KR100303884B1 - Method for fabricating piezoelectric/electrostrictive ceramic micro actuator using photolithography - Google Patents

Abstract

The present invention comprises the steps of providing a diaphragm; (A step of forming a lower electrode on the vibration plate;) applying a photoresist on the vibration plate (or lower electrode), exposing and then developing to form a mold of a fine pattern; Prepared by non-explosive oxidation-reduction combustion reaction at a low temperature of 100-500 ℃, the particle size is 5㎛ or less, ceramic oxide powder with lead (Pb), titanium (Ti) as a basic element, water or organic solvent Preparing a ceramic paste by mixing a ceramic sol solution having the same or similar components as the ceramic oxide powder prepared as a base; Filling the ceramic paste into the mold to form a piezoelectric / distortion film; Firing the piezoelectric / electric distortion film formed in the mold by heat treatment at 100-300 ° C .; And a method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using a photolithography method including forming an upper electrode on the piezoelectric / electric distortion film, to achieve a high aspect ratio of a fine pattern. It is possible to improve the coupling with the substructure and to prevent the piezoelectric / electric distortion film from being damaged by scratching from the outside by placing the piezoelectric / electric distortion film inside the mold.

Description

Method for fabricating piezoelectric / electrostrictive ceramic micro actuator using photolithography

The present invention relates to a method for manufacturing a micro actuator, and more particularly, to a method for manufacturing a micro actuator by photolithography using piezoelectric / electric warp ceramic paste.

In general, the micro actuator is composed of a diaphragm, a lower electrode formed on the upper portion of the diaphragm, a piezoelectric / electrodistor film formed on the upper portion of the lower electrode, and an upper electrode formed on the piezoelectric / distortion film. When applied, the piezoelectric / electrodistor film placed between the electrodes vibrates while repeating deformation and restoration.

In order to manufacture piezoelectric / electric warp films used as piezoelectric elements in micro actuators, ceramic powders manufactured by a solid phase method have been conventionally used.

The solid phase method, also called an oxide method, is a method of preparing a ceramic powder by mixing an oxide or molten salt, which is a raw material in powder form, and heat-processing at 800-1200 ° C, followed by grinding and sintering.

The ceramic powder produced by the solid phase method is inappropriate to obtain fine particles of 0.1 μm or less because the particle size thereof varies depending on the size of the raw material powder and the particle size of the produced powder is relatively large, such as 0.2-2 μm. In general, there is a problem in that heat treatment is required at a high temperature of 1000 ° C. or higher.

In manufacturing a micro actuator using a ceramic powder, a method of forming a micro pattern by screen printing ceramic paste on the lower structure of a diaphragm and a chamber has been mainly used.

In the screen printing method, a ceramic paste is manufactured and the manufactured ceramic paste is printed on a diaphragm using a screen, followed by debindering at 500 ° C. or higher, followed by heat treatment at 1000 ° C. or higher to form a piezoelectric / electric distortion film having a predetermined thickness. That's how.

The method of manufacturing a micro actuator using the screen printing method is commonly used to increase the degree of integration of the micro actuator, but this method has the following problems.

First, there is a limit in making the thickness of the printed piezoelectric / electric distortion film thin. That is, since the thickness of the piezoelectric / electric distortion film which can be produced by the screen printing method is 5 µm, it is difficult to produce a piezoelectric / electric distortion film having a film thickness of less than 5 µm.

Secondly, it is possible to produce a thick piezoelectric / electric distortion film by adjusting the emulsion film thickness of the screen to be used or printing it more than once, but as the printing is repeated, the ceramic paste 16 is shown as shown in FIG. It flows down the side of the previously printed pattern.

Therefore, it is difficult to obtain a pattern having a high aspect ratio, and it is difficult to align the piezoelectric / electrodistor film with the substructure.

Third, in the case of repeating the printing process, there is a possibility that deterioration of the film formed initially may occur because the heat treatment process subsequent to each printing process is repeated.

Fourth, in the case of forming the piezoelectric / electric distortion film by the screen printing method, since the width and the spacing of the micropatterns are limited to 30 µm or more, it is difficult to form the micropatterns having the width and spacing of less than 30 µm.

