KR100247850B1 - Security device, embossing table for security device and the preparation method of security device - Google Patents

Abstract

The security element for identifying the substrate 1 has a pattern including the carrier material of the plastic material and the optical diffraction element 4 which is enbossed in the neutral region 5 which is not enbossed. While the neutral region 5 on the enbossed side of the carrier material is placed between them without any reflection layer, the reflection layer only covers the surface with the relief structure of the diffraction element 4. If the security element is glued in the form of a stamp 3 onto the substrate 1 and the carrier material becomes transparent, the image portion 6 covered by the stamp 3 of the feature 2 on the substrate 1. ) Is identified through the neutral zone 5.

Description

Security device, embossing die for security device embossing and manufacturing method

1 shows an identity card or pass with secure elements.

2 is a cross-sectional view of the stamp.

3 (a) to 3 (d) show the operation of covering the relief structure with the protective lacquer by the printing process.

4 (a) to 4 (c) show the operation of covering the relief structure with the protective lacquer by the engraved printing process.

5 (a) to 5 (d) show the operation of covering the relief structure with the protective lacquer by the relief printing process.

6 shows a stamp on a carrier strip.

7 (a) and 7 (b) show the manufacture of an embossing die.

8 shows an embossing die of an embossed diffractive element.

* Explanation of symbols for main parts of the drawings

1 substrate 2 characteristics

3: stamp 4: diffraction element

5: neutral area 6,7: image part

8: Confirmation characteristic part

The present invention relates to a security device of the kind set forth in the characterizing part of claim 1 and to a manufacturing process of the security device.

The security element is, for example, suitable for protecting a photograph adhered on a personal identification card, and a security element in the form of a stamp covers both the part surface of the photograph and the part surface of the identification card.

European patent application EP-A-401 466 discloses a security element in which the reflective layer covers the entire surface and shows a pattern consisting of a surface having an embossed relief structure and an unembossed surface provided therebetween. If the security element is visible, high light intensity reflections on the unembossed surface interfere with the full color phenomenon of the light diffracted in the relief structure.

European patent EP 169 326 discloses an apparatus for producing a die on which, for example, a micro relief structure is embossed with a plastic carrier on one side of an aluminum treatment. The improved device disclosed in European patent application EP-A-330 738 makes it possible to produce a die having a surface portion which is required for embossing the relief structure and which has a size of at least 0.3 mm.

European patent application EP-A-253 089 discloses incorporating a reflective layer in the relief structure region in a predetermined pattern to enhance the adhesion between the relief structural carrier and the protective layer covering it.

European patent application EP-A-439 092 discloses the use of a security element having a diffractive structure covered with a reflective layer on its surface in a grid-like arrangement to protect the identity certificate. In spite of the clouding diffraction effect due to the arrangement, it is distinguished through the non-dust surface.

An object of the present invention is to provide a security element having a relief structure having a light diffraction effect and a pattern having an unembossed neutral region, wherein the visible observation of the pattern is not disturbed by the light reflected from the neutral region. Do not. It is also an object of the present invention to provide an economical manufacturing process.

According to the invention, the above object can be achieved through the characteristics of claims 1, 9 and 11. Effective configurations are set forth in the appended claims.

In FIG. 1, reference numeral 1 denotes a substrate having paper, plastic material, metal, or the like on the surface on which the characteristic portion 2 is disposed. The stamp 3 made of plastic as a security element covers the adjacent surface portions of the substrate 1 and the characteristic portion 2 and adheres to one surface portion on the characteristic portion 2 and the other surface portion on the substrate 1. . The substrate 1 may be an identity card or pass, in which case the feature 2 may be a photograph of the owner, a sign before the stamp 3 is applied, or another identification mark.

