[go: up one dir, main page]

KR100357882B1 - How to clean the back of the die - Google Patents

How to clean the back of the die Download PDF

Info

Publication number
KR100357882B1
KR100357882B1 KR1019960062311A KR19960062311A KR100357882B1 KR 100357882 B1 KR100357882 B1 KR 100357882B1 KR 1019960062311 A KR1019960062311 A KR 1019960062311A KR 19960062311 A KR19960062311 A KR 19960062311A KR 100357882 B1 KR100357882 B1 KR 100357882B1
Authority
KR
South Korea
Prior art keywords
die
lead frame
cleaning
mounting plate
mount tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960062311A
Other languages
Korean (ko)
Other versions
KR19980044249A (en
Inventor
문병훈
Original Assignee
앰코 테크놀로지 코리아 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 앰코 테크놀로지 코리아 주식회사 filed Critical 앰코 테크놀로지 코리아 주식회사
Priority to KR1019960062311A priority Critical patent/KR100357882B1/en
Publication of KR19980044249A publication Critical patent/KR19980044249A/en
Application granted granted Critical
Publication of KR100357882B1 publication Critical patent/KR100357882B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: A cleaning method for the backside of a die is provided to be capable of considerably intensifying the adhesive force between the die backside and epoxy for preventing failure and improving reliability. CONSTITUTION: A die bonder is used for attaching a die(3) of a wafer mount tape(1) to a loading plate(2') of a lead frame(2). At this time, an adhesive is coated on the loading plate. A cleaning process is performed on the backside of the die by irradiating UV(UltraViolet) rays while transferring the die from the wafer mount tape to the loading plate of the lead frame. Preferably, the wavelength of the UV ray is large enough in order not to generate ozone. Preferably, the UV irradiating process is capable of being carried out under a die alignment step.

Description

다이(Die) 뒷면의 클리닝(Cleaning) 방법How to clean the back of the die

본 발명은 리드프레임의 탑재판에 접착제를 도포하고 다이(Die : 반도체 칩)를 붙일 수 있도록 하는 다이 본더(Die Bonder)에 관한 것으로, 더욱 상세하게는 다이의 뒷면에 UV에 의한 클리닝(Cleaning)을 실시함으로서 다이를 리드프레임의 탑재판에 보다 양호하게 접착시켜 불량을 방지하고, 신뢰성을 확보하도록 된 다이(Die) 뒷면의 클리닝(Cleaning) 방법에 관한 것이다.The present invention relates to a die bonder for applying an adhesive to a mounting plate of a lead frame and attaching a die (semiconductor chip), and more particularly, cleaning by UV on the back of the die. The present invention relates to a method of cleaning the back surface of a die to better adhere the die to the mounting plate of the lead frame to prevent defects and to ensure reliability.

일반적으로 반도체의 제조공정 중 리드프레임의 탑재판에 다이를 접착하는 다이본딩 공정은 웨이퍼의 각 다이중에 선정된 다이를 픽업하여 에폭시(Epoxy) 등의 접착제가 도포된 리드프레임의 탑재판에 접착하는 공정을 말한다.In general, a die bonding process of bonding a die to a mounting plate of a lead frame during a semiconductor manufacturing process picks up a die selected from each die of the wafer and attaches the die to a mounting plate of a lead frame coated with an adhesive such as epoxy. Say fair.

반도체 패키지의 제조 공정중에 몰딩물과 다이와의 접착력을 향상시키기 위하여 다이의 상면을 클리닝하는 연구는 개발 진행되어 왔다. 그러나, 다이의 뒷면을 클리닝하여 다이와 리드프레임의 탑재판과의 접착력을 향상시키도록 하는 연구는 진행된 바 없어 리드프레임의 탑재판과 다이와의 접착력이 떨어지는 단점이 있었다.In order to improve the adhesion between the molding and the die during the manufacturing process of the semiconductor package, the research to clean the upper surface of the die has been developed. However, no research has been conducted to improve the adhesion between the die and the mounting plate of the lead frame by cleaning the back side of the die, so that the adhesion between the mounting plate of the lead frame and the die is inferior.