Fifth, the result of screen printing is influenced not only by the pattern of the screen but also by the conditions such as the viscosity of the ceramic paste, the pressure and the speed when printing.

The present invention for solving the above problems can be obtained a piezoelectric / electrodistortion film having a desired thickness by a single process at a low temperature, it is possible to prevent the ceramic paste from flowing to the side even when forming a thick film, and micro An object of the present invention is to provide a method of manufacturing a micro actuator, in which the thickness of the upper electrode which has a significant influence on the performance of the actuator can be adjusted.

1 is a schematic diagram illustrating a phenomenon in which a ceramic paste flows due to repetition of printing when a micro actuator is manufactured using conventional screen printing;

2 is a process chart showing a manufacturing process of a piezoelectric / electric distortion ceramic micro actuator using the photolithography method of the present invention when a metal is used as the diaphragm;

Figure 3 is a process diagram showing the manufacturing process of the piezoelectric / electrostrictive ceramic micro actuator using the photolithography method of the present invention when using a ceramic or an organic compound as a diaphragm.

<Description of the symbols for the main parts of the drawings>

10: diaphragm 14: photoresist

16: piezoelectric / electric distortion material 18: upper electrode

20: lower electrode

The present invention for achieving the above object comprises the steps of providing a diaphragm made of a metal; Applying a photoresist on the metal vibrating plate and patterning the same to form a mold having a fine pattern; Prepared by non-explosive oxidation-reduction combustion reaction at a low temperature of 100-500 ℃, the particle size is 5㎛ or less, ceramic oxide powder with lead (Pb), titanium (Ti) as a basic element, water or organic solvent Preparing a ceramic paste by mixing a ceramic sol solution having the same or similar components as the ceramic oxide powder prepared as a base; Filling the ceramic paste into the mold to form a piezoelectric / electric distortion film; Firing the piezoelectric / electric distortion film formed in the mold by heat treatment at 100-300 ° C .; And a method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using a photolithography method including forming an upper electrode on the piezoelectric / electric distortion film.

The present invention also provides a diaphragm; Forming a lower electrode on the diaphragm; Coating a photoresist on the lower electrode and patterning the photoresist to form a mold of a fine pattern; Prepared by non-explosive oxidation-reduction combustion reaction at a low temperature of 100-500 ℃, the particle size is 5㎛ or less, ceramic oxide powder with lead (Pb), titanium (Ti) as a basic element, water or organic solvent Preparing a ceramic paste by mixing a ceramic sol solution having the same or similar components as the ceramic oxide powder prepared as a base; Filling the ceramic paste into the mold to form a piezoelectric / distortion film; Firing the piezoelectric / electric distortion film formed in the mold by heat treatment at 100-300 ° C .; And a method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using a photolithography method including forming an upper electrode on the piezoelectric / electric distortion film.

Hereinafter, the present invention will be described in detail.

As the diaphragm for manufacturing a micro actuator, a metal, a ceramic of silicon, and a metal oxide system are used.

The manufacturing process of this invention at the time of using a metal as the diaphragm 10 is shown in FIG. 2, and the manufacturing process of this invention at the time of using a ceramic or organic compound as the diaphragm 10 is shown in FIG.

As the metal plate, various alloys conventionally used may be used. Among them, stainless steel (SUS) or nickel (Ni) is particularly preferable, and the metal plate is preferably 3-20 μm.

In the case of using the metal plate as the diaphragm, the metal has conductivity, so that the metal plate itself can simultaneously function as the diaphragm and the lower electrode, so that a separate lower electrode is not necessary.

As the ceramic plate of silicon, it is preferable to use silicon (Si), silicon dioxide (SiO ₂ ), silicon carbide (SiC), silicon nitride (Si ₃ N ₄ ), or the like. In addition, it is preferable to use glass or zirconium oxide (ZrO ₂ ) as the metal oxide.

The ceramic plate or the metal oxide as described above may be prepared by using a conventional method such as sintering the slurry containing the oxide powder in the form of a green sheet and sintering it or making a sintering plate in the slurry state.

In the case of using a silicon-like ceramic or metal oxide as the diaphragm, the lower electrode 20 must be formed because it does not have conductivity.