The stamp 3 has a pattern composed of a diffraction element 4 and a neutral region 5 having a light diffraction effect. The diffraction element 4 diffracts the incident light around the reflection mode to produce a unique color image which changes when the substrate 1 is inclined. Neutral region 5 is not reflective, for example absorbent or transparent. If the neutral region 5 is transparent, the stamp does not disturb the observation of the characteristic features 2 or the substrate 1 or the color image at a predetermined position due to a sudden change in the refractive index of the medium (air-plastic material). Only the low reflectance in the region 5 at the surface of the stamp 3 is observed through (3).

If the diffractive element 4 is for example in a linear arrangement and forms a dry pore pattern on the security element, the security element has a particularly beneficial effect at the visible observation position. In particular, if the line of the diffractive element 4 is as narrow as possible, the pattern has the advantage that the feature 2 under the stamp 3 is easily identified. The line width is smaller than 0.5 mm, for example 0.1 mm or 0.05 mm or smaller. Further, a pattern composed of dots or a dot grid may be used. In this case, the diameter of the diffractive element 4 in the form of a dot corresponds approximately to the above-described line width. Line widths from about 25 μm can be achieved by the means disclosed in EP-A-330 738 entitled “Document” by Ante et al., The text of which is incorporated herein. In any dot or line portion, individual diffraction elements can be manufactured which differ in their parameters, spatial frequency, and grid appearance from adjacent dot or line portions. Changes in parameters from one diffractive element to another act as a means of graphical construction to improve the security level.

For identification of the non-forged features 2, the pattern on the security element is such that the sum of the surface areas of the neutral regions 5 between the diffraction elements 4 is greater than the sum of the surface areas of the diffraction elements 4. It is advantageous to be designed to be large.

The security element has a highly contrasting effect from the weak light neutral region without reflection of the light, which can be mixed with the flash of the diffracted light due to the reflection of the diffracted light, thereby reducing the brightness of the diffraction element. The image part 6 of the feature part 2 underneath the neutral area 5 is identifiable through the neutral area 5 and the neutral area with the image part 7 not covered with the stamp 3 is a feature part. Since a complete image should be provided for (2), the adhered stamp 3 is distinguished not only by the transparency in the neutral region 5 and the high level of branching of the diffractive element 4 but also by the characteristic part 2. It is suitable as a security element for proof of the characteristic part 2 which gives a high level of security which can be visually confirmed against counterfeiting with respect to the proof of.

If the substrate 1 is made of plastic material, for example in the case of a credit card, the luminous optical diffraction identification features 8 in the same pattern as the security element are also indirectly processed through the bonded stamp 3. It is not produced directly on the surface of the substrate (1).

2 shows a cross section of an identity card with a stamp 3 adhered on a substrate 1 as a security element. The composite layer configuration described in European patent application EP-A-401 466 entitled “Diffractive Composite Layer Composition” by the same applicant is shown by way of example, the text of which is incorporated herein.

A carrier 10 made of a plastic material for the diffractive element 4 is surrounded by the fixed layer 9 made of polyester and the substrate 1. The lacquer layer 11 facilitates adhesion between the pinned layer 9 and the carrier 10. The diffractive element 4 is embossed on the carrier in the form of a micro relief structure 12. A protective layer 13 is provided to cover the entire surface of both the relief structure 12 covered with the reflective layer 14 and the unembossed non-reflective neutral region 5 of the carrier. The adhesive layer 15 applied to the protective layer 13 fixedly bonds the stamp 3 to the substrate 1 (see FIG. 1), where the adhesive bond is released without any interference to the security element.

Advantageously, the carrier 10 and the protective layer 13 are particularly intimately bonded in the neutral region 5, and without breaking any weak points formed in the joint and the protective layer 13, the lily The carrier 10 and the protective layer are composed of the same material that is not removed to form the if structure 12. If the carrier 10 and the protective layer 13 are made of the same clear material, the uninterrupted carrier surface 16 in the unembossed neutral region 5 is not visible. Thus, the carrier surface 16 is shown in dashed lines in the figure. The neutral region 5 maintains a very clear and transparent state, so that the characteristic portion 2 under the stamp 3 is easily identified (see FIG. 1). However, note that the carrier 10 and the protective layer 13 are also of different colors. Instead of the composite layer material, it is also possible to use a solid foil made of PVC like the carrier member 17.

