KR100347008B1 - Vibration indicator with a hybrid sensor for sensing vibration and temperature - Google Patents
Vibration indicator with a hybrid sensor for sensing vibration and temperature Download PDFInfo
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- KR100347008B1 KR100347008B1 KR1019990061375A KR19990061375A KR100347008B1 KR 100347008 B1 KR100347008 B1 KR 100347008B1 KR 1019990061375 A KR1019990061375 A KR 1019990061375A KR 19990061375 A KR19990061375 A KR 19990061375A KR 100347008 B1 KR100347008 B1 KR 100347008B1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D15/00—Component parts of recorders for measuring arrangements not specially adapted for a specific variable
- G01D15/06—Electric recording elements, e.g. electrolytic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
- G01D18/008—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00 with calibration coefficients stored in memory
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Abstract
이 발명은 진동센서에 의한 진동측정치의 온도의존성을 보정하기 위한 것으로서, 임피던스변환용 세라믹소자(11)의 하부에 부착된 온도센서(12)를 포함하는 진동온도복합센서(10)를 제공하고, 그러한 진동온도복합센서(10)와, 세라믹소자(11)가 갖는 온도의존성에 관한 출력변동값을 미리 측정하여 기록해 두기 위한 기억소자(23)와, 기억소자(23)에 저장된 데이터를 이용하여 온도측정치을 감안하여 보정된 순수진동치를 연산하는 CPU(25)를 구비한 진동측정인디게이터를 제공한다.The present invention is to correct the temperature dependence of the vibration measurement by the vibration sensor, to provide a vibration temperature complex sensor 10 including a temperature sensor 12 attached to the lower portion of the impedance conversion ceramic element 11, The vibration temperature complex sensor 10, the memory element 23 for measuring and recording the output fluctuation value related to the temperature dependence of the ceramic element 11 in advance, and the data using the data stored in the memory element 23 A vibration measurement indicator having a CPU 25 for calculating a corrected pure vibration value in view of the measured value is provided.
Description
이 발명은 압전체를 사용하여 진동을 측정하는 진동측정인디게이터에 관한 것이며, 온도변화에 따른 측정변화치를 보정하고 좀더 정확한 진동측정치를 얻을 수 있는 진동측정인디케이터에 관한 것이다.The present invention relates to a vibration measurement indicator for measuring vibration using a piezoelectric body, and to a vibration measurement indicator that can correct a measurement change value according to a temperature change and obtain a more accurate vibration measurement value.
압전체를 이용하는 진동센서는 외부에서 인가되는 진동에 의해 발생한 압전체의 변형이 분극방향으로 일으키는 전하량의 차이에 의해 진동을 검출하는 동작원리를 갖는다. 이 구조의 진동센서의 진동검출부는 결과적으로 진동에 의하여 압전세라믹의 양단에 발생하는 전하량을 변화시키는 구조를 갖게 되는데, 도 1 과 같은 등가회로로 나타낼 수 있다. 도 1에서 나타낸 것과 같이, 압전체는 캐페시터특성을 가짐을 알 수 있는데, 일반적인 진동감지용 압전체의 경우는 수십pF 정도의 캐페시터용량을 갖는다. 이러한 캐페시터용량은 그 특성상 온도의존성을 지니는데, 온도가 올라가는 경우에는 캐페시터용량도 증가하는 경향을 보인다. 다시 말해서, 온도에 의해 압전진동센서의 출력특성이 바뀌게 되므로, 고온환경에서 정밀한 진동값을 측정하고자 하는 경우에는 온도에 따른 출력성분의 보정이 매우 중요한 요소가 된다. 이러한 온도보상을 위해서는 먼저 PZT 압전체의 온도변화를 정확하게 측정할 필요가 있다. 기존의 방식은 센서의 주위에 설치된 열전쌍(thermocouple) 등과 같은 온도센서를 사용하여 온도를 측정하고, 이를 이용하여 진동센서내부의 압전세라믹의 온도를 추정하고, 이를 이용하여 온도의존성을 보정하는 방식을 취한다. 이러한 방식에서는 진동센서의 외부환경의 온도를 측정하여 내부의 압전세라믹의 온도변화를 추정하므로 정확한 압전체내부의 온도변화의 측정은 불가능하다. 또한, 온도센서를 추가로 진동센서의 외부에 설치해 주어야 하는 문제가 있으므로 센서의 설치 및 운용이 복잡하다는 문제점이 발생하게 된다.A vibration sensor using a piezoelectric body has an operation principle of detecting vibration due to a difference in the amount of charge caused by deformation of the piezoelectric body caused by vibration applied from the outside in the polarization direction. As a result, the vibration detection unit of the vibration sensor of this structure has a structure that changes the amount of charge generated at both ends of the piezoelectric ceramic due to vibration, which can be represented by an equivalent circuit as shown in FIG. As shown in FIG. 1, it can be seen that the piezoelectric material has a capacitor characteristic. In the case of a general vibration sensing piezoelectric material, the piezoelectric material has a capacitor capacity of several tens of pF. This capacitor capacity has a temperature dependency in nature, but when the temperature rises, the capacitor capacity also tends to increase. In other words, since the output characteristics of the piezoelectric vibration sensor are changed by temperature, the correction of the output component according to the temperature becomes a very important factor when the precision vibration value is to be measured in a high temperature environment. In order to compensate for this temperature, it is necessary to accurately measure the temperature change of the PZT piezoelectric body. The conventional method measures the temperature using a temperature sensor such as a thermocouple installed around the sensor, estimates the temperature of the piezoelectric ceramic inside the vibration sensor, and corrects the temperature dependence using it. Take it. In this method, since the temperature change of the piezoelectric ceramic inside is estimated by measuring the temperature of the external environment of the vibration sensor, accurate measurement of the temperature change inside the piezoelectric body is impossible. In addition, since there is a problem that the temperature sensor must be additionally installed outside the vibration sensor, a problem arises that the installation and operation of the sensor is complicated.