In case of using a ceramic or metal oxide of silicon as the diaphragm, a conductive paste such as platinum, silver, silver / palladium (Pd), nickel (Ni) or copper (Cu) is used as the lower electrode. A conductive paste such as platinum, which is an electrode, is seated and then heat treated at 500-1400 ° C., more preferably 600-1200 ° C. to bond the diaphragm and the lower electrode.

As the polymer organic compound of resins, polyester, polyimide, or Teflon resin vibrating plates are mainly used. The thickness of the diaphragm is preferably 7-50 μm, and is generally used in the form of a film.

Even when a polymer organic compound such as a resin is used as the diaphragm, since it does not have conductivity itself, a separate lower electrode should be formed.

When the organic compound is used as the diaphragm, lower electrodes include silver, aluminum, gold, platinum, and the like. In case of using silver, it is mainly formed by printing method such as screen printing and stencil printing on the vibrating plate using commercially available low temperature treatment silver paste. In case of using aluminum, gold, and platinum, sputtering, vacuum deposition or deposition Mold by

The lower electrode is placed on top of the organic compound vibrating plate and heat treated at 100-300 ° C. to combine the diaphragm and the lower electrode.

A liquid photoresist or dry photoresister 14 is attached to the vibrating plate through the above process. At this time, the thickness of the photoresist to be attached can be adjusted by the required thickness within the range of 1-200㎛.

The attached photoresist is patterned into a desired pattern to form a mold of a fine pattern.

The photoresist is masked with a mask of a desired pattern and then aligned and exposed to pattern. In exposure, a constant exposure energy is required, and the exposure energy is calculated as (illuminance x time).

After exposure, the exposed photoresist is developed, and the type of developer used varies depending on the type of photoresist used.

In the case of using a positive photoresist, sodium hydroxide (NaOH), potassium hydroxide (KOH) and organic bases are used as a developing solution, and water is used as a washing solution.

On the other hand, in the case of using a negative photoresist, xylene Stoddard's solvent is used as a developing solution, and n-butyl acetate is used as a washing solution.

After developing the exposed photoresist, an unnecessary photoresist pattern is removed to mold a fine pattern mold.

The patterned mold is cured by heat treatment at 100-300 ° C. when the ceramic paste reacts with the photoresist used as the mold, and is used as it is without heat treatment when the material does not react with each other.

The piezoelectric / electric warp material 16 is filled in the mold having the above thickness to a desired thickness.

As piezoelectric / electric warp material, ceramic paste prepared by mixing ceramic oxide powder and ceramic sol solution of the same or similar components as the ceramic oxide powder is used.

In the present invention, the ceramic oxide powder used as a raw material of the piezoelectric / electric warp material is prepared by dissolving or uniformly dispersing the ceramic component material in a solvent or a dispersion medium to prepare a solution or dispersion mixture containing the ceramic component. Preparing a mixed solution by adding citric acid or an amount or more necessary to cause an oxidation-reduction combustion reaction with the anion of the ceramic component to a solution or dispersion mixture in which the components are dissolved or dispersed, and heat-treating the mixed solution at 100-500 ° C. It is prepared, including the step, may further comprise the step of further heat treatment at 700-900 ℃ to increase the crystallinity.

The raw material containing the ceramic component is selected from a ceramic component such as an oxide, carbonate or nitrate of the ceramic component, a salt of an organic or inorganic substance, or a complex of ceramic components.

As the ceramic component, it is preferable to use a piezoelectric / electrically distorted ceramic element having lead (Pb) and titanium (Ti) as a basic component, and in particular, the ceramic component may include lead (Pb), zirconium (Zr), or titanium (Ti). ) Or a component composed of lead (Pb), magnesium (Mg) and niobium (Nb).

As a solvent or dispersion medium for dissolving or dispersing the ceramic component raw material, one or more selected from among those capable of dissolving or dispersing the raw material containing the ceramic component in water or an organic solvent is used. Among the organic solvents, dimethyl formamide, methoxyethanol, acetic acid and alcohols are mainly used.

As a combustion aid, citric acid, an organic compound that can cause a combustion reaction, is used. In the conventional method, citric acid has been used to impart homogeneity of the reaction as a complexing agent, not as a combustion aid, and has been applied in processes such as the Pechini process. By using can cause a controlled combustion reaction rate.