If the stamp 3 is adhered on the substrate 1, a transparent or completely colorless material is preferably used for the protective layer 13, the adhesive layer 15, and the carrier member 17, and the characteristic portion 2. Is visible through the neutral region 5 (see FIG. 1).

In another form, the carrier 10 itself is sufficiently fixed so that the fixed layer 9 and the lacquer layer 11 are unnecessary.

The manufacture of security features is distinguished by a certain number of specific steps as can be seen from the manufacturing process described in the embodiments. For example, compared to the technical literature (EP-A-401 466), only a predetermined number of additional steps are included in the process described below, as described below, the steps have different properties. . Each process has its advantages.

According to an embodiment, the third (a) to the third (b), the fourth (a) to the fourth (c) and the fifth (a) to the fifth (d) are made of a security element. For the stamp 3 (see FIG. 1) a gradual manufacturing process of the basic components is shown in cross section in the form of a strip. In the above process, the figure is rotated 180 ° with respect to FIG. 2 to show successive steps. The strip form becomes available due to the continuous process, thus enabling economic mass production.

In FIG. 3 (a), the carrier member 17 in the form of a strip comprises, for example, a carrier 10 bonded to a fixed layer 9 and a lacquer layer 11 (see FIG. 2). The carrier member 17 is covered over the entire area of the reflective layer 14 on the embossed side 18 away from the pinned layer 9. For example, an aluminum layer deposited by vapor deposition and having a thickness of less than 1 μm is known as the reflective layer 14.

The carrier member 17 is guided in the form of a strip from a supply roll (not shown) and continuously passes to another processing area in which a stamp 3 (see FIG. 1) with security features is produced step by step.

[Step 1]

In the first step (FIG. 3), for example, using a heated embossing die, the micro relief structure 12, which is a pattern of security elements, is embossed onto the embossing side 18 of the carrier member 17, The embossed side 18 is characterized by a reflective layer. An individual unembossed neutral region 5 is located between each of the two diffractive elements 4, 4 ′.

In the second step, the protective lacquer 19 is deposited on the embossed diffractive element 4 by the printing process to the position aligned with the register of the diffractive element 4 pattern (i.e., to the correct register position), and the protective layer The silver accurately covers the reflective layer 14 on the surface of the diffractive element 4 and leaves the reflective layer 14 exposed and neutral on the neutral region. The protective lacquer 19 is, for example, cleanly transparent or colored and only transparent with respect to light from a range of spectra.

The strip of the carrier member 17 is guided through the chemical bath. Within the bath, the exposed reflective layer 14 on the neutral region 5 is removed. If the reflective layer 14 comprises aluminum, a suitable chemical bath is, for example, a caustic soda dilution solution.

After the cleaning and drying operations, the carrier member 17 has the structure shown in FIG. 3 (c). There is only a reflective layer 14 deposited on the embossed relief structure 12 and is covered with a protective lacquer 19 in the region of the diffractive elements 4, 4 ′. The reflective layer on the unembossed neutral region 5 between the diffractive elements 4, 4 ′ is no longer present and the unembossed carrier surface 16 of the carrier member 17 is exposed.

In the final working process, the stamping base material shown in figure 3 (d) is finished, in which the protective layer 13 is deposited over the entire surface area from the carrier member 17 on the embossed side 18. Finally, the adhesive layer 15 is deposited.

Immediately prior to the operation of adhering the stamp 3 onto the substrate 1, the adhesive layer is deposited on one of the two adhesive components 1, 3 or if the protective layer 13 is in the form of an adhesive layer 15. Layer 15 may be omitted.

This process has the effect that the embossing die used for the manufacture of the optical diffraction pattern according to the state of the art is also used to manufacture the new security element so that a new embossing die does not have to be manufactured.