일반적으로 다이 본딩 공정은 도 1에 도시된 바와같이 다이(3)의 저면이 웨이퍼 마운트 테입(1 ; Wafer Mount Tape)에 붙어 있는 상태에서 다이(3)를 떼어 내어 바로 리드프레임(2)의 탑재판(2')에 붙이도록 된 다이 본더(Die Bonder)와, 도 2에 도시된 바와같이 다이(3)의 저면이 웨이퍼 마운트 테입(1)에 붙어 있는 상태에서 다이(3)를 떼어 내어 중간에 얼라이먼트(4 : Alignment)를 위한 중간 스텝(Step)을 거쳐 리드프레임(2)의 탑재판(2')에 붙이도록 된 다이 본더(Die Bonder)가 있다.In general, as shown in FIG. 1, the die bonding process is performed by removing the die 3 while the bottom surface of the die 3 is attached to the wafer mount tape 1, and immediately mounting the lead frame 2. A die bonder intended to be attached to the plate 2 'and the die 3 are removed in the state in which the bottom surface of the die 3 is attached to the wafer mount tape 1 as shown in FIG. There is a die bonder that is attached to the mounting plate 2 'of the lead frame 2 through an intermediate step for alignment 4:.

그러나, 이러한 다이 본더는 웨이퍼 마운트 테입(1)에 다이(3)가 접착되어 있음으로 웨이퍼 마운트 테입(1)의 접착제에 의하여 다이(3)의 뒷면이 더렵혀 절수 있다. 이와같이 오염된 다이의 뒷면은 에폭시와의 접착력을 나쁘게 할 수 밖에 없다. 즉, 리드프레임의 탑재판에 에폭시에 의해 다이를, 접착시킬 때 접착력을 저하시켜 불량을 발생시키고, 신뢰성을 저하시키는 요인이 되었던 것이다.However, in the die bonder, since the die 3 is attached to the wafer mount tape 1, the back surface of the die 3 may be soiled and cut by the adhesive of the wafer mount tape 1. This backside of the contaminated die is inevitably deteriorating the adhesion to the epoxy. In other words, when the die is bonded to the mounting plate of the lead frame by epoxy, the adhesive force is lowered to cause defects and to lower the reliability.

본 발명의 목적은 이와같은 문제점을 해결하기 위하여 발명된 것으로서, 웨이퍼 마운트 테입 등에 의해 오염된 다이의 뒷면을 리드프레임의 탑재판으로 이송되는 과정에서 UV에 의한 클리닝을 실시함으로서 다이의 뒷면과 에폭시와의 접착력을 크게 증대시켜 접착력을 향상시켜 불량을 방지하고, 신뢰성을 향상 시키도록 된 다이(Die) 뒷면의 클리닝(Cleaning) 방법을 제공함에 있다.An object of the present invention is to solve the above problems, the back of the die contaminated by wafer mount tape, etc. by performing cleaning by UV in the process of transferring to the mounting plate of the lead frame by the back of the die and epoxy and It is to provide a cleaning method of the back side of the die (Die) to increase the adhesive strength of the significantly improved adhesive strength to prevent defects, and improve the reliability.

도 1 내지 도 2는 종래의 다이 본더(Die Bonder)의 작동을 개략적으로 나타낸 도면1 to 2 schematically show the operation of a conventional die bonder (Die Bonder)

도 3은 본 발명에 따른 다이 본더(Die Bonder)의 작동을 개략적으로 도시한 도면3 schematically illustrates the operation of a die bonder according to the present invention.