Citric acid is added to a solution or dispersion mixture in which ceramic components are dissolved or dispersed to prepare a mixed solution. The amount of citric acid to be added is added to the amount or more necessary to cause an oxidation-reduction combustion reaction with the anion of the ceramic element. The rate of progress of the reaction can be controlled depending on the amount of citric acid added.

The mixed solution mixed with citric acid is heat-treated at 100-500 ° C. As the temperature of the heat treatment increases, the crystallinity of the ceramic phase increases, but when the heat treatment temperature is 100 ° C. or higher, the combustion reaction of citric acid can be sufficiently initiated. The reaction may occur even when the heat treatment is performed above 500 ° C., but the heat treatment is performed at a higher temperature. Is meaningless compared to conventional methods.

More preferably, the heat treatment is carried out at 150-300 ° C., and the temperature range can adequately secure the crystallinity of the ceramic phase even at a very low temperature.

Citric acid is removed during the combustion reaction, and ceramic oxide is formed without scattering by the heat of reaction of citric acid generated at this time.

In this reaction, components other than the ceramic component are removed by a combustion reaction for a sufficient time, thereby forming a ceramic oxide powder in a pure form in which impurities do not remain.

The ceramic oxide powder prepared by the above method is an extremely fine and uniform particle size distribution having a particle size of 5 μm or less, especially 0.5 μm or less, and the primary particles are in the form of an individual or a soft aggregate. It is a fully burned ceramic phase, so the weight is not reduced by further heat treatment.

In addition, since the surface is excellent in reactivity and can be formed only by heat treatment at low temperature, the degree of freedom of the vibration plate is high and various methods of printing or coating the vibration plate can be applied.

In order to increase the crystallinity of the ceramic oxide powder prepared, the ceramic oxide powder prepared may be further heat treated at 700-900 ° C.

Ceramic paste prepared by mixing the ceramic sol solution of the same or similar component having affinity with the ceramic powder to the ceramic powder prepared by the above method.

At this time, it is preferable to use PZT, PMN or their solid solution (PZT-PMN) composite oxide as the ceramic oxide.

In addition, the ceramic oxide is nickel (Ni), lanthanum (La), barium (Ba), zinc (Zn), lithium (Li), cobalt (Co), cadmium (Cd), cerium (Ce), chromium (Cr), Antimony (Sb), iron (Fe), yttrium (Y), tantalum (Ta), tungsten (W), strontium (Sr), calcium (Ca), bismuth (Bi), tin (Sn), manganese (Mn) It may further comprise one or more elements.

Ceramic sol solutions are prepared by dissolving ceramic components based on water or organic solvents. Although various organic solvents can be used as the base, it is preferable to use mainly selected from acetic acid, dimethylformamide, methoxyethanol, and alcohols.

The ceramic component used in the manufacture of the ceramic sol solution is preferably a component containing lead (Pb), zirconium (Zr), titanium (Ti), the concentration of the ceramic sol solution to be used is 0.1-5M It is preferable.

When the ceramic oxide powder and the ceramic sol solution are mixed, the content of the ceramic sol solution is preferably 10 to 200 parts by weight based on the ceramic oxide powder. This is because when the content of the ceramic sol solution is 200 parts by weight or more, the ceramic oxide powder is diluted too much and the viscosity of the mixture is low. When the content of the ceramic sol solution is less than 10 parts by weight, the amount of the ceramic oxide powder is too high and the viscosity becomes too high.

When the ceramic oxide powder and the ceramic sol solution are mixed, the liquid ceramic sol solution uniformly coats the surface of the solid ceramic oxide powder and connects the ceramic oxide powder particles to effectively fill the pores between the powders.

In the powder-sol mixture thus formed, the ceramic oxide powder having the characteristics of ceramics is surrounded by the ceramic sol solution of the same or similar component and has a proper fluidity. The ceramic sol acts as a reaction medium on the surface of the ceramic oxide powder and thus the powder surface. The reactivity of is improved.

In addition, the organic component contained in the sol, in the future when the mixture is in contact with a separate organic material, it is possible to secure the stability of the contact interface to impart dispersibility and homogeneity.