[Step 2]

The carrier member 17 embossed through the reflective layer 14 of FIG. 4 (a) is embossed by an embossing die described below having an embossed structure. As a result, the relief structure 12 embossed into the carrier 10 is brought into the carrier member by a predetermined distance A, ie below the carrier surface in which the depression 21 is made. The distance A is the value measured between the surface of the carrier member 17 and the tip 20 of the relief structure 12 closest thereto.

For example, the distance A is between about 1 μm and 5 μm, but the relief structure 12 has a height difference of 1 μm or less, as shown in B. The relief structures 12 are embossed on the floor of the depression 12, and thus may also include height differences of 1 μm or more, as shown in B.

As a result, the upper carrier member 17 of FIG. 4 (a) has a depression 21 having unembossed regions 5 representing pleto and relief structures 12 representing dips or valleys. It has a mesa structure having a.

As shown in Figure 4 (b), the deposition of the protective lacquer 19 is achieved when the carrier member 17 passes through the applicator mechanisms 22, 23 known in the printing art for intaglio printing. The carrier member 17 moves in the transport direction 24 from the roller support frame 22 to the scraper blade 23 comprising, for example, a plastic or rubber member. The scraper blades 23 are disposed on the carrier member 17, and the edges of the scraper blades 23 are reflective layers 14 over the entire width of the carrier member 17 for removal of excess protective lacquer 19. It can slide with light elastic contact.

The protective lacquer 19 is uniformly distributed over the reflective layer 14 as the carrier member 17 passes through its arrangement. In addition, by appropriately selecting the properties of the protective lacquer 19 such as tackiness, wettability, etc., that is, the value confirmed by the test, the protective lacquer 19 particularly fills the depression 21 and covers the relief structure 12. . After the scraper blade 23 scrapes off the protective lacquer 19 on the unembossed neutral region 5 on the reflective layer 14, only the protective layer 19 remains in the depression 21. The reflective layer 14 of the diffraction element is protected from the effect of the chemical bath for removing the reflective layer 14.

Following the operation of drying the protective lacquer 19, as in step 1, the strip of the carrier member 17 is drawn through a chemical bath so that the exposed reflective layer in area 5 is removed as in step 1. It is done. 4 (c) shows the preliminary material in the final state in which the reflective layer 14 is left only on the diffraction element 4. Only the protective layer 13 is present on the carrier member 17 over the entire surface.

This process has the advantage that when applying the protective lacquer 19, such as occurs automatically and with high precision, it does not have to be operated in the correct register relationship. In addition, the step of providing the protective layer 13 and the protective lacquer 19 at different manufacturing positions and the embossing operation are different from each other without adversely affecting the precision of the reflective layer 14 being limited to the diffraction element 4. Enable to be performed at location.

The arrangement of the relief structure 12 on the bottom of the depression 21 of the carrier member 17 is shown in FIG. 4 (b) of the relief structure 12 when the diffractive element 4 is covered with the protective lacquer 19. This has the advantage of providing maximum protection. Further, in order to obtain a finished product, the application of the protective lacquer 19 according to the process 1 may also be carried out in a mesa structure on the carrier member 17.

[Step 3]

In the manufacture of the security element, as shown in Fig. 5 (a), the carrier member 17 having no reflective layer 14 (Fig. 3 (a)) on the embossed side portion 18 is used as a starting material. May be performed. As in step 2, the depressions in the carrier member 17 and the diffraction element 4 are manufactured in an embossed structure by an embossing die.

After the embossing operation of the carrier member 17, the printing device known for relief printing and represented here by the applicator roller 26 is provided with a separating layer 25 which is washable according to EP-A-25 089. In FIG. 5 (b) it is used to apply the correct register position to the surface of the unembossed neutral region 5. The roller 26 rolls against the embossed side 18 of the carrier member 17 to cover the embossed neutral region 5 as the separation layer 25. The stickiness and thickness of the material to be washed is selected so that the material does not fill the recess 21 and contaminate the relief structure 12 (see also FIG. 2). Thus, only the separation layer 25 covers the neutral region 5, leaving the relief structure 12 embossed in the depression 21 being left empty.