이 발명에서는 진동온도복합센서를 사용하여 진동과 온도를 검출하고 이를 사용하여 진동센서의 출력성분이 지니는 온도의존성을 보상해 줌으로써 측정치에 대한 신뢰성이 높은 진동측정장치를 제공하려는 것이다.The present invention is to provide a vibration measuring device having a high reliability for the measured value by detecting the vibration and the temperature by using the vibration temperature complex sensor and using the same to compensate for the temperature dependency of the output component of the vibration sensor.
도 1은 압전진동센서의 등가회로도이고,1 is an equivalent circuit diagram of a piezoelectric vibration sensor,
도 2는 진동온도복합센서의 구조를 도시한 개요도이며,2 is a schematic diagram showing the structure of a vibration temperature composite sensor,
도 3은 진동온도복합센서를 구비한 진동인디케이터의 구성을 도시한 블록선도이고,3 is a block diagram showing the configuration of a vibration indicator with a vibration temperature composite sensor,
도 4는 도 3에 도시된 진동인디게이터를 이용한 진동측정을 설명하기 위한 흐름도이다.4 is a flowchart illustrating a vibration measurement using the vibration indicator shown in FIG.
이 발명에 따르면, 진동에 의하여 발생하는 고(高)임피던스의 전하량신호를 저(低)임피던스의 전압신호로 변환하여 외부로 출력하여 주는 진동감지용 세라믹소자 및 상기 진동감지용 세라믹소자의 알루미나(Al2O3)기판의 하부에 부착된 온도검출용 세라믹소자를 갖는 진동온도복합센서가 제공된다.According to the present invention, a vibration sensing ceramic device for converting a high impedance charge amount signal generated by vibration into a low impedance voltage signal and outputting it to the outside and alumina of the vibration sensing ceramic device ( An Al 2 O 3 ) vibration temperature complex sensor having a ceramic element for temperature detection attached to a lower portion of a substrate is provided.
또한, 이 발명에 따르면, 진동을 측정하기 위한 진동인디게이터에 있어서, 진동과 온도를 감지하는 진동온도복합센서 및 상기 진동온도복합센서를 구동하고 그 온도측정치를 감안하여 진동측정치를 보정함으로써 순수진동치를 획득하는 구동부를 포함하고, 상기 진동복합센서는 임피던스변환용 세라믹소자의 하부에 부착된 온도센서를 포함하고 측정대상물체의 진동에 연동하여 진동하면서 압전체를 압박하는 진동체에 부착되며, 상기 구동부는 세라믹소자가 갖는 온도의존성 출력변동값을 미리 측정해서 기록해 두는 기억소자와, 가변정전류원을 포함하는 진동센서구동부와 가변정전압원을 포함하는 온도센서구동부와, 진동온도복합센서에서 출력되는 온도측정신호와 진동측정신호를 예정된 처리알고리즘에 따라 처리하여 온도의존성 출력변동값이 보정된 순수진동치를 연산하는 중앙처리장치를 포함하는 것을 특징으로 하는 진동인디게이터가 제공된다.In addition, according to the present invention, in the vibration indicator for measuring vibration, by driving the vibration temperature compound sensor for sensing vibration and temperature and the vibration temperature compound sensor and correcting the vibration measurement value in consideration of the temperature measurement value pure vibration value And a driving unit for acquiring, wherein the vibration composite sensor includes a temperature sensor attached to a lower portion of the ceramic element for impedance conversion, and is attached to a vibrating body which presses the piezoelectric body while vibrating in conjunction with vibrations of an object to be measured. A memory device that measures and records the temperature-dependent output fluctuation value of the ceramic device in advance, a vibration sensor driver including a variable constant current source, a temperature sensor driver including a variable constant voltage source, and a temperature measurement signal output from the vibration temperature complex sensor Temperature-dependent output fluctuations by processing vibration and vibration measurement signals according to a predetermined processing algorithm A vibration indicator, characterized in that it comprises a central processing unit for calculating a corrected value of the pure vibration is provided.