In such a system, since the sol is thermally decomposed at a low temperature and converted into the same or similar composition as the ceramic oxide powder, a ceramic system with improved inter-particle connectivity can be obtained even at low temperatures.

In order to ensure the stability of the mixture of the ceramic oxide powder and the ceramic sol solution and the fluidity required for molding, an organic solvent for controlling properties may be added. Various physical solvents may be used as the organic solvent for controlling physical properties, but it is preferable to use glycols or alcohols having a certain viscosity and low vapor pressure at room temperature.

When adding an organic solvent for controlling physical properties to the mixture of ceramic oxide powder and ceramic sol solution, the amount of the organic solvent for controlling physical properties is preferably 1-100 parts by weight based on the ceramic oxide powder. This is because if the amount of the organic solvent for controlling physical properties is less than 1 part by weight, the effect of adding the organic solvent for controlling physical properties is not effective, and if the amount is more than 100 parts by weight, the mixture does not maintain viscosity and is too diluted to deteriorate moldability during molding.

The addition amount of the organic solvent for controlling the physical properties is particularly preferably 10 to 40 parts by weight based on the ceramic oxide powder. In this range, the organic solvent for controlling the physical properties can be added while maintaining the viscosity of the mixture as appropriate.

In addition, a small amount of organic matter may be added to the mixture of the ceramic oxide powder and the ceramic sol solution in order to improve the dispersibility and homogeneity of the mixture in which the solvent for controlling physical properties is added. At this time, it is preferable to use long-chain alcohols or polar organic solvents to add.

Among the long chain alcohols, it is preferable to use pentanol or hexanol, and it is preferable to use acetylacetone or methoxyethanol as the polar organic solvent.

It is preferable that the addition amount of an organic substance shall be 1-100 weight part with respect to a ceramic oxide powder. This is because if the added amount of the organic substance is less than 1 part by weight, there is no effect of adding the organic substance. If the added amount is more than 100 parts by weight, the mixture does not maintain the viscosity and is too diluted to deteriorate the forming properties.

The addition amount of the organic material is particularly preferably 10 to 40 parts by weight based on the ceramic oxide powder. In this range, the addition of the organic material can be effected while maintaining the viscosity of the mixture as appropriate.

The ceramic paste prepared by the above method is filled in a mold having a fine pattern, and then heat-treated at 100-300 ° C. to form a piezoelectric / electric distortion film.

The solvent is removed by the heat treatment, and the ceramic sol acts as a reaction medium on the surface of the oxide particles, thereby inducing bonding between the ceramic oxide particles.

Heat treatment at a low temperature of 100-300 ° C. is sufficient for the reaction that water on the surface of the ceramic oxide powder hydrolyzes the ceramic sol solution and that the ceramic constituents of the ceramic sol solution liberated by hydrolysis are combined with the ceramic oxide powder. This is because the same reaction as firing can be achieved by the reaction of the liver. In addition, organic matter added during the heat treatment is removed.

Although heat treatment at 300 DEG C or higher is possible, it is not preferable because the photoresist used in the mold may be damaged.

The upper electrode 18 is seated on the piezoelectric / distortion film fired by the heat treatment.

As the upper electrode, silver, aluminum, gold, platinum and the like are all used. When silver is used as the upper electrode, commercially available low temperature treatment silver paste is formed on the vibrating plate by printing or blading. When using aluminum, gold, or platinum as the upper electrode, sputtering and vacuum deposition are used. Thereby forming an electrode.

The upper electrode is placed on the piezoelectric / distortion film, and then heat-treated at 100-300 ° C. to bond the piezoelectric / electric distortion film and the upper electrode. Even in this case, heat treatment at 300 ° C. or higher is possible, but the photoresist used in the mold may be damaged, which is not preferable.

If aluminum or gold is used as the upper electrode, it can be used immediately without further heat treatment.

Since the thickness of the photoresist attached to the mold can be finely adjusted in the range of 1-200 μm, the thickness of the formed piezoelectric / electrodistor film and the upper electrode can be freely adjusted.

At this time, the thickness of the piezoelectric / electric distortion film to be formed is preferably 1-100 μm, particularly preferably 5-30 μm.