Thereafter, as shown in FIG. 5 (c), the carrier member 17 partially covered with the separation layer 25 is provided to both the relief structure 12 and the separation layer 25 in the depression 21. It is covered as a reflective layer 14.

After the cleaning operation to remove the material to be washed out of the separation layer 25 together with the reflecting layer 14 which has been applied immediately, in FIG. 5 (b), the carrier member 17 is exposed while in the neutral region 5. The material still has a reflective layer 14 in the diffractive element 4. As a result, the entire surface of the carrier member 17 is covered with the protective layer 13, and the depression 21 is filled with the material of the protective layer 13.

The advantage of this process is that the passage time through the device is shorter in the preparation of the preliminary material, as in the step where the process of applying the protective lacquer 19 (Fig. 4 (c)) is omitted.

Combinations of the individual steps from the three processes are also possible. In particular, as shown in FIG. 5 (a), starting from the embossed carrier member 17 without the reflective layer 14 (see also FIG. 4 (b)), the protective lacquer 19 has a third ( It may be applied by a printing process as in FIG. b) or by a process illustrated in FIG. 4 (b). The carrier material 17 and the protective lacquer 19 of FIG. 4C are advantageously different in their refractive indices. In the refractive index, the protective lacquer 19 on the diffraction element 4 has a refractive index of 1.55 or more, while the carrier member 17 has a value of 1.5 or less. The jump of the refractive index at the interface between the carrier member 17 and the protective lacquer 19 strongly reflects the light incident on the diffraction element 4 through the carrier member 17, whereby the interface forms the reflective layer 14. Try to achieve the same effect. In addition, the member of the metal reflective layer 14 additionally makes a strong interlayer bond which is not released from the diffraction element 4.

The protective lacquer 19, which can be cured by light irradiation, is recessed for the relief structure 12 (see FIG. 2) in the correct form in the diffractive element 4 (21) (fifth (a There is an advantage in that the protective lacquer 19 is hardened in the form of a strong support which is very stable against heat. A stamp 3 made of such the same material (see also FIG. 1) is required when the stamp 3 is applied by hot tacking or over-lamination, even without the fixing layer 9 (see also FIG. 2). It can withstand the heat effect.

The carrier member 17 is transparent and at least the protective lacquer 19 (see also third (b)) or the protective layer 13 is a pattern with a prominent shining linework (e.g. a fine line in the dark background). Dark color or full black is preferred so that the observer can distinguish the identifying feature 8. If the reflective layer 14 is not applied to the correct register position, reflection of the non-diffractive surface, which can be easily identified with the naked eye, occurs next to the linear diffraction structure 4.

Secure elements may be used to verify the authenticity of documents, bank notes, and other items. The pattern of features 2 and security elements underneath the stamp 3, such as graphics or script elements printed on the substrate, or watermark elements on the substrate, may include reflective layers 14, protective layers 13. ) And the carrier member 17 can be visually identified by a non-expert. A seemingly transparent security element of that kind with a fine new pore pattern comprising a diffraction element 4 results in the viewing direction and the angle of incidence of the light, without the identification of graphic or script elements, through the transparent transparent neutral area 5 which is subsequently damaged. Depending on the dazzling color of the appearance will appear.

The seemingly transparent security element is used to partially or wholly cover the substrate 1 and its features 2 which are protected against counterfeiting.

The personal identification document printed on it and the photograph of the owner are mentioned in the example of such a substrate 1. The graphic pattern of the stamp 3 covers the features 2 with fine lines or line elements of the relief structure 12 acting as the diffractive element 4. Due to the high level of light diffraction efficiency of the diffraction element 4, the surface portion of the diffraction element 4 becomes sufficiently small, so that the identification of the information item on the substrate 1 through the neutral region 5 is not adversely affected. .

