KR100281881B1 - 인쇄회로기판의크림솔더검사장치및검사방법 - Google Patents
인쇄회로기판의크림솔더검사장치및검사방법 Download PDFInfo
- Publication number
- KR100281881B1 KR100281881B1 KR1019980026467A KR19980026467A KR100281881B1 KR 100281881 B1 KR100281881 B1 KR 100281881B1 KR 1019980026467 A KR1019980026467 A KR 1019980026467A KR 19980026467 A KR19980026467 A KR 19980026467A KR 100281881 B1 KR100281881 B1 KR 100281881B1
- Authority
- KR
- South Korea
- Prior art keywords
- cream solder
- circuit board
- printed circuit
- light
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Quality & Reliability (AREA)
- Theoretical Computer Science (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims (7)
- 크림솔더가 형성된 인쇄회로기판을 촬영하기 위한 카메라;상기 인쇄회로기판의 상면에 대하여 경사진 면에서 반사되는 광이 상기 카메라로 향하도록 상기 인쇄회로기판의 상면에 대하여 녹색 또는 청색파장의 링형 조명을 조사하는 제1조명;상기 인쇄회로기판의 상면에 대하여 평행한 면에서 반사되는 광이 상기 카메라로 향하도록 상기 인쇄회로기판의 상면에 대하여 적색파장의 링형 조명을 조사하는 제2조명; 및상기 카메라, 제1조명 및 제2조명을 제어하며, 상기 카메라에 의해 촬영된 화상으로부터 크림솔더의 도포상태를 검사하기 위한 제어부;를 포함하여 된 것을 특징으로 하는 인쇄회로기판의 크림솔더 검사장치.
- 제1항에 있어서,상기 제1조명 및 제2조명은 복수개의 발광다이오드가 링형태로 배치되어 형성된 것을 특징으로 하는 인쇄회로기판의 크림솔더 검사장치.
- 제1항에 있어서,상기 인쇄회로기판에 대하여 레이저를 발사하여 크림솔더의 높이를 측정하는 레이저 측정장치를 더 포함하여 된 것을 특징으로 하는 인쇄회로기판의 크림솔더 검사장치.
- 가) 인쇄회로기판 상에 형성될 크림솔더의 인쇄회로기판에 대한 테두리 위치를 나타내는 테두리의 기준좌표, 크림솔더의 테두리 내부에 균일하게 도포된 크림솔더 상태 및 허용오차율을 포함하는 기준값을 입력하는 단계;나) 상기 인쇄회로기판을 촬영하여 상기 크림솔더의 테두리 화상을 측정하는 단계;다) 상기 기준값과 상기 테두리 화상을 비교하여 상기 크림솔더의 위치불량 유,무를 판단하는 단계;라) 상기 인쇄회로기판을 촬영하여 상기 나) 단계에서 구해진 상기 테두리 내부에 형성된 크림솔더의 화상을 측정하는 단계; 및마) 상기 기준값과 상기 테두리 내부에 형성된 크림솔더의 화상을 비교하여 상기 테두리 내부에 형성된 크림솔더 도포상태의 불량 유,무를 판단하는 단계;를 포함하는 인쇄회로기판의 크림솔더 검사방법.
- 제4항에 있어서,상기 나)단계는, 녹색 또는 청색파장을 출사하는 조명을 이용하여 인쇄회로기판을 촬영하는 것을 특징으로 하는 인쇄회로기판의 크림솔더 검사방법.
- 제4항에 있어서,상기 라)단계는, 적색파장을 출사하는 조명을 이용하여 인쇄회로기판을 촬영하는 것을 특징으로 하는 인쇄회로기판의 크림솔더 검사방법.