After forming the upper electrode, the photoresist is removed or left as needed. In the case of removing the photoresist layer, the photoresist layer is heat-treated at 500 ° C. or higher, or dissolved in a solvent or dissolved in a solvent, and then removed by ultrasonication. As a solvent for dissolving the photoresist layer, acetones, alcohols, diluted hydrochloric acid or sulfuric acid are generally used.

In the conventional case, since the heat treatment must be performed at a high temperature, the photoresist was inevitably removed by burning, but in the present invention, the photoresist can be selectively removed or left.

In particular, when a metal is used as the substrate, it may be bent or deteriorated when the heat treatment is performed at a high temperature. Therefore, it is preferable to leave the photoresist by heat treatment below 300 ° C.

Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the following examples are illustrative of the invention and do not limit the scope of the invention.

(Example 1)

5 g of fine PZT powder having an average particle diameter of 50 nm was mixed with 35 ml of ethanol and ground for 40 minutes by auto induction. 0.8 g of 2-methoxyethanol, 0.2 g of acetylacetone and 3.0 g of PZT sol were added thereto, and mixed for 1 hour to prepare a ceramic paste.

The prepared ceramic paste was filled in a nickel vibrating plate to which a micropatterned photosensitive film was attached, dried at room temperature for 5 hours, and then heat-treated at 130 ° C. for 2 hours to form a piezoelectric / electric distortion film.

The silver paste was formed on the upper part of the formed piezoelectric / distortion film by a blading method and then heat-treated at 200 ° C. to prepare a micro actuator.

(Example 2)

20 g of fine PZT / PMN powder having a particle diameter of 50 nm was ground for 40 minutes with 50 ml of ethanol. 0.6 g of 1-pentanol, 1.4 g of tri-methylene glycol and 6 g of PZT sol were added thereto, and mixed for 1 hour to prepare a ceramic paste.

The prepared ceramic paste was filled in a SUS vibrating plate to which a micropatterned photosensitive film was attached and dried, and then heat-treated at 130 ° C. for 2 hours and at 300 ° C. for 1 hour to form a piezoelectric / electric distortion film.

Platinum was sputtered on top of the formed piezoelectric / distortion film and heat treated at 150 ° C. to prepare a micro actuator.

(Example 3)

0.3 g of 1-pentanol, 0.6 g of tri-methylene glycol, and 1.5 g of PZT sol were added to 5 g of fine PMN / PZT powder having a particle diameter of 0.5 μm, and the ceramic paste was prepared by grinding for 1 hour and 30 minutes by automatic induction.

The prepared ceramic paste was filled on the lower electrode of the polyimide resin vibrating plate to which the micropatterned photosensitive film was attached, dried at room temperature for 1 hour, and then heat-treated at 100 ° C. for 2 hours and at 150 ° C. to form a piezoelectric / electrodistor film. It was.

Aluminum was vacuum-deposited on top of the formed piezoelectric / distortion film to prepare a micro actuator.

(Example 4)

5 g of PZT / PMN powder was ground for 30 minutes in an automatic induction, and 2 g of PZT sol, 0.7 g of trimethylene glycol, and 0.5 g of 2-methoxyethanol were added thereto and mixed for 1 hour in the automatic induction.

The prepared ceramic paste was homogenized by passing through a 3-roll mill equipped with an alumina roll, and the micropatterned photosensitive film mold was filled into a molded SUS substrate and leveled at room temperature. The ceramic thick film of which the planarization was completed was dried and heat-treated at 250 ° C. for 1 hour.

Gold was vacuum deposited on the upper electrode to prepare a micro actuator.

(Example 5)

0.7 g of trimethylene glycol and 0.5 g of 1-pentanol were added to 5 g of PZT / PMN powder, and the mixture was mixed for 5 hours by autoinduction. 2 g of PZT sol was added thereto, followed by further stirring for 30 minutes.

The prepared paste was filled in a nickel substrate on which a micropatterned photosensitive film mold was molded and flattened at room temperature. The planarized ceramic thick film was dried at 70 ° C. and heat-treated at 250 ° C. for 1 hour.

Gold was vacuum deposited on the upper electrode to prepare a micro actuator.

