KR100305844B1 - 전자제어모듈용pcb조립체 - Google Patents
전자제어모듈용pcb조립체 Download PDFInfo
- Publication number
- KR100305844B1 KR100305844B1 KR1019960068541A KR19960068541A KR100305844B1 KR 100305844 B1 KR100305844 B1 KR 100305844B1 KR 1019960068541 A KR1019960068541 A KR 1019960068541A KR 19960068541 A KR19960068541 A KR 19960068541A KR 100305844 B1 KR100305844 B1 KR 100305844B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- ground
- electronic control
- control module
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010410 layer Substances 0.000 claims description 32
- 239000002356 single layer Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims description 2
- 230000002452 interceptive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000004941 influx Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Semiconductor Integrated Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (5)
- 복수의 PCB가 다층으로 이루어진 전자제어 모듈용 PCB 조립체에 있어서, 상기 PCB는 복수개의 층으로 분리되고, 전원단의 영역과 그라운드의 영역을 독립된 하나의 층에 할당되어 레이아웃된 것을 특징으로 하는 전자제어 모듈용 PCB 조립체.
- 제1항에 있어서, 공급되는 동일한 전원단과 동일한 전위를 갖는 그라운드에 대해서는 공동을 접속한 다음 단일 포트의 입출력 단자로 연결된 것을 특징으로 하는 전자제어 모듈용 PCB 조립체.
- 제1항에 있어서, 상기 PCB는 4층으로 이루어지고, 이들 중 제1층(10)과 제4층(40)은 마이컴(11)을 중심으로 각각의 소자가 결합되는 컴퍼넌트층으로 할당되고, 제2층(20)은 그라운드층으로 할당되며, 제3층(30)은 전원단층으로 할당된 것을 특징으로 하는 전자제어 모듈용 PCB 조립체.
- 제3항에 있어서, 상기 제2층(20)의 그라운드층은 커넥터 쪽에 위치시키며 다른 그라운드와 만나지 않고 전자제어 모듈의 케이스를 통해 새시에 연결되도록 구성하는 새시 그라운드(21)와; 출력 구동단의 전원 그라운드인 전원단 그라운드(22) 및; PBC 기판상에서 가장 많은 면적을 차지하는 로직 그라운드(23)로 레이아웃된 것을 특징으로 하는 전자제어 모듈용 PCB 조립체.
- 제3항에 있어서, 상기 제3층인 전원단층은 이그니션 온시 B+ 전원이 공급되는 구동 전원을 연결하는 패턴과 메인 릴레이의 온시 공급되는 전원을 연결하는 패턴, 항시 공급되는 전원을 연결하는 패턴, 각각의 정보 검출센서에서 인가되는 전원을 연결하는 패턴 및 입력되는 전원의 A/D 변환시 아날로그 신호가 디지털 신호에 간섭을 받지 않도록 하는 패턴을 각각 독립적으로 레이아웃하며, 임의의 입출력 포트를 통해 커넥터에 연결되도록 레이아웃된 것을 특징으로 하는 전자제어 모듈용 PCB 조립체.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960068541A KR100305844B1 (ko) | 1996-12-20 | 1996-12-20 | 전자제어모듈용pcb조립체 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960068541A KR100305844B1 (ko) | 1996-12-20 | 1996-12-20 | 전자제어모듈용pcb조립체 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19980049792A KR19980049792A (ko) | 1998-09-15 |
KR100305844B1 true KR100305844B1 (ko) | 2001-12-15 |
Family
ID=37530230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960068541A Expired - Fee Related KR100305844B1 (ko) | 1996-12-20 | 1996-12-20 | 전자제어모듈용pcb조립체 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100305844B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7102196B2 (en) | 2003-09-08 | 2006-09-05 | Pantech Co., Ltd. | Multi-layered printed circuit board for efficient electrostatic discharge protection |
KR100932060B1 (ko) * | 2008-04-03 | 2009-12-15 | 콘티넨탈 오토모티브 시스템 주식회사 | 센서신호의 전달회로 구현 시스템 |
KR100932059B1 (ko) | 2008-04-03 | 2009-12-15 | 콘티넨탈 오토모티브 시스템 주식회사 | 센서신호의 전달회로 구현 시스템 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100341077B1 (en) * | 1998-12-31 | 2002-09-27 | Simm Tech Co Ltd | Structure of multi-layered module in pcb |
KR100439406B1 (ko) * | 2002-04-04 | 2004-07-09 | 삼성전기주식회사 | 텔레마틱 단말기의 그라운드 분리 구조 및 방법 |
KR100597904B1 (ko) * | 2004-08-18 | 2006-07-07 | 한성엘컴텍 주식회사 | 소형 카메라 모듈용 인쇄회로기판 |
-
1996
- 1996-12-20 KR KR1019960068541A patent/KR100305844B1/ko not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7102196B2 (en) | 2003-09-08 | 2006-09-05 | Pantech Co., Ltd. | Multi-layered printed circuit board for efficient electrostatic discharge protection |
KR100932060B1 (ko) * | 2008-04-03 | 2009-12-15 | 콘티넨탈 오토모티브 시스템 주식회사 | 센서신호의 전달회로 구현 시스템 |
KR100932059B1 (ko) | 2008-04-03 | 2009-12-15 | 콘티넨탈 오토모티브 시스템 주식회사 | 센서신호의 전달회로 구현 시스템 |
Also Published As
Publication number | Publication date |
---|---|
KR19980049792A (ko) | 1998-09-15 |
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Legal Events
Date | Code | Title | Description |
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PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19961220 |
|
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19970829 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19961220 Comment text: Patent Application |
|
PG1501 | Laying open of application | ||
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Comment text: Notification of reason for refusal Patent event date: 20000126 Patent event code: PE09021S01D |
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Comment text: Notification of reason for refusal Patent event date: 20000602 Patent event code: PE09021S01D |
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Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20010531 |
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Comment text: Registration of Establishment Patent event date: 20010802 Patent event code: PR07011E01D |
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PR1002 | Payment of registration fee |
Payment date: 20010803 End annual number: 3 Start annual number: 1 |
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PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20040317 Start annual number: 4 End annual number: 4 |
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FPAY | Annual fee payment |
Payment date: 20050801 Year of fee payment: 5 |
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Payment date: 20050801 Start annual number: 5 End annual number: 5 |
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LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20070710 |