- 제4항에 있어서,상기 마)단계 후,상기 테두리 내부에 형성된 크림솔더 도포상태가 정상이면, 상기 크림솔더의 높이를 측정하는 단계를 더 포함하는 것을 특징으로 하는 인쇄회로기판의 크림솔더 검사방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980026467A KR100281881B1 (ko) | 1998-07-01 | 1998-07-01 | 인쇄회로기판의크림솔더검사장치및검사방법 |
US09/338,486 US6529624B1 (en) | 1998-07-01 | 1999-06-23 | Apparatus for inspecting cream solder on PCB and method thereof |
JP11186590A JP2000065758A (ja) | 1998-07-01 | 1999-06-30 | 印刷回路基板のクリ―ムソルダ検査装置及び検査方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980026467A KR100281881B1 (ko) | 1998-07-01 | 1998-07-01 | 인쇄회로기판의크림솔더검사장치및검사방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000007250A KR20000007250A (ko) | 2000-02-07 |
KR100281881B1 true KR100281881B1 (ko) | 2001-02-15 |
Family
ID=19542744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980026467A Expired - Fee Related KR100281881B1 (ko) | 1998-07-01 | 1998-07-01 | 인쇄회로기판의크림솔더검사장치및검사방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6529624B1 (ko) |
JP (1) | JP2000065758A (ko) |
KR (1) | KR100281881B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101123051B1 (ko) * | 2009-07-21 | 2012-03-15 | 주식회사 미르기술 | 비전검사장치 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IE20000838A1 (en) * | 1999-10-18 | 2001-05-16 | Mv Res Ltd | Machine vision |
JP3468205B2 (ja) * | 2000-06-12 | 2003-11-17 | 株式会社大真空 | 圧電デバイスの周波数特性調整装置 |
JP2002048733A (ja) * | 2000-08-01 | 2002-02-15 | Toppan Printing Co Ltd | 配線基板の外観検査方法 |
KR100763958B1 (ko) * | 2001-03-03 | 2007-10-05 | 주식회사 휘닉스 디지탈테크 | 스크린 프린터의 비젼 장치 및, 그것을 이용한 비젼 검사방법 |
KR20030026839A (ko) * | 2001-09-26 | 2003-04-03 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 화상처리를 이용한 검사대상물의 표면검사방법 및 그 장치 |
JP4051568B2 (ja) * | 2004-02-09 | 2008-02-27 | ソニー株式会社 | 部品実装基板検査装置 |
JP5191089B2 (ja) * | 2005-06-30 | 2013-04-24 | Ckd株式会社 | 基板の検査装置 |
JP4816194B2 (ja) * | 2006-03-29 | 2011-11-16 | パナソニック株式会社 | 電子部品実装システムおよび電子部品搭載装置ならびに電子部品実装方法 |
KR100785308B1 (ko) * | 2006-07-10 | 2007-12-17 | (주)아이엠에스나노텍 | 칩 엘이디 표면 검사 방법 및 장치 |
JP5205224B2 (ja) * | 2008-11-18 | 2013-06-05 | ヤマハ発動機株式会社 | 部品実装状態検査装置 |
DE102010028894B4 (de) * | 2009-05-13 | 2018-05-24 | Koh Young Technology Inc. | Verfahren zur Messung eines Messobjekts |
KR101207198B1 (ko) * | 2010-01-18 | 2012-12-03 | 주식회사 고영테크놀러지 | 기판 검사장치 |
JP5919478B2 (ja) * | 2012-10-04 | 2016-05-18 | パナソニックIpマネジメント株式会社 | 半田印刷機及び半田印刷機のマスクの汚れ検査方法 |
KR101438157B1 (ko) * | 2012-11-12 | 2014-09-05 | 주식회사 고영테크놀러지 | 기판 검사방법 |
KR101399431B1 (ko) * | 2013-09-24 | 2014-05-27 | 주식회사 고영테크놀러지 | 솔더 영역의 측정방법 |
CN108226060A (zh) * | 2017-12-28 | 2018-06-29 | 深圳市鑫美威自动化设备有限公司 | 一种fpc视觉检测方法及系统 |
CN111982933B (zh) * | 2019-11-23 | 2023-08-29 | 深圳市安达自动化软件有限公司 | 一种涂覆缺陷检测系统及装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5039868A (en) * | 1988-11-24 | 1991-08-13 | Omron Corporation | Method of and apparatus for inspecting printed circuit boards and the like |
JPH02231510A (ja) | 1989-03-02 | 1990-09-13 | Omron Tateisi Electron Co | 基板検査装置 |
JPH03189544A (ja) | 1989-12-19 | 1991-08-19 | Omron Corp | 基板検査装置 |
JP2691789B2 (ja) * | 1990-03-08 | 1997-12-17 | 三菱電機株式会社 | はんだ印刷検査装置 |
JPH04104044A (ja) | 1990-08-23 | 1992-04-06 | Sharp Corp | 半田ペーストの印刷状態検査装置 |
JP2504637B2 (ja) | 1991-06-21 | 1996-06-05 | シーケーディ株式会社 | クリ―ムハンダ配設状況識別装置 |
JP3189544B2 (ja) | 1993-12-24 | 2001-07-16 | 株式会社ノーリツ | 温度制御弁の弁制御装置 |
KR0176661B1 (ko) * | 1995-12-28 | 1999-05-15 | 김광호 | 납땜부 검사방법 및 검사장치 |
JPH09283921A (ja) | 1996-04-17 | 1997-10-31 | Sony Corp | プリント基板及びプリント基板に印刷した半田の膜厚測定方法 |
US6005965A (en) * | 1997-04-07 | 1999-12-21 | Komatsu Ltd. | Inspection apparatus for semiconductor packages |
-
1998
- 1998-07-01 KR KR1019980026467A patent/KR100281881B1/ko not_active Expired - Fee Related
-
1999
- 1999-06-23 US US09/338,486 patent/US6529624B1/en not_active Expired - Fee Related
- 1999-06-30 JP JP11186590A patent/JP2000065758A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101123051B1 (ko) * | 2009-07-21 | 2012-03-15 | 주식회사 미르기술 | 비전검사장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2000065758A (ja) | 2000-03-03 |
US6529624B1 (en) | 2003-03-04 |
KR20000007250A (ko) | 2000-02-07 |
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