The linear diffraction element 4 has a profile shape that changes in a predetermined shape along the line, for example, so that the visual indentation changes in a predetermined shape along the line if the viewing state is changed due to the substrate 1 being turned or tilted. It is desirable to have and spatial frequencies. Attempts to exchange features 2 belonging to the secure element destroy the secure element. For example, forgery of passes or identification cards, which fit together a number of genuine passes or identification cards, can be easily detected by combining them in a broken configuration and placing them consecutively. For example, by moving obliquely, the substrate checks that the diffraction effect of the diffractive element 4 does not suddenly change or change along the fine line, thereby preventing the fine diffraction element 4 covering the item of information from being damaged. Even the public can easily check by the striking diffraction effect to confirm.

If the carrier member 17 is sufficiently hardened, the card can be stamped in credit card format directly from the spare material. The pattern of the security element forms an identification feature 8 (see FIG. 1) and is provided as an optical device, for example to identify it with the eye. If visible identification features 8 (see FIG. 1) are provided from both sides of the card, transparent or completely colorless materials are used for the protective layer 13, the carrier member 17 and the protective lacquer 19. It is preferable to be.

As shown in FIG. 6, in a separation operation process, a strip-like preliminary member may be processed to provide a roll of stamps, represented as eg 27. In the case where the stamp 3 is very thin (between about 15 μm and 40 μm) for technical reasons, the above description is particularly relevant. Patterns of the security elements regularly arranged on the preliminary member can be stamped in the form of a stamp 3 and the fixing layer 9 is adhered by cold adhesive on the carrier foil 28 of the paper or plastic member. .

In order to protect a document, pass or identity card, the stamp 3 is removed from the carrier foil 28 and placed on the substrate 1 (FIG. 1) and on the feature 2 (FIG. 1). Sticks.

With embossed structures for creating the depression 21 (FIG. 4 (a)) and the relief structures 12 (FIG. 4 (a)) that are embossed on the floor of the recesses. The embossing dies can be produced by the numerical control device described in EP-A-330 738, wherein the master structure 29 of the embossing die is first created as shown in figure 7 (a).

The master structure 29 is fixed on the structure carrier 30. As soon as the master structure 29 is embossed in a pattern of fine relief structures 12, along with the structure carrier 30, it is removed from the device for coating with the photoresist 31. Top on the neutral regions 5 of the exposed master structure 29 and top on the relief structures 12 of the diffractive element 4, 4 ′ without destroying the embossed relief structures 12. A photoresist 31 is applied that operates clearly at a layer thickness between about 1 μm and 10 μm over the entire area. The layer thickness of the photoresist 31 determines the height of the embossed structures that are subsequently embossed and corresponds at least to interval A (figure 4 (a)).

In a second pass, the device exposes the photoresist 31 to the light of a writing beam 32 through the structure carrier 30 of the master structure 29, wherein the writing beam 32 is controlled by a program such as a control program on the surfaces of the diffractive elements 4, 4 ′ and irradiates the photoresist 31. The process has the advantage that the structure carrier 30 is irradiated within the limits 33 above the diffractive element 4, 4 ′ with a high register accuracy such that the structural carrier 30 is correctly repositioned in the device by a nail. Have

After deployment of the photoresist 31, what remains in FIG. 7 (b) is to have the photoresist 31 only on the unembossed surfaces between the surfaces of the diffractive elements 4, 4 '. It is a master mold 34 comprising a master structure 29. For example, using a galvanic process, a metal layer 35 is deposited on the surface of the master mold 34. The metal layer 35 comprises, for example, nickel and becomes the correct negative of the master mold 34.

If the photoresist 31 is irradiated in the unembossed regions 5, the generation of the embossing die is also performed with the photoresist 31 which operates negatively.

As shown in FIG. 8, after separation, the metal layer 35 forms an embossing die 36 with embossed structures 37 that can be used to emboss the carrier member 17.

