KR100311453B1 - 금속판 도금장치 - Google Patents
금속판 도금장치 Download PDFInfo
- Publication number
- KR100311453B1 KR100311453B1 KR1019990005692A KR19990005692A KR100311453B1 KR 100311453 B1 KR100311453 B1 KR 100311453B1 KR 1019990005692 A KR1019990005692 A KR 1019990005692A KR 19990005692 A KR19990005692 A KR 19990005692A KR 100311453 B1 KR100311453 B1 KR 100311453B1
- Authority
- KR
- South Korea
- Prior art keywords
- plating
- metal plate
- tank
- bath
- storage tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 title claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 40
- 238000007747 plating Methods 0.000 claims abstract description 190
- 239000000243 solution Substances 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims abstract description 40
- 238000002347 injection Methods 0.000 claims abstract description 12
- 239000007924 injection Substances 0.000 claims abstract description 12
- 238000011084 recovery Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000005507 spraying Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 1
- 238000005868 electrolysis reaction Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0685—Spraying of electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (2)
- 도금용액이 담겨지는 소정 깊이로 된 도금조(2)가 설치되며, 이 도금조(2)의 내부 둘레에는 도금할 금속판(1)을 누르면서 -전원을 공급하는 수개의 -전극부재(4)가 설치되며, 도금조(2)의 상측에는 모터의 구동으로 도금조(2)의 상측에서 전후방으로 수평이동하면서 +전원을 공급하는 +전극통(8)이 횡단설치되는 금속판 도금장치에 있어서,도금액을 저장하기 위한 도금액저장조(20) 및 상기 도금조(2)에 도금액을 공급하기 위한 펌프(30)를 도금조(2)의 외부에 설치하고, 공급관(40)을 구비하여 일단을 상기 도금액저장조(20)와 연결함과 동시에 타단은 상기 펌프(30)를 통하여 상기 도금조(2)의 상측으로 연장되게 설치하며, 굴절관(50)을 구비하여 일단을 상기 공급관(40)의 선단에 연결한 상태로 상기 +전극통(8)의 이동구간을 따라 상기 도금조(2)의 일측 상부에 배치하고, 공급되는 도금액을 상기 도금조(2)의 바닥측으로 분사시킬 수 있도록 주면에 다수의 분사공(61)이 형성된 분사관(60)을 구비하여 일단을 상기 공급관(40)과 연결한 상태로 상기 +전극통(8)에 내장하며, 최소한 1개 이상의 회수관(70)을 구비하여 상기 도금조(2)에 있는 도금액을 상기 도금액저장조(20)로 배출되도록 일단은 상기 도금조(2)의 바닥과 연통되도록 연결하고 타단은 상기 도금액저장조(20)의 상부로 연장되게 설치한 것을 특징으로 하는 금속판 도금장치.
- 제1항에 있어서, 상기 공급관(40)에 히터(80)를 구비하여 도금조(2)로 공급되는 도금액을 가열할 수 있도록 한 것을 특징으로 하는 금속판도금장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990005692A KR100311453B1 (ko) | 1999-02-20 | 1999-02-20 | 금속판 도금장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990005692A KR100311453B1 (ko) | 1999-02-20 | 1999-02-20 | 금속판 도금장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990045932A KR19990045932A (ko) | 1999-06-25 |
KR100311453B1 true KR100311453B1 (ko) | 2001-11-02 |
Family
ID=37531025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990005692A Expired - Lifetime KR100311453B1 (ko) | 1999-02-20 | 1999-02-20 | 금속판 도금장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100311453B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101143401B1 (ko) * | 2004-11-22 | 2012-05-22 | 주식회사 포스코 | 도금액 채취장치 및 성분 분석방법 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100532830B1 (ko) * | 2002-12-11 | 2005-12-01 | 주식회사 메시 | 고속복합 도금장치 |
KR101905950B1 (ko) | 2016-04-08 | 2018-10-08 | 현대자동차주식회사 | 수동변속기의 변속레버 어셈블리 |
KR101880599B1 (ko) * | 2016-06-22 | 2018-07-23 | (주)포인텍 | 애노드 이동형 수평도금장치 |
KR102124406B1 (ko) * | 2018-03-28 | 2020-06-18 | 주식회사 익스톨 | 수평 도금 장치 및 방법 |
-
1999
- 1999-02-20 KR KR1019990005692A patent/KR100311453B1/ko not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101143401B1 (ko) * | 2004-11-22 | 2012-05-22 | 주식회사 포스코 | 도금액 채취장치 및 성분 분석방법 |
Also Published As
Publication number | Publication date |
---|---|
KR19990045932A (ko) | 1999-06-25 |
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