KR100343520B1 - 땜납볼공급장치 - Google Patents
땜납볼공급장치 Download PDFInfo
- Publication number
- KR100343520B1 KR100343520B1 KR1019940703657A KR19940703657A KR100343520B1 KR 100343520 B1 KR100343520 B1 KR 100343520B1 KR 1019940703657 A KR1019940703657 A KR 1019940703657A KR 19940703657 A KR19940703657 A KR 19940703657A KR 100343520 B1 KR100343520 B1 KR 100343520B1
- Authority
- KR
- South Korea
- Prior art keywords
- solder ball
- flux
- head
- solder
- supplying
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 256
- 230000004907 flux Effects 0.000 claims abstract description 121
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 22
- 239000011295 pitch Substances 0.000 claims description 20
- 230000004308 accommodation Effects 0.000 claims description 9
- 238000011084 recovery Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims 1
- 239000006071 cream Substances 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (16)
- 땜납볼 공급 수단을 포함하는 땜납볼 공급 장치에 있어서,상기 땜납볼 공급 수단은,하나의땜납볼을 수납하는 땜납볼 수납공을 매트릭스형으로다수개형성한 요동기()와 상기 요동기에 형성된 땜남볼 수납공과대응하는다수의 흡기공을 형성한 헤드부를 가지며,상기 요동기를 작동시켜 상기 땜납볼을 상기 땜납볼 수납공에 떨어뜨려 넣고, 또한 상기 요동기의 동작이 정지한 후, 상기 헤드부의 상기 흡입공에 의하여상기 땜납볼 수납공으로부터 상기 땜납볼을 꺼내어, 소정 위치에 반송(搬送), 공급하는 땜납볼 공급 장치.
- 제1항에 있어서,상기 땜납볼 공급 수단의 헤드부에 형성된 흡기공과 동일 패턴으로 노즐을 배치한 플럭스(flux) 디스펜서를 가지고, 땜납볼의 공급에 앞서 땜납볼을 공급하는 소정 위치에 플럭스를 동시에 공급하는 플럭스 공급 수단을 구비한 땜납볼 공급 장치.
- 제2항에 있어서,상기 플럭스 및 땜납볼을 공급하는 소정 위치가 이송 수단에 세트된 프린트 기판상의 집적 회로 칩 입출력 단자인 땜납볼 공급 장치.
- 제3항에 있어서,상기 이송 수단이 깊은 오목부(凹部)를 가지고, 기판에 탑재되어 있는 집적 회로 칩을 수용함으로써, 집적 회로 칩의 두께에 관계없이 기판의 입출력 단자를 일정한 높이에 위치시키는 구성으로 되어 있는 땜납볼 공급 장치.
- 제1항 내지 제4항 중 어느 한 항에 있어서,상기 요동기가 상이한 피치로 이루어지는 땜납볼 수납공이 각각 매트릭스형으로 형성되어 이루어지는 복수의 땜납볼 수납공군(群)을 가지는 땜납볼 공급 장치.
- 제1항 내지 제4항 중 어느 한 항에 있어서,상기 땜납볼 수납공에 땜납볼 수납시에 흡기하고, 땜납볼을 꺼낼 때에 배기하는 흡배기 수단을 연결 접속한 땜납볼 공급 장치.
- 제1항 내지 제4항 중 어느 한 항에 있어서,상기 요동기가 땜납볼의 전동(轉動) 방향으로 먼저 크게 스윙하고, 그 후 복수회 작게 스윙하는 구성인 땜납볼 공급 장치.
- 제7항에 있어서,상기 요동기가 땜납볼의 전동 방향과 직교하는 방향으로, 상기 스윙과 동기(同期)하여 왕복하여 움직이는 구성인 땜납볼 공급 장치.
- 제1항 내지 제4항 중 어느 한 항에 있어서,상기 땜납볼 공급 수단이 복수 종류의 땜납볼 헤드를 교환 가능하게 장착하고, 또한 복수 종류의 땜납볼 헤드를 수용하는 수용부를 구비한 땜납볼 공급 장치.
- 제9항에 있어서,상기 수용부와 일체적으로 미스볼 회수 트레이를 배치한 땜납볼 공급 장치.