The embossing die 36 has the effect that, in the embossing process, the relief structures 12 (see also the fourth (a)) are produced in the depression 21 (see also the fourth (a)). Has This makes it possible in particular to use the economic processes 2 and 3 described above, which can be used in filigree patterns.

Claims (12)

Optical diffractive elements 4, 4 having a micro relief structure 12 embossed with a carrier member 17 of plastic material on one side and a reflective layer 14 partially covering the embossed side 18 of the carrier member 17. In the security element with the visible pattern of ′), the reflective layer 14 covers only the embossed relief structure 12, and the unembossed neutral region 5 between the diffractive elements 4, 4 ′ Security element, characterized in that not reflected. 2. The transparent protection according to claim 1, wherein the embossed side portion (18) covers the reflective layer (14) and the neutral region (5) on the relief structure (12) to protect the diffractive elements (4, 4 '). The front side is covered with a layer (13), wherein the carrier (10) and the protective layer (13) of the relief structure (12) are made of the same material. 3. The carrier member (17) according to claim 1 or 2, characterized in that the carrier member (17) is transparent so that a pattern formed from the diffraction elements (4,4 ') and the neutral region (5) is visible through the carrier member (17). Security device. 4. The embossed side portion 18 according to claim 3, wherein the carrier member 17 is properly bonded onto the substrate 1, and the characteristic portion 2 of the substrate 1 is visible through the neutral region 5. The security layer, characterized in that the adhesive layer 15 applied on the entire surface area of the furnace is transparent. 2. A security element according to claim 1, wherein the sum of the surface areas of the neutral regions (5) between the diffraction elements (4, 4 ') is greater than the sum of the areas of the diffraction elements (4, 4'). 6. A security device according to claim 5, wherein the diffractive elements (4, 4 ') have a size of less than 0.5 mm and form a fine filigree pore pattern. 4. The diffractive element (4, 4 ') is below the carrier surface (16) defined by the surface of the unembossed neutral region (5) in the depression (21) of the carrier member (17). Security element, characterized in that installed below 1㎛. 8. A security device according to claim 7, wherein the depression (21) is filled with a protective lacquer that is cured by radiation. In order to make the depression 21 in the carrier member 17, the micro relief structure 12 for the diffractive elements 4, 4 'protrudes as an embossed structure beyond the plane defined for the neutral region 5. An embossing die for embossing the security element according to claim 6 or 7. A carrier member made of plastic material having a neutral region 5 between the diffractive elements 4, 4 ′ of the micro relief structure 12 embossed through the reflective layer 14 and the diffractive elements 4, 4 ′ ( In the method of manufacturing the security element on 17), after the step of embossing the carrier member 17, only the surface of the diffractive elements 4, 4 'embossed with the protective lacquer 9 is covered and the neutral region 5 is not covered. And removing the reflective layer (14) on the neutral region (5) and covering the carrier member (17) on the entire surface of the embossed side (18) with at least one protective layer (13). The method according to claim 10, wherein in the embossing operation, the depression 21 having the relief structure 12 is manufactured on the surface of the carrier member 17, and the protective lacquer 19 is placed on the entire surface of the embossing side 18. Covering, removing the protective lacquer (19) with a scraper blade to expose the reflective layer (14) of the neutral region (5) and the depression (21) being filled with the protective lacquer. Security on a carrier member 17 made of plastic material having an embossed diffractive element 4, 4 ′ with a micro relief structure 12 and a neutral region 5 between the diffractive elements 4, 4 ′. In the method of manufacturing the device, a material capable of washing the neutral region 5, which is not embossed, by using an embossing die 36 having an embossed structure 37 with an embossed structure to emboss the carrier member 17. The separation layer 25, covering the surface of the separation layer 25 and the relief structure 12 with the reflection layer 14, together with the reflection layer 14 on the neutral region 5. (25) removing, and covering the entire surface of the carrier member (17) with a protective layer (13).