(Example 6)

2.5 g of PZT acetate sol was added to 5 g of PZT / PMN powder, followed by stirring for 30 minutes. Acetic acid used as the solvent of the sol was completely evaporated and a mixture of powder and PZT (52/48) gel was formed. 0.8 g of trimethylene glycol and 0.4 g of 1-pentanol were added thereto, and the mixture was mixed for 1 hour by auto-induction.

The paste thus prepared has a characteristic that no volatile acetic acid is removed and there is no viscosity change with time. The paste is filled into a nickel substrate on which a micropatterned photosensitive film mold is formed, dried at 130 ° C., and dried at 200 ° C. Heat treatment for 2 hours at.

Aluminum was vacuum-deposited as the upper electrode to prepare a micro actuator.

The present invention as described above can change the thickness of the photoresist layer to be a mold in the range of 1-200㎛ has the effect of finely controlling the thickness of the piezoelectric / electrodistortion film and the upper electrode.

In addition, when the organic material of the ceramic paste reacts with the photoresist, the photoresist itself may be cured by heat treatment at 100-300 ° C. to minimize the reaction between them. Ceramic powder-sol-gel mixtures may also be used.

In addition, by placing the piezoelectric / electric strainer inside the mold, it is possible to prevent the piezoelectric / electric strainer from being damaged by scratches from the outside, and since the mold itself is an insulator, the lower electrode or the diaphragm may be used even when the upper electrode and the power supply line are connected. Since the process of forming a separate insulating layer is not necessary, the process can be simplified.

In addition, unlike the case of using the screen printing method, a high aspect ratio of the micronized pattern can be achieved, and the coupling with the substructure is improved.

Claims (31)