- 도면의 주요 부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawing-

1 - 웨이퍼 마운트 테입(Wafer Mount Tape)1-Wafer Mount Tape

2 - 리드프레임2-leadframe

3 - 다이(Die)3-Die

이하, 본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명에 따른 다이 본더(Die Bonder)의 작동을 개략적으로 도시한 도면으로서, 웨이퍼 마운트 테입(1)에 접착되어 있는 다이(3)를 리드프레임(2)의 탑재판(2')에 부착시키기 위하여 이송되는 과정에서 다이(3)의 뒷면을 클리닝(5 ; Cleaning) 할 수 있도록 한 것이다.3 is a view schematically showing the operation of a die bonder according to the present invention, in which the die 3 adhered to the wafer mount tape 1 is mounted on a mounting plate 2 'of the lead frame 2; In order to be attached to the back of the die (3) in the process of transport (5;) to be able to clean.

이와같이 다이(3)의 뒷면을 클리닝(5) 하는 방법에는 UV에 의한 클리닝(인체에 유해한 오존을 발생시키지 않는 긴 파장의 UV파장을 사용). 또는, 높은 온도의 히터 블럭에 의한 단순 열 분해 방법이 있을 수 있다.Thus, the method of cleaning (5) the back side of the die 3 by UV cleaning (using a long wavelength UV wavelength which does not generate ozone harmful to the human body). Alternatively, there may be a simple thermal decomposition method by a high temperature heater block.

또한, 상기 클리닝(5) 방법은 웨이퍼 마운트 테입(1)에 접착되어 있는 다이(3)가 리드프레임(2)의 탑재판(2')에 이송되는 경로 전체에 UV를 조사하는 방법과, 웨이퍼 마운트 테입(1)에 접착되어 있는 다이(3)가 리드프레임(2)의 탑재판(2')에 이송되기 전에 얼라이먼트(4 : Alignment)를 위한 중간 스텝에서 UV를 조사하는 방법이 있다.In addition, the cleaning (5) method is a method of irradiating UV to the entire path in which the die (3) bonded to the wafer mount tape (1) is transferred to the mounting plate (2 ') of the lead frame (2), and the wafer There is a method of irradiating UV at an intermediate step for alignment (4) before the die 3 adhered to the mount tape 1 is transferred to the mounting plate 2 'of the lead frame 2.

이와같이 다이(3)가 웨이퍼 마운트 테입(1)에 접착되어 리드프레임(2)의 탑재판(2')으로 이송되는 과정에서 클리닝(5)을 실시함으로서 접착력을 향상시켜 불량을 방지하고, 신뢰성을 확보할 수 있는 것이다.Thus, cleaning (5) is carried out while the die (3) is bonded to the wafer mount tape (1) and transferred to the mounting plate (2 ') of the lead frame (2), thereby improving adhesion and preventing defects. It can be secured.

이상의 설명에서와 같은 본 발명의 다이 뒷면의 클리닝 방법에 의하면, 리드 프레임의 탑재판에 접착제를 도포하고 다이를 붙이는 다이 본더에서, 다이가 이송되는 경로상에 UV를 조사하여 다이 뒷면을 클리닝함으로서 접착력을 향상시키고, 신뢰성을 확보할 수 있는 효과가 있다.According to the cleaning method of the die back side of the present invention as described above, in the die bonder applying the adhesive to the mounting plate of the lead frame and attaching the die, the adhesive force by cleaning the die back side by irradiating UV on the path where the die is transported It is effective to improve the reliability and to ensure the reliability.

Claims (3)

