KR100335736B1 - 웨이퍼 반전을 위한 로봇 핑거 어셈블리 - Google Patents
웨이퍼 반전을 위한 로봇 핑거 어셈블리 Download PDFInfo
- Publication number
- KR100335736B1 KR100335736B1 KR1019990050663A KR19990050663A KR100335736B1 KR 100335736 B1 KR100335736 B1 KR 100335736B1 KR 1019990050663 A KR1019990050663 A KR 1019990050663A KR 19990050663 A KR19990050663 A KR 19990050663A KR 100335736 B1 KR100335736 B1 KR 100335736B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- case
- finger assembly
- robot
- robot finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003860 storage Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 abstract description 29
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000004904 shortening Methods 0.000 abstract description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (4)
- 웨이퍼를 이송하기 위한 암을 구비하고 있는 로봇에 있어서,상기 암부의 선단부에 결합되어 웨이퍼를 반전시키기 위하여 제어장치와 전기적으로 연결되는 반전 모터에 제공된 축;내부에 수납공간을 갖추고 있으며 상기 웨이퍼를 홀딩하기 위한 수단을 갖고 상기 반전 모터의 축에 회전할 수 있도록 결합되는 케이스;상기 케이스에 수납되어 있으며, 상기 웨이퍼를 클램핑하기 위하여 제어장치와 전기적으로 연결되는 클램핑 모터;상기 클램핑 모터의 구동에 의하여 상기 케이스에 미끄럼 이동 가능하게 결합되어 상기 웨이퍼가 안착되는 받침부재; 그리고상기 받침부재는 웨이퍼에 선택적으로 밀착될 수 있도록 자유단부에 결합되는 푸셔;를 더 포함하는 웨이퍼 반전을 위한 로봇 핑거 어셈블리.
- 제1항에 있어서, 상기 케이스는선단에 상기 웨이퍼의 가장자리 일부가 삽입될 수 있는 홈이 제공된 웨이퍼 반전을 위한 로봇 핑거 어셈블리.
- 제1항에 있어서, 상기 케이스는선단에 상기 웨이퍼의 외주면이 일부 접촉할 수 있도록 구성된 홀더를 구비하고 있는 웨이퍼 반전을 위한 로봇 핑거 어셈블리.
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990050663A KR100335736B1 (ko) | 1999-11-15 | 1999-11-15 | 웨이퍼 반전을 위한 로봇 핑거 어셈블리 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990050663A KR100335736B1 (ko) | 1999-11-15 | 1999-11-15 | 웨이퍼 반전을 위한 로봇 핑거 어셈블리 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010046765A KR20010046765A (ko) | 2001-06-15 |
KR100335736B1 true KR100335736B1 (ko) | 2002-05-09 |
Family
ID=19620171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990050663A Expired - Fee Related KR100335736B1 (ko) | 1999-11-15 | 1999-11-15 | 웨이퍼 반전을 위한 로봇 핑거 어셈블리 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100335736B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100413067B1 (ko) * | 2001-09-28 | 2003-12-31 | 한국디엔에스 주식회사 | 반도체 제조 장비의 웨이퍼 세정 장비 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111128842A (zh) * | 2019-11-29 | 2020-05-08 | 东台镭创光电技术有限公司 | 一种晶圆夹具 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60120520A (ja) * | 1983-12-02 | 1985-06-28 | Canon Inc | 半導体製造用搬送装置 |
JPS60133731A (ja) * | 1983-12-21 | 1985-07-16 | Matsushita Electric Ind Co Ltd | 薄板搬送装置 |
JPS62150739A (ja) * | 1985-12-24 | 1987-07-04 | Oji Koei Kk | Ic用ウエハ−移替装置 |
JPH04247638A (ja) * | 1991-02-04 | 1992-09-03 | Nippon Telegr & Teleph Corp <Ntt> | 着脱移送装置 |
JPH06163493A (ja) * | 1992-11-20 | 1994-06-10 | Tokyo Electron Ltd | 洗浄処理装置 |
-
1999
- 1999-11-15 KR KR1019990050663A patent/KR100335736B1/ko not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60120520A (ja) * | 1983-12-02 | 1985-06-28 | Canon Inc | 半導体製造用搬送装置 |
JPS60133731A (ja) * | 1983-12-21 | 1985-07-16 | Matsushita Electric Ind Co Ltd | 薄板搬送装置 |
JPS62150739A (ja) * | 1985-12-24 | 1987-07-04 | Oji Koei Kk | Ic用ウエハ−移替装置 |
JPH04247638A (ja) * | 1991-02-04 | 1992-09-03 | Nippon Telegr & Teleph Corp <Ntt> | 着脱移送装置 |
JPH06163493A (ja) * | 1992-11-20 | 1994-06-10 | Tokyo Electron Ltd | 洗浄処理装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100413067B1 (ko) * | 2001-09-28 | 2003-12-31 | 한국디엔에스 주식회사 | 반도체 제조 장비의 웨이퍼 세정 장비 |
Also Published As
Publication number | Publication date |
---|---|
KR20010046765A (ko) | 2001-06-15 |
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