Providing a diaphragm made of metal; Applying a photoresist on the metal vibrating plate and patterning the same to form a mold having a fine pattern; Prepared by non-explosive oxidation-reduction combustion reaction at a low temperature of 100-500 ℃, the particle size is 5㎛ or less, ceramic oxide powder with lead (Pb), titanium (Ti) as a basic element, water or organic solvent Preparing a ceramic paste by mixing a ceramic sol solution having the same or similar components as the ceramic oxide powder prepared as a base; Filling the ceramic paste into the mold to form a piezoelectric / electric distortion film; Firing the piezoelectric / electric distortion film formed in the mold by heat treatment at 100-300 ° C .; And A method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using a photolithography method comprising forming an upper electrode on a piezoelectric / electric distortion film. The method of claim 1, further comprising heat-treating at 100-300 ° C. after forming the mold. The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using the photolithography method according to claim 1, further comprising the step of heat-treating at 100-300 ° C. after forming the upper electrode. The method of claim 1, further comprising removing the mold after forming the upper electrode. The method of claim 1, wherein the metal is made of stainless steel (SUS) or nickel (Ni). The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using the photolithography method according to claim 1, wherein the photoresist has a thickness of 1-200 µm. The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using the photolithography method according to claim 1, wherein the ceramic oxide powder has a particle size of 0.5 m or less. The method of claim 1, wherein the ceramic oxide is PZT, PMN or their solid solution (PZT-PMN) composite oxide. The method of claim 8, wherein the ceramic oxide is nickel (Ni), lanthanum (La), barium (Ba), zinc (Zn), lithium (Li), cobalt (Co), cadmium (Cd), cerium (Ce), Chromium (Cr), Antimony (Sb), Iron (Fe), Yttrium (Y), Tantalum (Ta), Tungsten (W), Strontium (Sr), Calcium (Ca), Bismuth (Bi), Tin (Sn), A method of manufacturing a piezoelectric / electric warp ceramic micro actuator using a photolithography method, characterized in that it further comprises one or more elements of manganese (Mn). The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using the photolithography method according to claim 1, wherein the thickness of the piezoelectric / electric distortion film is formed to be 1-100 µm. The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using the photolithography method according to claim 10, wherein the thickness of the piezoelectric / electric distortion film is molded to 5 to 30 µm. The piezoelectric / electric distortion ceramic microactuator using the photolithography method according to claim 1, wherein the upper electrode is selected from silver (Ag), aluminum (Al), gold (Au) or platinum (Pt). Manufacturing method. Providing a diaphragm; Forming a lower electrode on the diaphragm; Coating a photoresist on the lower electrode and patterning the photoresist to form a mold of a fine pattern; Prepared by non-explosive oxidation-reduction combustion reaction at a low temperature of 100-500 ℃, the particle size is 5㎛ or less, ceramic oxide powder with lead (Pb), titanium (Ti) as a basic element, water or organic solvent Preparing a ceramic paste by mixing a ceramic sol solution having the same or similar components as the ceramic oxide powder prepared as a base; Filling the ceramic paste into the mold to form a piezoelectric / distortion film; Firing the piezoelectric / electric distortion film formed in the mold by heat treatment at 100-300 ° C .; And A method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using a photolithography method comprising forming an upper electrode on a piezoelectric / electric distortion film. 15. The method of claim 13, further comprising heat treatment at 100-300 ° C. after forming the mold. 15. The method of claim 13, further comprising heat-treating at 100-300 ° C. after forming the upper electrode. 15. The method of claim 13, further comprising removing the mold after forming the upper electrode. The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using the photolithography method according to claim 13, wherein a ceramic vibrating plate is used as the diaphragm. The method of claim 17, wherein the ceramic vibrating plate is aluminum oxide (Al ₂ O ₃ ), zirconium oxide (ZrO ₂ ), silicon carbide (SiC), silicon nitride (Si ₃ N ₄ ), silicon dioxide (SiO ₂ ) or glass-based Method for producing a piezoelectric / electrostrictive ceramic micro actuator using a photolithography method, characterized in that using. 18. The conductive paste of claim 17, wherein the lower electrode formed on the diaphragm includes an alloy of platinum (Pt), silver (Ag), silver / palladium (Ag / Pd), nickel (Ni), copper (Cu), or the like. A method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using a photolithography method, characterized in that it is selected and used. 18. The method of claim 17, further comprising forming the lower electrode on the diaphragm and heat-treating it at 500-1400 ° C. The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using a photolithography method according to claim 13, wherein a high molecular weight organic organic compound vibration plate is used as the diaphragm. 22. The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using a photolithography method according to claim 21, wherein the polymeric organic compound vibration plate of the resin is a polyester, polyimide, or Teflon resin vibration plate. 23. The photolithography method of claim 22, wherein the lower electrode formed on the diaphragm is selected from metals such as silver (Ag), aluminum (Al), gold (Au), or platinum (Pt). Method of manufacturing piezoelectric / electric distortion ceramic micro actuators used. 23. The method of claim 22, further comprising the step of forming the lower electrode on the diaphragm and heat-treating at 100-300 ° C. The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using the photolithography method. 14. The piezoelectric / electric distortion ceramic micro actuator using the photolithography method according to claim 13, wherein the upper electrode is selected from silver (Ag), aluminum (Al), gold (Au) or platinum (Pt). Manufacturing method. 15. The method of claim 13, further comprising heat-treating at 100-300 ° C. after forming the upper electrode. The method of manufacturing a piezoelectric / electric warp ceramic micro actuator using the photolithography method according to claim 13, wherein the ceramic oxide powder has a particle size of 0.5 m or less. The method of claim 13, wherein the ceramic oxide is PZT, PMN or their solid solution (PZT-PMN) composite oxide. The method of claim 28, wherein the ceramic oxide is nickel (Ni), lanthanum (La), barium (Ba), zinc (Zn), lithium (Li), cobalt (Co), cadmium (Cd), cerium (Ce), Chromium (Cr), Antimony (Sb), Iron (Fe), Yttrium (Y), Tantalum (Ta), Tungsten (W), Strontium (Sr), Calcium (Ca), Bismuth (Bi), Tin (Sn), A method of manufacturing a piezoelectric / electric warp ceramic micro actuator using a photolithography method, characterized in that it further comprises one or more elements of manganese (Mn). The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using the photolithography method according to claim 13, wherein the thickness of the piezoelectric / electric distortion film is formed to be 1-100 µm. 31. The method of manufacturing a piezoelectric / electric distortion ceramic micro actuator using the photolithography method according to claim 30, wherein the thickness of the piezoelectric / electric distortion film is formed to be 5-30 µm.