웨이퍼 마운트 테입에 접착되어 있는 다이를 접착제가 도포된 리드프레임의 탑재판에 부착시키는 다이 본더(Die Bonder)에 있어서, 상기의 다이가 웨이퍼 마운트 테입에서 리드프레임의 탑재판으로 이송되는 경로상에 UV를 조사하여 다이의 뒷면을 클리닝(Cleaning)하도록 된 것을 특징으로 하는 다이(Die) 뒷면의 클리닝(Cleaning) 방법.In a die bonder for attaching a die adhered to a wafer mount tape to a mounting plate of an adhesive-coated leadframe, the die is UV on a path from the wafer mount tape to the mounting plate of the leadframe. Cleaning the back side of the die, characterized in that for cleaning (Cleaning). 청구항 1에 있어서, 상기의 UV는 인체에 유해한 오존을 발생시키지 않는 긴 파장의 UV파장을 사용하여 다이 뒷면을 클리닝함을 특징으로 하는 다이(Die) 뒷면의 클리닝(Cleaning) 방법.The method of claim 1, wherein the UV is cleaned on the back side of the die by using a long wavelength UV wavelength that does not generate ozone harmful to the human body. 청구항 1에 있어서, 상기 웨이퍼 마운트 테입에 접착되어 있는 다이가 리드 프레임의 탑재판으로 이송되기 전에 다이의 얼라이먼트(Alignment)를 위한 중간 스텝에서 UV를 조사하여 다이 뒷면을 클리닝함을 특징으로 하는 다이(Die) 뒷면의 클리닝(Cleaning) 방법.The die of claim 1, wherein the die is bonded to the wafer mount tape to clean the back side of the die by irradiating UV at an intermediate step for alignment of the die before being transferred to the mounting plate of the lead frame. Die) Cleaning method on the back side.
KR1019960062311A 1996-12-06 1996-12-06 How to clean the back of the die Expired - Fee Related KR100357882B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960062311A KR100357882B1 (en) 1996-12-06 1996-12-06 How to clean the back of the die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960062311A KR100357882B1 (en) 1996-12-06 1996-12-06 How to clean the back of the die

Publications (2)

Publication Number Publication Date
KR19980044249A KR19980044249A (en) 1998-09-05
KR100357882B1 true KR100357882B1 (en) 2003-07-07

Family

ID=37490368

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960062311A Expired - Fee Related KR100357882B1 (en) 1996-12-06 1996-12-06 How to clean the back of the die

Country Status (1)

Country Link
KR (1) KR100357882B1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960039298A (en) * 1995-04-04 1996-11-25 김광호 Manufacturing Method of Semiconductor Package Incorporating UV / Ozone Cleaning Process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960039298A (en) * 1995-04-04 1996-11-25 김광호 Manufacturing Method of Semiconductor Package Incorporating UV / Ozone Cleaning Process

Also Published As

Publication number Publication date
KR19980044249A (en) 1998-09-05

Similar Documents

Publication Publication Date Title
US6821815B2 (en) Method of assembling a semiconductor chip package
JP2001044144A (en) Semiconductor chip manufacturing process
JPH11204551A (en) Manufacture of semiconductor device
JP2011077138A (en) Method and apparatus for separating protective tape
JP2000012745A (en) Semiconductor package and its manufacture
JPH1027836A (en) Manufacture of semiconductor device and semiconductor manufacturing device
JP3811567B2 (en) Manufacturing method of semiconductor device
KR102658356B1 (en) Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
KR100357882B1 (en) How to clean the back of the die
KR100539271B1 (en) Method for die attaching a chip having a warpage prevention materials
CN107564950B (en) Wafer, semiconductor package and manufacturing method thereof
JPH0794539A (en) Semiconductor device
JPH05291397A (en) Manufacture of collet and semiconductor device
JPH10340914A (en) Manufacture of semiconductor device
JPH0621219A (en) Manufacture of semiconductor device
KR100385870B1 (en) Semiconductor device and a method for assembling the same
JPH06204267A (en) Manufacture of semiconductor device
JP2978862B2 (en) LOC semiconductor device and method of manufacturing the same
JPH0547988A (en) Semiconductor device
JPH08255803A (en) Semiconductor module and manufacture thereof
KR19980022842A (en) Molding device with UV-ozone cleaning function
KR960007202Y1 (en) Saw Filter
JPH1064934A (en) Manufacture of semiconductor device
JPS604225A (en) Method for removing resin burr in resin mold semiconductor device
JP2859412B2 (en) Method for manufacturing semiconductor device

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19961206

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19991122

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19961206

Comment text: Patent Application

N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20000502

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20011128

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20020725

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20021009

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20021010

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20051010

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20061010

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20061010

Start annual number: 5

End annual number: 5

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

Termination category: Default of registration fee

Termination date: 20080910