- 제2항에 있어서,상기 플럭스 공급 수단이 플럭스 디스펜서의 노즐에 부착되는 플럭스 찌꺼기를 제거하는 플럭스 클리너를 구비한 땜납볼 공급 장치.
- 제2항 또는 제11항에 있어서,상기 플럭스 공급 수단이 플럭스 디스펜서의 노즐로부터의 토출 상태를 체크하는 플럭스 체커를 구비한 땜납볼 공급 장치.
- 제1항 내지 제4항 중 어느 한 항에 있어서,땜납볼 공급 수단이 흡기공의 패턴 및 흡기공 간의 피치가 상이한 복수대의땜납볼 헤드를 가지고, 이들 복수대의 땜납볼 헤드를 선택적으로 사용하는 구성으로 되어 있는 땜납볼 공급 장치.
- 제2항 내지 제4항 중 어느 한 항에 있어서,플럭스 공급 수단이 노즐의 배치 패턴과 노즐 간 피치 중 어느 하나가 상이 하거나 양자 모두가 상이한 복수대의 플럭스 디스펜서를 가지고, 이들 복수대의 플럭스 디스펜서를 선택적으로 사용하는 구성으로 되어 있는 땜납볼 공급 장치.
- 제2항 내지 제4항 중 어느 한 항에 있어서,플럭스 공급을 위한 로봇과 땜납볼 공급을 위한 로봇을 공용(共用)하고, 이 로봇의 헤드에 플럭스 헤드와 땜납볼 헤드를 선택적으로 교환하여 장착하는 구성으로 한 땜납볼 공급 장치.
- 제13항에 있어서,상기 플럭스 헤드에 플럭스 디스펜서를 교환 가능하게 장착하고, 상기 땜납볼 헤드에 흡기공 헤드를 교환 가능하게 장착하는 구성으로 한 땜납볼 공급 장치.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-154311 | 1993-05-31 | ||
JP15431193 | 1993-05-31 | ||
PCT/JP1994/000337 WO1994028580A1 (fr) | 1993-05-31 | 1994-03-02 | Systeme d'alimentation en billes de soudure |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100343520B1 true KR100343520B1 (ko) | 2002-11-23 |
Family
ID=15581347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940703657A KR100343520B1 (ko) | 1993-05-31 | 1994-03-02 | 땜납볼공급장치 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5467913A (ko) |
JP (1) | JP3303109B2 (ko) |
KR (1) | KR100343520B1 (ko) |
GB (1) | GB2284933B (ko) |
HK (1) | HK116497A (ko) |
SG (1) | SG42943A1 (ko) |
TW (1) | TW261558B (ko) |
WO (1) | WO1994028580A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100694462B1 (ko) * | 2001-04-02 | 2007-03-12 | 앰코 테크놀로지 코리아 주식회사 | 반도체 자재의 신호인출단자 형성 장치 및 그 형성 방법 |
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- 1994-03-02 US US08/319,660 patent/US5467913A/en not_active Expired - Lifetime
- 1994-03-02 JP JP52142494A patent/JP3303109B2/ja not_active Expired - Lifetime
- 1994-03-02 GB GB9424776A patent/GB2284933B/en not_active Expired - Lifetime
- 1994-03-02 WO PCT/JP1994/000337 patent/WO1994028580A1/ja active Application Filing
- 1994-03-30 TW TW083102746A patent/TW261558B/zh not_active IP Right Cessation
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1997
- 1997-06-26 HK HK116497A patent/HK116497A/xx not_active IP Right Cessation
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KR100694462B1 (ko) * | 2001-04-02 | 2007-03-12 | 앰코 테크놀로지 코리아 주식회사 | 반도체 자재의 신호인출단자 형성 장치 및 그 형성 방법 |
Also Published As
Publication number | Publication date |
---|---|
SG42943A1 (en) | 1997-10-17 |
GB9424776D0 (en) | 1995-03-01 |
WO1994028580A1 (fr) | 1994-12-08 |
GB2284933A (en) | 1995-06-21 |
TW261558B (ko) | 1995-11-01 |
US5467913A (en) | 1995-11-21 |
GB2284933B (en) | 1996-12-04 |
JP3303109B2 (ja) | 2002-07-15 |
HK116497A (en) | 1997-09-05 |
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