KR100300543B1 - 에폭시수지조성물 - Google Patents
에폭시수지조성물 Download PDFInfo
- Publication number
- KR100300543B1 KR100300543B1 KR1019950705517A KR19950705517A KR100300543B1 KR 100300543 B1 KR100300543 B1 KR 100300543B1 KR 1019950705517 A KR1019950705517 A KR 1019950705517A KR 19950705517 A KR19950705517 A KR 19950705517A KR 100300543 B1 KR100300543 B1 KR 100300543B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- dihydroxydiphenylmethane
- diglycidyl ether
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (6)
- 3,3',5,5'-테트라메틸-4,4'-디히드록시디페닐메탄의 디글리시딜에테르, 2,2'-디메틸-5,5'-디-tert-부틸-4,4'-디히드록시디페닐메탄의 디글리시딜에테르 및 2,2',3,3'-5,5'-헥사메틸-4,4'-디히드록시디페닐메탄의 디글리시딜에테르로 이루어진 군에서 선택된 에폭시 수지를 결정화시켜서 고체로 만든 후, 여기에 에폭시 수지 경화제를 배합함으로써 얻게되는 에폭시 수지 조성물.
- 제1항에 있어서, 에폭시 수지의 융점이 40~130℃인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, 에폭시 수지의 에폭시 당량이 250 이하이고, 가수분해 염소 함유량이 1500ppm 이하인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항 또는 제2항에 있어서, 에폭시 수지 경화제가 다가 페놀성 화합물인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, 무기 충전제를 75중량% 이상의 양으로 더 함유함을 특징으로 하는 에폭시 수지 조성물.
- 3,3',5,5'-테트라메틸-4,4'-디히드록시디페닐메탄의 디글리시딜에테르, 2,2'-디메틸-5,5'-디-tert-부틸-4,4'-디히드록시디페닐메탄의 디글리시딜에테르 및 2,2',3,3',5,5'-헥사메틸-4,4'-디히드록시디페닐메탄의 디글리시딜에테르로 이루어진 군에서 선택된 에폭시 수지를 결정화시켜서 고체로 만든 후, 여기에 에폭시 수지 경화제를 배합하고, 경화시킨 것을 특징으로 하는 에폭시 수지 경화물.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5163930A JP2825735B2 (ja) | 1993-06-08 | 1993-06-08 | エポキシ樹脂組成物 |
JP1993-163930 | 1993-06-08 | ||
PCT/JP1994/000918 WO1994029363A1 (en) | 1993-06-08 | 1994-06-07 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960702853A KR960702853A (ko) | 1996-05-23 |
KR100300543B1 true KR100300543B1 (ko) | 2001-11-22 |
Family
ID=15783532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950705517A Expired - Lifetime KR100300543B1 (ko) | 1993-06-08 | 1994-06-07 | 에폭시수지조성물 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2825735B2 (ko) |
KR (1) | KR100300543B1 (ko) |
WO (1) | WO1994029363A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3705618B2 (ja) * | 1994-09-14 | 2005-10-12 | 京セラケミカル株式会社 | エポキシ樹脂組成物および半導体封止装置 |
JP4576676B2 (ja) * | 2000-07-04 | 2010-11-10 | 東亞合成株式会社 | オキセタン環を有するテトラメチルジフェニルメタン誘導体の製造方法およびオキセタン環を有するテトラメチルジフェニルメタン誘導体 |
TW202124498A (zh) * | 2019-12-25 | 2021-07-01 | 日商日鐵化學材料股份有限公司 | 環氧樹脂及其製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62115057A (ja) * | 1985-11-13 | 1987-05-26 | Mitsubishi Electric Corp | エポキシ樹脂組成物の製造方法 |
JPS62115021A (ja) * | 1985-11-13 | 1987-05-26 | Mitsubishi Electric Corp | エポキシ樹脂組成物の製造方法 |
JP2544686B2 (ja) * | 1990-05-28 | 1996-10-16 | ソマール株式会社 | エポキシ樹脂粉体組成物及びその製造方法 |
JP2933705B2 (ja) * | 1990-11-16 | 1999-08-16 | 住友ベークライト株式会社 | 樹脂組成物 |
JPH04198211A (ja) * | 1990-11-27 | 1992-07-17 | Sumitomo Bakelite Co Ltd | 樹脂組成物 |
JPH04372619A (ja) * | 1991-06-20 | 1992-12-25 | Toshiba Chem Corp | 一液性エポキシ樹脂組成物 |
-
1993
- 1993-06-08 JP JP5163930A patent/JP2825735B2/ja not_active Expired - Fee Related
-
1994
- 1994-06-07 KR KR1019950705517A patent/KR100300543B1/ko not_active Expired - Lifetime
- 1994-06-07 WO PCT/JP1994/000918 patent/WO1994029363A1/ja active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
WO1994029363A1 (en) | 1994-12-22 |
JPH06345850A (ja) | 1994-12-20 |
KR960702853A (ko) | 1996-05-23 |
JP2825735B2 (ja) | 1998-11-18 |
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