상기 처리알고리즘은 진동온도복합센서에서 출력된 진동신호 및 온도신호가 입력되는 단계와, 온도변화의 값에 따라 적절한 온도보정데이터를 선택하는 단계와, 선택된 온도보정데이터에 의해 진동측정신호를 보정하는 단계를 포함할 수 있다.The processing algorithm comprises the steps of inputting the vibration signal and the temperature signal output from the combined vibration temperature sensor, selecting the appropriate temperature correction data according to the value of the temperature change, and correcting the vibration measurement signal by the selected temperature correction data It may include a step.
아래에서는 도면을 보면서 이 발명의 양호한 실시예에 따른 진동온도복합센서의 구성을 상세히 설명하겠다.Hereinafter, a configuration of a vibration temperature composite sensor according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 2에 보이듯이, 이 실시예에 따른 진동온도복합센서(10)는 임피던스변환용 세라믹소자(11)의 하부에 부착된 온도센서(12)를 포함한다. 이러한 온도센서(12)는 온도에 따라 전기적 저항성분이 변하는 것으로서 외부에서 정전압원을 가해주면 저항성분의 변화에 따라 전류가 변화하는 온도검출용 세라믹소자이다. 온도센서(12)는 세라믹소자(11)와 함께 진동체(13)에 거의 밀착되어 있으므로, 세라믹소자(11)의 온도변화를 정확하게 검출할 수 있다. 절연층(17)을 사이에 두고 베이스(16)에 고정된 센트럴포스트(14)와 그 둘레에 배치된 환형 압전소자(15) 및 커버(18) 등의 구성은 종래의 진동센서와 동일하다.As shown in FIG. 2, the vibration temperature composite sensor 10 according to this embodiment includes a temperature sensor 12 attached to a lower portion of the ceramic element 11 for impedance conversion. The temperature sensor 12 is a ceramic element for temperature detection, in which an electric resistance component changes with temperature, and a current is changed according to a change in resistance component when a constant voltage source is applied from the outside. Since the temperature sensor 12 is almost in close contact with the vibrating body 13 together with the ceramic element 11, the temperature change of the ceramic element 11 can be detected accurately. The configuration of the central post 14 fixed to the base 16 with the insulating layer 17 therebetween, the annular piezoelectric element 15 and the cover 18 arranged around the same, is the same as that of the conventional vibration sensor.
도 3에 보이듯이, 이 실시예에 따른 진동온도복합센서(10)의 작동을 위해서는 사용된 세라믹소자(11)가 갖는 온도의존성에 관한 출력변동값을 미리 측정하고 이를 시스템 내부의 기억소자(23)에 기록해 두게 된다. 이 때, 기억소자(23)로는 각각의 세라믹소자(11)의 세라믹소재에 따른 온도의존성의 변화에 대한 출력변동의 데이터를 손쉽게 변경하기 위하여 기록 및 삭제가 손쉬운 EEPROM(Electrically Erasable and Programmable ROM)을 사용한다.As shown in FIG. 3, in order to operate the vibration temperature composite sensor 10 according to the present embodiment, an output variation value related to the temperature dependence of the ceramic element 11 used is measured in advance and stored in the storage element 23 in the system. ). At this time, the memory element 23 is provided with EEPROM (Electrically Erasable and Programmable ROM), which is easy to record and delete, in order to easily change the data of the output variation with respect to the change of temperature dependence according to the ceramic material of each ceramic element 11. use.
이 실시예에 따른 진동온도복합센서(10)의 구동회로는 가변정전류원을 포함하는 진동센서구동부(21) 및 가변정전압원을 포함하는 온도센서구동부(22)를 포함한다. 진동온도복합센서(10)의 출력신호는 전류전압변환회로와 전하량전압변환회로 및 증폭회로(22)를 거쳐서 출력되며, 출력된 전압파형의 신호는 아날로그디지탈변환기(24)를 거쳐서 CPU(25)에 입력되며, CPU(25)에서 예정된 처리알고리즘에 따라 온도 및 진동값을 연산한다. 기억소자(23)는 온도변화에 따른 보정데이터의 조회표 뿐만 아니라, 현재 활성중인 온도보정데이터를 일시적으로 저장해 두고 CPU(25)에 제공할 수 있게 구성되는 것이 양호하며, CPU(25)에서 온도보정이 완료된 진동측정치는 디지탈아날로그변환기(26)를 거쳐서 아날로그방식의 출력부(27)에서 출력되거나, 디지탈 방식의 출력유니트(28)에서 출력된다.The driving circuit of the vibration temperature complex sensor 10 according to this embodiment includes a vibration sensor driver 21 including a variable constant current source and a temperature sensor driver 22 including a variable constant voltage source. The output signal of the vibration temperature complex sensor 10 is output through the current voltage conversion circuit, the charge amount voltage conversion circuit and the amplification circuit 22, and the output voltage waveform signal is passed through the analog digital converter 24 to the CPU 25. Is input to the CPU 25, and calculates temperature and vibration values in accordance with a predetermined processing algorithm. The memory device 23 is preferably configured to temporarily store not only the correction data inquiry table according to the temperature change, but also to provide the CPU 25 with the currently active temperature correction data, and the temperature at the CPU 25. The corrected vibration measurement value is output from the analog output unit 27 through the digital analog converter 26 or from the digital output unit 28.
한편, CPU에서 온도보정치의 연산을 신속하게 행하기 위해서는 도 4에 보이는 연산로직을 이용하는 것이 양호하다.On the other hand, it is preferable to use the calculation logic shown in Fig. 4 to quickly calculate the temperature correction value in the CPU.
우선, 단계 S0에서 로직처리가 시작되면, 단계 S1과 단계 S2에서 진동온도복합센서(10)에서 출력된 진동신호 및 온도신호가 입력되며, 단계 S3에서는 입력된 온도신호가 직전의 논리연산에서 사용된 온도신호로부터 변한 온도변화의 값이 일정한 수준을 넘는지를 판단하고, 판단결과가 "아니오"이면 단계 S7에서 현재 활성상태인 온도보정데이터를 그대로 출력하고, 판단결과가 "예"이면, 입력된 온도신호에 따른 온도보정데이터를 기억소자(23)로부터 취득하며, 단계 S5에서는 새로 취득된 온도보정데이터가 현재 활성상태인 온도보정데이터와 같은지를 판단하며, 판단결과가 "예"이면, 단계 S7에서 현재 활성상태인 온도보정데이터를 출력하며, 판단결과가 "아니오"이면, 기억소자(23)에 기록된 현재 활성상태인 온도보정데이터를 갱신한다.First, when logic processing starts in step S0, the vibration signal and the temperature signal output from the vibration temperature complex sensor 10 are input in steps S1 and S2, and in step S3, the input temperature signal is used in the previous logical operation. It is determined whether the value of the temperature change changed from the temperature signal is exceeded a certain level. If the determination result is "No", the temperature correction data which is currently active is output as it is in step S7. The temperature correction data according to the temperature signal is acquired from the storage element 23. In step S5, it is determined whether the newly acquired temperature correction data is the same as the temperature correction data which is currently active. If the determination result is YES, step S7 Outputs the temperature correction data which is currently active, and if the determination is "no", the temperature correction data which is currently active is recorded in the memory device 23.
위에서 설명한 온도센서의 출력값을 사용하여 진동센서의 온도의존성을 보상해 주면, 기존의 방식에서 사용하는 외장형 온도센서의 출력을 이용하는 경우에 비하여 좀더 정확한 보정값을 얻을 수 있다.Compensating the temperature dependence of the vibration sensor by using the output value of the temperature sensor described above, more accurate correction value can be obtained than when using the output of the external temperature sensor used in the conventional method.
진동온도복합센서에 내장된 온도센서의 검출값을 사용하여 압전세라믹의 정확한 온도변화를 검출하고 이를 이용하여 진동센서의 출력값의 온도의존성을 보정하는 기능을 갖는 이 발명에 따른 인디케이터는 진동센서의 출력값에 대한 온도보정을 보다 정확하게 수행 할 수 있다.The indicator according to the present invention has the function of detecting the temperature change of the piezoelectric ceramic using the detected value of the temperature sensor built into the vibration temperature sensor and correcting the temperature dependence of the output value of the vibration sensor. Temperature correction can be done more accurately.
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| KR102249113B1 (en) * | 2019-05-08 | 2021-05-10 | (주)제이에스시스템 | Automatic equipment failure prediction system in smart factory |
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