN1245820A (zh) | 薄膜粘合剂及其制法和所得产品 | |
| KR200372123Y1 (ko) | 바닥마감용 마루판재 | |
| CN102203206A (zh) | 密封材料及其发泡施工方法 | |
| US20100059164A1 (en) | Methods and Kits for Application of Wood Flooring | |
| JP4492324B2 (ja) | 化粧材 | |
| KR102460263B1 (ko) | 타일 및 그 제조방법 | |
| JP4616310B2 (ja) | 床材、その製造方法及び床構造 | |
| KR102130192B1 (ko) | 화장재, 화장재의 제조 방법, 및 벽면 구조 | |
| PT1654129E (pt) | Placa laminada autocolante decorativa | |
| JP2019183565A (ja) | 床材 | |
| JP4278916B2 (ja) | 床材、その製造方法及び床構造 | |
| CN219090915U (zh) | 一种防火板结构 | |
| CN213259993U (zh) | 一种三聚氰胺饰面板的拼缝接口结构 | |
| NL2024496B1 (en) | Panel for constructing a floor or wall covering | |
| JPH01223261A (ja) | 複合コルク板及びコルク板を使用する床施工法 | |
| CN209494159U (zh) | 新型的防火环保硅钙装饰板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R15-X000 | Change to inventor requested |
St.27 status event code: A-3-3-R10-R15-oth-X000 |
|
| R16-X000 | Change to inventor recorded |
St.27 status event code: A-3-3-R10-R16-oth-X000 |
|
| A302 | Request for accelerated examination | ||
| PA0302 | Request for accelerated examination |
St.27 status event code: A-1-2-D10-D17-exm-PA0302 St.27 status event code: A-1-2-D10-D16-exm-PA0302 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R14-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| S20-X000 | Security interest recorded |
St.27 status event code: A-4-4-S10-S20-lic-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20110804 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20120731 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20130805 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20130805 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |